JP2015088684A - Lamination type electronic component module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamination type electronic component module which achieves high density mounting of electronic components and downsizing of a module while inhibiting deterioration of electric characteristics of the module.SOLUTION: A lamination type electronic component module 1A includes: a first wiring board 2 having a first mounting surface 2a; multiple first electronic components 3 mounted on the first mounting surface 2a; a second wiring board 4 which is laminated on the first wiring board 2 so as to sandwich the multiple first electronic components 3 and has a second mounting surface 4a; a second electronic component 5 mounted on the second mounting surface 4a; an electric insulation film 15 covering the first mounting surface 2a and the multiple first electronic components 3; and a voltage resistance resin material 16 disposed between the first wiring board 2 and the second wiring board 4.

Description

  The present invention relates to a multilayer electronic component module.

  A first wiring board, a first electronic component mounted on a mounting surface of the first wiring board, a second wiring board stacked on the first wiring board so as to sandwich the first electronic component, and a second wiring board A multilayer electronic component module including a second electronic component mounted on a mounting surface and a buffer adhesive disposed between the first electronic component and the second wiring board is known (for example, Patent Literature 1). 1).

JP 2001-85601 A

  In the multilayer electronic component module as described above, it is required to increase the mounting density of electronic components and downsize the module. However, if the distance between the electronic components is reduced by them, the electrical characteristics of the module may be deteriorated.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a multilayer electronic component module capable of increasing the mounting density of electronic components and reducing the size of the module while suppressing deterioration of the electrical characteristics of the module. .

  The multilayer electronic component module of the present invention includes a first wiring board having a first mounting surface, a plurality of first electronic components mounted on the first mounting surface, and a first so as to sandwich the plurality of first electronic components. A second wiring substrate stacked on the wiring substrate and having a second mounting surface; a second electronic component mounted on the second mounting surface; an electrical insulating film covering the first mounting surface and the plurality of first electronic components; A withstand voltage resin material disposed between the first wiring board and the second wiring board.

  In this multilayer electronic component module, even if the distance between the first electronic components is reduced, the first mounting surface and the plurality of first electronic components are covered with the electrical insulating film. Generation of leakage current is suppressed. Further, even if the distance between the first electronic component and the second electronic component is reduced, the voltage-resistant resin material is disposed between the first wiring substrate and the second wiring substrate, so that the first electronic component and the second electronic component Generation of electric discharge between the two electronic components is suppressed. Therefore, according to the multilayer electronic component module, it is possible to increase the density of mounting electronic components and reduce the size of the module while suppressing the deterioration of the electrical characteristics of the module.

  In the multilayer electronic component module of the present invention, a plurality of second electronic components may be mounted on the second mounting surface, and the electrical insulating film may cover the second mounting surface and the plurality of second electronic components. . According to this, it is possible to increase the density of mounting of the second electronic components on the second mounting surface while suppressing the occurrence of leakage current between the second electronic components.

  In the multilayer electronic component module of the present invention, the electrical insulating film has a lower water absorption rate than the withstand voltage resin material, and the withstand voltage resin material has a lower elastic modulus than the electrical insulating film. Good. According to this, it is possible to more reliably suppress the occurrence of leakage current between the electronic components covered with the electrical insulating film, and to function the voltage-resistant resin material as a buffer material, thereby reducing the stress generated in the module. Can be relaxed.

  In the multilayer electronic component module of the present invention, the withstand voltage resin material may be filled in a gap between the first wiring board and the second wiring board by vacuum casting. According to this, in the multilayer electronic component module, the withstand voltage resin material is reliably filled in the gap between the first wiring board and the second wiring board.

  In the multilayer electronic component module of the present invention, the first wiring substrate may be provided with a frame portion surrounding the first mounting surface, and the second wiring substrate may be supported by the frame portion. In the multilayer electronic component module of the present invention, the second wiring board may be supported by at least one of the plurality of first electronic components. According to these, the lamination state of the second wiring board with respect to the first wiring board can be stabilized.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the multilayer electronic component module which can aim at the high density of mounting of an electronic component, and size reduction of a module, suppressing the fall of the electrical property of a module. .

It is sectional drawing of the multilayer electronic component module of 1st Embodiment of this invention. It is sectional drawing of the multilayer electronic component module of 2nd Embodiment of this invention.

DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same or an equivalent part, and the overlapping description is abbreviate | omitted.
[First Embodiment]

  As shown in FIG. 1, the multilayer electronic component module 1 </ b> A includes a first wiring board 2, a plurality of first electronic components 3, a second wiring board 4, a plurality of second electronic components 5, and a third wiring board. A wiring board 6 and a control circuit 10 are provided. The multilayer electronic component module 1A is a booster that raises the voltage from about 100V to about 1000V, for example. The size of the multilayer electronic component module 1A is, for example, about 10 mm (vertical) × 10 mm (horizontal) × 4 mm (height).

