JP6262996B2 - Multilayer electronic component module - Google Patents

Multilayer electronic component module Download PDF

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JP6262996B2
JP6262996B2 JP2013228046A JP2013228046A JP6262996B2 JP 6262996 B2 JP6262996 B2 JP 6262996B2 JP 2013228046 A JP2013228046 A JP 2013228046A JP 2013228046 A JP2013228046 A JP 2013228046A JP 6262996 B2 JP6262996 B2 JP 6262996B2
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wiring board
electronic component
mounting surface
wiring
electronic components
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JP2015088684A (en
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利之 柿原
利之 柿原
誉 増田
誉 増田
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Hamamatsu Photonics KK
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Combinations Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

本発明は、積層型電子部品モジュールに関する。   The present invention relates to a multilayer electronic component module.

第１配線基板と、第１配線基板の実装面に実装された第１電子部品と、第１電子部品を挟むように第１配線基板に積層された第２配線基板と、第２配線基板の実装面に実装された第２電子部品と、第１電子部品と第２配線基板との間に配置された緩衝接着剤と、を備える積層型電子部品モジュールが知られている（例えば、特許文献１参照）。   A first wiring board, a first electronic component mounted on a mounting surface of the first wiring board, a second wiring board stacked on the first wiring board so as to sandwich the first electronic component, and a second wiring board A multilayer electronic component module including a second electronic component mounted on a mounting surface and a buffer adhesive disposed between the first electronic component and the second wiring board is known (for example, Patent Literature 1). 1).

特開２００１−８５６０１号公報JP 2001-85601 A

上述したような積層型電子部品モジュールにおいては、電子部品の実装の高密度化及びモジュールの小型化が求められている。しかしながら、それらによって電子部品間の距離が小さくなると、モジュールの電気的な特性が低下するおそれがある。   In the multilayer electronic component module as described above, it is required to increase the mounting density of electronic components and downsize the module. However, if the distance between the electronic components is reduced by them, the electrical characteristics of the module may be deteriorated.

そこで、本発明は、モジュールの電気的な特性の低下を抑制しつつ、電子部品の実装の高密度化及びモジュールの小型化を図ることができる積層型電子部品モジュールを提供することを目的とする。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a multilayer electronic component module capable of increasing the mounting density of electronic components and reducing the size of the module while suppressing deterioration of the electrical characteristics of the module. .

本発明の積層型電子部品モジュールは、第１実装面を有する第１配線基板と、第１実装面に実装された複数の第１電子部品と、複数の第１電子部品を挟むように第１配線基板に積層され、第２実装面を有する第２配線基板と、第２実装面に実装された第２電子部品と、第１実装面及び複数の第１電子部品を覆う電気絶縁膜と、第１配線基板と第２配線基板との間に配置された耐電圧樹脂材と、を備える。   The multilayer electronic component module of the present invention includes a first wiring board having a first mounting surface, a plurality of first electronic components mounted on the first mounting surface, and a first so as to sandwich the plurality of first electronic components. A second wiring substrate stacked on the wiring substrate and having a second mounting surface; a second electronic component mounted on the second mounting surface; an electrical insulating film covering the first mounting surface and the plurality of first electronic components; A withstand voltage resin material disposed between the first wiring board and the second wiring board.

この積層型電子部品モジュールでは、第１電子部品間の距離が小さくなっても、第１実装面及び複数の第１電子部品が電気絶縁膜に覆われているので、第１電子部品間でのリーク電流の発生が抑制される。更に、第１電子部品と第２電子部品との距離が小さくなっても、第１配線基板と第２配線基板との間に耐電圧樹脂材が配置されているので、第１電子部品と第２電子部品との間での放電の発生が抑制される。よって、この積層型電子部品モジュールによれば、モジュールの電気的な特性の低下を抑制しつつ、電子部品の実装の高密度化及びモジュールの小型化を図ることができる。   In this multilayer electronic component module, even if the distance between the first electronic components is reduced, the first mounting surface and the plurality of first electronic components are covered with the electrical insulating film. Generation of leakage current is suppressed. Further, even if the distance between the first electronic component and the second electronic component is reduced, the voltage-resistant resin material is disposed between the first wiring substrate and the second wiring substrate, so that the first electronic component and the second electronic component Generation of electric discharge between the two electronic components is suppressed. Therefore, according to the multilayer electronic component module, it is possible to increase the density of mounting electronic components and reduce the size of the module while suppressing the deterioration of the electrical characteristics of the module.

