JP4320298B2 - Film peeling device - Google Patents

Description

  The present invention relates to a film peeling apparatus for peeling a protective film from a substrate having an insulating material layer protected by a protective film.

  Conventionally, the manufacturing process of a wiring board has a process of forming an insulating material layer on the surface of the board. Specific examples of such a process include a process of laminating a photosensitive resist film on the surface of the substrate and a process of laminating a photosensitive or thermosetting interlayer insulating film on the surface of the substrate. The surface layer portion of the insulating material layer is covered with a carrier film made of PET (polyethylene terephthalate), for example. One carrier film is laminated on each main surface of each substrate. Therefore, in order to start processing the attached insulating material layer, it is necessary to peel the carrier film from the surface of the insulating material layer in advance.

  Another specific example of the step of forming the insulating material layer on the surface of the substrate includes a step of forming the insulating material layer by repeatedly applying and drying a liquid resist on the surface of the substrate. Since the surface layer portion of the insulating material layer is somewhat sticky even when dried, it needs to be covered with a protective film made of PET, for example. As with the carrier film, this protective film is laminated one by one on the main surface of each substrate. Therefore, in order to perform development after exposing the insulating material layer, it is necessary to peel the protective film from the surface of the substrate in advance, as in the case of peeling the carrier film.

As a conventional method of peeling such a film such as a carrier film or a protective film, for example, by rotating a knurling roll and moving it in the surface direction of the film, the film is damaged to form a raised portion ( For example, see Patent Document 1). Further, it has been proposed that the film pressing member is moved in the surface direction of the film so that the film is lifted to form a raised portion (for example, see Patent Document 2).
JP 2000-86080 A (FIG. 1 etc.) JP-A-10-324454 (FIG. 2 etc.)

  However, when peeling the film, it is necessary to perform the peeling operation as many times as the number of substrates (when the film is laminated on both sides of the substrate, the number of times of the number of substrates is two). The efficiency of work cannot be increased. Moreover, since the peeled films are generated in the same number or more separately from the substrate, the film collecting operation is troublesome.

  Moreover, since the possibility of damaging an insulating material layer and a board | substrate will become high when the force added to a film at the time of the movement of a knurling roll or a film press member becomes too strong, it will lead to the fall of a yield. Furthermore, the insulating material layer is formed of a fragile material that is broken even if it is slightly damaged. Therefore, there is a high possibility that a part of the insulating material layer collapses and becomes dust. In addition, if the dust adheres to the insulating material layer, the thickness of the insulating material layer cannot be kept constant. This is also a factor that decreases the yield.

  This invention is made | formed in view of said subject, The objective provides the film peeling apparatus which can suppress the fall of a yield while being able to perform efficiently the peeling operation | work and collection | recovery operation | work of a protective film. There is.

  And as a means for solving the above-mentioned problem, it is an apparatus for peeling off the protective film from a substrate having an insulating material layer protected by a protective film, the opportunity for peeling off the protective film on the outer peripheral portion of the protective film. A peeling trigger portion forming means for forming a peeling trigger portion, a substrate supporting means for supporting a plurality of the substrates adjacent to each other in a state where the substrate ends are brought close to each other, and a substrate supporting means supported by the substrate supporting means. By successively lifting the protective film connected by applying the tape and the tape applying means for applying a flexible tape so as to connect the protective films to each other at the peeling opportunity, via the tape There is a film peeling apparatus comprising a peeling mechanism for continuously peeling the protective film.

  Therefore, in this film peeling apparatus, each protective film can be connected by sticking a tape with a tape sticking means. And a peeling mechanism can peel a protective film continuously by raising a protective film sequentially via a tape. Therefore, if a peeling operation is performed on a plurality of substrates, a plurality of protective films can be peeled together, so that the protective film can be efficiently peeled off. Moreover, since the protective films are connected with a tape, a plurality of protective films can be collected together, and the protective film can be collected efficiently.

  In addition, in this apparatus, since the peeling operation is performed after the tape is applied by the tape applying means, the possibility that the insulating material layer and the substrate are damaged by the peeling operation of the protective film is reduced, and the decrease in the yield can be suppressed. it can. Further, as the damage to the insulating material layer is reduced, the generation of dust due to the collapse of a part of the insulating material layer can be suppressed. Therefore, a decrease in yield due to the dust having an adverse effect on the insulating material layer can be suppressed.

  Furthermore, since the tape is stuck so as to connect the protective films at the peeling trigger part, the peeling mechanism can easily peel the protective film from the peeling trigger part.

  Here, as a suitable material which comprises a protective film, resin, paper, etc. which have flexibility can be mentioned. These materials are appropriately selected in consideration of little damage to the insulating material layer, low cost, and durability even when formed thin. Specific examples of the resin material used for the protective film include PET resin (polyethylene terephthalate resin), EP resin (epoxy resin), and PI resin (polyimide resin).

  In addition, it is preferable that the peeling opportunity part formed in the outer peripheral part of a protective film is a some through-hole which penetrates a protective film. In this case, since an air pool is generated around the through hole, the adhesion force does not act between the portion where the air pool is generated and the substrate. Therefore, the peeling mechanism can easily peel off the protective film from the air pocket.

  In addition, although the internal diameter of a through-hole is not specifically limited, For example, it is preferable that they are 0.1 mm or more and 1.5 mm or less, and it is more preferable that they are 0.5 mm or more and 1.0 mm or less. This is because if the diameter is 0.1 mm or less, only a small air pocket is generated, so that even if the protective film is peeled off from the air pool, the protective film may not be peeled off successfully. This is because when the diameter is 1.5 mm or more, cracks may occur from the edge of the through hole when the through hole is formed.

  Moreover, it is preferable that a through-hole is arrange | positioned on a straight line along the edge of the advancing direction side edge of a protective film, and exists only in 1 row orthogonal to the advancing direction of a board | substrate. If a plurality of through holes exist in a plurality of rows perpendicular to the direction of travel of the substrate, the range of damage to the insulating material layer and the substrate due to the formation of the through holes is increased, and thus the insulating material layer is necessary for the configuration of the wiring board. The part may be damaged.