  The first wiring board 2 is a cavity board having a first mounting surface 2a. The first wiring board 2 is provided with a frame portion 7 surrounding the first mounting surface 2a. A plurality of first electronic components 3 are mounted on the first mounting surface 2a. Each first electronic component 3 is a surface mount component such as a capacitor, a resistor, or a diode, for example, and is electrically connected to the wiring 8 provided on the first wiring board 2.

  The second wiring board 4 is a cavity board having a second mounting surface 4 a and is stacked on the first wiring board 2 so as to sandwich the plurality of first electronic components 3. The second wiring board 4 is provided with a frame portion 9 surrounding the second mounting surface 4a. A plurality of second electronic components 5 are mounted on the second mounting surface 4a. Each second electronic component 5 is a semiconductor element such as a transistor, and is electrically connected to a wiring 8 provided on the second wiring substrate 4 by a wire 11.

  The third wiring board 6 is a plate-shaped rigid board and is stacked on the second wiring board 4 so as to sandwich the plurality of second electronic components 5. A plurality of output electrode pads 12 are provided on the surface 6 a of the third wiring substrate 6. Each electrode pad 12 is electrically connected to a wiring 8 provided on the third wiring board 6.

  The control circuit 10 is mounted on the back surface 2 b of the first wiring board 2. The control circuit 10 is, for example, an IC using CMOS (Complementary MOS), and is electrically connected to the wiring 8 of the first wiring board 2. The control circuit 10 controls a booster circuit composed of the first electronic component 3, the second electronic component 5, and the like.

  The back surface 4 b of the second wiring substrate 4 is joined to the surface 7 a of the frame portion 7 provided on the first wiring substrate 2 by solder 13. That is, the second wiring board 4 is supported by the frame portion 7. The solder 13 disposed between the back surface 4b of the second wiring board 4 and the front surface 7a of the frame part 7 is connected to the first wiring board 2 through the through holes 14 provided in the frame part 7 and the frame part 9, respectively. The wiring 8 and the wiring 8 of the second wiring board 4 are joined.

  The back surface 6 b of the third wiring substrate 6 is joined to the surface 9 a of the frame portion 9 provided on the second wiring substrate 4 by solder 13. That is, the third wiring board 6 is supported by the frame portion 9. The solder 13 disposed between the back surface 6b of the third wiring substrate 6 and the front surface 9a of the frame portion 9 is passed through the second wiring substrate in the through holes 14 provided in the frame portion 9 and the third wiring substrate 6 respectively. 4 and the wiring 8 of the third wiring substrate 6 are joined.

  The first mounting surface 2 a and the plurality of first electronic components 3, and the second mounting surface 4 a and the plurality of second electronic components 5 are covered with an electrical insulating film 15. A withstand voltage resin material 16 is disposed between the first wiring board 2 and the second wiring board 4 and between the second wiring board 4 and the third wiring board 6. The electrical insulating film 15 has a lower water absorption rate than the withstand voltage resin material 16, and the withstand voltage resin material 16 has an elastic modulus lower than that of the electrical insulating film 15. As an example, the material of the electrical insulating film 15 is Teflon (registered trademark, the same applies hereinafter) or parylene, and the withstand voltage resin material 16 is silicone gel.

  The withstand voltage resin material 16 is filled by vacuum casting between the first wiring board 2 and the second wiring board 4 and between the second wiring board 4 and the third wiring board 6. More specifically, the withstand voltage resin material 16 is filled using a needle dispenser and a filling jig in a vacuum filling device. The filling of the withstand voltage resin material 16 between the first wiring substrate 2 and the second wiring substrate 4 is performed through an injection port 7 b provided in the frame portion 7. The filling of the withstand voltage resin material 16 between the second wiring substrate 4 and the third wiring substrate 6 is performed through an injection port 9 b provided in the frame portion 9. The gap between the first wiring board 2 and the second wiring board 4 and the gap between the second wiring board 4 and the third wiring board 6 are filled with epoxy resin or the like before vacuum casting. In other words, a very high density filling process can be performed during vacuum casting.