本発明の積層型電子部品モジュールでは、第２実装面には、第２電子部品が複数実装されており、電気絶縁膜は、第２実装面及び複数の第２電子部品を覆っていてもよい。これによれば、第２電子部品間でのリーク電流の発生を抑制しつつ、第２実装面上での第２電子部品の実装の高密度化を図ることができる。   In the multilayer electronic component module of the present invention, a plurality of second electronic components may be mounted on the second mounting surface, and the electrical insulating film may cover the second mounting surface and the plurality of second electronic components. . According to this, it is possible to increase the density of mounting of the second electronic components on the second mounting surface while suppressing the occurrence of leakage current between the second electronic components.

本発明の積層型電子部品モジュールでは、電気絶縁膜は、耐電圧樹脂材よりも低い吸水率を有しており、耐電圧樹脂材は、電気絶縁膜よりも低い弾性率を有していてもよい。これによれば、電気絶縁膜に覆われた電子部品間でのリーク電流の発生をより確実に抑制することができると共に、耐電圧樹脂材を緩衝材として機能させて、モジュールに発生する応力を緩和することができる。   In the multilayer electronic component module of the present invention, the electrical insulating film has a lower water absorption rate than the withstand voltage resin material, and the withstand voltage resin material has a lower elastic modulus than the electrical insulating film. Good. According to this, it is possible to more reliably suppress the occurrence of leakage current between the electronic components covered with the electrical insulating film, and to function the voltage-resistant resin material as a buffer material, thereby reducing the stress generated in the module. Can be relaxed.

本発明の積層型電子部品モジュールでは、耐電圧樹脂材は、真空注型によって、第１配線基板と第２配線基板との間の間隙に充填されていてもよい。これによれば、積層型電子部品モジュールは、第１配線基板と第２配線基板との間の間隙に耐電圧樹脂材が確実に充填されたものとなる。   In the multilayer electronic component module of the present invention, the withstand voltage resin material may be filled in a gap between the first wiring board and the second wiring board by vacuum casting. According to this, in the multilayer electronic component module, the withstand voltage resin material is reliably filled in the gap between the first wiring board and the second wiring board.

本発明の積層型電子部品モジュールでは、第１配線基板には、第１実装面を包囲する枠部が設けられており、第２配線基板は、枠部に支持されていてもよい。本発明の積層型電子部品モジュールでは、第２配線基板は、複数の第１電子部品の少なくとも１つに支持されていてもよい。これらによれば、第１配線基板に対する第２配線基板の積層状態の安定化を図ることができる。   In the multilayer electronic component module of the present invention, the first wiring substrate may be provided with a frame portion surrounding the first mounting surface, and the second wiring substrate may be supported by the frame portion. In the multilayer electronic component module of the present invention, the second wiring board may be supported by at least one of the plurality of first electronic components. According to these, the lamination state of the second wiring board with respect to the first wiring board can be stabilized.

本発明によれば、モジュールの電気的な特性の低下を抑制しつつ、電子部品の実装の高密度化及びモジュールの小型化を図ることができる積層型電子部品モジュールを提供することが可能となる。   ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the multilayer electronic component module which can aim at the high density of mounting of an electronic component, and size reduction of a module, suppressing the fall of the electrical property of a module. .

本発明の第１実施形態の積層型電子部品モジュールの断面図である。It is sectional drawing of the multilayer electronic component module of 1st Embodiment of this invention. 本発明の第２実施形態の積層型電子部品モジュールの断面図である。It is sectional drawing of the multilayer electronic component module of 2nd Embodiment of this invention.

以下、本発明の好適な実施形態について、図面を参照して詳細に説明する。なお、各図において同一又は相当部分には同一符号を付し、重複する説明を省略する。
［第１実施形態］ DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or equivalent part, and the overlapping description is abbreviate | omitted.
[First Embodiment]

図１に示されるように、積層型電子部品モジュール１Ａは、第１配線基板２と、複数の第１電子部品３と、第２配線基板４と、複数の第２電子部品５と、第３配線基板６と、制御回路１０と、を備えている。積層型電子部品モジュール１Ａは、例えば、１００Ｖ程度から１０００Ｖ程度に電圧を上昇させる昇圧装置である。積層型電子部品モジュール１Ａのサイズは、例えば、１０ｍｍ（縦）×１０ｍｍ（横）×４ｍｍ（高さ）程度である。   As shown in FIG. 1, the multilayer electronic component module 1 </ b> A includes a first wiring board 2, a plurality of first electronic components 3, a second wiring board 4, a plurality of second electronic components 5, and a third wiring board. A wiring board 6 and a control circuit 10 are provided. The multilayer electronic component module 1A is a booster that raises the voltage from about 100V to about 1000V, for example. The size of the multilayer electronic component module 1A is, for example, about 10 mm (vertical) × 10 mm (horizontal) × 4 mm (height).

