JP2006165072A - Substrate end surface automatic cleaning apparatus and manufacturing method of wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate end surface automatic cleaning apparatus capable of effectively performing cleaning work for an end surface of a substrate. <P>SOLUTION: The substrate end surface automatic cleaning apparatus 5 includes a substrate support bench 41, a cleaning member 20, and drive means. The substrate support bench 41 supports the substrate 15, and the cleaning member 20 includes an adhesive layer. The drive means moves the substrate support bench 41 and the cleaning member 20 to bring the end surface 16 of the substrate 15 and the adhesive layer into contact with each other. In this state, the end surface 16 of the substrate 15 is cleaned by sticking dust adhering to the end surface 16 of the substrate 15 on the adhesive layer and removing it. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention includes a substrate end surface automatic cleaning device for cleaning an end surface of a substrate to which at least one of a resin insulating layer, a resist layer, and a protective film layer is attached, and a step of cleaning the end surface of the substrate. The present invention relates to a method for manufacturing a wiring board.

  Conventionally, the manufacturing process of a wiring board has a process of forming an insulating material layer on the surface of the board. Specific examples of such a process include a process of laminating a photosensitive resist film on the surface of the substrate and a process of laminating a photosensitive or thermosetting interlayer insulating film on the surface of the substrate. For example, a protective film made of PET (polyethylene terephthalate) is laminated on the surface layer portion of the insulating material layer.

  By the way, when the surface layer portion of the insulating material layer is covered with a protective film, a single protective film may be attached to all the substrates in a state where a plurality of substrates are adjacently disposed horizontally. Therefore, in order to start the treatment of the insulating material layer, it is necessary to cut the protective film according to the size of each substrate in advance and separate each substrate before peeling the protective film from the surface of the insulating material layer. There is. In addition, since dust (such as chips) generated when the protective film is cut adheres to the substrate, it is necessary to clean the substrate in advance before peeling off the protective film.

Conventionally, as a method for cleaning a substrate, an operator grips a cleaner (see, for example, Patent Document 1) including a roller having an adhesive portion, and the roller is rolled while the adhesive portion is in contact with the substrate. Thus, it has been proposed to remove dust attached to the substrate.
JP 2004-121971 A (FIG. 1 etc.)

  By the way, dust is most likely to adhere to the end face of the substrate in the vicinity of the cut portion of the protective film. Therefore, if the end face of the substrate is cleaned using the cleaning device described in Patent Document 1, the dust can be effectively removed. Conceivable.

  However, when a cleaning operation is performed for a long time using a cleaner, the operator may become tired, and the work efficiency may gradually decrease. Therefore, it is conceivable to automate the cleaning operation, but at present there is no device for cleaning the end face of the substrate. Moreover, when a cleaning operation is performed using a cleaner, there is a high possibility that the dust will remain without being completely removed. In this case, it becomes necessary for the worker to perform the cleaning work again using the cleaner, which also causes a reduction in work efficiency.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an automatic substrate end surface cleaning apparatus capable of efficiently cleaning the end surface of the substrate. Another object of the present invention is to provide a method of manufacturing a wiring board that can efficiently manufacture the wiring board with high yield because dust attached to the end face of the board can be removed with high probability. is there.

  As a means for solving the above-mentioned problem, an apparatus for cleaning an end face of a substrate on which at least one of a resin insulating layer, a resist layer, and a protective film layer is attached, which supports the substrate. A substrate supporting member, a cleaning member having an adhesive portion, and drive means for moving at least one of the substrate supporting member and the cleaning member to bring the end surface of the substrate into contact with the adhesive portion. There exists the board | substrate end surface automatic cleaning apparatus characterized by the above-mentioned.

  Therefore, in this substrate end surface automatic cleaning apparatus, the end surface of the substrate and the adhesive portion are brought into contact with each other by the driving means, and the dust attached to the end surface of the substrate is attached to the adhesive portion and removed. Therefore, the end surface of the substrate can be cleaned. In addition, when cleaning the end surface of the substrate, the driving means, not the operator, makes the end surface of the substrate and the adhesive portion contact each other, so even if the cleaning operation is performed for a long time, the work efficiency gradually decreases. There is no going on. Moreover, since the end surface of the substrate and the adhesive portion can be stably brought into contact with each other by the driving means, the possibility that dust remains on the end surface of the substrate after the cleaning operation is reduced. Therefore, since it becomes less necessary to repeat the cleaning operation in order to remove the remaining dust, it is possible to prevent a reduction in work efficiency.

  The cleaning member may be a plate-like member having an adhesive layer that is an adhesive part on one surface, but a cleaning roller having an adhesive layer that is an adhesive part on the outer peripheral surface, and a roller for rolling the cleaning roller. It is preferable to include a roller support body that can be supported. In this case, once the end face of the substrate and the adhesive portion are brought into contact with each other, the end face of the substrate can be cleaned only by rolling the cleaning roller, so that the cleaning operation can be performed more efficiently. .