  As described above, in the multilayer electronic component module 1A, even if the distance between the first electronic components 3 is reduced, the first mounting surface 2a and the plurality of first electronic components 3 are covered with the electrical insulating film 15. Therefore, the generation of leakage current between the first electronic components 3 is suppressed. Similarly, even if the distance between the second electronic components 5 is reduced, the second mounting surface 4a and the plurality of second electronic components 5 are covered with the electrical insulating film 15, so Generation of leakage current is suppressed. Furthermore, even if the distance between the first electronic component 3 and the second electronic component 5 is reduced, the voltage-resistant resin material 16 is disposed between the first wiring board 2 and the second wiring board 4, so that the first The occurrence of discharge between the first electronic component 3 and the second electronic component 5 is suppressed. Therefore, according to the multilayer electronic component module 1A, the density of the mounting of the first electronic component 3 and the second electronic component 5 and the miniaturization of the module 1A can be reduced while suppressing the deterioration of the electrical characteristics of the module 1A. Can be planned.

  Such a multilayer electronic component module 1A needs to suppress the occurrence of leakage current between the first electronic components 3 and the occurrence of leakage current between the second electronic components 5 to several hundred pA or less. In the case where it is necessary to suppress the occurrence of discharge between the first electronic component 3 and the second electronic component 5 even when the potential difference between the first electronic component 3 and the second electronic component 5 is 1000 V or more. For example, this is particularly effective when the module 1A needs to be downsized to about 10 mm (vertical) × 10 mm (horizontal) × 4 mm (height). The potential difference between the first electronic component 3 and the second electronic component 5 is the voltage applied to any one terminal of the first electronic component 3 and any one terminal of the second electronic component 5. This means the maximum value of the difference from the voltage applied to.

  In the multilayer electronic component module 1 </ b> A, the electrical insulating film 15 has a lower water absorption rate than the withstand voltage resin material 16, and the withstand voltage resin material 16 has a lower elastic modulus than the electrical insulating film 15. doing. As a result, the generation of leakage current between the first electronic components 3 covered with the electrical insulating film 15 and between the second electronic components 5 covered with the electrical insulating film 15 can be more reliably suppressed. The stress generated in the module 1A can be relieved by allowing the withstand voltage resin material 16 to function as a buffer material.

  For example, although Teflon or parylene has a lower water absorption rate than a silicone gel, it has a higher elastic modulus than a silicone gel. Therefore, it can be said that it is superior to silicone gel from the viewpoint of electrical insulation, but only with Teflon or Parylene, between the first wiring board 2 and the second wiring board 4, and between the second wiring board 4 and the second wiring board. If the space between the three wiring boards 6 is filled, the stress generated in the module 1A is not sufficiently relaxed.

  On the other hand, although silicone gel has a lower elastic modulus than Teflon or parylene, it has a higher water absorption rate than silicone gel. Therefore, it can be said that it is superior to Teflon or Parylene from the viewpoint of stress relaxation, but only with silicone gel, between the first wiring board 2 and the second wiring board 4, and between the second wiring board 4 and the second wiring board. If the space between the three wiring boards 6 is filled, generation of leakage current between the first electronic components 3 and between the second electronic components 5 is not sufficiently suppressed.

  Therefore, by using together the electric insulating film 15 having a lower water absorption rate than the withstand voltage resin material 16 and the withstand voltage resin material 16 having an elastic modulus lower than that of the electric insulating film 15, both electric insulation and stress relaxation are achieved. Can be realized. As a result, it is possible to mount a component that is very sensitive to stress, such as C-MOS and MEMS (Micro Electro Mechanical System), on the multilayer electronic component module 1A.

  In the multilayer electronic component module 1 </ b> A, the withstand voltage resin material 16 is filled in the gap between the first wiring board 2 and the second wiring board 4 by vacuum casting. As a result, the multilayer electronic component module 1 </ b> A is such that the withstand voltage resin material 16 is reliably filled in the gap between the first wiring board 2 and the second wiring board 4 without a gap.

In the multilayer electronic component module 1 </ b> A, the second wiring board 4 is supported by the frame portion 7 provided on the first wiring board 2, and the third wiring board 6 is provided on the second wiring board 4. Supported by the frame 9. As a result, the stacked state of the second wiring substrate 4 with respect to the first wiring substrate 2 and the stacked state of the third wiring substrate 6 with respect to the second wiring substrate 4 can be stabilized.
[Second Embodiment]

  As shown in FIG. 2, the multilayer electronic component module 1 </ b> B of the second embodiment is such that the first wiring board 2, the second wiring board 4, and the third wiring board 6 are configured by a rigid flexible board. This is mainly different from the multilayer electronic component module 1A of the first embodiment. In the multilayer electronic component module 1B, the first wiring board 2, the second wiring board 4, and the third wiring board 6 are rigid parts of a rigid flexible board, and are electrically connected to each other by the flexible parts 17 and 18 of the rigid flexible board. It is connected to the.

