JP6819244B2 - Light emitting device - Google Patents

Description

The present invention relates to a light emitting device.

A light emitting device such as an LED (Light Emitting Diode) provided with a semiconductor light emitting element (hereinafter, also referred to as “light emitting element”) is known. The light emitting element is electrically bonded to the conductive member of the package via, for example, a wire. As the wire, a wire using gold or silver is generally used. Further, in the case of a semiconductor element such as an IC, it is known to use a coated copper wire in which the surface of the copper wire is coated with another metal such as palladium (for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-157745

When the tip of the coated copper wire is melted by electric discharge or the like to form an initial ball, the copper of the core material is exposed. In the case of ICs and the like, even if copper is exposed in this way, the characteristics are unlikely to be affected. However, in the case of a light emitting element, the light is absorbed by the exposed copper, which may reduce the light extraction efficiency.

Embodiments of the present invention include the following configurations.
A light emitting element having an electrode, a package having a conductive member and a light emitting element mounted on the upper surface, a core material containing copper as a main component, and a coating film having a higher reflectance than the core material were provided. A copper core wire having a ball portion connected to a conductive member or an electrode, a loop portion extending from the ball portion, and a connecting portion connected to the electrode or the conductive member, and a copper core wire. A light emitting device comprising a light reflecting resin for embedding the ball portion of the above.

As described above, it is possible to suppress a decrease in the light extraction efficiency of the light emitting device.

FIG. 1A is a schematic perspective view showing an example of a copper core wire. FIG. 1B is a schematic cross-sectional view showing an example of a copper core wire. FIG. 1C is a schematic cross-sectional view showing an example of a copper core wire. FIG. 1D is a schematic cross-sectional view showing an example of a copper core wire. FIG. 2A is a schematic top view showing an example of the light emitting device according to the embodiment. FIG. 2B is a schematic cross-sectional view taken along the line 2B-2B of FIG. 2A. FIG. 2C is a schematic cross-sectional view showing a modified example of the light emitting device according to the embodiment. FIG. 3A is a schematic cross-sectional view showing an example of the light emitting device according to the embodiment. FIG. 3B is a schematic cross-sectional view showing a modified example of the light emitting device according to the embodiment. FIG. 4A is a schematic top view showing an example of the light emitting device according to the embodiment. FIG. 4B is a schematic cross-sectional view taken along the line 4B-4B of FIG. 4A.

A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below exemplifies a light emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device to the following.

Further, the present specification does not specify the members shown in the claims as the members of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention to that alone unless otherwise specified. The size and positional relationship of the members shown in each drawing may be exaggerated to clarify the explanation. Further, in the following description, members of the same or the same quality are shown with the same name and reference numeral, and detailed description thereof will be omitted as appropriate.

In the present embodiment, the light emitting device includes a light emitting element, a package, a copper core wire, and a light reflecting resin. The package has a conductive member on the upper surface. The light emitting element includes electrodes. The copper core wire electrically connects the conductive member of the package and the electrode of the light emitting element. The light-reflecting resin embeds the ball portion of the copper core wire.

1A to 1D are schematic views showing a copper core wire 15. 1A is a schematic perspective view of the copper core wire 15, FIG. 1B is a schematic cross-sectional view in a direction perpendicular to the stretching direction of the copper core wire 15, and FIGS. 1C and 1D are schematic views in a direction parallel to the stretching direction of the copper core wire 15. It is a sectional view. The copper core wire 15 is a coating wire including a core material 154 containing copper as a main component and a coating film 155 containing a metal having a higher reflectance than the core material 154 as a main component.

Before joining the copper core wire 15 to the electrode of the conductive member or the light emitting element of the package, first, the tip of the copper core wire 15 drawn out from the capillary is melted by electric discharge or the like as shown in FIG. 1C. As a result, an initial ball 157 having a diameter larger than the diameter of the copper core wire 15 as shown in FIG. 1D is formed. The ball portion is formed by crimping and connecting the initial ball 157 on the conductive member of the package or on the electrode of the light emitting element.

As shown in FIG. 1D, the initial ball 157 has no boundary between the core material 154 and the coating film 155 by being melted, and the metal constituting the core material 154 and the metal forming the coating film 155 are formed. Becomes a metal mixing part in which and is mixed. A similar metal mixing portion is formed not only in the initial ball 157 but also in the copper core wire 15 serving as the loop portion 152 immediately above the initial ball 157. This metal mixing portion becomes a recrystallized portion 156 that has been recrystallized by being cooled.