第１配線基板２は、第１実装面２ａを有するキャビティ基板である。第１配線基板２には、第１実装面２ａを包囲する枠部７が設けられている。第１実装面２ａには、複数の第１電子部品３が実装されている。各第１電子部品３は、例えば、コンデンサ、抵抗又はダイオード等の面実装部品であり、第１配線基板２に設けられた配線８に電気的に接続されている。   The first wiring board 2 is a cavity board having a first mounting surface 2a. The first wiring board 2 is provided with a frame portion 7 surrounding the first mounting surface 2a. A plurality of first electronic components 3 are mounted on the first mounting surface 2a. Each first electronic component 3 is a surface mount component such as a capacitor, a resistor, or a diode, for example, and is electrically connected to the wiring 8 provided on the first wiring board 2.

第２配線基板４は、第２実装面４ａを有するキャビティ基板であり、複数の第１電子部品３を挟むように第１配線基板２に積層されている。第２配線基板４には、第２実装面４ａを包囲する枠部９が設けられている。第２実装面４ａには、複数の第２電子部品５が実装されている。各第２電子部品５は、トランジスタ等の半導体素子であり、ワイヤ１１によって、第２配線基板４に設けられた配線８に電気的に接続されている。   The second wiring board 4 is a cavity board having a second mounting surface 4 a and is stacked on the first wiring board 2 so as to sandwich the plurality of first electronic components 3. The second wiring board 4 is provided with a frame portion 9 surrounding the second mounting surface 4a. A plurality of second electronic components 5 are mounted on the second mounting surface 4a. Each second electronic component 5 is a semiconductor element such as a transistor, and is electrically connected to a wiring 8 provided on the second wiring substrate 4 by a wire 11.

第３配線基板６は、板状のリジッド基板であり、複数の第２電子部品５を挟むように第２配線基板４に積層されている。第３配線基板６の表面６ａには、出力用の電極パッド１２が複数設けられている。各電極パッド１２は、第３配線基板６に設けられた配線８に電気的に接続されている。   The third wiring board 6 is a plate-shaped rigid board and is stacked on the second wiring board 4 so as to sandwich the plurality of second electronic components 5. A plurality of output electrode pads 12 are provided on the surface 6 a of the third wiring substrate 6. Each electrode pad 12 is electrically connected to a wiring 8 provided on the third wiring board 6.

制御回路１０は、第１配線基板２の裏面２ｂに実装されている。制御回路１０は、例えば、ＣＭＯＳ（Complementary MOS）を用いたＩＣであり、第１配線基板２の配線８に電気的に接続されている。制御回路１０は、第１電子部品３及び第２電子部品５等で構成される昇圧回路等を制御する。   The control circuit 10 is mounted on the back surface 2 b of the first wiring board 2. The control circuit 10 is, for example, an IC using CMOS (Complementary MOS), and is electrically connected to the wiring 8 of the first wiring board 2. The control circuit 10 controls a booster circuit composed of the first electronic component 3, the second electronic component 5, and the like.

第２配線基板４の裏面４ｂは、第１配線基板２に設けられた枠部７の表面７ａに、半田１３によって接合されている。つまり、第２配線基板４は、枠部７に支持されている。第２配線基板４の裏面４ｂと枠部７の表面７ａとの間に配置された半田１３は、枠部７及び枠部９のそれぞれに設けられたスルーホール１４において、第１配線基板２の配線８と第２配線基板４の配線８とを接合している。   The back surface 4 b of the second wiring substrate 4 is joined to the surface 7 a of the frame portion 7 provided on the first wiring substrate 2 by solder 13. That is, the second wiring board 4 is supported by the frame portion 7. The solder 13 disposed between the back surface 4b of the second wiring board 4 and the front surface 7a of the frame part 7 is connected to the first wiring board 2 through the through holes 14 provided in the frame part 7 and the frame part 9, respectively. The wiring 8 and the wiring 8 of the second wiring board 4 are joined.

第３配線基板６の裏面６ｂは、第２配線基板４に設けられた枠部９の表面９ａに、半田１３によって接合されている。つまり、第３配線基板６は、枠部９に支持されている。第３配線基板６の裏面６ｂと枠部９の表面９ａとの間に配置された半田１３は、枠部９及び第３配線基板６のそれぞれに設けられたスルーホール１４において、第２配線基板４の配線８と第３配線基板６の配線８とを接合している。   The back surface 6 b of the third wiring substrate 6 is joined to the surface 9 a of the frame portion 9 provided on the second wiring substrate 4 by solder 13. That is, the third wiring board 6 is supported by the frame portion 9. The solder 13 disposed between the back surface 6b of the third wiring substrate 6 and the front surface 9a of the frame portion 9 is passed through the second wiring substrate in the through holes 14 provided in the frame portion 9 and the third wiring substrate 6 respectively. 4 and the wiring 8 of the third wiring substrate 6 are joined.