  The center-to-center distance between adjacent through holes is preferably 1.0 mm or more and 10 mm or less, and more preferably 2.5 mm or more and 7.5 mm or less. If the center-to-center distance is less than 2.5 mm, only the portion where the air accumulation has occurred is peeled off, and there is a high possibility that other portions of the protective film will remain on the insulating material layer without being peeled off. When the center-to-center distance is longer than 7.5 mm, it is difficult to apply the tape to the entire portion where the air pool is generated by the tape applying means.

  The substrate means a substrate composed mainly of a resin material or a ceramic material. Specific examples of substrates composed mainly of resin materials include EP resin (epoxy resin) substrates, PI resin (polyimide resin) substrates, BT resin (bismaleimide-triazine resin) substrates, and PPE resin (polyphenylene ether resin) substrates. and so on. In addition, a substrate made of a composite material of these resins and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers may be used. Alternatively, a substrate made of a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. Specific examples of the substrate mainly composed of a ceramic material include a substrate made of a ceramic material such as alumina, aluminum nitride, boron nitride, silicon carbide, and silicon nitride.

  The substrate support means includes a member such as a roller for supporting and transporting the substrate substantially horizontally. The substrate support means preferably includes a support base that supports the substrate only when a plurality of substrates are adjacent to each other with the substrate ends close to each other, that is, only when the substrate is positioned. As a specific configuration for supporting the substrate only when positioning the substrate, the support base is moved up and brought into contact with the substrate when positioning the substrate, and the support base when the substrate is not positioned. For example, an actuator that is moved downward and separated from the substrate can be used. In this way, since the substrate is supported by the support when the substrate is positioned, the substrate can be accurately positioned. Further, when the substrate is not positioned, for example, when the substrate is moved to a subsequent process, the substrate comes into contact with the support base and does not become a resistance. Therefore, the movement of the substrate is facilitated.

  Here, examples of suitable materials for the base material of the tape include resin and paper. These materials are appropriately selected in consideration of flexibility. If the base material is formed of a material having no flexibility, it is difficult to wind up the protective film with the tape attached thereto, and it is difficult to collect the protective film. Further, these materials are appropriately selected in consideration of being inexpensive and being strong even if formed thin. Specific examples of the resin material used for the base material of the tape include PET resin (polyethylene terephthalate resin), PVC resin (vinyl chloride resin), EP resin (epoxy resin), PI resin (polyimide resin), and the like. In addition, if the base material of a tape is formed with the same material as a protective film, separation will become easy and reuse of a material will become easy.

  Further, the tape may be one having no adhesive layer on the back side of the substrate or one having an adhesive layer, but is preferably an adhesive tape having an adhesive layer. In this way, when the tape is applied, it is not necessary to apply an adhesive material to the back side of the tape, so that the tape can be applied efficiently. In addition, since it is not necessary to apply heat or the like when applying the tape, heat or the like is not likely to adversely affect the insulating material layer, and a decrease in yield due to the heat can be suppressed.

  Examples of the tape having an adhesive layer (adhesive tape) include cellophane tape, vinyl tape, aluminum tape and the like. In particular, the cellophane tape is preferable in that it is less damaging to the substrate, is inexpensive, and is durable even if formed thin. On the other hand, a paper tape etc. are mentioned as a specific example of the tape which does not have an adhesion layer.

  The tape applying means may apply the tape only to the outer peripheral portion of the protective film, or may apply the tape to reach the central portion as well as the outer peripheral portion of the protective film. It is preferable to affix a tape only to the outer peripheral part. In this way, since a long tape is not required to connect the protective films, the amount of tape used can be reduced. Moreover, it is preferable that a tape sticking means sticks a tape to the part in which the said peeling opportunity part was formed, specifically, the part of the air pocket produced around the said through-hole. If it does in this way, since a protective film can be peeled on the basis of the air pocket which adhesive force does not act between board | substrates, peeling work becomes still easier.

  The tape sticking means includes a tape feeding means for feeding the tape, a tape cutting means for cutting the tape fed by the tape feeding means, and the tape fed by the tape feeding means as a substrate of the substrate. It is preferable to include a tape pressing unit that presses against the end.

  Here, the tape feeding means may feed the tape along the direction perpendicular to the substrate traveling direction at the outer peripheral portion of the protective film, or may feed the tape along the substrate traveling direction. However, it is preferable that the tape is fed out along the traveling direction of the substrate. In this way, since a long tape is not required to connect the protective films, the amount of tape used can be reduced. In addition, when extending | stretching a tape along the advancing direction of a board | substrate, it is preferable to attach a protective film by sticking a tape in multiple places. If the protective film is connected by affixing the tape to only one place, the tension will be concentrated in one place when the protective film is lifted through the tape. There is a high possibility that the protective films are separated from each other.

  The peeling mechanism is arranged so as to abut on the protective film before peeling on the substrate, and a pulling means for pulling the protective film connected by the tape sticking in a direction to lift the protective film. A guide roller that guides to the tension means side along a peripheral surface, and a guide roller positioning mechanism that can position the guide roller so that a rotation shaft of the guide roller is positioned closer to the substrate center than the substrate end. It is preferable to provide.

  If it does in this way, since it has been arranged so that the guide roller contacts the protective film, it is possible to prevent the substrate from being lifted when the protective film is lifted. Therefore, the board | substrate which peeled the protective film can be reliably conveyed to a post process. Further, if the guide roller is positioned so that the rotation axis of the guide roller is positioned outside the substrate end portion, the protective film may not be peeled off and may remain on the substrate. On the other hand, according to the present invention, the guide roller positioning mechanism can position the guide roller so that the rotation axis of the guide roller is located closer to the substrate center than the end portion of the substrate. In this case, the entire protective film can be reliably peeled from the substrate.