  Examples of the cleaning roller include those coated with an adhesive material, and those equipped with an adhesive tape having an adhesive layer. The roller is preferably a roll of adhesive tape. In this way, even if the adhesive layer exposed on the outer peripheral surface becomes dirty and the adhesive strength decreases, the adhesive force of the cleaning roller is always the best by peeling the adhesive tape and exposing the unclean adhesive layer. Can be maintained in a state. In addition, as an adhesive tape, a paper tape, a cellophane tape, a vinyl tape, an aluminum tape, etc. are mentioned.

  Moreover, it is preferable that the length of the cleaning roller in the rotation axis direction is set to be larger than the thickness of the substrate. In this way, since the adhesive portion can be reliably brought into contact with the end surface of the substrate, it becomes easy to completely remove the dust attached to the end surface of the substrate. Furthermore, it is preferable that a plurality of cleaning rollers are arranged on a straight line along the traveling direction of the substrate. In this case, the end surface of the substrate cleaned by the cleaning roller is preferably arranged in parallel with the traveling direction of the substrate. In this way, even if the dust attached to the end face of the substrate cannot be completely removed by one cleaning roller, the other cleaning roller can remove the dust.

  When the two cleaning rollers are arranged in a straight line along the traveling direction of the substrate, the distance between the centers of the adjacent cleaning rollers is between the front end (the traveling direction side end) and the rear end of the substrate. Preferably, it is set as large as possible within a range not exceeding the distance. In this way, when each cleaning roller is brought into contact with the end surface of the substrate, the pressing force of each cleaning roller is dispersed and applied to the substrate, so that the substrate is pressed by the cleaning roller in the traveling direction. In contrast, it can be prevented from being inclined.

  The cleaning roller is preferably detachably supported with respect to the roller support. In this way, for example, even when the cleaning roller becomes dirty and cannot be used, the end surface of the substrate can be cleaned again by the cleaning roller by replacing the cleaning roller.

  The cleaning roller may be supported by the roller support so as to come into contact with the end surface of the substrate from a vertical direction, but the cleaning roller comes into contact with the end surface of the substrate from an oblique direction. You may be supported by the roller support body. In this way, the cleaning roller can be reliably brought into contact with a portion (at least one cut portion of the resin insulating layer, the resist layer, and the protective film layer) where dust is more likely to adhere. Therefore, since the dust adhering to the end surface of the substrate can be removed more reliably, the cleaning operation can be performed more efficiently.

  When there are a plurality of cleaning rollers, it is preferable that each cleaning roller is supported by the roller support so as to come into contact with the upper edge of the end face of the substrate or the lower edge of the end face from an oblique direction. In this way, the upper edge and the lower edge of the end surface of the substrate can be cleaned at a time using each cleaning roller in a state where the end surface of the substrate and the adhesive portion are in contact with each other. Work can be performed more efficiently.

  In this case, the inclination angle θ1 of the cleaning roller with respect to the end surface of the substrate is preferably set to 0 ° <θ1 <30 °. In this way, since the cleaning roller reliably contacts the edge of the end surface of the substrate, dust attached to the edge of the end surface of the substrate can be reliably removed.

  The driving means includes a substrate supporting member driving unit that translates the substrate supporting member in a state of supporting the substrate along a surface direction of the substrate, and an end surface of the substrate that translates together with the substrate supporting member driving unit. It is preferable to include a roller support driving unit that presses the roller support in a direction in which the cleaning roller is brought into contact with the roller. In this way, when the substrate is moved in parallel by the substrate support member driving unit while the cleaning roller is in contact with the end surface of the substrate by the roller support driving unit, the cleaning roller rotates and the end surface of the substrate is moved. To be cleaned. That is, since the end surface of the substrate is automatically cleaned by the driving means, the cleaning operation can be performed more efficiently.

  Further, the substrate end surface automatic cleaning device is a cutting unit that cuts at least one of an excess resin insulating layer, a resist layer, and a protective film layer protruding from the end surface of the substrate before the cleaning by the cleaning member. It is preferable to provide a mechanism. In this way, it is not necessary to cut in advance the surplus portion protruding from the end surface of the substrate before cleaning the end surface of the substrate, thereby further reducing the burden on the operator.

  The cutting mechanism has a cutting blade, and the inclination angle θ2 of the cutting blade with respect to the moving direction of the substrate support member is preferably set to 10 ° <θ2 <20 °. If the inclination angle θ2 of the cutting blade is 10 ° or less, there is a possibility that at least one of the excess resin insulation layer, resist layer, and protective film layer protruding from the end face of the substrate cannot be completely cut. . On the other hand, if the inclination angle θ2 of the cutting blade is 20 ° or more, the cutting blade may bite into the substrate and damage the substrate.

  Moreover, it is preferable that the said cutting mechanism has a tension | pulling means which pulls at least any one of an excess resin insulation layer, a resist layer, and a protective film layer in the case of the cutting | disconnection by the said cutting blade. By doing so, the cutting blade can easily cut into the resin insulating layer, the resist layer, and the protective film layer, so that the cutting can be reliably performed.

  Furthermore, it is preferable to have vertical position adjusting means for adjusting the relative vertical position relationship between the substrate and the cutting blade. Specifically, it may have a vertical position adjustment means for adjusting the vertical position of the substrate by moving the substrate support member up and down, and the cutting mechanism adjusts the vertical position of the cutting blade. There may be provided a vertical position adjusting means. In such a case, when the cutting operation is continued, the vertical position adjustment means is periodically used to adjust the vertical position of the substrate or the vertical position of the cutting blade to prevent wear of only a specific portion of the cutting blade. can do. Therefore, the life of the cutting blade is also extended.