The recrystallized portion 156 contains both a metal derived from the core material 154 and a metal derived from the coating film 155. Since the volume of the core material 154 is larger than the volume of the coating film 155, the recrystallized portion 157 strongly exhibits the characteristics of copper, which is the core material 154. That is, the ball portion 157 composed of the recrystallized portion 157 containing a large amount of Cu component is more likely to absorb light than the coating film 155. In the present embodiment, by covering the portion where the copper component is exposed with a light-reflecting resin, it is possible to reduce the absorption of light from the light emitting element.

<Embodiment 1>
FIG. 2A is a schematic top view showing the light emitting device 10 according to the first embodiment, and FIG. 2B is a schematic cross-sectional view taken along the line 2B-2B of FIG. 2A. The light emitting device 10 includes a light emitting element 14 and a package 11 on which the light emitting element 14 is mounted. The light emitting element 14 includes an electrode 142, and the package 11 includes a conductive member 13. The electrode 142 and the conductive member 13 are electrically connected by a copper core wire 15. The copper core wire 15 includes a ball portion 151 connected to the conductive member 13, a loop portion 152 extending from the ball portion 151, and a connecting portion 153 connected to the electrode 142. The ball portion 151 is embedded in the light reflecting resin 16.

The package 11 has a recess, and the light emitting element 14 is arranged on the bottom surface of the recess. The package 11 is, for example, a molding resin, and the conductive member 13 is, for example, a lead having plating formed on the surface of a metal plate. The light emitting element 14 is placed substantially in the center on the bottom surface of the recess, and the ball portion 151 of the copper core wire 15 is arranged at a position close to the inner surface of the recess. The light-reflecting resin 16 covers a part of the ball portion 151 and the loop portion 152, and is also in contact with the inner surface of the recess. That is, the light reflecting resin 16 is in contact with the bottom surface and the inner surface of the recess. As a result, the contact area between the light reflecting resin 16 and the package 11 can be increased, and the adhesion between the two can be improved.

The light-reflecting resin 16 has a ball portion 151 embedded therein, and as shown in FIG. 2A, is formed in an annular shape so as to surround the periphery of the light emitting element 14 in a top view. That is, two ball portions 151 are embedded in one light reflecting resin 16. As shown in FIG. 2B, the light-reflecting resin 16 formed in an annular shape can be an inclined surface whose inner side surface is inclined upward. As a result, the light from the light emitting element 14 can be easily reflected upward. That is, the light-reflecting resin 16 can be used as a member that not only suppresses the absorption of light by the ball portion 151 with the exposed copper component, but also further improves the light extraction efficiency. In particular, in the case of a resin material having low heat resistance and light resistance as the base material 12 of the package 11, a material that easily absorbs light such as black resin, and a material having high light transmittance such as ceramic, the light emitting element is described in this way. It is preferable to provide the light reflecting resin 16 so as to surround the periphery of the light reflecting resin 16. The light-reflecting resin 16 is preferably formed so as to cover 1% or more of the inner side surface of the recess, and more preferably 5% or more. The light reflecting resin 16 may be provided so as to cover the entire inner surface surface. Alternatively, it is preferably provided so as to cover the inner side surface at a position higher than the upper surface of the light emitting element 14.

In the light emitting device 10A shown in FIG. 2C, the light reflecting resin 16A has two ball portions 151 and a part of the loop portion 152 embedded therein, and is not in contact with the inner wall of the recess. That is, the light reflecting resin 16A is formed as a separate body so as to be separated from each other. As described above, the light reflecting member 16A may be used as a member that only suppresses the absorption of light by the ball portion 151. As a result, depending on the shape of the package or the package base material, it is possible to obtain an effect of further improving the light extraction efficiency or preventing a decrease in the light extraction efficiency as compared with FIG. 2B in contact with the inner wall of the recess.

<Embodiment 2>
FIG. 3A is a schematic cross-sectional view showing an example of the light emitting device 20 according to the second embodiment. The second embodiment is different from the first embodiment in that the ball portion 251 of the copper core wire 25 is connected to the electrode 142 of the light emitting element 14, and the connecting portion 253 is connected to the conductive member 13 of the package 11. Therefore, the light reflecting resin 26 in which the ball portion 251 is embedded is formed on the upper surface of the light emitting element 14. As for other configurations, the same configuration as that of the light emitting device 10 shown in the first embodiment can be applied.