第１実装面２ａ及び複数の第１電子部品３、並びに、第２実装面４ａ及び複数の第２電子部品５は、電気絶縁膜１５によって覆われている。第１配線基板２と第２配線基板４との間、並びに、第２配線基板４と第３配線基板６との間には、耐電圧樹脂材１６が配置されている。電気絶縁膜１５は、耐電圧樹脂材１６よりも低い吸水率を有しており、耐電圧樹脂材１６は、電気絶縁膜１５よりも低い弾性率を有している。一例として、電気絶縁膜１５の材料は、テフロン（登録商標、以下同じ）又はパリレンであり、耐電圧樹脂材１６は、シリコーンゲルである。   The first mounting surface 2 a and the plurality of first electronic components 3, and the second mounting surface 4 a and the plurality of second electronic components 5 are covered with an electrical insulating film 15. A withstand voltage resin material 16 is disposed between the first wiring board 2 and the second wiring board 4 and between the second wiring board 4 and the third wiring board 6. The electrical insulating film 15 has a lower water absorption rate than the withstand voltage resin material 16, and the withstand voltage resin material 16 has an elastic modulus lower than that of the electrical insulating film 15. As an example, the material of the electrical insulating film 15 is Teflon (registered trademark, the same applies hereinafter) or parylene, and the withstand voltage resin material 16 is silicone gel.

耐電圧樹脂材１６は、第１配線基板２と第２配線基板４との間、並びに、第２配線基板４と第３配線基板６との間に、真空注型によって充填されている。より具体的には、耐電圧樹脂材１６は、真空充填装置内にてニードルディスペンサ及び充填用治具等を用いて充填される。第１配線基板２と第２配線基板４との間への耐電圧樹脂材１６の充填は、枠部７に設けられた注入口７ｂを介して実施される。第２配線基板４と第３配線基板６との間への耐電圧樹脂材１６の充填は、枠部９に設けられた注入口９ｂを介して実施される。なお、第１配線基板２と第２配線基板４との間の間隙、並びに、第２配線基板４と第３配線基板６との間の間隙を、真空注型前にエポキシ樹脂等で埋めておくと、真空注型時に非常に高密度な充填処理を行うことができる。   The withstand voltage resin material 16 is filled by vacuum casting between the first wiring board 2 and the second wiring board 4 and between the second wiring board 4 and the third wiring board 6. More specifically, the withstand voltage resin material 16 is filled using a needle dispenser and a filling jig in a vacuum filling device. The filling of the withstand voltage resin material 16 between the first wiring substrate 2 and the second wiring substrate 4 is performed through an injection port 7 b provided in the frame portion 7. The filling of the withstand voltage resin material 16 between the second wiring substrate 4 and the third wiring substrate 6 is performed through an injection port 9 b provided in the frame portion 9. The gap between the first wiring board 2 and the second wiring board 4 and the gap between the second wiring board 4 and the third wiring board 6 are filled with epoxy resin or the like before vacuum casting. In other words, a very high density filling process can be performed during vacuum casting.

以上説明したように、積層型電子部品モジュール１Ａでは、第１電子部品３間の距離が小さくなっても、第１実装面２ａ及び複数の第１電子部品３が電気絶縁膜１５に覆われているので、第１電子部品３間でのリーク電流の発生が抑制される。同様に、第２電子部品５間の距離が小さくなっても、第２実装面４ａ及び複数の第２電子部品５が電気絶縁膜１５に覆われているので、第２電子部品５間でのリーク電流の発生が抑制される。更に、第１電子部品３と第２電子部品５との距離が小さくなっても、第１配線基板２と第２配線基板４との間に耐電圧樹脂材１６が配置されているので、第１電子部品３と第２電子部品５との間での放電の発生が抑制される。よって、積層型電子部品モジュール１Ａによれば、モジュール１Ａの電気的な特性の低下を抑制しつつ、第１電子部品３及び第２電子部品５の実装の高密度化及びモジュール１Ａの小型化を図ることができる。   As described above, in the multilayer electronic component module 1A, even if the distance between the first electronic components 3 is reduced, the first mounting surface 2a and the plurality of first electronic components 3 are covered with the electrical insulating film 15. Therefore, the generation of leakage current between the first electronic components 3 is suppressed. Similarly, even if the distance between the second electronic components 5 is reduced, the second mounting surface 4a and the plurality of second electronic components 5 are covered with the electrical insulating film 15, so Generation of leakage current is suppressed. Furthermore, even if the distance between the first electronic component 3 and the second electronic component 5 is reduced, the voltage-resistant resin material 16 is disposed between the first wiring board 2 and the second wiring board 4, so that the first The occurrence of discharge between the first electronic component 3 and the second electronic component 5 is suppressed. Therefore, according to the multilayer electronic component module 1A, the density of the mounting of the first electronic component 3 and the second electronic component 5 and the miniaturization of the module 1A can be reduced while suppressing the deterioration of the electrical characteristics of the module 1A. Can be planned.