  As another means for solving the above problems, a layer forming step of forming at least one of a resin insulating layer, a resist layer and a protective film layer on the surface of the substrate, a resin insulating layer, a resist layer, and A cutting process for cutting at least one of the protective film layers at the end face of the substrate, and an end face cleaning for cleaning the end face of the substrate by bringing a cleaning member having an adhesive portion into contact with the end face of the substrate. There is a method for manufacturing a wiring board including a process.

  Moreover, as yet another means for solving the above-mentioned problem, a layer forming step of forming at least one of a resin insulating layer, a resist layer and a protective film layer on the surface of the substrate, a resin insulating layer, A cutting step of cutting at least one of the resist layer and the protective film layer at an end surface of the substrate, and using the substrate end surface automatic cleaning device according to any one of claims 1 to 9, There is an end face cleaning process for cleaning an end face of a substrate.

  Hereinafter, a method for manufacturing a wiring board will be described.

  First, a layer forming step of forming at least one of a resin insulating layer, a resist layer, and a protective film layer on the surface of the substrate is performed.

  Such a resin insulating layer can be appropriately selected in consideration of insulating properties, heat resistance, moisture resistance, and the like. Preferable examples of the resin material forming the resin insulating layer include EP resin (epoxy resin), PI resin (polyimide resin), BT resin (bismaleimide-triazine resin), PPE resin (polyphenylene ether resin) and the like. In addition, composite materials of these resins and organic fibers such as glass fibers (glass woven fabrics and glass nonwoven fabrics) and polyamide fibers, or three-dimensional network fluorine-based resin base materials such as continuous porous PTFE, epoxy resins, etc. A resin-resin composite material impregnated with a thermosetting resin may be used.

  Examples of the resist layer include a photoresist layer, a solder resist layer, a plating resist layer, and an etching resist layer.

  Suitable materials for forming the protective film layer include flexible resin and paper. These materials are appropriately selected in consideration of the fact that there is little damage to the resin insulating layer and the resist layer, the cost is low, and the material is durable even if it is thinly formed. Resin and paper are preferable because they are easy to reuse. Specific examples of the resin material used for the protective film layer include PET resin (polyethylene terephthalate resin), EP resin (epoxy resin), and PI resin (polyimide resin).

  The substrate means a substrate mainly composed of a resin material, a ceramic material, a metal material, or the like. Specific examples of substrates composed mainly of resin materials include EP resin (epoxy resin) substrates, PI resin (polyimide resin) substrates, BT resin (bismaleimide-triazine resin) substrates, and PPE resin (polyphenylene ether resin) substrates. and so on. In addition, a substrate made of a composite material of these resins and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers may be used. Alternatively, a substrate made of a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. Specific examples of the substrate mainly composed of a ceramic material include a substrate made of a ceramic material such as alumina, aluminum nitride, boron nitride, silicon carbide, and silicon nitride. Furthermore, specific examples of the substrate mainly composed of a metal material include, for example, a copper substrate, a copper alloy substrate, a substrate made of a single metal other than copper, and a substrate made of a metal alloy other than copper. It is not limited to.

  After the layer formation step, a cutting step is performed. Specifically, the substrate is disposed, and at least one of the resin insulating layer, the resist layer, and the protective film layer formed by the layer forming step is cut at the end surface of the substrate. As a result, at least one of the excess resin insulation layer, resist layer, and protective film layer protruding from the end face of the substrate is removed.

  After the cutting step, an end surface cleaning step for cleaning the end surface of the substrate is performed by bringing a cleaning member having an adhesive portion into contact with the end surface of the substrate. In addition, it is preferable that an end surface cleaning process is implemented not by an operator but by the substrate end surface automatic cleaning device. In this way, even if the cleaning operation is performed for a long time, the work efficiency does not gradually decrease.

  And according to such a manufacturing method, since the dust adhering to the end face of the substrate can be removed with a high probability, the above wiring substrate can be manufactured efficiently and with a high yield.

  Hereinafter, an embodiment in which the present invention is embodied in a substrate end face automatic cleaning apparatus for manufacturing a wiring board will be described in detail with reference to FIGS.

  FIG. 1 generally shows a film lamination line 1 of the present embodiment. The film lamination line 1 includes a substrate carry-in device 2, a laminator 3, a film cutting device 4, a substrate edge surface automatic cleaning device 5, an air blow device 6, a film peeling device 7 and a substrate carry-out device in order from the right side to the left side in FIG. 8 is provided. The substrate carry-in device 2 cleans the loaded substrate 15 with the substrate cleaning roller 9 and then transports the substrate 15 to the laminator 3. The laminator 3 makes a plurality of substrates 15 adjacent to each other with a gap between the substrate ends, laminates a protective film layer 12 having a size that can cover all the substrates 15, and then cuts the substrates 15 into a film. Transport to device 4. The film cutting device 4 cuts the protective film layer 12 according to the size of each substrate 15 to separate each substrate 15, and conveys these substrates 15 to the substrate end surface automatic cleaning device 5. The substrate end surface automatic cleaning device 5 carries out an operation of cleaning the end surface 16 of the substrate 15 and then transports the substrate 15 to the air blowing device 6. The air blowing device 6 carries out an operation of blowing off dust adhering to the substrate 15 with air, and then conveys the substrate 15 to the film peeling device 7. The film peeling device 7 transports the substrate 15 to the substrate carry-out device 8 after performing the work of peeling the protective film layer 12. The substrate carry-out device 8 carries the substrate 15 that has been peeled off in the film peeling device 7 from the film lamination line 1. The film lamination line 1 is used when a buildup layer is formed on the substrate 15 to manufacture a buildup multilayer resin wiring substrate (wiring substrate). The build-up layer is formed by alternately laminating interlayer insulating layers and conductor layers.

