JP6301721B2 - Wiring board manufacturing method, sheet thickness detection method - Google Patents

Description

  The present invention relates to a method of manufacturing a wiring board through a step of cutting a sheet that becomes a layer constituting the wiring board, and a method of detecting the thickness of the sheet when the sheet is cut. .

  Conventionally, a manufacturing process of a wiring board has a step of cutting a sheet that becomes a layer constituting the wiring board with a cutting member. However, the thickness of the sheet is not necessarily kept constant. For this reason, in the conventional manufacturing process, when the sheet is cut, the thickness of the sheet is inspected. Here, as a method for inspecting the thickness of the sheet, a sampling inspection for measuring the thickness of the extracted sheet after extracting a part of the sheet flowing through the line has been proposed. Further, as another method for inspecting the thickness of a sheet, an in-line inspection for measuring the thickness of a sheet flowing through a line using a measuring instrument incorporated in the line has been proposed (for example, see Patent Document 1). ). As the measuring instrument, for example, a non-contact type such as a laser is used.

JP 2003-291204 A (FIG. 1 etc.)

  However, when performing a sampling inspection, not all sheet thicknesses are measured, so there is a high possibility of leakage in the inspection, leading to a decrease in yield. On the other hand, in the case of performing in-line inspection, since the thickness of all sheets is continuously measured, there is no leakage in the inspection. However, when a laser is used as a measuring instrument, there is a problem that the thickness of the sheet cannot be measured because the laser absorptivity and reflectivity become too high depending on the type and surface state of the sheet. Further, when a measuring instrument that measures only one side (upper surface or lower surface) of the sheet is used, there is a problem that the thickness of the sheet cannot be measured accurately if the sheet is lifted or warped. That is, when performing in-line inspection, the thickness of the sheet cannot be reliably measured, which may lead to a decrease in yield.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a wiring board capable of improving yield by accurately detecting the thickness of the sheet, and sheet thickness detection. It is to provide a method.

  And as means (means 1) for solving the above-mentioned problems, there is provided a method for producing a wiring board through a sheet cutting step of cutting a sheet constituting a layer constituting the wiring board by a cutting member, wherein the sheet In the cutting step, the magnitude of the mechanical load applied to the cutting member when the sheet is cut is detected by a load detection means, and the magnitude of the mechanical load detected by the load detection means is determined by the thickness of the sheet. There is a method of manufacturing a wiring board characterized in that it is replaced by a wiring board.

  Therefore, according to the invention described in the means 1, since the mechanical load applied to the cutting member when the sheet is cut is directly replaced with the sheet thickness, the sheet thickness is accurately detected. can do. Therefore, based on the magnitude of the mechanical load, it is possible to reliably detect whether or not a defect has occurred in the sheet (specifically, a defect in which the sheet is too thick or too thin). Therefore, the problem that the wiring board is manufactured using a sheet having a defect is prevented in advance, so that the yield of the wiring board can be improved.

  Hereinafter, the manufacturing method of the means 1 will be described.

  In the sheet cutting step, a sheet to be a layer constituting the wiring board is cut by a cutting member. As a sheet | seat used as the layer which comprises a wiring board, the resin sheet used as a resin insulation layer, the ceramic green sheet used as a ceramic layer, etc. are mentioned, for example. Specific examples of the resin material used for the resin sheet include polyethylene terephthalate resin, epoxy resin, polyimide resin, bismaleimide-triazine resin, polyphenylene ether resin, and the like. In addition, composite materials of these resins and glass fibers (glass woven fabric or glass nonwoven fabric) or organic fibers such as polyamide fibers may be used. Alternatively, a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin into a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. Specific examples of the ceramic material used for the ceramic green sheet include aluminum oxide (alumina), aluminum nitride, boron nitride, silicon carbide, silicon nitride, and the like, which are sintered bodies of high-temperature fired ceramics. In addition, a glass ceramic in which an inorganic ceramic filler such as alumina is added to a borosilicate glass or lead borosilicate glass, which is a sintered body of a low-temperature fired ceramic, can also be mentioned.