The light emitting element 14 includes a pair of electrodes 142 serving as positive and negative electrodes on the upper surface of the laminated structure 141. That is, it includes two electrodes 142. The two ball portions 251 bonded to the two electrodes 142 are embedded in two light reflecting resins 26 which are separated from each other. When the upper surface of the light emitting element 14 is used as the light emitting surface, the light reflecting resin 26 is preferably formed in a small area. Therefore, in the example shown in FIG. 2A, the loop portion of the copper core wire is embedded in the light reflecting resin in a relatively large amount, whereas in the example shown in FIG. 3A, the copper core wire embedded in the light reflecting resin 26. The loop portion 252 of 25 is small.

FIG. 3B is a schematic cross-sectional view of a light emitting device 20A showing an example of a modification according to the second embodiment. In the light emitting device 20A, a pair of electrodes 142 on the upper surface of the light emitting element 14 are embedded in one light reflecting resin 26A. That is, it differs from the light emitting device 20 shown in FIG. 3A in that almost the entire upper surface of the light emitting element 14 is covered with the light reflecting resin 26A. Light is not emitted from the upper surface of such a light emitting element 14. That is, the light emitting element 14 emits light from the side surface of the laminated structure 141.

Another difference is that the package 21 has a flat plate shape without recesses. In the package 20A having no recess, the sealing member 27A is located on the side surface of the light emitting device 20A. That is, such a light emitting device 20A can emit light from the side surface. For the flat plate-shaped substrate 21, for example, ceramic or the like can be used as the base material 22. The conductive member 23 includes an upper surface conductive member 231 arranged on the upper surface of the base material 22, and a lower surface conductive member 232 arranged on the lower surface. The upper surface conductive member 231 and the lower surface conductive member 232 are conducted by an internal wiring 233 such as a via.

Since a wide area on the upper surface of the light emitting element 14 is covered with the light reflecting resin 26A, it is difficult for the light from the light emitting element 14 to be emitted from the upper surface. However, the light from the light emitting element 14 is emitted from the side surface. Since the light emitting device 20A is a flat plate-shaped package 21 having no recess, the light emitted from the side surface of the light emitting element 14 is emitted to the outside from the side surface of the light emitting device 20A. As a result, the light emitting device having a wider light distribution angle than the light emitting device 20 shown in FIG. 3A can be obtained.

<Embodiment 3>
FIG. 4A is a schematic top view showing the light emitting device 30 according to the third embodiment. FIG. 4B is a schematic cross-sectional view taken along the line 4B-4B of FIG. 4A. In the third embodiment, the ball portion is joined to both the top of the conductive member 33 of the package 31 and the top of the electrodes of the light emitting elements 341 and 342. Therefore, the light reflecting member covers the ball portion 551 on the conductive member 33 with the light reflecting resin (first light reflecting resin) 361, and the light reflecting member covers the ball portions 351 and 451 on the electrode (second light reflecting resin). ) It is different from the first and second embodiments in that it includes both of 362.

The light emitting device 30 includes a flat plate-shaped package 31. Specifically, the conductive member 33 is arranged on the upper surface of the flat plate-shaped base material 32. The conductive member 33 includes two conductive members 33a and 33c that function as a pair of electrodes. Further, two conductive members 33b and 33d are provided as conductive members that can function as conductive members but do not contribute to conduction. Since the conductive members 33a and 33c function as external connection terminals, the conductive members 33a and 33c are provided with a portion exposed to the outside without being covered with the light reflecting resin 361 or the sealing member 37. By making the outermost surface of the conductive member 33b a metal having high reflectance such as silver, the light from the light emitting element can be efficiently reflected to the outside. Further, the conductive member 33d can function as an identification symbol such as a cathode mark or an anode mark. The conductive members 33b and 33d that do not contribute to the continuity are not always essential and may be omitted.

The light-reflecting resin includes a light-reflecting resin (first light-reflecting resin 361) that coats the ball portion 441 on the conductive member 33 of the package 31 and light that covers the ball portions 351, 451 on the electrodes of the light-emitting elements 341 and 342. It includes a reflective resin (second light reflecting resin 362). It also includes a plurality of light emitting elements.