  1 to 8 show a substrate 15 that is a work target of the substrate end surface automatic cleaning device 5. The substrate 15 is a core substrate in a build-up multilayer resin wiring substrate, and for example, a substrate having conductor layers on both surfaces of a base material is used. As shown in FIG. 5, an interlayer insulating material 14 (resin insulating layer) is attached to the entire top surface of the substrate 15. The interlayer insulating material 14 is made of, for example, a photosensitive epoxy resin. Further, the surface layer portion of the interlayer insulating material 14 is protected by a protective film layer 12 made of PET (polyethylene terephthalate).

  As shown in FIGS. 2 and 3, the substrate end surface automatic cleaning device 5 includes a substrate transfer conveyor 33 supported by a conveyor support column 31. The substrate transfer conveyor 33 is configured to transfer the substrate 15 transferred from the film cutting device 4 to the air blow device 6 side. A plurality of substrate transport rollers 32 are rotatably disposed on the substrate transport conveyor 33 at a predetermined interval. A substrate 15 can be placed on each substrate transport roller 32. Each substrate transport roller 32 is arranged on a straight line along the transport direction of the substrate 15, and is arranged so that the rotation axis is orthogonal to the transport direction of the substrate 15. The interval between adjacent substrate transport rollers 32 is set to be shorter than the dimension of the substrate 15 in the transport direction. Each substrate transport roller 32 is configured to transport the substrate 15 by being rotated by a substrate moving motor (not shown).

  As shown in FIGS. 2 and 3, the substrate end surface automatic cleaning device 5 includes a substrate cleaning line 60 orthogonal to the substrate transporting conveyor 33. The substrate cleaning line 60 is provided with an electric single-axis slider 61 (substrate support member driving unit) which is a kind of actuator capable of multipoint positioning control. Instead of using the single axis slider 61, an actuator capable of multipoint positioning control such as a single axis robot may be used. The single axis slider 61 extends along the length direction of the substrate cleaning line 60 (the direction of the arrow A1 in FIG. 2), and includes a piston (not shown) therein. A slider 63 is connected to the piston, and the slider 63 is provided with an air cylinder 44 that expands and contracts in the vertical direction. A substrate support base 41 (substrate support member) for supporting the substrate 15 transported by the substrate transport conveyor 33 from below is attached to the rod tip of the air cylinder 44. Therefore, the uniaxial slider 61 is configured to translate the substrate support base 41 that supports the substrate 15 along the surface direction of the substrate 15, that is, along the length direction of the substrate cleaning line 60. Further, the substrate support base 41 can be moved up and down by the expansion and contraction of the air cylinder 44. The air cylinder 44 supports the substrate 15 by moving the substrate support base 41 upward when the substrate 15 on the substrate transfer conveyor 33 is transferred to the substrate cleaning line 60 side. The air cylinder 44 moves the substrate support base 41 downward when the substrate 15 on the substrate cleaning line 60 is transferred to the substrate transfer conveyor 33 side. Instead of using the air cylinder 44, the substrate support 41 may be moved up and down automatically by driving a ball screw with a stepping motor. This is preferable because multipoint position control in the vertical direction is possible.

  As shown in FIGS. 2 to 5 and 7, a pair of cutting mechanisms 51 are provided in the vicinity of the connection portion between the substrate transporting conveyor 33 and the substrate cleaning line 60. The cutting mechanisms 51 are arranged so as to face each other via the substrate cleaning line 60. Each cutting mechanism 51 has a cutting blade support 56, and a cutting blade 52 is attached to the cutting blade support 56. The tips of both cutting blades 52 are directed toward the substrate transfer conveyor 33 side. In the present embodiment, the inclination angle θ2 of the cutting blade 52 based on the moving direction of the substrate support base 41, that is, the traveling direction of the substrate 15, is set to about 15 ° (see FIG. 4). The distance between the tips of the two cutting blades 52 is substantially equal to the distance between the pair of end surfaces 16 of the substrate 15 (a pair of surfaces parallel to the traveling direction of the substrate 15). Therefore, when the board | substrate support stand 41 moves, the cutting blade 52 can cut | disconnect the excess protective film layer 12 which protruded from the end surface 16 of the board | substrate 15 (refer FIG. 4, FIG. 7). Moreover, the operation | work which cut | disconnects the protective film layer 12 with the cutting blade 52 is performed immediately before implementation of the cleaning by the cleaning member 20. FIG. In addition, you may make it attach the cutting blade support part 56 to which the cutting blade 52 was attached to the rod front-end | tip of an air cylinder (not shown). In this way, the cutting blade 52 can be reliably brought into contact with the end face 16 of the substrate 15 by projecting the rod and moving the cutting blade 52 toward the substrate 15. Further, in this case, a spring (not shown) may be provided between the cutting blade support 56 and the air cylinder so that the thrust applied to the substrate 15 from the air cylinder is absorbed by the elastic deformation of the spring. In this way, even if the end face 16 of the substrate 15 is somewhat uneven, the cutting blade 52 can always be in contact with the end face 16.

