JP6583247B2 - Light emitting device - Google Patents

Description

  The present disclosure relates to a light emitting device.

  For example, Patent Document 1 discloses a single package, a red LED, a green LED, and a blue LED arranged in the package, and a translucent seal arranged in the package so as to cover these three colors of LEDs. And a light-emitting device comprising a phosphor that emits light when excited by light emitted from a blue LED.

  Further, in Patent Document 2 cited as a prior art document in Patent Document 1, supply to a red LED, a green LED, and a blue-white LED is performed in synchronization with color information of three primary colors of an image displayed on an image display panel. It is described that each power is dynamically controlled.

International Publication No. 2012/046661 JP 2009-099334 A

  In the conventional light emitting device, even if excellent color reproducibility can be obtained, at least four external connection terminals are required to dynamically control the power supplied to the three colors of LEDs, and the drive circuit The configuration is also complicated.

  An object of one embodiment of the present invention is to provide a light-emitting device with excellent color reproducibility, which requires at least two external connection terminals for power supply.

  A light emitting device according to an embodiment of the present invention absorbs light of a first light emitting element that emits red light, a second light emitting element that emits green light, a third light emitting element that emits blue light, and the third light emitting element. A translucent member that includes a wavelength converting substance that emits light and covers the first to third light emitting elements, wherein the first light emitting element, the second light emitting element, and the third light emitting element are connected in series. The radiant flux of the third light emitting element at the same forward current value is greater than the radiant flux of the first light emitting element and the radiant flux of the second light emitting element, and the wavelength converting material is a phosphor that emits green to red light. It is characterized by.

  According to one embodiment of the present invention, a minimum of two external connection terminals for power supply is required, and a light emitting device having excellent color reproducibility can be obtained.

1 is a schematic top view of a light emitting device according to an embodiment of the present invention. It is a schematic sectional drawing in the AA cross section in FIG. 1A. It is a schematic sectional drawing which shows another example of a structure of the wavelength conversion substance in the light-emitting device which concerns on one embodiment of this invention. 1 is a schematic bottom view of a light emitting device according to an embodiment of the present invention. 1 is a schematic top view of a light emitting device according to an embodiment of the present invention. It is a schematic sectional drawing in the BB cross section in FIG. 2A. 1 is a schematic bottom view of a light emitting device according to an embodiment of the present invention.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. The contents described in one embodiment and example are applicable to other embodiments and examples. In addition, the size, positional relationship, and the like of members illustrated in the drawings may be exaggerated for clarity of explanation.

  The visible wavelength range is a wavelength range of 380 nm to 780 nm, the blue range is a wavelength range of 420 nm to 480 nm, the green range is a wavelength range of 500 nm to 560 nm, and the yellow range is longer than 560 nm to 590 nm. The orange region has a wavelength longer than 590 nm and shorter than 610 nm, and the red region has a wavelength between 610 nm and 750 nm.

<Embodiment 1>
1A is a schematic top view of light-emitting device 100 according to Embodiment 1. FIG. 1B is a schematic cross-sectional view taken along a line AA in FIG. 1A. FIG. 1C is a schematic cross-sectional view illustrating another example of the configuration of the wavelength converting substance in the light emitting device 100. FIG. 1D is a schematic bottom view of the light emitting device 100.

  As shown in FIGS. 1A to 1D, the light-emitting device 100 of Embodiment 1 includes a first light-emitting element 20R that emits red light, a second light-emitting element 20G that emits green light, a third light-emitting element 20B that emits blue light, The optical member 40 is provided. The first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are connected in series. The translucent member 40 covers the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B. The translucent member 40 includes a wavelength conversion material 30 that absorbs light from the third light emitting element 20B and emits light. The wavelength converting substance 30 is a phosphor that emits green to red light.

  More specifically, the light emitting device 100 further includes a base 10. The substrate 10 is a package for a surface mount type light emitting diode. The substrate 10 includes a first lead electrode 11a, a second lead electrode 11c, and a resin molded body 15. The resin molded body 15 holds the first lead electrode 11a and the second lead electrode 11c. The base 10 has a recess whose bottom surface is an element placement surface. A part of the bottom surface of the recess of the base 10 is constituted by the surface of the first lead electrode 11a and the surface of the second lead electrode 11c. The first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are mounted on the element mounting surface of the base 10. The second light emitting element 20G and the third light emitting element 20B are electrically insulating adhesive members 60, and the first light emitting element 20R is an electrically conductive adhesive member 65, which are adhered to the element mounting surface. Further, the first light emitting element 20R and the third light emitting element 20B, and the second light emitting element 20G and the third light emitting element 20B are connected to each other in series by a wire 50. The first light emitting element 20 </ b> R is connected to the first lead electrode 11 a serving as a positive terminal by an adhesive member 65. The second light emitting element 20G is connected to the second lead electrode 11c serving as a negative terminal by a wire 50. The translucent member 40 is filled in the recess of the base 10.