このような積層型電子部品モジュール１Ａは、第１電子部品３間でのリーク電流の発生、及び、第２電子部品５間でのリーク電流の発生を数百ｐＡ以下に抑制する必要があり、且つ、第１電子部品３と第２電子部品５との電位差が１０００Ｖ以上になっても第１電子部品３と第２電子部品５との間での放電の発生を抑制する必要がある場合において、例えば、１０ｍｍ（縦）×１０ｍｍ（横）×４ｍｍ（高さ）程度にモジュール１Ａを小型化する必要があるときに、特に有効である。なお、第１電子部品３と第２電子部品５との電位差とは、第１電子部品３が有するいずれか１つの端子に印加される電圧と、第２電子部品５が有するいずれか１つの端子に印加される電圧との差の最大値を意味する。   Such a multilayer electronic component module 1A needs to suppress the occurrence of leakage current between the first electronic components 3 and the occurrence of leakage current between the second electronic components 5 to several hundred pA or less. In the case where it is necessary to suppress the occurrence of discharge between the first electronic component 3 and the second electronic component 5 even when the potential difference between the first electronic component 3 and the second electronic component 5 is 1000 V or more. For example, this is particularly effective when the module 1A needs to be downsized to about 10 mm (vertical) × 10 mm (horizontal) × 4 mm (height). The potential difference between the first electronic component 3 and the second electronic component 5 is the voltage applied to any one terminal of the first electronic component 3 and any one terminal of the second electronic component 5. This means the maximum value of the difference from the voltage applied to.

また、積層型電子部品モジュール１Ａでは、電気絶縁膜１５が、耐電圧樹脂材１６よりも低い吸水率を有しており、耐電圧樹脂材１６が、電気絶縁膜１５よりも低い弾性率を有している。これにより、電気絶縁膜１５に覆われた第１電子部品３間、及び、電気絶縁膜１５に覆われた第２電子部品５間でのリーク電流の発生をより確実に抑制することができると共に、耐電圧樹脂材１６を緩衝材として機能させて、モジュール１Ａに発生する応力を緩和することができる。   In the multilayer electronic component module 1 </ b> A, the electrical insulating film 15 has a lower water absorption rate than the withstand voltage resin material 16, and the withstand voltage resin material 16 has a lower elastic modulus than the electrical insulating film 15. doing. As a result, the generation of leakage current between the first electronic components 3 covered with the electrical insulating film 15 and between the second electronic components 5 covered with the electrical insulating film 15 can be more reliably suppressed. The stress generated in the module 1A can be relieved by allowing the withstand voltage resin material 16 to function as a buffer material.

例えば、テフロン又はパリレンは、シリコーンゲルよりも低い吸水率を有しているものの、シリコーンゲルよりも高い弾性率を有している。そのため、電気絶縁という観点からは、シリコーンゲルよりも優れているといえるが、テフロン又はパリレンのみで、第１配線基板２と第２配線基板４との間、及び、第２配線基板４と第３配線基板６との間を埋めてしまうと、モジュール１Ａに発生する応力が十分に緩和されない。   For example, although Teflon or parylene has a lower water absorption rate than a silicone gel, it has a higher elastic modulus than a silicone gel. Therefore, it can be said that it is superior to silicone gel from the viewpoint of electrical insulation, but only with Teflon or Parylene, between the first wiring board 2 and the second wiring board 4, and between the second wiring board 4 and the second wiring board. If the space between the three wiring boards 6 is filled, the stress generated in the module 1A is not sufficiently relaxed.