  As shown in FIGS. 3 and 5, the cutting mechanism 51 has a vertical position adjusting means 55. The vertical position adjusting means 55 includes a vertical position adjusting rail 57 extending in the vertical direction and a fixing member (not shown) such as a screw. The vertical position adjustment rail 57 is provided with a cutting blade support portion 56 that can be manually moved up and down. The screw is provided on the cutting blade support 56, and the cutting blade support 56 is fixed by tightening the screw and pressing the tip of the screw against the vertical position adjustment rail 57. Therefore, the vertical position of the cutting blade 52 can be adjusted by the vertical position adjustment rail 57 and the screw. The vertical position adjusting means 55 may be one that automatically moves the cutting blade support 56 up and down by driving a ball screw with a motor.

  As shown in FIGS. 4, 5, and 7, the cutting mechanism 51 includes a pair of pulling means 53. Both pulling means 53 are arranged so as to face each other via the substrate cleaning line 60. The pulling means 53 includes a pair of gripping plates 58, a gripping actuator (not shown), and a protective film pulling air cylinder 54 (see FIG. 4). The gripping actuator is configured to sandwich the excess portion of the protective film layer 12 before cutting from the front surface side and the back surface side by driving the pair of gripping plates 58 to open and close. Further, the protective film layer 12 is pulled in the surface direction by driving the protective film pulling air cylinder 54 in a state in which the surplus portion of the protective film layer 12 is gripped by the pair of gripping plates 58, and a predetermined tension is applied. It is supposed to be.

  As shown in FIGS. 2, 3 and 6 to 8, the substrate cleaning line 60 is provided with a pair of cleaning members 20. Both the cleaning members 20 are arranged so as to face each other via the substrate cleaning line 60. In the cleaning member 20, two cleaning rollers 21 are arranged along the moving direction of the substrate support base 41. Each cleaning roller 21 is supported by a roller support shaft 23 (roller support) extending in the vertical direction so as to be able to roll, and is detachably supported by the roller support shaft 23. The roller support shaft 23 is disposed so as to be parallel to the end surface 16 of the substrate 15 supported by the substrate support base 41. Therefore, each cleaning roller 21 comes into contact with the end surface 16 of the substrate 15 from the vertical direction and rotates as the substrate 15 moves (see FIG. 8). In the present embodiment, two cleaning rollers 21 are in contact with one end surface 16 of the substrate 15. Each cleaning roller 21 has an adhesive layer 22 (adhesive portion) on the outer peripheral surface. The cleaning roller 21 of the present embodiment is a roll of an adhesive tape having an adhesive layer 22.

  As shown in FIG. 2, the cleaning member 20 is provided with an air cylinder 71 (roller support driving unit). Further, the cleaning member 20 includes a pair of linear guides 24 extending along a direction (arrow A2 direction in FIG. 2) perpendicular to the length direction of the substrate cleaning line 60. When the air cylinder 71 is driven, the cleaning member 20 moves along the extending direction of the linear guide 24 (arrow A2 direction). Therefore, the air cylinder 71 moves the cleaning member 20 in a direction (arrow A2 direction) in which the cleaning roller 21 is brought into contact with the end surface 16 of the substrate 15 that moves in parallel with the single-axis slider 61. . Thereby, each cleaning roller 21 can be pressed against the end face 16 of the substrate 15. The air cylinder 71 and the uniaxial slider 61 constitute driving means for moving at least one of the substrate support base 41 and the cleaning member 20 to bring the end surface 16 of the substrate 15 into contact with the adhesive layer 22. The

  Next, the manufacturing method of the buildup multilayer resin wiring board using said board | substrate end surface automatic cleaning apparatus 5 is demonstrated.

  First, a drilling machine is used for drilling a copper clad laminate, and a through hole (not shown) penetrating the copper clad laminate is formed in advance at a predetermined position. In addition, you may form a through-hole by performing a laser drilling process with respect to a copper clad laminated board using a YAG laser or a carbon dioxide gas laser. And a plating through hole is formed by performing electroless copper plating and electrolytic copper plating according to a conventionally well-known method. Further, the copper foil on both sides of the copper clad laminate is etched to pattern the first conductor layer by, for example, a subtractive method. Specifically, after the electroless copper plating, electrolytic copper plating is performed using the electroless copper plating layer as a common electrode. Further, the dry film is laminated, and the dry film is exposed and developed to form a dry film in a predetermined pattern. In this state, unnecessary electrolytic copper plating layer, electroless copper plating layer and copper foil are removed by etching. Then, the board | substrate 15 which is a double-sided board is obtained by peeling a dry film. The substrate 15 may be formed by a semi-additive method. Specifically, after electroless copper plating, exposure and development are performed to form a predetermined pattern of plating resist. In this state, after electrolytic copper plating is performed using the electroless copper plating layer as a common electrode, first, the resist is dissolved and removed, and further unnecessary electroless copper plating layer is removed by etching. As a result, a substrate 15 that is a double-sided board is obtained.