  In such a light-emitting device 100, the first light-emitting element 20R, the second light-emitting element 20G, and the third light-emitting element 20B are semiconductor light-emitting elements that each have a narrow spectral line width compared to the light emission of the phosphor. Excellent reproducibility. In the light emitting device 100, since the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are connected in series, at least two external connection terminals for feeding, that is, one positive terminal and One negative terminal may be sufficient. Therefore, the drive circuit of the light emitting device 100 can be configured simply.

  At the same forward current value, the radiant flux of the third light emitting element 20B is larger than the radiant flux of the first light emitting element 20R and larger than the radiant flux of the second light emitting element 20G. When the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are connected in series, the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B have the same value. A forward current flows, and the third light emitting element 20B emits light with the largest radiant flux. Therefore, by allowing the wavelength conversion material 30 to absorb a part of the blue light emitted from the third light emitting element 20B, it is possible to balance the radiant fluxes of the red, green, and blue colors of the light emitting device 100. Further, the radiant fluxes of the green and red light emitted from the wavelength conversion material 30 can be added as the radiant fluxes of the first light emitting element 20R and the second light emitting element 20G. Thereby, white light emission in a preferable chromaticity range of the light emitting device 100 is obtained. The forward current value here may be a predetermined forward current value, but is preferably 1 mA or more and 1000 mA or less, and more preferably 20 mA or more and 200 mA or less.

  In this specification, “red light emission”, “green light emission”, and “blue light emission” refer to the first light emitting element 20R, the second light emitting element 20G, the third light emitting element 20B, or the wavelength conversion substance 30. Means that the light color is recognized by human vision. For example, the emission peak wavelength is in the light color gamut, but may include wavelength components other than the light color gamut. In particular, the light emission of the phosphor has a wider spectral line width than that of the semiconductor light emitting device and includes many wavelength components. For this reason, the green to red light emission of the wavelength conversion material 30 includes the same wavelength component as the emission peak wavelength of the first light emitting element 20R and / or the second light emitting element 20G, and thereby the first light emitting element 20R and the second light emitting element 20G. The radiant flux of the light emitting element 20G can be supplemented.

  Further, the content of the wavelength converting substance 30 in the translucent member 40 is preferably an amount in a range where the light emission chromaticity of the light emitting device 100 is a preferable white region, and further within that range from the viewpoint of color reproducibility. The smaller the number, the better. The light emission chromaticity (x value, y value) of the light emitting device 100 is preferably such that the x value is 0.2 or more and 0.4 or less, the y value is 0.2 or more and 0.4 or less, and the x value is 0. More preferably, the value is 0.22 to 0.35 and the y value is 0.22 to 0.35, the x value is 0.25 to 0.32, and the y value is 0.23 to 0.33. It is even more preferable that: Note that the chromaticity (x value, y value) is based on the xyz color system of the International Commission on Illumination (CIE).

  Hereinafter, the preferable form of the light-emitting device 100 is explained in full detail.

  When the radiant flux of the third light emitting element 20B is larger than the radiant flux of the second light emitting element 20G and the radiant flux of the second light emitting element 20G is larger than the radiant flux of the first light emitting element 20R at the same forward current value, wavelength conversion is performed. The substance 30 is a combination of a phosphor 30R that emits red light and a phosphor 30G that emits green light as shown in FIG. 1B, or a phosphor 30R that emits red light as shown in FIG. 1C, or yellow light emission. It is preferable that the phosphor 30Y. Thereby, the radiant flux of the first light emitting element 20R or the first light emitting element 20R and the second light emitting element 20G can be supplemented to easily balance the radiant fluxes of the red, green, and blue colors of the light emitting device 100.

  When the radiant flux of the third light emitting element 20B is larger than the radiant flux of the first light emitting element 20R and the radiant flux of the first light emitting element 20R is larger than the radiant flux of the second light emitting element 20G at the same forward current value, wavelength conversion is performed. The substance 30 is a combination of a phosphor 30R emitting red light and a phosphor 30G emitting green light as shown in FIG. 1B, or a phosphor 30G emitting green light as shown in FIG. 1C, or yellow light emission. It is preferable that the phosphor 30Y. This makes it easy to balance the radiant fluxes of the red, green, and blue colors of the light emitting device 100 by supplementing the radiant flux of the second light emitting element 20G or the first light emitting element 20R and the second light emitting element 20G.

  As shown in FIGS. 1A to 1C, the first light emitting element 20R, the third light emitting element 20B, and the second light emitting element 20G are preferably juxtaposed in the order of description. As described above, the third light emitting element 20B that emits the excitation light of the wavelength converting substance 30 is disposed between the first light emitting element 20R and the second light emitting element 20G, thereby allowing light distribution of each color of red, green, and blue. It is easy to obtain light emission with less unevenness and less bias. The term “parallel arrangement” used here means that the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are in a first direction in a top view (in this embodiment, a longitudinal direction in a top view of the substrate 10). ) In that order. At this time, the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element in a second direction perpendicular to the first direction in the top view (in the present embodiment, the short side view in the top view of the substrate 10). The position of the element 20B (defined by the center of each light emitting element) may be different, but is most preferably on the same straight line.