一方、シリコーンゲルは、テフロン又はパリレンよりも低い弾性率を有しているものの、シリコーンゲルよりも高い吸水率を有している。そのため、応力緩和という観点からは、テフロン又はパリレンよりも優れているといえるが、シリコーンゲルのみで、第１配線基板２と第２配線基板４との間、及び、第２配線基板４と第３配線基板６との間を埋めてしまうと、第１電子部品３間及び第２電子部品５間でのリーク電流の発生が十分に抑制されない。   On the other hand, although silicone gel has a lower elastic modulus than Teflon or parylene, it has a higher water absorption rate than silicone gel. Therefore, it can be said that it is superior to Teflon or Parylene from the viewpoint of stress relaxation, but only with silicone gel, between the first wiring board 2 and the second wiring board 4, and between the second wiring board 4 and the second wiring board. If the space between the three wiring boards 6 is filled, generation of leakage current between the first electronic components 3 and between the second electronic components 5 is not sufficiently suppressed.

そこで、耐電圧樹脂材１６よりも低い吸水率を有する電気絶縁膜１５、及び、電気絶縁膜１５よりも低い弾性率を有する耐電圧樹脂材１６を併用することで、電気絶縁及び応力緩和の両方を実現することができる。これにより、積層型電子部品モジュール１Ａに、Ｃ−ＭＯＳ、ＭＥＭＳ(Micro Electro Mechanical System)等、応力に対して非常にセンシティブな部品を実装することが可能となる。   Therefore, by using together the electric insulating film 15 having a lower water absorption rate than the withstand voltage resin material 16 and the withstand voltage resin material 16 having an elastic modulus lower than that of the electric insulating film 15, both electric insulation and stress relaxation are achieved. Can be realized. As a result, it is possible to mount a component that is very sensitive to stress, such as C-MOS and MEMS (Micro Electro Mechanical System), on the multilayer electronic component module 1A.

また、積層型電子部品モジュール１Ａでは、耐電圧樹脂材１６が、真空注型によって、第１配線基板２と第２配線基板４との間の間隙に充填されている。これにより、積層型電子部品モジュール１Ａは、第１配線基板２と第２配線基板４との間の間隙に耐電圧樹脂材１６が隙間なく確実に充填されたものとなる。   In the multilayer electronic component module 1 </ b> A, the withstand voltage resin material 16 is filled in the gap between the first wiring board 2 and the second wiring board 4 by vacuum casting. As a result, the multilayer electronic component module 1 </ b> A is such that the withstand voltage resin material 16 is reliably filled in the gap between the first wiring board 2 and the second wiring board 4 without a gap.

また、積層型電子部品モジュール１Ａでは、第２配線基板４が、第１配線基板２に設けられた枠部７に支持されており、第３配線基板６が、第２配線基板４に設けられた枠部９に支持されている。これにより、第１配線基板２に対する第２配線基板４の積層状態、及び、第２配線基板４に対する第３配線基板６の積層状態の安定化を図ることができる。
［第２実施形態］ In the multilayer electronic component module 1 </ b> A, the second wiring board 4 is supported by the frame portion 7 provided on the first wiring board 2, and the third wiring board 6 is provided on the second wiring board 4. Supported by the frame 9. As a result, the stacked state of the second wiring substrate 4 with respect to the first wiring substrate 2 and the stacked state of the third wiring substrate 6 with respect to the second wiring substrate 4 can be stabilized.
[Second Embodiment]

図２に示されるように、第２実施形態の積層型電子部品モジュール１Ｂは、第１配線基板２、第２配線基板４及び第３配線基板６がリジッドフレキシブル基板で構成されている点で、第１実施形態の積層型電子部品モジュール１Ａと主に相違している。積層型電子部品モジュール１Ｂにおいては、第１配線基板２、第２配線基板４及び第３配線基板６は、リジッドフレキシブル基板のリジッド部であり、リジッドフレキシブル基板のフレキシブル部１７，１８によって互いに電気的に接続されている。   As shown in FIG. 2, the multilayer electronic component module 1 </ b> B of the second embodiment is such that the first wiring board 2, the second wiring board 4, and the third wiring board 6 are configured by a rigid flexible board. This is mainly different from the multilayer electronic component module 1A of the first embodiment. In the multilayer electronic component module 1B, the first wiring board 2, the second wiring board 4, and the third wiring board 6 are rigid parts of a rigid flexible board, and are electrically connected to each other by the flexible parts 17 and 18 of the rigid flexible board. It is connected to the.