  Next, a layer forming step is performed. Specifically, after pasting the film-like interlayer insulating material 14 on the main surface of the substrate 15, the laminator 3 is used to perform the pasting step, and the protective film layer 12 is pasted on the substrate 15 having the interlayer insulating material 14 pasted thereon. Laminate on the main surface. Specifically, first, the protective film layer 12 having a size capable of covering the main surface of all the substrates 15 is laminated by the laminator 3 in a state where the plurality of substrates 15 are disposed adjacently and horizontally. Then, the laminated protective film layer 12 is cut according to the size of each substrate 15 using the film cutting device 4.

  Then, the board | substrate 15 which has the interlayer insulation material 14 protected by the protective film layer 12 is conveyed to the board | substrate end surface automatic cleaning apparatus 5, and a cutting process is implemented. Specifically, in the cutting step, first, the air cylinder 44 is driven to move the substrate support base 41 upward, so that the substrate 15 on the substrate transfer conveyor 33 is supported by the substrate support base 41. Next, in a state where the protective film layer 12 is pulled in the surface direction (horizontal direction) by the pulling means 53, the protective film layer formed by the layer forming step is moved by moving the substrate support base 41 to the cutting blade 52 side. 12 is cut at the end face 16 of the substrate 15 (see FIGS. 4 and 7). Thereby, the surplus protective film layer 12 protruding from the end face 16 of the substrate 15 is removed.

  After the cutting process, an end face cleaning process for cleaning the end face 16 of the substrate 15 is performed. Specifically, the substrate support base 41 is further moved to the cleaning member 20 side, and the cleaning member 20 is moved so that each cleaning roller 21 is pressed against the end surface 16 of the substrate 15. In this state, when the single-axis slider 61 is driven to translate the substrate support base 41, dust attached to the end surface 16 of the substrate 15 is adhered to the adhesive layer 22 as each cleaning roller 21 rotates following the rotation. And is removed (see FIG. 8). Note that the substrate support base 41 may be reciprocated in a state where the cleaning rollers 21 are pressed against the end surface 16 of the substrate 15. In this way, dust attached to the end surface 16 of the substrate 15 can be more reliably removed.

  After the end face cleaning process, the substrate support table 41 is moved to the substrate transfer conveyor 33 side, and the air cylinder 44 is driven to move the substrate support table 41 downward, whereby the substrate 15 on the substrate support table 41 is moved. It is placed on the substrate transfer conveyor 33. Then, each substrate transport roller 32 of the substrate transport conveyor 33 is rotationally driven to carry out the substrate 15.

  Further, after exposing the interlayer insulating material 14 of the unloaded substrate 15, the substrate 15 is transported to the film peeling apparatus 7. And the peeling process which peels the protective film layer 12 is implemented. As a result, the protective film layer 12 is completely peeled off from the substrate 15, and an interlayer insulating material 14 to be an interlayer insulating layer of the build-up multilayer resin wiring substrate later remains on the substrate 15. The substrate 15 from which the protective film layer 12 has been peeled is carried out by the substrate carry-out device 8.

  Then, development is performed on the interlayer insulating material 14 of the unloaded substrate 15 to form an interlayer insulating layer having a blind hole (via) at a position where a via conductor is to be formed. Next, electroless copper plating is performed according to a conventionally known method (for example, a semi-additive method), and exposure and development are performed to form a plating resist having a predetermined pattern. In this state, by performing electrolytic copper plating using the electroless copper plating layer as a common electrode, a via conductor is formed inside the blind hole, and a copper plating layer is formed on the interlayer insulating layer. Further, the resist is dissolved and removed, and an unnecessary electroless copper plating layer is etched to form a second conductor layer on the interlayer insulating layer (conductor layer forming step).

  Thereafter, by repeating the pasting step to the conductor layer forming step, the interlayer insulating layers and the conductor layers are alternately laminated. As a result, a build-up layer is formed, and a desired build-up multilayer resin wiring board is completed.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the substrate end surface automatic cleaning device 5 of this embodiment, the end surface 16 of the substrate 15 and the adhesive layer 22 are brought into contact with each other, and dust attached to the end surface 16 is attached to the adhesive layer 22 and removed. Therefore, the end surface 16 of the substrate 15 can be cleaned. In addition, when cleaning the end surface 16 of the substrate 15, the end surface 16 of the substrate 15 and the adhesive layer 22 are brought into contact with each other by driving of the uniaxial slider 61 and the air cylinder 71 instead of an operator. For this reason, even if the cleaning operation is performed for a long time, the work efficiency does not gradually decrease. Further, since each cleaning roller 21 is pressed against the end face 16 of the substrate 15 by driving the air cylinder 71, the end face 16 of the substrate 15 and the adhesive layer 22 can be stably brought into contact with each other. Therefore, the possibility that dust will remain on the end surface 16 of the substrate 15 after the cleaning operation is reduced. Therefore, since it becomes less necessary to repeat the cleaning operation in order to remove the remaining dust, it is possible to prevent a reduction in work efficiency.