  As shown in FIGS. 1A to 1D, the first light emitting element 20R is placed on the first lead electrode 11a, and the second light emitting element 20G and the third light emitting element 20B are placed on the second lead electrode 11c. preferable. In many cases, the first light emitting element 20R has an opposing electrode structure in which a pair of positive and negative electrodes are provided on opposite surfaces. In an element having a counter electrode structure, one of a pair of positive and negative electrodes is connected to a lead electrode through a conductive adhesive member 65. For this reason, it is advantageous in heat dissipation of each light emitting element by making the lead electrode on which the first light emitting element 20R is placed different from the lead electrode on which the second light emitting element 20G and the third light emitting element 20B are placed. Become. Further, the light emitting device 100 can be easily formed in a small size. Even when the number of lead electrodes is two, it is possible to place all of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B on one lead electrode and connect them in series. If the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are mounted on separate lead electrodes with three lead electrodes, the heat dissipation of each light emitting element is further enhanced. It will be advantageous.

  As shown in FIGS. 1A to 1C, the light emitting device 100 includes only one first light emitting element 20R, second light emitting element 20G, and third light emitting element 20B. Thereby, the electrical connection of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B can be simply configured, and as a result, the light emitting device 100 can be easily formed in a small size. Further, as shown in FIG. 1D, the light emitting device 100 has two external connection terminals, both of which are for supplying power to the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B. . Thereby, the light-emitting device 100 can be configured to be simple and small. Note that the number of external connection terminals for supplying power to the light emitting device is not limited to two, and the arrangement and / or electrical connection of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are considered. For example, there may be three.

<Embodiment 2>
FIG. 2A is a schematic top view of light-emitting device 200 according to Embodiment 2. FIG. 2B is a schematic cross-sectional view taken along the line BB in FIG. 2A. FIG. 2C is a schematic bottom view of the light emitting device 200.

  As shown in FIGS. 2A to 2C, the light emitting device 200 according to the second embodiment also includes a first light emitting element 20R that emits red light, a second light emitting element 20G that emits green light, a third light emitting element 20B that emits blue light, And a sex member 42. The first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are connected in series. The translucent member 42 covers the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B. The translucent member 42 includes the wavelength conversion material 30 that absorbs the light of the third light emitting element 20B and emits light. The wavelength converting substance 30 is a phosphor that emits green to red light. At the same forward current value, the radiant flux of the third light emitting element 20B is larger than the radiant flux of the first light emitting element 20R and larger than the radiant flux of the second light emitting element 20G.

  More specifically, the light emitting device 200 does not include the base body 10 as in the first embodiment. The light-emitting device 200 is a surface-mounted light-emitting diode that is also called a “chip size package (CSP) type”. The first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are each a flip-chip mounting type element. A pair of protruding electrodes 80 is connected to a pair of positive and negative electrodes provided on the lower surfaces of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B. One flat (sheet-like) translucent member 42 is bonded to the upper surfaces of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B. The wavelength converting material 30 is composed of a combination of a phosphor 30R that emits red light and a phosphor 30G that emits green light. The resin molded body 17 covers the side surfaces and the bottom surface of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B, the side surface of the translucent member 42, and the side surface of the protruding electrode 80. On the lower surface of the resin molded body 17, one first wiring film 13a, one second wiring film 13c, and a plurality of third wiring films 13e connected to each protruding electrode 80 are formed. The first light emitting element 20R and the third light emitting element 20B, and the second light emitting element 20G and the third light emitting element 20B are connected to each other in series by the third wiring film 13e. The first light emitting element 20 </ b> R is connected to the first wiring film 13 a serving as a positive terminal via the protruding electrode 80. The second light emitting element 20G is connected to the second wiring film 13c serving as a negative electrode terminal via the protruding electrode 80.

  The light emitting device 200 having such a configuration is also extremely excellent in color reproducibility because it requires a minimum of two external connection terminals for power feeding.

  As shown in FIGS. 2A and 2C, in the light emitting device 200, the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are each composed of two elements. Thus, each of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B is not limited to one element, and may be composed of a plurality of elements. That is, even if at least one of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B is composed of a plurality of elements, the first light emitting element 20R (group) and the second light emitting element 20G. (Group) and the 3rd light emitting element 20B (group) should just be connected in series as a whole. In this case, the connection between a plurality of elements constituting the group may be a serial connection or a parallel connection. The radiant flux is considered as the sum of the radiant fluxes of all elements constituting a group. As described above, at least one of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B is constituted by a plurality of elements, and by devising the arrangement, red, green, and blue The bias of the light distribution of each color is further suppressed, and light emission with less color spots is more easily obtained. In the second embodiment, as a matrix arrangement in a top view, the second light emitting element 20G, the third light emitting element 20B, and the first light emitting element 20R are juxtaposed in this order from the left side in the first row, and in the second row. The first light emitting element 20R, the third light emitting element 20B, and the second light emitting element 20G are juxtaposed in this order from the left.

