JP6280518B2 - Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ - Google Patents

Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ Download PDF

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Publication number
JP6280518B2
JP6280518B2 JP2015084928A JP2015084928A JP6280518B2 JP 6280518 B2 JP6280518 B2 JP 6280518B2 JP 2015084928 A JP2015084928 A JP 2015084928A JP 2015084928 A JP2015084928 A JP 2015084928A JP 6280518 B2 JP6280518 B2 JP 6280518B2
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JP
Japan
Prior art keywords
fpc
conductive adhesive
adhesive sheet
conductive
vol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015084928A
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English (en)
Japanese (ja)
Other versions
JP2016207738A (ja
Inventor
野村　直宏
直宏 野村
喬規 櫻木
喬規 櫻木
さなえ 藤井
さなえ 藤井
後藤　信弘
信弘 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimori Kogyo Co Ltd
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimori Kogyo Co Ltd filed Critical Fujimori Kogyo Co Ltd
Priority to JP2015084928A priority Critical patent/JP6280518B2/ja
Priority to KR1020160036660A priority patent/KR101764754B1/ko
Priority to CN201610188046.XA priority patent/CN106042519B/zh
Priority to TW109115674A priority patent/TWI754931B/zh
Priority to TW105110861A priority patent/TWI754611B/zh
Publication of JP2016207738A publication Critical patent/JP2016207738A/ja
Priority to KR1020170095998A priority patent/KR101848635B1/ko
Application granted granted Critical
Publication of JP6280518B2 publication Critical patent/JP6280518B2/ja
Priority to KR1020180040766A priority patent/KR101953555B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Structure Of Printed Boards (AREA)
JP2015084928A 2015-04-17 2015-04-17 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ Active JP6280518B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2015084928A JP6280518B2 (ja) 2015-04-17 2015-04-17 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
KR1020160036660A KR101764754B1 (ko) 2015-04-17 2016-03-28 Fpc용 도전성 접착 시트 및 그것을 이용한 fpc
CN201610188046.XA CN106042519B (zh) 2015-04-17 2016-03-29 Fpc用导电性粘接片及使用该粘接片的fpc
TW105110861A TWI754611B (zh) 2015-04-17 2016-04-07 Ｆｐｃ用導電性黏著片材及使用此片材之ｆｐｃ
TW109115674A TWI754931B (zh) 2015-04-17 2016-04-07 Fpc用導電性黏著片材及使用此片材之fpc
KR1020170095998A KR101848635B1 (ko) 2015-04-17 2017-07-28 Fpc용 도전성 접착 시트 및 그것을 이용한 fpc
KR1020180040766A KR101953555B1 (ko) 2015-04-17 2018-04-09 Fpc용 도전성 접착 시트 및 그것을 이용한 fpc

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015084928A JP6280518B2 (ja) 2015-04-17 2015-04-17 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2018006785A Division JP6542920B2 (ja) 2018-01-18 2018-01-18 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
JP2018006786A Division JP6541283B2 (ja) 2018-01-18 2018-01-18 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ
JP2018006787A Division JP6448160B2 (ja) 2018-01-18 2018-01-18 接着性組成物及びｆｐｃ用導電性接着シート

Publications (2)

Publication Number Publication Date
JP2016207738A JP2016207738A (ja) 2016-12-08
JP6280518B2 true JP6280518B2 (ja) 2018-02-14

Family

ID=57251926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015084928A Active JP6280518B2 (ja) 2015-04-17 2015-04-17 Ｆｐｃ用導電性接着シート及びそれを用いたｆｐｃ

Country Status (4)

Country Link
JP (1) JP6280518B2 (ko)
KR (3) KR101764754B1 (ko)
CN (1) CN106042519B (ko)
TW (2) TWI754931B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109890124B (zh) * 2017-12-06 2024-03-19 昆山雅森电子材料科技有限公司 多层异向穿刺型导电布胶及使用其的fpc补强屏蔽结构
CN115867622A (zh) * 2020-09-03 2023-03-28 东洋铝株式会社 导电性粘接剂、使用该导电性粘接剂的电子电路及其制造方法
CN111968536B (zh) * 2020-09-09 2022-06-10 武汉华星光电半导体显示技术有限公司 屏蔽带及显示模组的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61222299A (ja) 1985-03-28 1986-10-02 日本光フアイバ株式会社 電磁波シ−ルド用テ−プもしくはシ−ト
JPH07122883A (ja) 1993-10-21 1995-05-12 Nitto Denko Corp 電磁波シ−ルド材
JPH1197879A (ja) * 1997-09-19 1999-04-09 Bridgestone Corp 電磁波シールド性光透過窓材
US6344155B1 (en) * 1999-04-06 2002-02-05 Tomoegawa Paper Co., Ltd. Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof
JP3535412B2 (ja) * 1999-04-06 2004-06-07 株式会社巴川製紙所 導電性接着剤組成物、導電性接着剤シート及びそれを用いた電磁波シールド材料ならびに電磁波シールド性フレキシブルプリント基板。
JP4956867B2 (ja) * 2001-04-27 2012-06-20 大日本印刷株式会社 フラットケーブル用シールド材及びシールド付きフラットケーブル
JP4759899B2 (ja) * 2001-09-28 2011-08-31 大日本印刷株式会社 電磁波シールド材および電磁波シールド付きフラットケーブル
JP2004212496A (ja) * 2002-12-27 2004-07-29 Nippon Aerosil Co Ltd 混合粒子
JP4825830B2 (ja) * 2008-03-11 2011-11-30 住友電気工業株式会社 金属補強板を備えたフレキシブルプリント配線板
JP6081819B2 (ja) * 2013-02-28 2017-02-15 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
JP6254386B2 (ja) * 2013-08-29 2017-12-27 共同印刷株式会社 感圧接着剤組成物
JPWO2017043455A1 (ja) * 2015-09-07 2018-06-28 株式会社巴川製紙所 導電性接着剤組成物、導電性接着シート及びそれを用いた配線デバイス

Also Published As

Publication number Publication date
KR20170092502A (ko) 2017-08-11
KR101848635B1 (ko) 2018-04-13
TWI754931B (zh) 2022-02-11
TW202033700A (zh) 2020-09-16
KR20180040129A (ko) 2018-04-19
KR101953555B1 (ko) 2019-03-04
KR101764754B1 (ko) 2017-08-03
KR20160123990A (ko) 2016-10-26
TWI754611B (zh) 2022-02-11
TW201702336A (zh) 2017-01-16
CN106042519B (zh) 2020-05-05
CN106042519A (zh) 2016-10-26
JP2016207738A (ja) 2016-12-08

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