  (2) In the present embodiment, two cleaning rollers 21 are in contact with both end surfaces 16 of the substrate 15. For this reason, the cleaning operation of both end surfaces 16 can be completed only by passing the substrate 15 between the cleaning members 20 once. Therefore, since the cleaning work can be completed in a short time, the work efficiency is improved.

  (3) In the present embodiment, the cutting mechanisms 51 are arranged so as to face each other via the substrate cleaning line 60. For this reason, the surplus protective film layer 12 can be removed from both end surfaces 16 only by passing the substrate 15 between the two cutting mechanisms 51 once. Therefore, since the cleaning operation of both end faces 16 can be started at the same time, the work efficiency is improved.

  (4) In the present embodiment, the pulling means 53 are arranged so as to face each other via the substrate cleaning line 60. For this reason, when cutting the surplus part of the protective film layer 12, the protective film layer 12 comes to be pulled from both sides of the board | substrate 15 in the advancing direction. Therefore, when the protective film layer 12 is pulled by the pulling means 53, the substrate 15 can be prevented from being inclined with respect to the traveling direction.

  (5) The cleaning roller 21 of the present embodiment is a roll of an adhesive tape having the adhesive layer 22. For this reason, even if the adhesive layer 22 exposed on the outer peripheral surface is soiled and the adhesive force is lowered, the adhesive force of the cleaning roller 21 is always best by peeling the adhesive tape to expose the unstained adhesive layer 22. Can be maintained in a state. However, when the adhesive tape is peeled off and the outer diameter of the cleaning roller 21 is reduced, the adhesive layer 22 becomes difficult to contact the end face 16 of the substrate 15. Therefore, in this embodiment, by driving the air cylinder 71, the cleaning member 20 is moved to press the cleaning roller 21 against the end surface 16 of the substrate 15. Thereby, since the contact state between the adhesive layer 22 and the end surface 16 is maintained constant, the possibility that dust may remain on the end surface 16 of the substrate 15 can be reduced despite the cleaning operation. .

  In addition, you may change embodiment of this invention as follows.

  In the above embodiment, each cleaning roller 21 is supported by the roller support shaft 23 so as to come into contact with the end surface 16 of the substrate 15 from the vertical direction.

  However, each cleaning roller 21 may be supported by the roller support shaft 23 so as to contact the end surface 16 of the substrate 15 from an oblique direction. Specifically, the inclination angle θ1 of the cleaning roller 21 with respect to the end surface 16 of the substrate 15 may be set to about 15 °, for example (see FIG. 9). In this way, the cleaning roller 21 can be reliably brought into contact with the edge of the end face 16. Therefore, dust attached to the edge of the end surface 16 of the substrate 15 can be more reliably removed, so that the cleaning operation can be performed more efficiently.

  In this case, each cleaning roller 21 is preferably supported by the roller support shaft 23 so as to contact the upper edge of the end surface 16 and the lower edge of the end surface 16 from an oblique direction (FIGS. 9 and 9). 10). In this way, the cleaning work for both the upper edge and the lower edge of the end face 16 can be completed by passing the substrate 15 between the cleaning members 20 once. Therefore, since the cleaning work can be completed in a short time, the work efficiency is improved.

  The cutting mechanism 51 of the above embodiment is used to cut the excess protective film layer 12 protruding from the end surface 16 of the substrate 15. However, the cutting mechanism 51 may be used to cut a resin insulating layer such as an excess interlayer insulating material 14 protruding from the end face 16. Further, when a resist layer such as a solder resist layer or a plating resist layer is affixed to the substrate 15, the cutting mechanism 51 may be used to cut an excessive resist layer protruding from the end face 16.

  In the above embodiment, the cutting mechanism 51 is moved up and down, but the substrate support base 41 may be moved up and down. For example, instead of fixing the cutting blade 52 and the cutting blade support 56 so that they cannot move up and down, and using the air cylinder 44 to move the substrate support table 41 up and down, the substrate support table is automatically driven by driving a ball screw with a stepping motor. You may make it control which position of the cutting blade 52 is made to contact the end surface 16 of the board | substrate 15 by moving 41 up and down. In this way, the vertical position of the substrate support base 41 on which the substrate 15 is placed can be controlled more finely. In addition, by using the single-axis slider 61 capable of multipoint positioning control, the control of the height of the substrate 15 when cutting the protective film layer 12 and the control of the height of the substrate 15 when cleaning the end face 16 are performed. And can be performed individually. Therefore, since the upper and lower widths of the adhesive tape constituting the cutting blade 52 and the cleaning roller 21 can be used effectively, the usage amount of the consumable members (the cutting blade 52 and the adhesive tape) can be reduced.