  As shown in FIGS. 2B and 2C, there are two external connection terminals for power supply in the light emitting device 200: a first wiring film 13a and a second wiring film 13c. The third wiring film 13e may not be used as an external connection terminal, or may be used as an external connection terminal for heat dissipation and / or soldering reinforcement. As described above, the light emitting device may include external connection terminals other than those for power feeding. The mounting posture of the light emitting device can be adjusted by the arrangement of the external connection terminals other than those for power feeding.

  Hereinafter, each component in the light-emitting device which concerns on one embodiment of this invention is demonstrated.

(Light emitting device 100, 200)
The light emitting devices 100 and 200 are, for example, light emitting diodes (LEDs). The light emitting devices 100 and 200 can be a top emission type (also referred to as “top view type”) or a side emission type (also referred to as “side view type”) depending on the arrangement of external connection terminals. In the top emission type light emitting device, the mounting direction and the main light emitting direction are parallel to each other. In the side-emitting type light emitting device, the mounting direction and the main light emitting direction are perpendicular to each other. The light emitting devices 100 and 200 according to the first and second embodiments are of the top emission type, and the lower side is the mounting direction. The top view shape of the light emitting devices 100 and 200 can be selected as appropriate, but a rectangular shape is preferable in terms of mass productivity. Moreover, although a square shape may be sufficient, if the arrangement | positioning of the 1st light emitting element 20R, the 2nd light emitting element 20G, and the 3rd light emitting element 20B is considered, the rectangular shape which has a longitudinal direction and a transversal direction is preferable. In that case, the juxtaposed direction of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B is preferably set as the longitudinal direction.

(Substrate 10)
The base 10 is mainly a package or a wiring board. The base 10 may have a recess that accommodates the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B, or may have a flat plate shape. The top view shape of the recess includes a rectangle, a rectangle with rounded corners, a circle, and an ellipse. In particular, the shape of the concave portion as viewed from above is preferably a rectangular shape or a rectangular shape with rounded corners so that the opening of the concave portion is easily provided, and the light of the light emitting element and the wavelength converting material can be easily extracted. In order to efficiently extract the light of the first light emitting element 20R, the second light emitting element 20G, the third light emitting element 20B, and the wavelength converting material 30, the side wall surface of the recess has a diameter that increases from the bottom surface toward the opening side. It is preferable to be inclined (including a curve). Although the inclination angle of the side wall surface of the recess can be selected as appropriate, it is preferably from 95 ° to 135 °, more preferably from 100 ° to 120 ° from the bottom of the recess. Although the depth of a recessed part can be selected suitably, 0.1 mm or more and 1 mm or less are preferable, and 0.25 mm or more and 0.5 mm or less are more preferable.

(First lead electrode 11a, second lead electrode 11c)
The first lead electrode 11a and the second lead electrode 11c are metal members that can conduct electricity to the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B (herein, “metal” includes an alloy). Can be used. Specifically, copper, aluminum, gold, silver, palladium, chromium, titanium, tungsten, iron, nickel, cobalt, molybdenum, or an alloy thereof, phosphor bronze, iron-containing copper, or the like can be given. Various shapes of the first lead electrode 11a and the second lead electrode 11c can be formed by subjecting the metal plate (base material) to processing such as pressing, rolling, and etching. Further, a light reflecting film such as silver, aluminum, rhodium or an alloy thereof may be provided on the surface, and silver or a silver alloy excellent in light reflectivity is particularly preferable. The first lead electrode 11a and the second lead electrode 11c may be wiring on a wiring board. In this case, the first lead electrode 11a and the second lead electrode 11c can be formed by plating, sputtering, vapor deposition, printing, a cofire method, a postfire method, or the like.

(First wiring film 13a, second wiring film 13c, third wiring film 13e)
The first wiring film 13a, the second wiring film 13c, and the third wiring film 13e can use the same metal member as the first lead electrode 11a and the second lead electrode 11c. The first wiring film 13a, the second wiring film 13c, and the third wiring film 13e may be single layer films, but are preferably multilayer films. Examples of the multilayer film include nickel / gold, nickel / palladium / gold, nickel / palladium / gold / silver, and the like. The first wiring film 13a, the second wiring film 13c, and the third wiring film 13e can be formed by plating, sputtering, vapor deposition, printing, or the like.