  Further, the thickness of the sheet is not particularly limited, but is preferably 0.1 mm or more and 2.0 mm or less, for example. In this way, the thickness of the sheet can be detected well. If the thickness is less than 0.1 mm, the mechanical load applied to the cutting member when cutting the sheet becomes extremely small, so that it is difficult to detect the magnitude of the mechanical load by the load detection means. Thus, it becomes difficult to replace the magnitude of the mechanical load with the thickness of the sheet. On the other hand, when the thickness is larger than 2.0 mm, it becomes difficult to cut the sheet.

  Furthermore, although it does not specifically limit as a cutting member, What is necessary is just to be thinly formed with the material harder than a sheet | seat and being hard to deform | transform, For example, at least 1 of a rotary blade, a flat blade, and a metal wire may be sufficient. In this way, when the sheet is cut, a mechanical load is always applied to the cutting member, so that the magnitude of the mechanical load can be reliably detected by the load detection means. In addition, the sheet can be easily cut only by moving at least one of the cutting member and the sheet while the cutting member is in contact with the sheet.

  Here, the load detecting means is not particularly limited, but may be, for example, at least one of a tension gauge, a torque gauge, a load gauge, and a piezoelectric element. In this way, it is possible to reliably detect the magnitude of the mechanical load applied to the cutting member when the sheet is cut by using an appropriate load detection means according to the type of the cutting member. When the cutting member is, for example, a rotary blade, the load detection means is preferably a torque gauge that is provided on the rotary shaft of the rotary blade and detects the magnitude of torque applied to the rotary shaft. In addition, when the cutting member is, for example, a metal wire, the load detection means may be a tension gauge that contacts the metal wire and detects the magnitude of the tension applied to the metal wire.

  Further, another means (means 2) for solving the above-described problem is a method of detecting the thickness of the sheet when the sheet is cut by a cutting member, and the method is performed when the sheet is cut. Sheet thickness detection characterized in that the magnitude of a mechanical load applied to the cutting member is detected by a load detection means, and the magnitude of the mechanical load detected by the load detection means is replaced with the thickness of the sheet. There is a way.

  Therefore, according to the invention described in the means 2, since the mechanical load applied to the cutting member when cutting the sheet is directly replaced with the sheet thickness, the sheet thickness is accurately detected. can do. Therefore, based on the magnitude of the mechanical load, it is possible to reliably detect whether or not a defect has occurred in the sheet (specifically, a defect in which the sheet is too thick or too thin). Therefore, it is possible to suppress a decrease in yield due to a bad influence on the seat.

The schematic explanatory drawing which shows the manufacturing apparatus of the ceramic green sheet in 1st Embodiment. The schematic explanatory drawing which shows the cutting machine of the ceramic green sheet in 1st Embodiment. The principal part perspective view which shows the cutting machine of the ceramic green sheet in 1st Embodiment. In 1st Embodiment, the graph which shows the relationship between the thickness of a ceramic green sheet, and the torque applied to a lower side rotary blade when cut | disconnecting a ceramic green sheet. The graph which shows the relationship between the position of the ceramic green sheet in 1st Embodiment, and the thickness of a ceramic green sheet. Schematic explanatory drawing which shows the cutting machine in 2nd Embodiment. The principal part perspective view which shows the cutting machine in 2nd Embodiment.

[First Embodiment]
Hereinafter, a first embodiment embodying the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows an apparatus 1 for manufacturing a ceramic green sheet 51. The manufacturing apparatus 1 includes a film delivery roller 2 (film delivery means), a film guide roller 3, a coating machine 4, a drying furnace 5, a film peeling mechanism 6, a cutting machine 7, and a sheet take-up roller 8. The film delivery roller 2 is configured to feed a carrier film 50 made of PET (polyethylene terephthalate) by being rotationally driven by a film delivery motor (not shown). Further, the film guide roller 3 abuts on the back surface of the carrier film 50 and rotates as the carrier film 50 is fed. The film guide roller 3 guides the carrier film 50 to the coating machine 4.