In the example shown in FIG. 4A, four light emitting elements are mounted on the package 31. The upper two light emitting elements and the lower two light emitting elements are respectively wired in series by a copper core wire. The two light emitting elements on the right side are connected to the conductive member 33c by a copper core wire, and the two light emitting elements on the left side are connected to the conductive member 33a by a copper core wire. As a result, the upper two light emitting elements and the lower two light emitting elements are wired in parallel. That is, in the light emitting device 30, four light emitting elements are connected in two series × 2 in parallel.

The number and arrangement of light emitting elements, the connection method, and the like are not limited to this. For example, one light emitting element may be used. In that case, the ball portion of the copper core wire may be joined on one electrode of the light emitting element, and the connecting portion of the copper core wire having the ball portion connected on the package may be connected to the other electrode. Further, when two or more light emitting elements are provided, the connection may be made by combining the series connection and the parallel connection as described above, or all may be connected in series, or all may be connected in parallel.

In the example shown in FIG. 4B, the light emitting element on the left side will be referred to as a first light emitting element 341, and the light emitting element on the right side will be referred to as a second light emitting element 342. It also includes three copper core wires that connect these two light emitting elements and the package. In the schematic cross-sectional view shown in FIG. 4B, the first copper core wire 35 connecting the conductive member 33a of the package 31 and the first light emitting element 341, and the second copper connecting the first light emitting element 341 and the second light emitting element 342. The third copper core wire 55 that connects the core wire 45, the second light emitting element 342, and the conductive member 33c of the package 31 will be described below.

The first light reflecting resin 361 is formed in an annular shape (frame shape) so as to embed the ball portion 551 on the conductive member 33 of the package 31 and surround the light emitting element. The first light-reflecting resin 361 formed in this frame shape also serves as a wall portion for forming a sealing member 37 that seals the light emitting element. In the first embodiment, an annular light-reflecting resin is provided inside the recess, and the wall portion of the recess is composed of a package and a light-reflecting resin. On the other hand, in the third embodiment, the frame-shaped wall portion is formed only by the first light-reflecting resin 361, thereby forming a concave portion. The height of the first light reflecting resin 361 is higher than the height of the light emitting element. Further, the height of the first light reflecting resin 361 is higher than the highest position of the copper core wire. This makes it easier to cover them with the sealing member.

Although an example in which the first light reflecting resin 361 has a frame shape is shown here, the present invention is not limited to this. For example, as shown in FIG. 2C in the first embodiment, only the ball portion on the package and its vicinity may be embedded. In that case, the sealing member may form the side surface of the light emitting device, or the wall portion may be formed of a light reflecting resin different from the first light reflecting resin in which the ball portion is embedded. Further, a package having a recess as shown in FIG. 2A or the like may be used.

The second light-reflecting resin 362 embeds a ball portion on the electrode of the light emitting element. Specifically, the ball portion 351 connected on the electrode of the first light emitting element 341 and the ball portion 451 connected on the electrode of the second light emitting element 342 are embedded by the second light reflecting resin 362. ..

In the third copper core wire 55, the ball portion 551 connected to the conductive member 33c and about half of the loop portion 552 are embedded in the first light reflecting resin 361. The connecting portion 553 of the third copper core wire 55 is connected to the electrode of the second light emitting element 342.

In the second copper core wire 45, the ball portion 451 is connected on the connecting portion 553 of the third copper core wire 55 connected on the electrode of the second light emitting element 342. Since the connecting portion 553 is connected so as to cover a part of the electrode of the second light emitting element 342, the ball portion 451 of the second copper core wire 45 is connected to the electrode of the second light emitting element 342 and the third copper core wire. It is connected to both of the connection portions 553 of 55. Most of the loop portion 452 of the second copper core wire 45 is embedded in the sealing member 37.

In the first copper core wire 35, the ball portion 351 is connected on the connecting portion 453 of the second copper core wire 45 connected on the electrode of the first light emitting element 341. Since the connecting portion 453 is connected so as to cover a part of the electrode of the first light emitting element 341, the ball portion 351 of the first copper core wire 45 is connected to the electrode of the first light emitting element 341 and the second copper core wire. It is connected to both of the connection portions 453 of 55. A part of the loop portion 352 and the connecting portion 353 of the first copper core wire 35 are embedded in the first light reflecting resin 361.