(Resin moldings 15 and 17)
A thermosetting resin or a thermoplastic resin can be used for the base material of the resin molded bodies 15 and 17. In addition, the resin shown below shall also contain the modified resin (a hybrid resin is included). Examples of the thermosetting resin include epoxy resin, silicone resin, polybismaleimide triazine resin, polyimide resin, polyurethane resin, and unsaturated polyester resin. Especially, any one of an epoxy resin, a silicone resin, and an unsaturated polyester is preferable. Examples of the thermoplastic resin include aliphatic polyamide resin, semi-aromatic polyamide resin, aromatic polyphthalamide resin, polycyclohexylenedimethylene terephthalate, polyethylene terephthalate, polycyclohexane terephthalate, liquid crystal polymer, and polycarbonate resin. Among these, any one of aromatic polyphthalamide resin, aliphatic polyamide resin, polycyclohexane terephthalate, and polycyclohexylene dimethylene terephthalate is preferable. Further, in these base materials, as a filler (including reinforcing fibers) or a color pigment, glass, silicon oxide, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, Magnesium silicate, wollastonite, mica, zinc oxide, barium titanate, potassium titanate, aluminum borate, aluminum oxide, zinc oxide, silicon carbide, antimony oxide, zinc stannate, zinc borate, iron oxide, chromium oxide, Particles or fibers such as manganese oxide and carbon black can be mixed. Among these, it is preferable to use silicon oxide as a filler and titanium oxide or zinc oxide as a color pigment (reflecting material). The content of the color pigment in the resin moldings 15 and 17 can be selected as appropriate, and it is better from the viewpoint of the optical function of the resin moldings 15 and 17, but considering the influence on fluidity, it is 20 wt% or more. 70 wt% or less is preferable, and 30 wt% or more and 60 wt% or less is more preferable. Note that “wt%” is weight percent and represents the ratio of the weight of the material to the total weight of all the constituent materials. From the viewpoint of forward light extraction efficiency, the resin molded bodies 15 and 17 preferably have a light reflectance at the emission peak wavelength of the third light emitting element 20B of 70% or more, more preferably 80% or more. Preferably, 90% or more is even more preferable. Furthermore, the resin molded bodies 15 and 17 are preferably white. The resin molded bodies 15 and 17 are in a fluid state, that is, in a liquid state (including a sol form or a slurry form) before being cured or solidified. The resin moldings 15 and 17 can be molded by transfer molding or injection molding. The base material in the case where the substrate 10 is a wiring board is made of ceramics containing aluminum oxide, aluminum nitride or a mixture thereof, or resin such as epoxy resin, BT resin, polyimide resin, or fiber reinforced resin (reinforced resin). Examples of the fiber include glass.

(First light emitting element 20R, second light emitting element 20G, third light emitting element 20B)
As the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B, a semiconductor light emitting element such as a light emitting diode element can be used. The 1st light emitting element 20R, the 2nd light emitting element 20G, and the 3rd light emitting element 20B should just have the element structure comprised with various semiconductors, and a pair of positive and negative electrodes. The first light emitting element 20R is preferably a light emitting element of gallium arsenide or gallium phosphide-based semiconductor. Gallium arsenide or gallium phosphide-based semiconductors can emit light with high efficiency at a long wavelength in the visible range. The emission peak wavelength of the first light emitting element 20R can be selected as appropriate, but is preferably 620 nm or more and 660 nm or less, and more preferably 620 nm or more and 640 nm or less. The size of the first light emitting element 20R in a top view is often smaller than the second light emitting element 20G and the third light emitting element 20B. Further, the forward voltage of the first light emitting element 20R at the same forward current value is often smaller than the forward voltage of the second light emitting element 20G and the forward voltage of the third light emitting element 20B. The second light emitting element 20G and the third light emitting element 20B are preferably light emitting elements of a gallium nitride based semiconductor (In _x Al _y Ga _1-xy N, 0 <x, 0 <y, x + y <1). Gallium nitride semiconductors can emit light with high efficiency at short wavelengths in the visible range. The emission peak wavelength of the second light emitting element 20G can be appropriately selected, but is preferably 520 nm or more and 560 nm or less, and more preferably 540 nm or more and 560 nm or less. The emission peak wavelength of the third light emitting element 20B can be selected as appropriate, but is preferably 435 nm or more and 465 nm or less, and more preferably 440 nm or more and 460 nm or less. In many cases, the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B have a substrate. The substrate is preferably translucent, but is not limited thereto. Examples of the base material of the substrate include sapphire, spinel, gallium nitride, aluminum nitride, silicon, silicon carbide, gallium arsenide, gallium phosphide, indium phosphide, zinc sulfide, zinc oxide, and zinc selenide. When the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B are provided with a pair of positive and negative electrodes on the same surface side, “face-up mounting” in which each electrode is connected to the lead electrode with a wire. Can be adopted. Further, “face-down (flip chip) mounting” in which each electrode is bonded to the lead electrode with a conductive adhesive member may be employed. In the case of a counter electrode structure in which a pair of positive and negative electrodes are provided on opposite surfaces, the lower electrode is bonded to the lead electrode with a conductive adhesive member, and the upper electrode is connected to the lead electrode with a wire.

(Wavelength converting material 30)
The wavelength converting substance 30 absorbs at least a part of the primary light emitted from the third light emitting element 20B and emits secondary light having a wavelength different from that of the primary light. Thereby, it can be set as the light-emitting device which emits the mixed color light (for example, white light) of the primary light of the visible wavelength, and secondary light. The wavelength conversion substance 30 can be used individually by 1 type in the specific example shown below, or in combination of 2 or more types.