  Further, the film peeling apparatus provides a gap between the substrate position detecting means for detecting the position of the substrate end portion of the substrate in the substrate supporting means and the detection result of the substrate position detecting means. It is preferable that the apparatus includes a substrate placement unit that places the substrate in a state where the substrate is placed. If the protective film protrudes from the outer peripheral portion of the substrate, if the substrate ends are brought into contact with each other, the protective film will sink under the substrate, making it difficult to peel off the protective film. Further, according to this configuration, since the substrate placement unit adjusts the position of the substrate based on the detection result of the substrate position detection unit, it is possible to more reliably provide a gap between the substrate end portions.

  The size of the gap is preferably set to 0.7 mm or more and 1.3 mm or less. When this gap is 0.7 mm or less, the possibility that the protective film will sink under the substrate increases. On the other hand, when the gap is 1.3 mm or more, the tape required for connecting the protective films becomes long. Moreover, when a protective film is connected, since a weak section (section only of a tape) becomes long, it becomes easy to cut a tape.

  Moreover, it is preferable that a film peeling apparatus is provided with the film winding means to wind up and collect | recover the said protective films peeled by the said peeling mechanism. If the protective film is dropped into the trash box and collected, the collected protective film becomes bulky, which takes time for disposal. On the other hand, according to this invention, since a protective film is wound up and collect | recovered, a protective film can be packed small and disposal becomes easy.

  The film winding means includes a core body around which the protective film peeled off by the peeling mechanism is wound, a core body support means that rotatably supports the core body, and a core body driving means that rotationally drives the core body. And a clutch mechanism for adjusting a transmission amount of the rotational driving force between the core body and the core body driving means. In this case, when the protective film is wound around the core body and the outer diameter of the portion of the core body where the protective film is wound is increased, the transmission amount of the rotational driving force is reduced by the clutch mechanism. In this case, the rotational speed of the core can be reduced. Thereby, the peripheral speed of a protective film can be maintained constant, and it can be made comparable as the speed | rate which peels a protective film with the said peeling mechanism. Therefore, it is possible to prevent the tape from being cut due to an excessive increase in the peripheral speed of the protective film.

  The core body is preferably detachably supported by the core body support means. In this way, for example, even when the protective film is wound around the core and the protective film can no longer be wound around, the protective film can be easily recovered again by replacing the core. Can be done.

  Here, metal, resin, paper, etc. can be mentioned as a suitable material which comprises a core. In particular, resin and paper are preferable because they can be easily discarded. Furthermore, if the core is formed of the same material as the protective film, it becomes easy to separate and reuse the material. Specific examples of the resin material used for the core include PET resin (polyethylene terephthalate resin), EP resin (epoxy resin), and PI resin (polyimide resin).

  Moreover, when the said protective film is provided in both surfaces of the said board | substrate, it is preferable to provide the inversion mechanism which reverses the said board | substrate after either one of the said protective films in both surfaces peels from the said board | substrate. In this case, if the substrate from which either one of the protective films on both sides is peeled is reversed by the reversing mechanism, the peeling operation can be performed on the protective film on the other side, so that both sides are protected. The film can be peeled off. Moreover, even if it does not change arrangement | positioning aspects, such as a tape sticking means and a peeling mechanism, a protective film of both surfaces can be peeled. In addition, it is preferable that a film peeling apparatus is provided with the board | substrate return mechanism which returns the board | substrate reversed by the said inversion mechanism to the said tape sticking means. In this way, even if it is necessary to peel off the protective films on both sides, only one set of the tape applying means and the peeling mechanism is required.

  Next, as an example of a method for using the film peeling apparatus, a specific example of a method for manufacturing a wiring board using the same will be described below.

  First, the peeling trigger part formation process which conveys the board | substrate which has the insulating material layer protected by the protective film, and forms the peeling opportunity part used as the opportunity which peels a protective film in the outer peripheral part of a protective film is implemented. As a specific example of a peeling trigger part formation process, the through-hole formation process etc. which perforate the outer peripheral part of a protective film with a needle | hook and form a through-hole (peeling trigger part) are mentioned.

  A tape sticking process is implemented after a peeling opportunity part formation process. Specifically, first, a plurality of substrates are arranged adjacent to each other with a gap provided between the substrate end portions. And the tape which has flexibility is stuck so that protection films may be connected. Specifically, the tape is fed onto the protective film by the tape feeding means, the tape fed by the tape feeding means is cut by the tape cutting means, and then the tape cut by the tape cutting means is used as the substrate substrate by the tape pressing means. Press against the edge. Thereby, a tape is stuck so that protection films may be connected. The tape may be cut by the tape cutting unit after the tape fed by the tape feeding unit is pressed against the substrate end of the substrate by the tape pressing unit.

  After the tape sticking step, the protective film connected to each other is sequentially lifted through the tape to perform a peeling step of continuously peeling the protective film and leaving the insulating material layer on the substrate. In the peeling step, a guide roller is disposed so as to abut on the protective film before peeling on the substrate, and the rotation axis thereof is positioned closer to the center of the substrate than the substrate end. Then, the protective film connected by applying the tape is lifted while being pulled along the peripheral surface of the guide roller. If it does in this way, a protective film can be easily peeled with a peeling mechanism. In addition, since it is not necessary to heat the protective film in the peeling step, it is possible to prevent the insulating material layer from being modified (for example, thermosetting).

  In addition, you may implement the protective film collection | recovery process which winds up and collects the said protective film peeled after the peeling process. If it does in this way, a protective film will peel from a board | substrate completely and an insulating material layer will come to remain on a board | substrate. Further, if the protective film is wound up into a roll shape in this way, the volume of waste is reduced.

  Furthermore, you may implement a tape sticking process before a peeling trigger part formation process. That is, a tape sticking process may be performed, and after the tape sticking process, a peeling trigger part may be formed in a part where the tape is stuck in the peeling trigger part forming process, and the peeling process may be performed after the peeling trigger part forming process.

  And if such a film peeling apparatus is used, a protective film can be peeled with high probability. Therefore, it becomes possible to manufacture a wiring board efficiently.

