JP6291800B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP6291800B2
JP6291800B2 JP2013235228A JP2013235228A JP6291800B2 JP 6291800 B2 JP6291800 B2 JP 6291800B2 JP 2013235228 A JP2013235228 A JP 2013235228A JP 2013235228 A JP2013235228 A JP 2013235228A JP 6291800 B2 JP6291800 B2 JP 6291800B2
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Japan
Prior art keywords
external electrode
semiconductor element
semiconductor
light emitting
electrode
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JP2013235228A
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English (en)
Japanese (ja)
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JP2014143396A5 (https=
JP2014143396A (ja
Inventor
祐太 岡
祐太 岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
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Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013235228A priority Critical patent/JP6291800B2/ja
Priority to US14/140,352 priority patent/US9768228B2/en
Priority to CN201310728085.0A priority patent/CN103904206B/zh
Publication of JP2014143396A publication Critical patent/JP2014143396A/ja
Publication of JP2014143396A5 publication Critical patent/JP2014143396A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
JP2013235228A 2012-12-26 2013-11-13 半導体装置およびその製造方法 Active JP6291800B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013235228A JP6291800B2 (ja) 2012-12-26 2013-11-13 半導体装置およびその製造方法
US14/140,352 US9768228B2 (en) 2012-12-26 2013-12-24 Semiconductor device and method for manufacturing the same
CN201310728085.0A CN103904206B (zh) 2012-12-26 2013-12-25 半导体装置及其制造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012283270 2012-12-26
JP2012283270 2012-12-26
JP2013235228A JP6291800B2 (ja) 2012-12-26 2013-11-13 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2014143396A JP2014143396A (ja) 2014-08-07
JP2014143396A5 JP2014143396A5 (https=) 2016-12-15
JP6291800B2 true JP6291800B2 (ja) 2018-03-14

Family

ID=50973708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013235228A Active JP6291800B2 (ja) 2012-12-26 2013-11-13 半導体装置およびその製造方法

Country Status (3)

Country Link
US (1) US9768228B2 (https=)
JP (1) JP6291800B2 (https=)
CN (1) CN103904206B (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6511887B2 (ja) 2015-03-18 2019-05-15 日亜化学工業株式会社 発光装置
JP2017063073A (ja) * 2015-09-24 2017-03-30 東芝ライテック株式会社 発光装置、および照明装置
JP6447580B2 (ja) 2016-06-15 2019-01-09 日亜化学工業株式会社 発光装置
WO2018061889A1 (ja) * 2016-09-28 2018-04-05 シチズン電子株式会社 発光装置
JP2019016780A (ja) * 2017-07-04 2019-01-31 日亜化学工業株式会社 発光装置
JP6879270B2 (ja) * 2018-07-20 2021-06-02 日亜化学工業株式会社 発光装置
JP6916450B2 (ja) * 2019-04-01 2021-08-11 日亜化学工業株式会社 発光装置及びその製造方法
JP6773166B2 (ja) * 2019-04-10 2020-10-21 日亜化学工業株式会社 発光装置
US10561029B1 (en) * 2019-04-10 2020-02-11 Innolux Corporation Electronic device
JP7041375B2 (ja) * 2020-09-26 2022-03-24 日亜化学工業株式会社 発光装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7479660B2 (en) * 2005-10-21 2009-01-20 Perkinelmer Elcos Gmbh Multichip on-board LED illumination device
DE102005061204A1 (de) 2005-12-21 2007-07-05 Perkinelmer Elcos Gmbh Beleuchtungsvorrichtung, Beleuchtungssteuergerät und Beleuchtungssystem
US7655957B2 (en) 2006-04-27 2010-02-02 Cree, Inc. Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
US20080121902A1 (en) * 2006-09-07 2008-05-29 Gelcore Llc Small footprint high power light emitting package with plurality of light emitting diode chips
US8049237B2 (en) * 2007-12-28 2011-11-01 Nichia Corporation Light emitting device
JP5349811B2 (ja) * 2008-02-06 2013-11-20 シャープ株式会社 半導体発光装置
US7893445B2 (en) * 2009-11-09 2011-02-22 Cree, Inc. Solid state emitter package including red and blue emitters
JP5623062B2 (ja) * 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
JP2011216868A (ja) 2010-03-16 2011-10-27 Toshiba Lighting & Technology Corp 発光装置及び照明装置
EP2365525A3 (en) 2010-03-12 2013-05-29 Toshiba Lighting & Technology Corporation Illumination apparatus having an array of red and phosphour coated blue LEDs
CN103026514B (zh) * 2010-09-30 2016-08-03 日亚化学工业株式会社 发光装置以及发光装置的制造方法
JP5573602B2 (ja) 2010-10-29 2014-08-20 日亜化学工業株式会社 発光装置
JP5569389B2 (ja) * 2010-12-28 2014-08-13 日亜化学工業株式会社 発光装置の製造方法及び発光装置
WO2012165007A1 (ja) * 2011-05-27 2012-12-06 シャープ株式会社 発光装置、照明装置および発光装置の製造方法
JP6079629B2 (ja) * 2011-07-25 2017-02-15 日亜化学工業株式会社 発光装置
JP2013179197A (ja) 2012-02-28 2013-09-09 Sharp Corp 発光装置および、その製造方法
KR20140108756A (ko) * 2013-02-27 2014-09-15 서울반도체 주식회사 발광 장치

Also Published As

Publication number Publication date
CN103904206B (zh) 2018-02-23
US20140175595A1 (en) 2014-06-26
US9768228B2 (en) 2017-09-19
CN103904206A (zh) 2014-07-02
JP2014143396A (ja) 2014-08-07

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