(First phosphor 30R)
The first phosphor 30R emits red light. The emission peak wavelength of the first phosphor 30R can be selected as appropriate, but is preferably 620 nm or more and 660 nm or less, and more preferably 620 nm or more and 640 nm or less. Specific examples include nitrogen-containing calcium aluminosilicate (CASN or SCASN) phosphors (for example, (Sr, Ca) AlSiN ₃ : Eu). Further, a manganese-activated fluoride phosphor (a phosphor represented by the general formula A ₂ [M _1-a Mn _a F ₆ ] (where A represents K, Li, Na, Rb, Cs and At least one selected from the group consisting of NH ₄ , M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0 <a <0.2. Satisfying)) is capable of light emission with a relatively narrow spectral line width, which is preferable in terms of color reproducibility. A typical example of the manganese-activated fluoride phosphor is a manganese-activated potassium fluorosilicate phosphor (for example, K ₂ SiF ₆ : Mn).

(Second phosphor 30G)
The second phosphor 30G emits green light. The emission peak wavelength of the second phosphor 30G can be appropriately selected, but is preferably 520 nm or more and 560 nm or less, and more preferably 540 nm or more and 560 nm or less. Specifically, an yttrium / aluminum / garnet phosphor (for example, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce), a lutetium / aluminum / garnet phosphor (for example, Lu ₃ (Al, Ga) ₅ O ₁₂ : Ce), terbium / aluminum / garnet phosphors (eg, Tb ₃ (Al, Ga) ₅ O ₁₂ : Ce) phosphors, silicate phosphors (eg (Ba, Sr) ₂ SiO ₄ : Eu), chlorosilicates -Based phosphors (for example, Ca ₈ Mg (SiO ₄ ) ₄ Cl ₂ : Eu), β-sialon-based phosphors (for example, Si _6-z Al _z O _z N _8-z : Eu (0 <z <4.2)) And SGS-based phosphors (for example, SrGa ₂ S ₄ : Eu).

(Third phosphor 30Y)
The third phosphor 30Y emits yellow light. Specifically, α sialon-based phosphor (for example, M _z (Si, Al) ₁₂ (O, N) ₁₆ (where 0 <z ≦ 2 and M represents Li, Mg, Ca, Y, and La) In addition, there are phosphors that emit yellow light in the second phosphor 30G.For example, yttrium, aluminum, and garnet phosphors have a part of Y. By substituting with Gd, the emission peak wavelength can be shifted to the longer wavelength side and yellow emission is possible, and some of these phosphors can emit orange.

(Translucent members 40 and 42)
The translucent members 40 and 42 are members that cover the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B and transmit light emitted from these to the outside of the apparatus. The translucent members 40 and 42 have electrical insulation, and are translucent to light emitted from the first light emitting element 20R, the second light emitting element 20G, the third light emitting element 20B, and the wavelength conversion material 30 ( The light transmittance at the emission peak wavelength of the third light emitting element 20B is preferably 60% or more, more preferably 70% or more, and even more preferably 80% or more. Good. The translucent member 40 of the first embodiment is a sealing member that seals the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B from each other and protects them from dust, moisture, external force, and the like. is there.

  Examples of the base material of the translucent members 40 and 42 include silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, TPX resin, polynorbornene resin, and modified resins thereof (including hybrid resins). Of these, silicone resins (silicone resins and modified resins thereof) are preferable because they have a low elastic modulus and are particularly excellent in heat resistance and light resistance. Silicone resins containing a phenyl group (methyl-phenylsilicone resin to diphenylsilicone resin) are more preferable among silicone resins because of their relatively high heat resistance and gas barrier properties.

  Examples of the filler for the translucent members 40 and 42 include silicon oxide, aluminum oxide, zirconium oxide, and zinc oxide. The filler of the translucent members 40 and 42 can be used alone or in combination of two or more thereof. In particular, silicon oxide is preferable as a reducing agent for the coefficient of thermal expansion of the translucent members 40 and 42. The shape of the filler of the translucent members 40 and 42 can be selected as appropriate and may be indefinite (crushed), but is preferably spherical from the viewpoint of fluidity. The content of the filler in the translucent members 40 and 42 can be selected as appropriate, and may be determined as appropriate in consideration of the thermal expansion coefficient, fluidity, etc. of the translucent members 40 and 42, but 0.1 wt% or more 50 wt% or less is preferable, and 1 wt% or more and 30 wt% or less is more preferable. Further, by using nanoparticles (particles having a particle diameter of 1 nm or more and 100 nm or less) as fillers of the translucent members 40 and 42, the blue light scattering (including Rayleigh scattering) of the third light emitting element 20B is increased. Thus, the amount of the wavelength converting substance 30 used can be reduced. As the nanoparticle filler, for example, silicon oxide or zirconium oxide is preferable.

(Wire 50)
The wire 50 is a conducting wire that connects the electrodes of the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B, or the electrodes of these light emitting elements and the lead electrodes. The wire 50 can also be used to connect the electrode of the protection element 70 and the lead electrode. Specifically, a metal wire of gold, copper, silver, platinum, aluminum, palladium, or an alloy thereof (herein, “metal” includes an alloy) can be used. In particular, a gold wire or a gold alloy wire that is less likely to break due to stress from the translucent member 40 and is excellent in thermal resistance or the like is preferable. In order to improve light reflectivity, at least the surface may be made of silver or a silver alloy. The wire diameter of the wire 50 can be selected as appropriate, but is preferably 5 μm or more and 50 μm or less, more preferably 10 μm or more and 40 μm or less, and even more preferably 15 μm or more and 30 μm or less.