積層型電子部品モジュール１Ｂでは、第１配線基板２の配線８と第２配線基板４の配線８とは、フレキシブル部１７に設けられた配線８によって電気的に接続されている。同様に、第２配線基板４の配線８と第３配線基板６の配線８とは、フレキシブル部１８に設けられた配線８によって電気的に接続されている。また、第２配線基板４は、第１配線基板２の第１実装面２ａに実装された複数の第１電子部品３の少なくとも１つに支持されている。同様に、第３配線基板６は、第２配線基板４の第２実装面４ａに実装された複数の第２電子部品５の少なくとも１つに支持されている。   In the multilayer electronic component module 1 </ b> B, the wiring 8 of the first wiring board 2 and the wiring 8 of the second wiring board 4 are electrically connected by the wiring 8 provided in the flexible portion 17. Similarly, the wiring 8 of the second wiring board 4 and the wiring 8 of the third wiring board 6 are electrically connected by the wiring 8 provided in the flexible portion 18. The second wiring board 4 is supported by at least one of the plurality of first electronic components 3 mounted on the first mounting surface 2 a of the first wiring board 2. Similarly, the third wiring board 6 is supported by at least one of the plurality of second electronic components 5 mounted on the second mounting surface 4 a of the second wiring board 4.

このような積層型電子部品モジュール１Ｂは、次のように製造される。まず、リジッドフレキシブル基板を展開した状態で、第１配線基板２の第１実装面２ａに複数の第１電子部品３を実装し、第２配線基板４の第２実装面４ａに複数の第２電子部品５を実装する。続いて、少なくとも、第１実装面２ａ及び複数の第１電子部品３、並びに、第２実装面４ａ及び複数の第２電子部品５を覆うように、電気絶縁膜１５を形成する。続いて、リジッドフレキシブル基板のフレキシブル部１７，１８を湾曲させて、第１配線基板２に第２配線基板４を積層し、第２配線基板４に第３配線基板６を積層する。この状態で、形成治具にセットする。このとき、端子等の必要個所には、マスキングが施されている。続いて、真空注型によって、第１配線基板２と第２配線基板４との間、並びに、第２配線基板４と第３配線基板６との間に、耐電圧樹脂材１６を充填する。   Such a multilayer electronic component module 1B is manufactured as follows. First, a plurality of first electronic components 3 are mounted on the first mounting surface 2a of the first wiring board 2 with the rigid flexible substrate deployed, and a plurality of second electronic components 3 are mounted on the second mounting surface 4a of the second wiring board 4. The electronic component 5 is mounted. Subsequently, an electrical insulating film 15 is formed so as to cover at least the first mounting surface 2a and the plurality of first electronic components 3, and the second mounting surface 4a and the plurality of second electronic components 5. Subsequently, the flexible portions 17 and 18 of the rigid flexible substrate are bent so that the second wiring substrate 4 is stacked on the first wiring substrate 2 and the third wiring substrate 6 is stacked on the second wiring substrate 4. In this state, it is set on a forming jig. At this time, masking is applied to necessary portions such as terminals. Subsequently, the withstand voltage resin material 16 is filled between the first wiring board 2 and the second wiring board 4 and between the second wiring board 4 and the third wiring board 6 by vacuum casting.

以上のように構成された積層型電子部品モジュール１Ｂによっても、上述した積層型電子部品モジュール１Ａと同様の効果が奏される。   Also with the multilayer electronic component module 1B configured as described above, the same effects as those of the multilayer electronic component module 1A described above are exhibited.

また、積層型電子部品モジュール１Ｂでは、第２配線基板４が、第１電子部品３の少なくとも１つに支持されており、第３配線基板６が、複数の第２電子部品５の少なくとも１つに支持されている。これにより、第１配線基板２に対する第２配線基板４の積層状態、及び、第２配線基板４に対する第３配線基板６の積層状態の安定化を図ることができる。この場合、第１電子部品３と接触する第２配線基板４の裏面４ｂ、及び、第２電子部品５と接触する第３配線基板６の裏面６ｂにも電気絶縁膜１５を形成することで、各裏面に接触する電子部品間でのリーク電流の発生をより確実に抑制することができる。   In the multilayer electronic component module 1 </ b> B, the second wiring substrate 4 is supported by at least one of the first electronic components 3, and the third wiring substrate 6 is at least one of the plurality of second electronic components 5. It is supported by. As a result, the stacked state of the second wiring substrate 4 with respect to the first wiring substrate 2 and the stacked state of the third wiring substrate 6 with respect to the second wiring substrate 4 can be stabilized. In this case, by forming the electrical insulating film 15 also on the back surface 4b of the second wiring board 4 in contact with the first electronic component 3 and on the back surface 6b of the third wiring board 6 in contact with the second electronic component 5, It is possible to more reliably suppress the occurrence of leakage current between electronic components that are in contact with the respective back surfaces.