  Hereinafter, an embodiment in which the present invention is embodied in a film peeling apparatus for manufacturing a wiring board will be described in detail with reference to FIGS.

  FIG. 1 generally shows a film peeling apparatus 1 of the present embodiment. The film peeling apparatus 1 includes a film punching mechanism 2, a tape sticking mechanism 5 (tape sticking means), a film peeling mechanism 4 (peeling mechanism), and a substrate carry-out mechanism 3. The film perforation mechanism 2 forms a through hole 16 in the protective film 12 of the substrate 15 having the interlayer insulating material 14 (insulating material layer) protected by the protective film 12 (see FIG. 4), and then the substrate 15 is taped. It is conveyed to the sticking mechanism 5. The tape applying mechanism 5 applies a flexible tape 31 so as to connect the protective films 12 of the adjacent substrates 15, and then conveys the substrates 15 to the film peeling mechanism 4. The film peeling mechanism 4 performs the operation of continuously peeling the protective film 12 by sequentially lifting the protective film 12 connected by the application of the tape 31 through the tape 31, and then the substrates 15 are transferred to the substrate 15. Transport to the unloading mechanism 3. The substrate carry-out mechanism 3 carries out the substrate 15 that has been peeled off in the film peeling mechanism 4 from the film peeling apparatus 1. The film peeling apparatus 1 is used when a buildup layer is formed on a substrate 15 to manufacture a buildup multilayer resin wiring substrate (wiring substrate). The build-up layer is formed by alternately laminating interlayer insulating layers and conductor layers.

  In FIG. 2, FIG. 4, etc., the board | substrate 15 used as the work object by this film peeling apparatus 1 is shown. The substrate 15 is a core substrate in a build-up multilayer resin wiring substrate, and for example, a substrate having conductor layers on both surfaces of a base material is used. An interlayer insulating material 14 is attached to the entire top surface of the substrate 15. The interlayer insulating material 14 is made of, for example, a photosensitive epoxy resin. Further, the surface layer portion of the interlayer insulating material 14 is protected by a protective film 12 made of PET (polyethylene terephthalate). In addition, a plurality of through holes 16 (peeling trigger parts) serving as a trigger for peeling the protective film 12 are formed at the end portion on the traveling direction side in the outer peripheral portion of the protective film 12. In the present embodiment, the diameter of the through hole 16 is set to about 1.0 mm, and the distance between the centers of the adjacent through holes 16 is set to about 3 mm. The distance between the through hole 16 and the end of the substrate 15 in the traveling direction is set to about 6 mm. In addition, each through-hole 16 is arrange | positioned on the straight line along the edge part 13 of the advancing direction side edge of the protective film 12. In addition, each through hole 16 is present in only one row perpendicular to the traveling direction of the substrate 15. These through holes 16 correspond to the positions of the needles 57 included in the film punching mechanism 2.

  As shown in FIG. 1, the film punching mechanism 2 includes a plurality of substrate support rollers 8 and needles 57. The substrate support roller 8 supports the substrate 15 from below and rotates as the substrate 15 moves. The needle 57 (peeling trigger part forming means) is for forming the through hole 16 by perforating the outer peripheral portion of the protective film 12. And if the operation | movement which removes the needle | hook 57 from the protective film 12 is performed, the air pocket 17 (refer FIGS. 4-8) will arise around the part in which the through-hole 16 was formed in the protective film 12. FIG.

  As shown in FIGS. 1, 2, 6, and 7, the tape applying mechanism 5 protects the substrate end 18 of the substrate 15 and the substrate end 19 of another substrate 15 on the traveling direction side. The tape 31 is attached to two spaced locations so as to connect the films 12 together. In other words, the tape applying mechanism 5 applies the tape 31 so as to connect the portion of the protective film 12 where the air pocket 17 is generated and the outer peripheral portion of the protective film 12 of another substrate 15 on the traveling direction side. It has become. In the present embodiment, the tape 31 uses an adhesive tape having an adhesive layer on the back side.

  As shown in FIG. 1, the tape applying mechanism 5 includes a tape feeding mechanism 61 (tape feeding means). The tape feeding mechanism 61 includes a tape feeding roller 64, a rubber roller 65, and a tape guide roller 66. The tape supply roller 64 is driven to rotate by a tape supply motor (not shown) so as to supply the tape 31 along the traveling direction of the substrate 15. A plurality of irregularities are provided on the outer peripheral surface of the tape feeding roller 64, and the outer peripheral surface of the tape feeding roller 64 is in contact with the back surface side (adhesive layer side) of the tape 31. Thereby, since the contact area of the tape supply roller 64 and the tape 31 becomes small, sticking of the tape 31 to the tape supply roller 64 is prevented. Further, the rubber roller 65 abuts on the surface side of the tape 31 and rotates as the tape 31 is fed. The tape 31 is sandwiched between the rubber roller 65 and the tape feeding roller 64. The tape guide roller 66 is in contact with the back side of the tape 31 and rotates as the tape 31 is fed. The tape guide roller 66 guides the tape 31 fed by the tape feed roller 64 onto the substrate 15.

  Moreover, the tape sticking mechanism 5 shown in FIG. 1 includes a tape cutter 62 (tape cutting means) and a tape pressing roller 63 (tape pressing means). The tape cutter 62 is attached to the rod tip of the air cylinder 67. The tape cutter 62 moves up and down by driving the air cylinder 67 and cuts the tape 31 fed by the tape feeding roller 64 (see FIG. 6). The tape pressing roller 63 is attached to the rod tip of the air cylinder 68 and moves up and down by driving the air cylinder 68. The tape pressing roller 63 moves along the traveling direction (arrow F1, F2 direction) of the substrate 15 while rotating while in contact with the surface of the tape 31 fed by the tape feeding roller 64. (See FIG. 7). As a result, the tape pressing roller 63 presses the tape 31 against the substrate end portions 18 and 19 of the substrate 15.