  In the multilayer electronic component module 1 </ b> B, the wiring 8 of the first wiring board 2 and the wiring 8 of the second wiring board 4 are electrically connected by the wiring 8 provided in the flexible portion 17. Similarly, the wiring 8 of the second wiring board 4 and the wiring 8 of the third wiring board 6 are electrically connected by the wiring 8 provided in the flexible portion 18. The second wiring board 4 is supported by at least one of the plurality of first electronic components 3 mounted on the first mounting surface 2 a of the first wiring board 2. Similarly, the third wiring board 6 is supported by at least one of the plurality of second electronic components 5 mounted on the second mounting surface 4 a of the second wiring board 4.

  Such a multilayer electronic component module 1B is manufactured as follows. First, a plurality of first electronic components 3 are mounted on the first mounting surface 2a of the first wiring board 2 with the rigid flexible substrate deployed, and a plurality of second electronic components 3 are mounted on the second mounting surface 4a of the second wiring board 4. The electronic component 5 is mounted. Subsequently, an electrical insulating film 15 is formed so as to cover at least the first mounting surface 2a and the plurality of first electronic components 3, and the second mounting surface 4a and the plurality of second electronic components 5. Subsequently, the flexible portions 17 and 18 of the rigid flexible substrate are bent so that the second wiring substrate 4 is stacked on the first wiring substrate 2 and the third wiring substrate 6 is stacked on the second wiring substrate 4. In this state, it is set on a forming jig. At this time, masking is applied to necessary portions such as terminals. Subsequently, the withstand voltage resin material 16 is filled between the first wiring board 2 and the second wiring board 4 and between the second wiring board 4 and the third wiring board 6 by vacuum casting.

  Also with the multilayer electronic component module 1B configured as described above, the same effects as those of the multilayer electronic component module 1A described above are exhibited.

  In the multilayer electronic component module 1 </ b> B, the second wiring substrate 4 is supported by at least one of the first electronic components 3, and the third wiring substrate 6 is at least one of the plurality of second electronic components 5. It is supported by. As a result, the stacked state of the second wiring substrate 4 with respect to the first wiring substrate 2 and the stacked state of the third wiring substrate 6 with respect to the second wiring substrate 4 can be stabilized. In this case, by forming the electrical insulating film 15 also on the back surface 4b of the second wiring board 4 in contact with the first electronic component 3 and on the back surface 6b of the third wiring board 6 in contact with the second electronic component 5, It is possible to more reliably suppress the occurrence of leakage current between electronic components that are in contact with the respective back surfaces.

  Although the first and second embodiments of the present invention have been described above, the present invention is not limited to the first and second embodiments. For example, if there are a plurality of first electronic components 3 mounted on the first mounting surface 2a of the first wiring board 2, the second electronic component 5 mounted on the second mounting surface 4a of the second wiring substrate 4 is: There may be one. The materials and shapes of the components of the multilayer electronic component modules 1A and 1B are not limited to the materials and shapes described above, and various materials and shapes can be applied.

  DESCRIPTION OF SYMBOLS 1A, 1B ... Laminated type electronic component module, 2 ... 1st wiring board, 2a ... 1st mounting surface, 3 ... 1st electronic component, 4 ... 2nd wiring board, 4a ... 2nd mounting surface, 5 ... 2nd electron Components: 7 ... Frame portion, 15 ... Electric insulating film, 16 ... Voltage resistant resin material.

Claims (6)

A first wiring board having a first mounting surface;
A plurality of first electronic components mounted on the first mounting surface;
A second wiring board stacked on the first wiring board so as to sandwich the plurality of first electronic components and having a second mounting surface;
A second electronic component mounted on the second mounting surface;
An electrical insulating film covering the first mounting surface and the plurality of first electronic components;
A multilayer electronic component module comprising: a voltage-resistant resin material disposed between the first wiring board and the second wiring board. A plurality of the second electronic components are mounted on the second mounting surface,
The multilayer electronic component module according to claim 1, wherein the electrical insulating film covers the second mounting surface and the plurality of second electronic components. The electrical insulating film has a lower water absorption rate than the withstand voltage resin material,
The multilayer electronic component module according to claim 1, wherein the withstand voltage resin material has a lower elastic modulus than the electrical insulating film.   The multilayer electronic component according to any one of claims 1 to 3, wherein the withstand voltage resin material is filled in a gap between the first wiring board and the second wiring board by vacuum casting. module. The first wiring board is provided with a frame portion surrounding the first mounting surface,
The multilayer electronic component module according to claim 1, wherein the second wiring board is supported by the frame portion.   5. The multilayer electronic component module according to claim 1, wherein the second wiring board is supported by at least one of the plurality of first electronic components.

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