  The coating machine 4 includes a film support 11, a liquid reservoir 12, and a doctor blade 13. The film support base 11 supports the carrier film 50 guided by the film guide roller 3 from the back side. The liquid reservoir 12 has a function of storing the slurry and continuously applying the stored slurry to the upper surface (surface) of the carrier film 50. The slurry of the present embodiment includes an alumina powder and a thermally decomposable organic binder (for example, a butyral binder that softens at about 80 ° C. and thermally decomposes at about 250 ° C.), and a solvent such as an organic solvent or water. Are mixed. The doctor blade 13 is disposed below the liquid reservoir 12 in a state of being separated from the upper surface of the carrier film 50 supported by the film support 11 by a predetermined length. For example, when the ceramic green sheet 51 having a thickness of 0.4 mm is formed, the doctor blade 13 is separated from the upper surface of the carrier film 50 by 1.0 mm in consideration of volume reduction due to volatilization of the solvent contained in the slurry. Placed in a state. The doctor blade 13 has a function of adjusting the thickness of the slurry by coming into contact with the slurry coated on the carrier film 50 and scraping off an excess portion of the slurry. Thereafter, the carrier film 50 and the slurry are introduced into the drying furnace 5.

  As shown in FIG. 1, the drying furnace 5 is disposed downstream of the coating machine 4 in the traveling direction of the carrier film 50. Moreover, the drying furnace 5 heats and dries the slurry coated on the upper surface of the carrier film 50. As a result, the slurry becomes a ceramic green sheet 51 having a predetermined thickness (for example, 0.4 mm). The ceramic green sheet 51 is a sheet that becomes a ceramic layer constituting a ceramic wiring board (not shown). The ceramic wiring board of this embodiment has a structure in which a plurality of ceramic layers are stacked.

  Further, the film peeling mechanism 6 is disposed downstream of the drying furnace 5 in the traveling direction of the carrier film 50. The film peeling mechanism 6 is for peeling the carrier film 50 from the ceramic green sheet 51. The film peeling mechanism 6 includes a film pressing roller 21, a film winding roller 22, and a film discharge roller 23. The film pressing roller 21 is in contact with the back surface of the carrier film 50 and rotates as the carrier film 50 and the ceramic green sheet 51 move. The film winding roller 22 has a function of peeling the carrier film 50 from the ceramic green sheet 51 and winding and collecting the peeled carrier film 50. The film discharge roller 23 abuts on the upper surface of the ceramic green sheet 51 from which the carrier film 50 has been peeled off, and rotates as the ceramic green sheet 51 moves. The film discharge roller 23 is for guiding the ceramic green sheet 51 to the cutting machine 7 side.

  As shown in FIGS. 1 to 3, the cutting machine 7 includes a sheet carry-in roller 31, a sheet discharge roller 32, an upper rotary blade 41 (cutting member), and a lower rotary blade 42 (cutting member). The sheet carry-in roller 31 abuts on the back surface of the ceramic green sheet 51 and rotates as the ceramic green sheet 51 moves.

  Further, a plurality (three in this embodiment) of the upper rotary blade 41 and the lower rotary blade 42 are provided. The upper rotary blades 41 are arranged at equal intervals along the width direction of the ceramic green sheet 51 on the upper surface side of the ceramic green sheet 51. Each upper rotary blade 41 is disposed so that the blade edge penetrates the ceramic green sheet 51 from the upper side to the lower side and the blade hits the ceramic green sheet 51 at a right angle. Each upper rotary blade 41 can rotate around a common rotation shaft 43, and the rotation shaft 43 is connected to a rotation shaft 46 of a motor 45.

  As shown in FIGS. 1 and 2, the lower rotary blades 42 are arranged at equal intervals along the width direction of the ceramic green sheet 51 on the back side of the ceramic green sheet 51. Each of the lower rotary blades 42 is disposed such that the blade edge penetrates the ceramic green sheet 51 from the lower side to the upper side, and the blade hits the ceramic green sheet 51 at a right angle. A part of the back surface of the lower rotary blade 42 is in contact with a part of the back surface of the upper rotary blade 41. Each lower rotary blade 42 is rotatable around a rotation shaft 47, and the rotation shaft 47 is connected to the rotation shaft of the torque gauge 48 and the motor 45 through a joint 44.