  As shown in FIG. 1, a substrate support portion 41 (substrate support means) for supporting the substrate 15 is provided between the tape applying mechanism 5 and the film peeling mechanism 4. The substrate support unit 41 includes a substrate transport roller 32, a substrate support roller 35, and a support base 45. The substrate transport roller 32 is driven to rotate by a substrate moving motor (not shown) to transport the supporting substrate 15 to the film peeling mechanism 4. The substrate support roller 35 supports the substrate 15 from below and rotates as the substrate 15 moves. The support base 45 supports the substrate end 18 of the substrate 15 and the substrate end 19 of another substrate 15 on the traveling direction side from below. That is, the support base 45 is configured to support the two substrates 15 adjacent to each other with the substrate end portions 18 and 19 being brought close to each other. The support base 45 is attached to the rod tip of the air cylinder 44 and moves up and down by driving the air cylinder 44. When the substrate 15 is positioned, the air cylinder 44 supports the substrate end portions 18 and 19 by moving the support base 45 upward. The air cylinder 44 moves the support base 45 downward when the substrate 15 moves.

  Substrate position detection sensors 71 and 72 (substrate position detection means) are provided in the vicinity of the transport path of the substrate 15 (see FIG. 5). The substrate position detection sensor 71 includes a light emitting unit 73 provided above the transport path and a light receiving unit 74 provided below the transport path, and the substrate end 18 on the side in the traveling direction of the transported substrate 15. It is detected whether or not has reached a predetermined position. The substrate position detection sensor 72 also includes a light emitting unit 75 and a light receiving unit 76, and detects whether or not the substrate end 19 of another substrate 15 on the traveling direction side is at a predetermined position. Specifically, the substrate position detection sensors 71 and 72 detect whether or not the substrate end 18 and the substrate end 19 are adjacent to each other with a gap 20 of about 1 mm.

  The substrate moving motor moves the substrate end 18 of the substrate 15 by rotating the substrate transport roller 32 based on the detection results of the substrate position detection sensors 71 and 72, thereby moving the substrate end 18, 19 is set to have a gap 20 between them. That is, the substrate moving motor has a function as a substrate arranging means.

  As shown in FIG. 1, the film peeling mechanism 4 is for peeling the protective film 12 with the air reservoir 17 as a base point. The film peeling mechanism 4 includes a plurality of substrate pressing rollers 36 and a pair of discharge rollers 46. Each substrate pressing roller 36 is in contact with the upper surface side and the lower surface side of the substrate 15 and sandwiches the substrate 15 by an actuator such as an air cylinder (not shown). Each substrate pressing roller 36 rotates with the movement of the substrate 15. Further, both the discharge rollers 46 sandwich the substrate 15 from the upper surface side and the lower surface side, and rotate as the substrate 15 moves. The two discharge rollers 46 discharge the substrate 15 to the substrate carry-out mechanism 3 side. The substrate carry-out mechanism 3 is mainly composed of a plurality of rubber rollers 6. The rubber roller 6 sandwiches the substrate 15 from the upper surface side and the lower surface side and rotates as the substrate 15 moves.

  The film peeling mechanism 4 shown in FIG. 1 includes a guide roller 33 and a pair of pulling rollers 38 (tensioning means). The guide roller 33 is disposed at the front end (traveling direction side end) of the substrate 15 conveyed to the film peeling mechanism 4 so as to contact the protective film 12 before peeling on the substrate 15. The guide roller 33 guides the protective film 12 toward the tension roller 38 along its peripheral surface. Both tension rollers 38 sandwich the protective film 12 from the front surface side and the back surface side. Further, both the pulling rollers 38 are driven to rotate by a protective film pulling motor (not shown) so as to pull the protective film 12 connected by applying the tape 31 in the lifting direction.

  As shown in FIG. 1, the film peeling apparatus 1 includes a film winding mechanism 7 (film winding means) that winds and collects the protective film 12 peeled by the film peeling mechanism 4. The film winding mechanism 7 includes a paper tube 34 (core body) and a paper tube support shaft 40 (core body support means). The paper tube 34 is detachably supported with respect to the paper tube support shaft 40. Specifically, the paper tube support shaft 40 can be inserted into and removed from the paper tube 34. Further, the inner diameter of the paper tube 34 is substantially equal to the outer diameter of the paper tube support shaft 40, so that the paper tube 34 and the paper tube support shaft 40 do not rotate relative to each other. The paper tube support shaft 40 is rotationally driven by a paper tube drive motor 39 (core body driving means) shown in FIG. As a result, the protective film 12 is wound around the paper tube 34.

  Next, the manufacturing method of the buildup multilayer resin wiring board using said film peeling apparatus 1 is demonstrated.

  First, a drilling machine is used for drilling a copper clad laminate, and a through hole (not shown) penetrating the copper clad laminate is formed in advance at a predetermined position. In addition, you may form a through-hole by performing a laser drilling process with respect to a copper clad laminated board using a YAG laser or a carbon dioxide gas laser. And a plating through hole is formed by performing electroless copper plating and electrolytic copper plating according to a conventionally well-known method. Further, the copper foil on both sides of the copper clad laminate is etched to pattern the first conductor layer by, for example, a subtractive method. Specifically, after the electroless copper plating, electrolytic copper plating is performed using the electroless copper plating layer as a common electrode. Further, the dry film is laminated, and the dry film is exposed and developed to form a dry film in a predetermined pattern. In this state, unnecessary electrolytic copper plating layer, electroless copper plating layer and copper foil are removed by etching. Then, the board | substrate 15 which is a double-sided board is obtained by peeling a dry film. The substrate 15 may be formed by a semi-additive method. Specifically, after electroless copper plating, exposure and development are performed to form a predetermined pattern of plating resist. In this state, after electrolytic copper plating is performed using the electroless copper plating layer as a common electrode, first, the resist is dissolved and removed, and further unnecessary electroless copper plating layer is removed by etching. As a result, a substrate 15 that is a double-sided board is obtained.