(Adhesive members 60 and 65)
The adhesive members 60 and 65 are members that adhere the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B to the lead electrodes. The adhesive member 65 can also be used for bonding the protective element 70 to the lead electrode. As the electrically insulating adhesive member 60, an epoxy resin, a silicone resin, a polyimide resin, a modified resin thereof (including a hybrid resin), or the like can be used. For the conductive adhesive member 65, in addition to conductive pastes such as silver, gold, and palladium, tin-bismuth, tin-copper, tin-silver, gold-tin, or the like can be used.

(Protective element 70)
The protection element 70 is an element for protecting the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B from static electricity, high voltage surge, and the like. Specific examples of the protective element 70 include a Zener diode. The protection element 70 is not necessarily required, and may be provided according to the reliability required for the light emitting device.

(Projection electrode 80)
The protruding electrode 80 is also called a bump or a pillar. The protruding electrode 80 can be composed of a small piece of metal or alloy. Specific examples include gold, silver, copper, iron, tin, platinum, zinc, nickel, aluminum, tungsten, and alloys thereof. Especially, since copper is excellent in thermal conductivity and relatively inexpensive, copper or a copper alloy is particularly suitable. Gold or gold alloy is also preferable because it is chemically stable and has a property of being easily bonded with little surface oxidation. The protruding electrode 80 may have a coating such as gold or silver on the surface from the viewpoint of bondability.

  Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

<Example 1>
The light-emitting device of Example 1 is a substantially rectangular parallelepiped top-emitting and surface-mounted light-emitting diode having the structure of the light-emitting device 100 of the example shown in FIGS. 1A, 1B, and 1D.

  The base 10 has a length of 1.4 mm, a width of 4.0 mm, and a thickness of 0.6 mm, and a resin molded body 15 is integrally formed on a pair of positive and negative first and second lead electrodes 11a and 11c. It is a structured package. The base 10 is formed by placing a processed metal plate (lead frame) in which a plurality of pairs of first and second lead electrodes 11a and 11c are connected vertically and horizontally via a suspension lead in a mold, and forming a liquid resin It is manufactured by injecting the constituent material of the body 15, curing and releasing, and then cutting (dividing into pieces).

  The first and second lead electrodes 11a and 11c are small pieces of copper alloy having a maximum thickness of 0.2 mm each having a surface plated with silver. The exposed areas of the lower surfaces of the first and second lead electrodes 11a and 11c, which are external connection terminals, are substantially the same as the lower surface of the resin molded body 15 and constitute the lower surface of the base body 10. In the first and second lead electrodes 11a and 11c, the cut suspension leads are exposed at the four end surfaces of the base body 10 (resin molded body 15).

  The resin molding 15 has a rectangular shape with a top view of 1.4 mm in length and 4.0 mm in width, a maximum thickness of 0.6 mm, and is made of an epoxy resin containing silicon oxide and titanium oxide. At the approximate center of the upper surface of the resin molded body 15, that is, the upper surface of the substrate 10, there is a rectangular opening with a rounded corner of 1.0 mm and a width of 3.7 mm when viewed from above, and a recess with a depth of 0.4 mm. Is formed. The side wall surface of the recess is an inclined surface that forms an angle of 111.3 ° with the bottom surface of the recess.

  The first light emitting element 20R is bonded to the upper surface of the first lead electrode 11a on the positive electrode side on the bottom surface of the recess (element mounting surface) of the base 10 by an adhesive member 65 of silver paste. The second light emitting element 20G and the third light emitting element 20B are bonded to the upper surface of the second lead electrode 11c on the negative electrode side by a bonding member 60 of dimethyl silicone resin. The first light emitting element 20R is red (forward voltage of 120 V, forward voltage of 2.1 V, radiant flux of 85 mW, emission peak wavelength of about 630 nm) in which a gallium phosphide-based semiconductor element structure is stacked on a gallium phosphide substrate. This LED element is capable of emitting light and has a rectangular shape when viewed from above, having a length of 320 μm and a width of 320 μm. The second light emitting element 20G is capable of emitting green light (a forward current of 120 mA, a forward voltage of 3.1 V, a radiant flux of 105 mW, and an emission peak wavelength of about 523 nm) in which a gallium nitride based semiconductor element structure is stacked on a sapphire substrate. The LED element is 650 μm in length and 650 μm in width when viewed from above. The third light-emitting element 20B is capable of emitting blue light (forward voltage of 120 V, forward voltage of 3.0 V, radiant flux of 190 mW, emission peak wavelength of about 453 nm) in which a gallium nitride-based semiconductor element structure is stacked on a sapphire substrate. The LED element is 650 μm in length and 650 μm in width when viewed from above. In the first light emitting element 20R, the p electrode is bonded to the first lead electrode 11a by the adhesive member 65, and the n electrode is connected to the p electrode of the third light emitting element 20B by the wire 50. The third light emitting element 20B has an n electrode connected to the p electrode of the second light emitting element 20G by a wire 50. In the second light emitting element 20G, the n electrode is connected to the upper surface of the second lead electrode 11c on the negative electrode side by a wire 50. The wire 50 is a gold wire having a wire diameter of 25 μm.