  Each upper rotary blade 41 and each lower rotary blade 42 are rotated by driving a motor 45 so as to cut the ceramic green sheet 51 carried by the sheet carry-in roller 31 along its longitudinal direction. It has become. As a result, the ceramic green sheet 51 is divided into two strip-shaped cut sheets 52 having a smaller width and excessive portions 53 on both sides of the two cut sheets 52 (see FIG. 3).

  As shown in FIG. 2, a torque gauge 48 serving as a load detection unit is attached to the rotating shaft 46 of the motor 45. The torque gauge 48 is a measuring instrument that can detect the magnitude of the torque (mechanical load) applied to the rotary shaft 47 of the lower rotary blade 42 when the ceramic green sheet 51 is cut. The magnitude of the torque detected by the torque gauge 48 increases as the ceramic green sheet 51 becomes thicker. The torque gauge 48 of the present embodiment detects the magnitude of torque applied to the rotary shaft 47 of the lower rotary blade 42, but detects the magnitude of torque applied to the rotary shaft 43 of the upper rotary blade 41. You may do.

  A pair of sheet discharge rollers 32 shown in FIG. 1 are provided so as to correspond to the two cut sheets 52, respectively. Each sheet discharge roller 32 is in contact with the back surface of the cut sheet 52 and rotates as the cut sheet 52 moves. Each sheet discharge roller 32 is for guiding the cut sheet 52 to the sheet take-up roller 8.

  A pair of sheet take-up rollers 8 are provided so as to correspond to the two cut sheets 52, respectively. Each sheet take-up roller 8 has a function of taking up and collecting the cut sheet 52 guided by the sheet discharge roller 32. The sheet take-up roller 8 is rotatably supported by a roller support shaft (not shown) and is detachably supported on the roller support shaft. The roller support shaft is rotationally driven by a support shaft drive motor (not shown). As a result, the cut sheet 52 is wound around the sheet winding roller 8. Thereafter, the cut sheet 52 taken up by the sheet take-up roller 8 is carried out from the manufacturing apparatus 1 together with the sheet take-up roller 8.

  Next, the electrical configuration of the manufacturing apparatus 1 will be described.

  As shown in FIG. 2, the manufacturing apparatus 1 includes a control device 61 that controls the entire apparatus. The control device 61 includes a CPU 62, a ROM 63 (storage means), a RAM 64, an input / output circuit, and the like. The CPU 62 is electrically connected to the motor 45 and the like, and controls them by various drive signals. The torque signal output from the torque gauge 48 is input to the CPU 62. The ROM 63 stores upper limit value data indicating the upper limit value of the thickness of the ceramic green sheet 51 and lower limit value data indicating the lower limit value of the thickness of the ceramic green sheet 51. In this embodiment, when the design value of the thickness of the ceramic green sheet 51 is 0.4 mm, the upper limit value is 0.5 mm and the lower limit value is 0.3 mm. When the design value of the thickness of the ceramic green sheet 51 is 0.8 mm, the upper limit value is 0.9 mm and the lower limit value is 0.7 mm. Furthermore, when the design value of the thickness of the ceramic green sheet 51 is 1.6 mm, the upper limit value is 1.7 mm and the lower limit value is 1.5 mm.

  Next, the manufacturing method of the ceramic wiring board using said manufacturing apparatus 1 is demonstrated.

  First, the ceramic green sheet 51 is formed. Specifically, a slurry is prepared by the following procedure. Alumina powder and a thermally decomposable organic binder are mixed using a solvent such as an organic solvent or water. As a result, a slurry is obtained as a starting material when forming the ceramic green sheet 51 to be a ceramic layer.

  Next, the ceramic green sheet 51 is formed using this slurry as follows. Specifically, first, a roll of a carrier film 50 having a predetermined width is prepared, and this roll is set on the film delivery roller 2. Next, a feeding process for continuously feeding the carrier film 50 by the film feeding roller 2 is performed. In the subsequent coating process, the slurry is cast (coated) with a thin and uniform thickness on the upper surface of the carrier film 50 fed onto the film support 11 of the coating machine 4 by the doctor blade method. Further, the thickness of the coated slurry is adjusted using the doctor blade 13 of the coating machine 4. Thereafter, a drying step is performed, and the slurry coated on the carrier film 50 is heated and dried in the drying furnace 5 to be solidified, whereby the ceramic green sheet 51 is obtained.