As described above, the first copper core wire 35 and the third copper core wire 55 are embedded in both the first light reflecting resin 361 and the second light reflecting resin 362. The second copper core wire 45 is embedded only in the second light reflecting resin 362.
Hereinafter, each member will be described in detail.

(Light emitting element)
The light emitting element includes a laminated structure including an element substrate and a semiconductor layer including a light emitting layer, and an electrode. The p layer, light emitting layer, and n layer constituting the semiconductor layer are not particularly limited, and are, for example, In _X Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1). Nitride-based compound semiconductors such as the above are preferably used. Each of these nitride semiconductor layers may have a single-layer structure, but may also have a laminated structure of layers having different compositions and film thicknesses, a superlattice structure, or the like. In particular, the light emitting layer preferably has a single quantum well or multiple quantum well structure in which thin films that generate a quantum effect are laminated. The element substrate is not always essential, and may be a laminated structure composed of only a semiconductor layer.

The pair of electrodes of the light emitting element are arranged on the same surface side of the semiconductor layer. These pair of electrodes may have a single-layer structure as long as they are ohmic-connected to the above-mentioned first semiconductor layer and second semiconductor layer so that the current-voltage characteristics are linear or substantially linear, respectively. , May be a laminated structure. Such electrodes can be formed of any thickness using materials and configurations known in the art. For example, a dozen μm to 300 μm is preferable.

(package)
The package is a member on which a light emitting element is placed. The package includes a base material and a conductive member. As the package, a resin package having a lead as a conductive member and a resin member as a base material can be used. Further, as the package, a ceramic package having a ceramic as a base material and a wiring member as a conductive member can be used. Further, as the package, a glass epoxy package having a glass epoxy as a base material and a wiring member as a conductive member can be used. Such a package may have a flat plate shape or a structure having recesses. Alternatively, the package may include a plate-shaped member having a conductive member on the upper surface of a base material such as metal or ceramic, and a frame formed by drawing, bonding, molding, or the like.

(Copper core wire)
The copper core wire is a member that electrically connects the electrodes of the light emitting element and the conductive member of the package. The core material of the copper core wire mainly contains copper. The core material preferably contains 15% or more of copper. The copper core wire includes a coating film that covers the core material. The coating film contains a metal having a higher reflectance than the core material. For example, Ag, Au, Al, Pd and alloys thereof can be mentioned. The core material or coating film may contain Ca, Sr, Y, La, Ce, Eu, Be, Ge, In, Sn, Pt, Cu, Ru, Os, Ir and the like as trace components. In addition, it may contain unavoidable impurities.

The diameter of the copper core wire can be about 10 μm to 30 μm. Further, the core material may have a diameter of about 9.5 μm to 25 μm. The thickness of the covering portion can be about 0.5 μm to 5 μm.

(Light reflective resin)
The light-reflecting resin is a member for embedding the ball portion of the copper core wire. As a result, it is possible to suppress the absorption of light by the copper exposed in the ball portion of the copper core wire and suppress the reduction in the light extraction efficiency. As the material constituting the light-reflecting resin, a member that does not easily absorb the light from the light emitting element and efficiently reflects the light is preferable. The specific reflectance is preferably at least 50% or more, and more preferably 70% or more.

Further, an insulating member is preferable, and a member that is not easily deteriorated by light from a light emitting element or external light is preferable. Further, it has a certain degree of strength, and a thermosetting resin, a thermoplastic resin and the like can be used, and more specific examples thereof include a phenol resin, a glass epoxy resin, a BT resin, a PPA and a silicone resin. Light can be efficiently reflected by adding a reflective member (for example, TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO, ZnO) that reflects light from the light emitting element to these base resins. ..

(Sealing member)
The sealing member contains a translucent resin. It may also contain additives such as phosphor particles and diffusing materials. The sealing member is a member that protects electronic components mounted on a package, such as a light emitting element, a protective element, and a wire, from dust, moisture, external force, and the like. As the material of the sealing member, it is preferable that the material has a translucency that allows light from a light emitting element to be transmitted and has a light resistance that is not easily deteriorated by them.