  Next, after affixing a film-like interlayer insulating material 14 to the main surface of the substrate 15, a pasting process is performed using a conventionally known laminator, and the protective film 12 is attached to the substrate 15 having the interlayer insulating material 14 affixed thereto. Laminate on the main surface. Specifically, first, in a state where a plurality of substrates 15 are arranged adjacent to each other and horizontally disposed, the protective film 12 having a size capable of covering the main surfaces of all the substrates 15 is laminated by a laminating machine (not shown). Then, the laminated protective film 12 is cut according to the size of each substrate 15. Thereafter, the interlayer insulating material 14 is exposed.

  Thereafter, the substrate 15 having the interlayer insulating material 14 protected by the protective film 12 is conveyed to the film punching mechanism 2. Next, the through hole forming step S1 (see FIG. 3) shown in FIG. 3 is performed. Specifically, an operation of perforating the outer peripheral portion of the protective film 12 with the needle 57 is performed, and the through-hole 16 is formed in the traveling direction side end portion of the outer peripheral portion of the protective film 12. Thereafter, by performing an operation of removing the needle 57 from the protective film 12, an air pocket 17 (see FIG. 4) is generated around the portion of the protective film 12 where the through hole 16 is formed.

  After the through hole forming step S1, a tape applying step S2 (see FIG. 3) is performed. Specifically, the board | substrate 15 is conveyed to the film peeling mechanism 4, and the board | substrate 15 is arrange | positioned adjacently in the state which provided the clearance gap 20 between board | substrate edge parts 18 and 19 (refer FIG. 5). Next, using the tape applying mechanism 5, the tape 31 is applied so as to connect the portion of the protective film 12 where the air pocket 17 is generated and the outer peripheral portion of the protective film 12 of the other substrate 15 on the traveling direction side. (See FIGS. 6 and 7). Specifically, first, a tape feeding process S2-1 for feeding the tape 31 onto the protective film 12 by the tape feeding roller 64 is performed. And tape cutting process S2-2 which cuts | feeds out the tape 31 with the tape cutter 62 is implemented (refer FIG. 6). After the tape cutting step S2-2, a tape pressing step S2-3 is performed in which the tape 31 is pressed against the substrate ends 18 and 19 of the substrate 15 by the tape pressing roller 63 (see FIG. 7). Thereby, the tape 31 is affixed so that the protective films 12 may be connected, and tape adhering process S2 is complete | finished.

  Note that the tape pressing step S2-3 may be performed before the tape cutting step S2-2. That is, the tape pressing step S2-3 may be performed, and the tape 31 may be cut by the tape cutter 62 in the tape cutting step S2-2 after the tape pressing step S2-3.

  After the tape sticking step S2, a peeling step S3 (see FIG. 3) for continuously peeling the protective film 12 by sequentially lifting the protective films 12 connected to each other through the tape 31 is performed. In the peeling step S <b> 3, the guide roller 33 is disposed so as to contact the protective film 12 before peeling on the substrate 15, and the rotation axis thereof is positioned closer to the center of the substrate 15 than the substrate end 18. Then, the protective film 12 connected by applying the tape 31 is lifted while being pulled along the peripheral surface of the guide roller 33 (see FIG. 8). More specifically, when the tape 31 is lifted, it is gradually pulled by the pulling roller 38 to increase the volume of the air reservoir 17. At this time, the air reservoir 17 spills outward from the vicinity of the portion where the through hole 16 is formed in the edge portion 13 to the end portion of the edge portion 13. As a result, the air pocket 17 spreads over the entire width of the edge portion 13, and finally the edge portion 13 is peeled off from the interlayer insulating material 14.

  After the peeling step S3, a protective film collecting step S4 is performed in which the peeled protective film 12 is wound around the paper tube 34 and collected. As a result, the protective film 12 is completely peeled off from the substrate 15, and the interlayer insulating material 14 to be an interlayer insulating layer of the build-up multilayer resin wiring substrate later remains on the substrate 15 (see FIG. 9). The substrate 15 from which the protective film 12 has been peeled is carried out by the substrate carrying-out mechanism 3.

  Then, development is performed on the interlayer insulating material 14 of the unloaded substrate 15 to form an interlayer insulating layer having a blind hole (via) at a position where a via conductor is to be formed. Next, electroless copper plating is performed according to a conventionally known method (for example, a semi-additive method), and exposure and development are performed to form a plating resist having a predetermined pattern. In this state, by performing electrolytic copper plating using the electroless copper plating layer as a common electrode, a via conductor is formed inside the blind hole, and a copper plating layer is formed on the interlayer insulating layer. Further, the resist is dissolved and removed, and an unnecessary electroless copper plating layer is etched to form a second conductor layer on the interlayer insulating layer (conductor layer forming step).

  Thereafter, by repeating the pasting step to the conductor layer forming step, the interlayer insulating layers and the conductor layers are alternately laminated. As a result, a build-up layer is formed, and a desired build-up multilayer resin wiring board is completed.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the film peeling apparatus 1 of this embodiment, the protective film 12 of each board | substrate 15 can be connected by sticking the tape 31 by the tape sticking mechanism 5. FIG. And the film peeling mechanism 4 can peel the protective film 12 continuously by raising the protective film 12 sequentially via the tape 31. FIG. Therefore, if the peeling operation is performed on the plurality of substrates 15, the plurality of protective films 12 can be peeled together, so that the protective film 12 can be efficiently peeled off. In addition, since the protective films 12 are connected to each other by the tape 31, a plurality of protective films 12 can be collected together, and the collecting operation of the protective films 12 can be performed efficiently.

  Moreover, in this apparatus, the tape 31 is stuck by the tape sticking mechanism 5 instead of performing the peeling operation after moving the knurling roll or the film pressing member in the surface direction of the protective film 12. Peel off from. Therefore, it is possible to reduce the possibility that the interlayer insulating material 14 and the substrate 15 are damaged by the peeling operation of the protective film 12, and thus it is possible to suppress a decrease in yield. Further, as the damage to the interlayer insulating material 14 is reduced, the generation of dust due to the collapse of a part of the interlayer insulating material 14 can be suppressed. Therefore, a decrease in yield due to the dust having an adverse effect on the interlayer insulating material 14 can be suppressed.