  After the drying process, a peeling process for continuously peeling the carrier film 50 is performed. In the peeling process, the carrier film 50 on which the ceramic green sheet 51 is formed is wound while being pulled along the peripheral surface of the film winding roller 22 of the film peeling mechanism 6. As a result, the carrier film 50 is peeled from the ceramic green sheet 51. The peeled carrier film 50 is taken up by the film take-up roller 22 and collected. Further, the ceramic green sheet 51 is guided to the cutting machine 7 side by the film discharge roller 23 and guided into the cutting machine 7 by the sheet carry-in roller 31 of the cutting machine 7.

  After the peeling process, a sheet cutting process is performed, and the ceramic green sheet 51 is cut by the upper rotary blade 41 and the lower rotary blade 42 of the cutting machine 7, and the ceramic green sheet 51 is divided into two smaller cutting sheets 52 and It divides | segments into the excess part 53 in the both sides of the two cutting sheets 52 (refer FIG. 3). At this time, although the ceramic green sheet 51 moves at a constant speed, the upper rotary blade 41 and the lower rotary blade 42 are rotatably supported by the rotary blade support portion 49 (see FIG. 1), so that they do not move. It has become. The cut sheet 52 is guided to the sheet take-up roller 8 by the sheet discharge roller 32.

  In the sheet cutting step, the magnitude of torque applied to the rotating shaft 47 of the lower rotary blade 42 when the ceramic green sheet 51 is cut is detected by a torque gauge 48 (see FIG. 2). Then, the torque gauge 48 outputs a torque signal indicating the magnitude of the detected torque to the CPU 62 of the control device 61.

  The CPU 62 replaces the magnitude of the torque indicated by the torque signal with the thickness of the ceramic green sheet 51. In addition, the ceramic green sheet 51 becomes thick, so that the torque which a torque signal shows becomes large (refer FIG. 4). Next, the CPU 62 determines whether or not the thickness of the ceramic green sheet 51 is larger than the upper limit value. Further, the CPU 62 determines whether or not the thickness of the ceramic green sheet 51 is smaller than the lower limit value. Then, in the region A1 (see FIG. 5) where the thickness of the ceramic green sheet 51 is not more than the upper limit value and not less than the lower limit value, the CPU 62 determines that the ceramic green sheet 51 is a non-defective product. On the other hand, in the region A2 (see FIG. 5) where the thickness of the ceramic green sheet 51 is larger than the upper limit value or the region where the thickness is smaller than the lower limit value, the CPU 62 determines that the ceramic green sheet 51 is defective.

  After the sheet cutting step, a winding step of winding and collecting the cut sheet 52 by the sheet winding roller 8 is performed. The cut sheet 52 taken up by the sheet take-up roller 8 is cut according to the size of the ceramic layer constituting the ceramic wiring board. Moreover, the area | region (refer area | region A2 of FIG. 5) determined to be inferior goods in the cutting sheet 52 is removed.

  Thereafter, the cut sheet 52 is punched using a mechanical drill, a YAG laser, a carbon dioxide laser, an excimer laser, a punching device, or the like to form a plurality of through holes at predetermined positions. Next, using a conventionally known paste printing apparatus (not shown), the through hole of the cut sheet 52 is filled with a conductive paste (in this embodiment, tungsten paste) to form an unfired via conductor. Further, the conductive paste is printed using a conventionally known paste printing apparatus to form an unfired conductor layer.

  Then, after the conductive paste is dried, a plurality of cut sheets 52 are stacked and disposed, and a pressing force is applied in the sheet stacking direction, whereby the cut sheets 52 are pressed and integrated to form a ceramic laminate. Next, the ceramic laminate is degreased and fired at a predetermined temperature for a predetermined time. As a result, the alumina in the cut sheet 52 and the tungsten in the paste are simultaneously sintered, and a ceramic wiring board having a via conductor and a conductor layer is formed.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) According to the method for manufacturing a ceramic wiring board of the present embodiment, the magnitude of the torque applied to the rotating shaft 47 of the lower rotary blade 42 when cutting the ceramic green sheet 51 is directly determined. The thickness is replaced. For this reason, even if the ceramic green sheet 51 is lifted or warped, the thickness of the ceramic green sheet 51 can be accurately detected. Therefore, based on the magnitude of the torque, it is possible to reliably detect whether or not there is a problem that the ceramic green sheet 51 is too thick or too thin. Therefore, since the problem that the ceramic wiring board is manufactured using the defective ceramic green sheet 51 is prevented, the yield of the ceramic wiring board can be improved.