Specific materials for the translucent resin include light from a light emitting element such as a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition. Examples thereof include an insulating resin composition having excellent translucency. Further, silicone resin, epoxy resin, urea resin, fluororesin, hybrid resin containing at least one of these resins, and the like can also be used.

The phosphor is in the form of particles, and the shape of the phosphor is not particularly limited, but is preferably spherical or a shape similar thereto. The phosphor is, for example, particles having an average particle size of about 3 μm to 30 μm. Here, the average particle size can be defined by D50. The average particle size of the phosphor can be measured by, for example, a laser diffraction / scattering method, an image analysis method (scanning electron microscope (SEM), transmission electron microscope (TEM)), or the like. As the particle size measuring device of the laser diffraction / scattering method, for example, the SALD series (for example, SALD-3100) manufactured by Shimadzu Corporation can be used. The image analysis method conforms to, for example, JIS-Z8827-1: 2008.

Examples of the phosphor include oxide-based, sulfide-based, and nitride-based phosphors. For example, when a gallium nitride-based light emitting element that emits blue light is used as the light emitting element, YAG type, LAG type, SiAlON type (β-sialon) that emits green light, SGS phosphor, and blue light that absorb blue light and emit yellow to green light. Examples thereof include a BAM phosphor that emits light, a SCASN that emits red light, a CASN-based phosphor, a manganese-activated potassium fluoride silicate (KSF-based phosphor; K2SiF6: Mn), and a sulfide-based phosphor that may be used alone or in combination. ..

The phosphor is contained in, for example, 1 part by weight to 200 parts by weight in the resin member. Further, in addition to such a material, a colorant, a light diffusing agent, a light reflecting material, various fillers, and the like can be contained, if desired. The filling amount of the resin member may be any amount as long as the electronic parts are covered.

The light emitting device according to the present invention can be a light emitting device having high light extraction efficiency in a light emitting device using a wire.

10, 10A, 20, 20A, 30 ... Light emitting device 11, 21, 31 ... Package 12, 22, 32 ... Base material 13, 23, 33a, 33b, 33c, 33d ... Conductive member 231 ... Top conductive wiring 232 ... Bottom conductive Wiring 233 ... Internal wiring 14 ... Light emitting element (141 ... Laminated structure, 142 ... Electrode)
341 ... 1st light emitting element 342 ... 2nd light emitting element 15 ... Copper core wire (151 ... ball part, 152 ... loop part, 153 ... connection part)
154 ... Core material 155 ... Coating film 156 ... Recrystallization region 157 ... Initial ball 25 ... Copper core wire (251 ... Ball part, 252 ... Loop part, 253 ... Connection part)
35 ... 1st copper core wire (351 ... ball part, 352 ... loop part, 353 ... connection part)
45 ... 2nd copper core wire (451 ... ball part, 452 ... loop part, 453 ... connection part)
55 ... 3rd copper core wire (551 ... ball part, 552 ... loop part, 535 ... connection part)
16, 16A, 26, 26A ... Light reflecting resin 361 ... First light reflecting resin 362 ... Second light reflecting resin 17, 27, 37 ... Sealing member

Claims (8)

A light emitting element equipped with electrodes and
A package with a conductive member and the above light emitting element mounted on the upper surface,
A copper core wire having a core material containing copper as a main component and a coating film having a higher reflectance than the core material, and a ball portion connected to the conductive member or the electrode, and the ball portion. A copper core wire including a loop portion extending from the electrode and a connecting portion connected to the electrode or the conductive member.
A light-reflecting resin for embedding the ball portion of the copper core wire,
A light emitting device equipped with. The light emitting device according to claim 1, wherein the light reflecting resin is arranged in an annular shape so as to surround the light emitting element. The light emitting device according to claim 1 or 2, wherein the package has a recess, and the light reflecting resin is in contact with the inner surface of the recess. The light emitting device according to claim 1 or 2, wherein the package is flat. The light-reflecting resin includes a first light-reflecting resin for embedding the ball portion connected to the conductive member and a second light-reflecting resin for embedding the ball portion connected to the electrode. The light emitting device according to any one of claim 4. The light emitting device according to any one of claims 1 to 5, wherein the coating film contains Ag. The light emitting device according to any one of claims 1 to 6, wherein the coating film contains Au. The light emitting device according to any one of claims 1 to 7, wherein the light reflecting resin contains TiO ₂ .

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