JP6261194B2 - 光学部材、電子基板、光学部材の製造方法、電子基板の製造方法 - Google Patents

光学部材、電子基板、光学部材の製造方法、電子基板の製造方法 Download PDF

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Publication number
JP6261194B2
JP6261194B2 JP2013120828A JP2013120828A JP6261194B2 JP 6261194 B2 JP6261194 B2 JP 6261194B2 JP 2013120828 A JP2013120828 A JP 2013120828A JP 2013120828 A JP2013120828 A JP 2013120828A JP 6261194 B2 JP6261194 B2 JP 6261194B2
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polymer
general formula
structural unit
optical member
unit represented
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JP2013120828A
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Japanese (ja)
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JP2014012833A5 (enExample
JP2014012833A (ja
Inventor
涼 小川
涼 小川
岡田　誠司
誠司 岡田
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Canon Inc
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Canon Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F12/02—Monomers containing only one unsaturated aliphatic radical
    • C08F12/32—Monomers containing only one unsaturated aliphatic radical containing two or more rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/32—Monomers containing only one unsaturated aliphatic radical containing two or more rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2013120828A 2012-06-07 2013-06-07 光学部材、電子基板、光学部材の製造方法、電子基板の製造方法 Expired - Fee Related JP6261194B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013120828A JP6261194B2 (ja) 2012-06-07 2013-06-07 光学部材、電子基板、光学部材の製造方法、電子基板の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012130083 2012-06-07
JP2012130083 2012-06-07
JP2013120828A JP6261194B2 (ja) 2012-06-07 2013-06-07 光学部材、電子基板、光学部材の製造方法、電子基板の製造方法

Publications (3)

Publication Number Publication Date
JP2014012833A JP2014012833A (ja) 2014-01-23
JP2014012833A5 JP2014012833A5 (enExample) 2016-07-21
JP6261194B2 true JP6261194B2 (ja) 2018-01-17

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JP2013120828A Expired - Fee Related JP6261194B2 (ja) 2012-06-07 2013-06-07 光学部材、電子基板、光学部材の製造方法、電子基板の製造方法

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US (1) US8940810B2 (enExample)
JP (1) JP6261194B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573808B (zh) * 2013-12-31 2017-03-11 陶氏全球科技責任有限公司 經引導之自組裝圖案形成方法及組成物
CN115785647B (zh) * 2021-09-10 2025-10-31 台光电子材料(昆山)股份有限公司 一种树脂组合物及其制品
CN115785603B (zh) * 2021-09-10 2025-10-14 台光电子材料(昆山)股份有限公司 一种树脂组合物及其制品
CN113773432B (zh) * 2021-09-27 2022-07-12 中国科学院兰州化学物理研究所 一种低介电常数形状记忆聚苯乙烯及其制备方法和应用
CN119930902B (zh) * 2025-04-03 2025-06-17 像航（上海）科技有限公司 一种固体光学材料及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4642329A (en) * 1984-08-27 1987-02-10 The Dow Chemical Company Prepolymer processing of arylcyclobutene monomeric compositions
US4783514A (en) * 1986-02-28 1988-11-08 The Dow Chemical Company Polymeric monoarylcyclobutane compositions
JP2005280261A (ja) 2004-03-30 2005-10-13 Mitsubishi Chemicals Corp 樹脂成形体の製造方法
JP4522838B2 (ja) * 2004-12-14 2010-08-11 日本曹達株式会社 高分子固体電解質用組成物、高分子固体電解質、開環能をもつ共重合体及び架橋高分子
US8765895B2 (en) * 2007-11-08 2014-07-01 Innolene Llc Crosslinked polyolefins for biomedical applications and method of making same

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US20130331477A1 (en) 2013-12-12
US8940810B2 (en) 2015-01-27
JP2014012833A (ja) 2014-01-23

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