  (2) In this embodiment, the inspection device (torque gauge 48) for inspecting the thickness of the ceramic green sheet 51 is incorporated in the cutting machine 7 used when performing the sheet cutting process. Therefore, since it is not necessary to provide a space dedicated for inspection equipment in the manufacturing apparatus 1, it is easy to reduce the size of the manufacturing apparatus 1.

  (3) For example, as a measuring instrument for measuring the thickness of the ceramic green sheet 51, a light emitting unit and a light receiving unit are arranged on the front side and the back side of the ceramic green sheet 51, respectively, and the ceramic green sheet 51 is irradiated from the light emitting unit. It is conceivable to use a non-contact type measuring instrument that measures the thickness of the ceramic green sheet 51 by causing the light receiving unit to receive a laser. However, in this case, there is a problem that an error occurs in the measurement value unless the light emitting unit and the light receiving unit are accurately aligned. Further, depending on the forming material and the surface state of the ceramic green sheet 51, there is a problem that the laser absorptivity and reflectivity are too large to be measured.

  Therefore, in the present embodiment, the thickness of the ceramic green sheet 51 is indirectly measured using the torque gauge 48. In this case, since it is not necessary to align the light emitting unit and the light receiving unit, the thickness of the ceramic green sheet 51 can be measured easily and accurately. In addition, the thickness of the ceramic green sheet 51 can be reliably measured regardless of the forming material and surface state of the ceramic green sheet 51.

  (4) In this embodiment, after the sheet cutting step, a winding step for winding and collecting the cut sheet 52 is further performed. If the cut sheet 52 is dropped and collected, the collected cut sheet 52 becomes bulky and takes time and effort. On the other hand, in this embodiment, since the cut sheet 52 is wound up into a roll shape, the recovery can be performed in a short time.

[Second Embodiment]
A second embodiment embodying the present invention will be described below. Here, the description will focus on the parts that are different from the first embodiment.

  As shown in FIGS. 6 and 7, in this embodiment, the cutting member and the load detection means are different from those in the first embodiment. That is, the cutting machine 71 of this embodiment includes a plurality of (three in this embodiment) metal wires 72 (cutting members). The metal wires 72 are arranged at equal intervals along the width direction of the ceramic green sheet 73. Further, each metal wire 72 extends along the thickness direction of the ceramic green sheet 73 and is disposed so as to contact the ceramic green sheet 73 at a right angle. Each metal wire 72 cuts the ceramic green sheet 73 along its longitudinal direction as the ceramic green sheet 73 carried into the cutting machine 71 advances.

  The cutting machine 71 includes an upper winding unit 74 and a lower winding unit 75. The upper end portion of the metal wire 72 is wound around the core portion of the upper winding portion 74, and the lower end portion of the metal wire 72 is wound around the core portion of the lower winding portion 75. As a result, a strong tension is applied to the metal wire 72. In addition, a tension gauge 76 serving as a load detecting means is attached in the vicinity of the lower winding portion 75. The tension gauge 76 is in contact with the metal wire 72 and is a measuring instrument that can detect the magnitude of the tension (mechanical load) applied to the metal wire 72 when the ceramic green sheet 73 is cut. The tension is a cutting resistance applied to the metal wire 72 when the ceramic green sheet 73 is cut. Although the tension gauge 76 of the present embodiment is provided in the vicinity of the lower winding portion 75, it may be provided in the vicinity of the upper winding portion 74. Further, instead of providing the tension gauge 76, a torque gauge similar to that of the first embodiment may be attached to the cores of the upper winding portion 74 and the lower winding portion 75.