  (2) In this embodiment, since the guide roller 33 is disposed so as to contact the protective film 12, the substrate 15 can be prevented from being lifted when the protective film 12 is lifted. Therefore, since the substrate 15 from which the protective film 12 has been peeled can be surely entered between the discharge rollers 46, the substrate 15 can be reliably conveyed to the substrate carry-out mechanism 3.

  (3) For example, if the tape 31 applied by the tape applying mechanism 5 is applied to the protective film 12 by applying heat, the heat will adversely affect the interlayer insulating material 14 (for example, thermosetting). There is a possibility of affecting. However, since the tape 31 applied by the tape applying mechanism 5 of the present embodiment is an adhesive tape having an adhesive layer, it is not particularly necessary to apply heat during adhesion. Therefore, there is no possibility that heat or the like adversely affects the interlayer insulating material 14, and a decrease in yield due to it can be suppressed.

  (4) In the tape applying step S2, it is conceivable to apply a plurality of protective films 12 so as not to cut one tape 31. However, in this embodiment, the tape 31 is dared to be cut short and pasted so as to connect the adjacent protective films 12 with the cut tape 31. In this way, since the long tape 31 is not required to connect the protective film 12, the amount of the tape 31 used can be minimized. In other words, it can be said that the amount of use of the tape 31 can be minimized because the tape 31 is cut using the tape cutter 62.

  In addition, you may change embodiment of this invention as follows.

  In the above embodiment, the film peeling mechanism 4 includes a guide roller positioning mechanism that can position the guide roller 33 so that the rotation axis of the guide roller 33 is positioned closer to the center of the substrate 15 than the substrate end 18. Also good. For example, the guide roller 33 may be rotatably attached to the rotation shaft, and the guide roller positioning mechanism may be configured by an actuator such as an air cylinder that moves the rotation shaft along the traveling direction of the substrate 15.

  In this case, even if the rotation axis of the guide roller 33 is located outside the substrate end 18 with respect to the substrate end portion 18, the rotation axis of the guide roller 33 is adjusted by driving the air cylinder. It can be moved closer to the center of the substrate 15 than the portion 18. Therefore, the entire protective film 12 can be reliably peeled without positioning the substrate 15 accurately.

  As shown in FIG. 10, the film winding mechanism 7 may include a clutch mechanism 81 that adjusts the amount of rotation drive force transmitted between the paper tube 34 and the paper tube drive motor 39. For example, the clutch mechanism 81 includes a paper tube side plate 82 fixed to the paper tube support shaft 40, a motor side plate 84 fixed to the rotation shaft 83 of the paper tube driving motor 39, the paper tube side plate 82 and the motor. You may comprise from the spring (not shown) which presses the side plate 84 mutually.

  If the protective film 12 is wound around the paper tube 34 and the outer diameter of the portion of the paper tube 34 around which the protective film 12 is wound increases, the paper tube support shaft 40 and the paper tube 34 are rotated once. The winding amount of the protective film 12 increases. At this time, if the paper tube side plate 82 and the motor side plate 84 are slid relative to each other by reducing the pressure-bonding force by the spring, the amount of transmission of the rotational driving force is reduced, so that the rotational speed of the paper tube support shaft 40 and the paper tube 34 is reduced. Can slow down. Therefore, the peripheral speed of the protective film 12 can be maintained constant, and the speed can be made comparable to the speed at which the protective film 12 is pulled by the pulling roller 38. Therefore, cutting of the tape 31 due to the peripheral speed of the protective film 12 becoming too high can be prevented.

  In the above embodiment, the film peeling apparatus 1 is used when forming an interlayer insulating layer of a build-up multilayer resin wiring board, but is used when forming an insulating layer of a wiring board other than the build-up multilayer resin wiring board. May be.

  -The film peeling apparatus 1 of the said embodiment was used for peeling the protective film 12 from the insulating material (interlayer insulating material 14) which forms the interlayer insulation layer of a built-up multilayer resin wiring board. However, the film peeling apparatus 1 may be used to peel the protective film 12 from an insulating material that forms a solder resist or a plating resist.

  -The film peeling apparatus 1 of the said embodiment was used when manufacturing wiring boards, such as a built-up multilayer resin wiring board. However, the film peeling apparatus 1 is not used only when manufacturing a wiring board, but may be used when peeling the protective film 12 when manufacturing a thing other than the wiring board.

  -The board | substrate carrying-out mechanism 3 of the said embodiment assumes carrying out the board | substrate 15 with which the protective film 12 was laminated on one side, and the film | membrane peeling apparatus 1 removes the board | substrate 15 which the peeling operation | work completed in the film peeling mechanism 4. It was supposed to be carried out from.

  However, the substrate carry-out mechanism 3 may be assumed to carry out the substrate 15 having the protective film 12 laminated on both surfaces. That is, the substrate carry-out mechanism 3 may also serve as a reversing mechanism that reverses the substrate 15 after any one of the protective films 12 on both sides is peeled from the substrate 15 (see FIG. 11). In this case, if the substrate 15 from which one of the protective films 12 on both sides is peeled is reversed by the reversing mechanism, the peeling work can be performed on the protective film 12 on the other side, The protective films 12 on both sides can be peeled off. Moreover, even if it does not change arrangement | positioning aspects, such as the tape sticking mechanism 5 and the film peeling mechanism 4, the protective film 12 of both surfaces can be peeled. Further, since the substrate 15 is reversed by the reversing mechanism, it is not necessary to turn the substrate 15 upside down by hand, and the peeling work is facilitated.