  In the above embodiment, the substrate edge surface automatic cleaning device 5 is used when forming the interlayer insulating layer of the build-up multilayer resin wiring board, but when forming the insulating layer of the wiring board other than the build-up multilayer resin wiring board. You may use for.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) An apparatus for cleaning an end face of a substrate on which at least one of a resin insulating layer, a resist layer, and a protective film layer is affixed, comprising: a substrate support member that supports the substrate; and an adhesive portion A cleaning roller having an adhesive layer on the outer peripheral surface, a roller support that supports a plurality of cleaning rollers in a rollable manner, and at least one of the substrate support member and the roller support is moved to move the substrate. Driving means for bringing the end face of the end face into contact with the adhesive portion, and each cleaning roller contacts the roller support body so as to contact the upper edge of the end face or the lower edge of the end face from an oblique direction. A substrate end face automatic cleaning device, characterized in that it is supported.

Schematic which shows the film lamination line of this embodiment. The top view which shows the board | substrate end surface automatic cleaning apparatus of this embodiment. The front view which shows the board | substrate end surface automatic cleaning apparatus of this embodiment. The principal part schematic diagram which shows the state at the time of performing the operation | movement which cut | disconnects an excess protective film. AA line sectional view of Drawing 4. The principal part schematic which shows the state at the time of cleaning the end surface of a board | substrate. The schematic perspective view which shows the state at the time of performing the operation | movement which cut | disconnects an excess protective film. The schematic perspective view which shows the state at the time of cleaning the end surface of a board | substrate. The principal part schematic diagram which shows the state at the time of cleaning the end surface of the board | substrate in other embodiment. The schematic perspective view which shows the state at the time of cleaning the end surface of the board | substrate in other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 5 ... Board | substrate end surface automatic cleaning apparatus 12 ... Protective film layer 14 ... Interlayer insulating material 15 as a resin insulating layer ... Board | substrate 16 ... End surface 20 ... Cleaning member 21 ... Cleaning roller 22 ... Adhesive layer 23 which is an adhesion part ... Roller support body A roller support shaft 41 as a substrate support base 51 as a substrate support member ... a cutting mechanism 52 ... a cutting blade 53 ... a tension means 55 ... a vertical position adjusting means 61 ... a single-axis slider 71 as a substrate support member drive unit ... a roller support Air cylinder as drive unit

Claims (11)

An apparatus for cleaning an end face of a substrate to which at least one of a resin insulating layer, a resist layer, and a protective film layer is attached,
A substrate support member for supporting the substrate;
A cleaning member having an adhesive portion;
An apparatus for automatically cleaning a substrate end surface, comprising driving means for moving at least one of the substrate support member and the cleaning member to bring the end surface of the substrate into contact with the adhesive portion.   The said cleaning member is comprised including the roller for cleaning which has the adhesion layer which is an adhesion part on an outer peripheral surface, and the roller support body which supports the roller for cleaning so that rolling is possible. The substrate end face automatic cleaning apparatus according to 1.   3. The substrate end face automatic cleaning device according to claim 2, wherein the cleaning roller is supported by the roller support so as to contact the end face of the substrate from an oblique direction.   4. The substrate end face automatic cleaning apparatus according to claim 3, wherein an inclination angle [theta] 1 of the cleaning roller with respect to the end face of the substrate is set to 0 [deg.] <[Theta] 1 <30 [deg.]. The driving means includes
A substrate support member driving unit that translates the substrate support member in a state of supporting the substrate along a surface direction of the substrate;
And a roller support driving unit that presses the roller support in a direction in which the cleaning roller is brought into contact with an end face of the substrate that moves in parallel with the substrate support driving unit. The substrate end face automatic cleaning apparatus according to any one of claims 2 to 4.   A cutting mechanism is provided that cuts at least one of an excess resin insulating layer, a resist layer, and a protective film layer protruding from an end surface of the substrate before the cleaning by the cleaning member. Item 6. The substrate end face automatic cleaning device according to any one of Items 1 to 5.   The cutting mechanism includes a cutting blade, and an inclination angle θ2 of the cutting blade with respect to a moving direction of the substrate support member is set to 10 ° <θ2 <20 °. Automatic substrate end face cleaning device.   The said cutting mechanism has a tension means which pulls at least any one of a surplus resin insulation layer, a resist layer, and a protective film layer at the time of the cutting | disconnection by the said cutting blade, The Claim 6 or 7 characterized by the above-mentioned. The board | substrate end surface automatic cleaning apparatus of description.   The apparatus for automatically cleaning a substrate end face according to claim 7 or 8, further comprising a vertical position adjusting means for adjusting a relative vertical positional relationship between the substrate and the cutting blade. A layer forming step of forming at least one of a resin insulating layer, a resist layer and a protective film layer on the surface of the substrate;
A cutting step of cutting at least one of a resin insulating layer, a resist layer, and a protective film layer at an end surface of the substrate;
A method of manufacturing a wiring board comprising: an end face cleaning step of cleaning an end face of the substrate by bringing a cleaning member having an adhesive portion into contact with the end face of the substrate. A layer forming step of forming at least one of a resin insulating layer, a resist layer and a protective film layer on the surface of the substrate;
A cutting step of cutting at least one of a resin insulating layer, a resist layer, and a protective film layer at an end surface of the substrate;
A method for manufacturing a wiring board, comprising: an end face cleaning step of cleaning the end face of the substrate using the automatic substrate end face cleaning device according to claim 1.

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