  A tension signal indicating the magnitude of the detected tension is output from the tension gauge 76 to the CPU of the control device. The CPU replaces the magnitude of the tension indicated by the tension signal with the thickness of the ceramic green sheet 73. The ceramic green sheet 73 becomes thicker as the tension indicated by the tension signal increases. Next, the CPU determines whether the thickness of the ceramic green sheet 73 is larger than the upper limit value and whether the thickness of the ceramic green sheet 73 is smaller than the lower limit value. When the thickness of the ceramic green sheet 73 is equal to or less than the upper limit value and equal to or greater than the lower limit value, the CPU determines that the ceramic green sheet 73 is a non-defective product. On the other hand, when the thickness of the ceramic green sheet 73 is larger than the upper limit value or smaller than the lower limit value, the CPU determines that the ceramic green sheet 73 is defective.

  That is, in this embodiment, the magnitude of the tension applied to the metal wire 72 when the ceramic green sheet 73 is cut is directly replaced with the thickness of the ceramic green sheet 73. For this reason, even if the ceramic green sheet 73 is floated or warped, the thickness of the ceramic green sheet 73 can be accurately detected. Therefore, based on the magnitude of the tension, it can be reliably detected whether or not there is a problem that the ceramic green sheet 73 is too thick or too thin. Therefore, the problem that the ceramic wiring board is manufactured using the defective ceramic green sheet 73 is prevented in advance, so that the yield of the ceramic wiring board can be improved.

  In addition, you may change embodiment of this invention as follows.

  In each of the above embodiments, ceramic green sheets 51 and 73 are ceramic green based on the magnitude of the mechanical load (torque, tension) applied to the cutting member (lower rotary blade 42, metal wire 72). The thickness of the sheets 51 and 73 was detected. However, the amount of change in the mechanical load applied to the cutting member when the ceramic green sheets 51 and 73 are cut is measured, and the amount of change in the thickness of the ceramic green sheets 51 and 73 is detected based on the amount of change. Also good.

  In the first embodiment, the magnitude of the torque applied to the entire three lower rotary blades 42 is detected by one torque gauge 48, and the thickness of the ceramic green sheet 51 is determined based on the detected magnitude of the torque. It was derived. However, one torque gauge 48 is provided for each lower rotary blade 42, and the thickness of the ceramic green sheet 51 is derived based on the average value of the magnitude of torque detected by each torque gauge 48. Also good.

  In the second embodiment, the tension applied to the entire three metal wires 72 is detected by one tension gauge 76, and the thickness of the ceramic green sheet 73 is determined based on the detected tension. It was derived. However, one tension gauge 76 may be provided for each metal wire 72, and the thickness of the ceramic green sheet 73 may be derived based on the average value of the magnitude of tension detected by each tension gauge 76. .

  In each of the above embodiments, the torque gauge 48 and the tension gauge 76 are used as load detection means, but other elements may be used as auxiliary detection means. For example, a temperature sensor that measures the temperature of the sheet may be used as auxiliary detection means. That is, since the hardness of the sheet changes according to the temperature, the magnitude of the mechanical load (torque, tension) applied to the cutting member (lower rotary blade 42, metal wire 72) when cutting the sheet also depends on the temperature. Change. Therefore, if the CPU 62 derives the thickness of the sheet based on the temperature measured by the temperature sensor and the mechanical load detected by the load detection means, the thickness of the sheet can be detected more accurately. it can. Further, a speed measuring unit that measures the moving speed of the sheet may be used as an auxiliary detecting unit. That is, when the moving speed of the sheet changes, the cutting resistance changes, so there is a high possibility that the thickness of the sheet has changed. Therefore, if the CPU 62 derives the sheet thickness based on the moving speed measured by the speed measuring unit and the mechanical load detected by the load detecting unit, the sheet thickness can be detected more accurately. be able to.

  In each of the above embodiments, the ceramic green sheets 51 and 73 serving as the ceramic layers constituting the ceramic wiring board are used as the sheets serving as the layers constituting the wiring board. However, a resin sheet serving as a resin insulating layer constituting the resin wiring board may be used as a sheet serving as a layer constituting the wiring board. Examples of such a resin wiring board include a build-up multilayer wiring board having a build-up layer on one or both sides of the core board, and a coreless wiring board having no core board. The buildup layer is formed by alternately laminating resin insulating layers and conductor layers. Moreover, when the sheet | seat used as the layer which comprises a wiring board is a resin sheet, the drying process which dries and solidifies a sheet | seat becomes unnecessary.

  Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the embodiment described above are listed below.

  (1) A method for manufacturing a wiring board according to the above means 1, wherein the sheet is a ceramic green sheet to be a ceramic layer.

  (2) The method for manufacturing a wiring board according to the above means 1, wherein the sheet is a resin sheet to be a resin insulating layer.

  (3) In the means 1, the sheet is a ceramic green sheet to be a ceramic layer, and a feeding step of continuously feeding the carrier film by the film feeding means, and after the feeding step, the surface of the carrier film A coating step of applying a slurry as a starting material when forming the ceramic green sheet; and a drying step of obtaining the ceramic green sheet by drying and solidifying the slurry after the coating step; After the drying step, the sheet is cut by the cutting member to form a plurality of narrower cut sheets, and a winding step for winding and collecting the cut sheet after the sheet cutting step. A method for manufacturing a wiring board, comprising:

  (4) In the above means 1, the cutting member is a rotary blade, and the load detecting means is a torque gauge provided on the rotary shaft of the rotary blade and detecting the magnitude of torque applied to the rotary shaft. A method of manufacturing a wiring board characterized by the above.

  (5) In the above means 1, the cutting member is a metal wire, and the load detecting means is a tension gauge that contacts the metal wire and detects the magnitude of the tension applied to the metal wire. A method of manufacturing a wiring board.

  (6) The method for manufacturing a wiring board according to the above means 1, wherein the mechanical load is a cutting resistance applied to the cutting member when the sheet is cut.

  (7) A method for manufacturing a wiring board according to the above means 1, wherein a plurality of the cutting members are present.

  (8) The above means 1 includes storage means for storing an upper limit value and a lower limit value of the thickness of the sheet, and the sheet is not used when the thickness of the sheet exceeds the upper limit value or the lower limit value. A method of manufacturing a wiring board, wherein the method is determined as a non-defective product.

  (9) The method for manufacturing a wiring board according to the above means 1, further comprising a temperature sensor for measuring the temperature of the sheet.

  (10) The method for manufacturing a wiring board according to (1), further comprising speed measuring means for measuring a moving speed of the sheet.

  (11) The method for manufacturing a wiring board according to the above means 1, wherein the sheet is conveyed at a constant speed, while the cutting member does not move.

  (12) The sheet thickness detecting method according to the above means 2, wherein the sheet is a ceramic green sheet serving as a ceramic layer.

  (13) The sheet thickness detecting method according to the above means 2, wherein the sheet is a resin sheet to be a resin insulating layer.

41: Upper rotary blade 42 as a cutting member and rotary blade ... Lower rotary blade 48 as a cutting member and rotary blade ... Torque gauges 51, 73 as load detecting means ... Ceramic green sheet 72 as a sheet ... As a cutting member Metal wire 76 ... tension gauge as load detection means

Claims (6)

A method of manufacturing a wiring board through a sheet cutting step of cutting a sheet to be a layer constituting the wiring board with a cutting member,
In the sheet cutting step,
Detecting the magnitude of the mechanical load applied to the cutting member when the sheet is cut by the load detecting means;
A method of manufacturing a wiring board, wherein the magnitude of the mechanical load detected by the load detecting means is replaced with a thickness of the sheet.   The method of manufacturing a wiring board according to claim 1, wherein the cutting member is at least one of a rotary blade, a flat blade, and a metal wire.   The method for manufacturing a wiring board according to claim 1, wherein the load detecting means is at least one of a tension gauge, a torque gauge, a load gauge, and a piezoelectric element. A method of detecting the thickness of the sheet when the sheet is cut by a cutting member,
Detecting the magnitude of the mechanical load applied to the cutting member when the sheet is cut by the load detecting means;
A sheet thickness detection method comprising replacing the magnitude of the mechanical load detected by the load detection means with the thickness of the sheet.   The sheet thickness detection method according to claim 4, wherein the cutting member is at least one of a rotary blade, a flat blade, and a metal wire.   The sheet thickness detection method according to claim 4 or 5, wherein the load detection means is at least one of a tension gauge, a torque gauge, a load gauge, and a piezoelectric element.

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