以上、本発明の第１及び第２実施形態について説明したが、本発明は、上記第１及び第２実施形態に限定されるものではない。例えば、第１配線基板２の第１実装面２ａに実装される第１電子部品３が複数であれば、第２配線基板４の第２実装面４ａに実装される第２電子部品５は、１つであってもよい。また、積層型電子部品モジュール１Ａ，１Ｂの各構成の材料及び形状には、上述した材料及び形状に限らず、様々な材料及び形状を適用することができる。   Although the first and second embodiments of the present invention have been described above, the present invention is not limited to the first and second embodiments. For example, if there are a plurality of first electronic components 3 mounted on the first mounting surface 2a of the first wiring board 2, the second electronic component 5 mounted on the second mounting surface 4a of the second wiring substrate 4 is: There may be one. The materials and shapes of the components of the multilayer electronic component modules 1A and 1B are not limited to the materials and shapes described above, and various materials and shapes can be applied.

１Ａ，１Ｂ…積層型電子部品モジュール、２…第１配線基板、２ａ…第１実装面、３…第１電子部品、４…第２配線基板、４ａ…第２実装面、５…第２電子部品、７…枠部、１５…電気絶縁膜、１６…耐電圧樹脂材。   DESCRIPTION OF SYMBOLS 1A, 1B ... Laminated type electronic component module, 2 ... 1st wiring board, 2a ... 1st mounting surface, 3 ... 1st electronic component, 4 ... 2nd wiring board, 4a ... 2nd mounting surface, 5 ... 2nd electron Components: 7 ... Frame portion, 15 ... Electric insulating film, 16 ... Voltage-resistant resin material.

Claims (6)

第１実装面を有する第１配線基板と、
前記第１実装面に実装された複数の第１電子部品と、
前記複数の第１電子部品を挟むように前記第１配線基板に積層され、第２実装面を有する第２配線基板と、
前記第２実装面に実装された第２電子部品と、
前記第１実装面及び前記複数の第１電子部品を覆う電気絶縁膜と、
前記第１配線基板と前記第２配線基板との間に配置された耐電圧樹脂材と、を備え、
前記電気絶縁膜は、前記耐電圧樹脂材よりも低い吸水率を有しており、
前記耐電圧樹脂材は、前記電気絶縁膜よりも低い弾性率を有している、積層型電子部品モジュール。 A first wiring board having a first mounting surface;
A plurality of first electronic components mounted on the first mounting surface;
A second wiring board stacked on the first wiring board so as to sandwich the plurality of first electronic components and having a second mounting surface;
A second electronic component mounted on the second mounting surface;
An electrical insulating film covering the first mounting surface and the plurality of first electronic components;
A withstand voltage resin material disposed between the first wiring board and the second wiring board ;
The electrical insulating film has a lower water absorption rate than the withstand voltage resin material,
The withstand voltage resin material, that has a lower modulus than the electrical insulating film, the multilayer electronic component module. 前記第２実装面には、前記第２電子部品が複数実装されており、
前記電気絶縁膜は、前記第２実装面及び前記複数の第２電子部品を覆っている、請求項１記載の積層型電子部品モジュール。 A plurality of the second electronic components are mounted on the second mounting surface,
The multilayer electronic component module according to claim 1, wherein the electrical insulating film covers the second mounting surface and the plurality of second electronic components. 前記耐電圧樹脂材は、真空注型によって、前記第１配線基板と前記第２配線基板との間の間隙に充填されている、請求項１又は２記載の積層型電子部品モジュール。 The withstand voltage resin material, by vacuum casting, the first wiring substrate and is filled in a gap between the second wiring board, according to claim 1 or 2 laminated electronic component module according. 前記第１配線基板には、前記第１実装面を包囲する枠部が設けられており、
前記第２配線基板は、前記枠部に支持されている、請求項１〜３のいずれか一項記載の積層型電子部品モジュール。 The first wiring board is provided with a frame portion surrounding the first mounting surface,
The second wiring substrate is supported by the frame portion, the multilayer electronic component module according any one of claims 1-3. 前記第２配線基板は、前記複数の第１電子部品の少なくとも１つに支持されている、請求項１〜４のいずれか一項記載の積層型電子部品モジュール。 The second wiring board, the is supported on at least one of the plurality of first electronic components, according to claim 1-4 multilayer electronic component module according to one of. 前記第２電子部品は、前記第２配線基板の内部に配置された配線に電気的に接続されている、請求項１〜５のいずれか一項記載の積層型電子部品モジュール。The multilayer electronic component module according to claim 1, wherein the second electronic component is electrically connected to a wiring disposed inside the second wiring board.
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