  In this case, the film peeling apparatus 1 preferably includes a substrate returning mechanism 91 and a substrate lifting mechanism 92 (see FIG. 11). The substrate returning mechanism 91 includes a plurality of substrate moving rollers 93 and is disposed below the film peeling mechanism 4 and the tape applying mechanism 5. The substrate returning mechanism 91 is configured to return the substrate 15 reversed by the reversing mechanism to the film punching mechanism 2 side (substrate lifting mechanism 92 side) by rotating each substrate moving roller 93. The substrate lifting mechanism 92 includes an air cylinder 94 and a substrate support roller 8 attached to the rod tip of the air cylinder 94, and moves up and down by driving the air cylinder 94. The substrate lifting mechanism 92 is configured to lift the substrate 15 conveyed by the substrate returning mechanism 91 and supported by the substrate supporting roller 8 and to carry it out to the film punching mechanism 2. In this way, even if it is necessary to peel off the protective films 12 on both sides, only one set of the tape attaching mechanism 5 and the film peeling mechanism 4 is sufficient.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) Peeling device that peels off the protective film from a substrate having an insulating material layer protected by a protective film, and forms a peeling trigger portion that triggers the peeling of the protective film on the outer peripheral portion of the protective film. In the trigger part forming means, the substrate support means for supporting a plurality of the substrates adjacent to each other in a state where the substrate ends are brought close to each other, and the protective films in the peeling trigger part of the substrate supported by the substrate support means A tape applying means for attaching a flexible tape so as to connect the protective film, and the protective film connected by the application of the tape is sequentially lifted through the tape to continuously peel the protective film. The tape applying means is fed out by the tape feeding means for feeding the tape and the tape feeding means. Tape cutting means, said film peeling apparatus comprising: a tape pressing means for pressing the tape cut by the tape cutting means in the substrate end portion of the substrate for cutting the tape.

Schematic which shows the film peeling apparatus of this embodiment. The principal part top view which shows the board | substrate which has an interlayer insulation material protected with the protective film. The flowchart which shows the outline of the manufacturing process of a wiring board. The principal part sectional drawing which shows the state after performing the operation | movement which extracts a needle | hook from a protective film. The principal part sectional drawing which shows a state when arrange | positioning a board | substrate adjacently. The principal part sectional drawing which shows a state when performing the operation | movement which cut | disconnects the tape extended | stretched with the tape cutter. The principal part sectional drawing which shows a state when performing the operation | movement which presses a tape with a tape pressing roller. The principal part sectional drawing which shows a state when performing the operation | movement which peels a protective film. The principal part sectional drawing which shows the board | substrate after peeling a protective film. Schematic which shows the clutch mechanism in other embodiment. Schematic which shows the film peeling apparatus in other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Film peeling apparatus 4 ... Film peeling mechanism 5 as peeling mechanism ... Tape sticking mechanism 7 as tape sticking means 7 ... Film winding mechanism 12 as film winding means ... Protective film 14 ... Interlayer insulating material as an insulating material layer DESCRIPTION OF SYMBOLS 15 ... Board | substrate 16 ... Through-hole 18,19 as peeling trigger part ... Board | substrate edge part 20 ... Gap 31 ... Tape 33 ... Guide roller 34 ... Paper tube 38 as a core body ... Tension roller 39 as a tension means ... Core body drive Paper tube drive motor 40 as a means ... Paper tube support shaft 41 as a core support means ... Substrate support part 57 as a substrate support means ... Needle 61 as a peeling trigger part forming means ... Tape feeding mechanism as a tape feeding means 62 ... Tape cutter 63 as tape cutting means ... Tape pressing rollers 71 and 72 as tape pressing means ... Substrate position detection as substrate position detecting means Sensor 81 ... clutch mechanism

Claims (9)

An apparatus for peeling the protective film from a substrate having an insulating material layer protected by a protective film,
Peeling trigger part forming means for forming a peeling trigger part that triggers peeling of the protective film on the outer peripheral part of the protective film;
Substrate support means for supporting a plurality of the substrates adjacent to each other with the substrate edges close to each other;
A tape applying means for applying a flexible tape so as to connect the protective films to each other in the peeling trigger part of the substrate supported by the substrate supporting means;
A film peeling apparatus comprising: a peeling mechanism for continuously peeling the protective film by sequentially lifting the protective films connected by the tape application through the tape. Substrate position detection means for detecting the position of the substrate end of the substrate in the substrate support means;
The film peeling apparatus according to claim 1, further comprising: a substrate placement unit that places the substrate in a state where a gap is provided between the substrate end portions based on a detection result of the substrate position detection unit. . The peeling mechanism is
Tension means for pulling in the direction of lifting the protective film connected by applying the tape;
A guide roller that is disposed so as to abut on the protective film before peeling on the substrate and guides the protective film to the tension means side along its peripheral surface;
3. The film peeling according to claim 1, further comprising a guide roller positioning mechanism capable of positioning the guide roller so that a rotation shaft of the guide roller is positioned closer to a substrate center than an end portion of the substrate. apparatus.   The film peeling apparatus according to claim 1, further comprising a film winding unit that winds and collects the protective film peeled by the peeling mechanism. The film winding means includes
A core around which the protective film peeled off by the peeling mechanism is wound;
Core body support means for rotatably supporting the core body;
Core driving means for rotating the core, and
The film peeling apparatus according to claim 4, further comprising a clutch mechanism that adjusts a transmission amount of a rotational driving force between the core body and the core body driving unit.   6. The film peeling apparatus according to claim 5, wherein the core body is detachably supported by the core body supporting means. The tape applying means is
A tape feeding means for feeding out the tape;
Tape cutting means for cutting the tape fed by the tape feeding means;
The film peeling apparatus according to any one of claims 1 to 6, further comprising a tape pressing unit that presses the tape fed by the tape feeding unit against a substrate end portion of the substrate.   The film peeling apparatus according to claim 1, wherein the tape is an adhesive tape having an adhesive layer. The protective film is provided on both sides of the substrate;
The film peeling apparatus according to claim 1, further comprising a reversing mechanism for reversing the substrate after any one of the protective films on both sides is peeled from the substrate. .

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