  The concave portion of the base 10 is filled with a translucent member 40 and covers the first light emitting element 20R, the second light emitting element 20G, and the third light emitting element 20B. The translucent member 40 uses a methyl phenyl silicone resin as a base material, and includes a manganese-activated potassium fluorosilicate first phosphor 30R (emission peak wavelength of about 630 nm) and a β sialon second phosphor 30G. It contains a wavelength converting substance 30 composed of (emission peak wavelength of about 540 nm) and a silicon oxide filler. The wavelength converting substance 30 is unevenly distributed on the lower side (the bottom surface of the recess) in the translucent member 40 due to sedimentation. The upper surface of the translucent member 40 is substantially the same surface as the upper surface of the substrate 10 (resin molded body 15), and is a substantially flat surface (strictly concave due to shrinkage due to curing). The translucent member 40 is formed by dropping a liquid constituent material into the recess of the substrate 10 by a dispenser or the like and curing it by heating.

  The light emitting device of Example 1 configured as described above can emit light with chromaticity (x, y) = (0.28, 0.28), 88 lm at a forward current of 120 mA. And the light-emitting device of this Example 1 can have the same effect as the light-emitting device 100 of Embodiment 1.

  A light emitting device according to an embodiment of the present invention includes a backlight device for a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guidance, a projector device, a digital video camera, a facsimile, a copy It can be used for an image reading apparatus in a machine, a scanner or the like.

DESCRIPTION OF SYMBOLS 10 ... Base | substrate 11a ... 1st lead electrode, 11c ... 2nd lead electrode 13a ... 1st wiring film, 13c ... 2nd wiring film, 13e ... 3rd wiring film 15, 17 ... Resin molding 20R ... 1st light emitting element ( Red light emitting element)
20G ... Second light emitting element (green light emitting element)
20B ... 3rd light emitting element (light emitting element of blue light emission)
30 ... Wavelength converting material 30R ... Red light emitting phosphor (first phosphor)
30G ... Green-emitting phosphor (second phosphor)
30Y ... Yellow-emitting phosphor (third phosphor)
40, 42 ... Translucent member 50 ... Wire 60, 65 ... Adhesive member 70 ... Protection element 80 ... Projection electrode 100, 200 ... Light emitting device

Claims (6)

A first light emitting element emitting red light;
A second light emitting element that emits green light;
A third light emitting element emitting blue light;
A flat plate-shaped translucent member that includes a wavelength converting material that absorbs and emits light from the third light-emitting element , and is positioned on an upper surface of the first to third light-emitting elements;
A resin molded body located between a side surface of the first light emitting element and a side surface of the third light emitting element, and having a light reflectance of 70% or more at an emission peak wavelength of the third light emitting element;
The first to third light emitting elements each have a pair of positive and negative electrodes on a lower surface, and a pair of protruding electrodes connected to the pair of positive and negative electrodes,
A plurality of wiring films located on the lower surface of the resin molded body and connected to the protruding electrodes;
With
The first light emitting element, the second light emitting element, and the third light emitting element are connected in series,
The radiant flux of the third light emitting element at the same forward current value is larger than the radiant flux of the first light emitting element and the radiant flux of the second light emitting element;
The wavelength converting substance is a phosphor emitting red light, a phosphor emitting green light, a combination of a phosphor emitting red light and a phosphor emitting green light, or a phosphor emitting yellow light. The
The resin molded body is a light-emitting device that covers the side surfaces of the first to third light-emitting elements, the lower surface of the first to third light-emitting elements, the side surface of the translucent member, and the side surfaces of the protruding electrodes . At the same forward current value, the radiant flux of the third light emitting element is larger than the radiant flux of the second light emitting element, and the radiant flux of the second light emitting element is larger than the radiant flux of the first light emitting element,
The light emitting device according to claim 1, wherein the wavelength converting substance is a phosphor that emits red light, a combination of a phosphor that emits red light and a phosphor that emits green light, or a phosphor that emits yellow light. . At the same forward current value, the radiant flux of the third light emitting element is larger than the radiant flux of the first light emitting element, and the radiant flux of the first light emitting element is larger than the radiant flux of the second light emitting element,
2. The light emitting device according to claim 1, wherein the wavelength converting substance is a phosphor emitting green light, a combination of a phosphor emitting red light and a phosphor emitting green light, or a phosphor emitting yellow light. .   The light-emitting device according to claim 1, wherein the phosphor that emits red light is a manganese-activated fluoride phosphor.   The light emitting device according to any one of claims 1 to 4, wherein the first light emitting element, the third light emitting element, and the second light emitting element are juxtaposed in the order of description.   The light emitting device according to any one of claims 1 to 5, wherein the resin molded body is positioned between a side surface of the second light emitting element and a side surface of the third light emitting element.

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