JP6256737B2 - 化学機械的研磨装置用リテーナリング構造物 - Google Patents
化学機械的研磨装置用リテーナリング構造物 Download PDFInfo
- Publication number
- JP6256737B2 JP6256737B2 JP2013168718A JP2013168718A JP6256737B2 JP 6256737 B2 JP6256737 B2 JP 6256737B2 JP 2013168718 A JP2013168718 A JP 2013168718A JP 2013168718 A JP2013168718 A JP 2013168718A JP 6256737 B2 JP6256737 B2 JP 6256737B2
- Authority
- JP
- Japan
- Prior art keywords
- ring
- retainer ring
- chemical mechanical
- mechanical polishing
- ring structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005498 polishing Methods 0.000 title claims description 27
- 239000000126 substance Substances 0.000 title claims description 15
- 230000008878 coupling Effects 0.000 claims description 25
- 238000010168 coupling process Methods 0.000 claims description 25
- 238000005859 coupling reaction Methods 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 14
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
12、32:上部リング
16,50:ボルト孔
18:結合溝
22、34:下部リング
36:中心突起部
38:結合ボルト
40:結合ボルト孔
42:中心溝部
48:端突起部
Claims (1)
- 化学機械的研磨(CMP)装置用リテーナリング構造物において、
前記化学機械的研磨装置のヘッドに結合されるための複数のボルト孔が上面に形成され、中心部には一定深さの中心溝部が形成されるため、その中心溝部の側面に自然的に形成された一対の端突起部を有する金属材の上部リングと、
前記上部リングが結合される結合溝が中心に形成され、前記上部リングの中心溝部に挿入される中心突起部が前記結合溝の中心部に形成される樹脂材の下部リングとを含み、
前記上部リングおよび前記下部リングの中心突起部には互いに連通する結合ボルト孔が
形成され、結合ボルトによって前記上部リングと下部リングとが結合することを特徴とする化学機械的研磨装置用リテーナリング構造物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013168718A JP6256737B2 (ja) | 2013-08-14 | 2013-08-14 | 化学機械的研磨装置用リテーナリング構造物 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2013168718A JP6256737B2 (ja) | 2013-08-14 | 2013-08-14 | 化学機械的研磨装置用リテーナリング構造物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015037143A JP2015037143A (ja) | 2015-02-23 |
JP6256737B2 true JP6256737B2 (ja) | 2018-01-10 |
Family
ID=52687505
Family Applications (1)
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JP2013168718A Active JP6256737B2 (ja) | 2013-08-14 | 2013-08-14 | 化学機械的研磨装置用リテーナリング構造物 |
Country Status (1)
Country | Link |
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JP (1) | JP6256737B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111482893A (zh) * | 2020-04-16 | 2020-08-04 | 华海清科股份有限公司 | 一种化学机械抛光保持环和化学机械抛光承载头 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6449194B2 (ja) * | 2015-05-25 | 2019-01-09 | 株式会社荏原製作所 | 研磨装置、研磨ヘッド、およびリテーナリング |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030070757A1 (en) * | 2001-09-07 | 2003-04-17 | Demeyer Dale E. | Method and apparatus for two-part CMP retaining ring |
JP3091590U (ja) * | 2002-07-23 | 2003-02-07 | 水源 陳 | シリコンウェハの研磨用定位リングの構造 |
DE10247180A1 (de) * | 2002-10-02 | 2004-04-15 | Ensinger Kunststofftechnologie Gbr | Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung |
KR20080031870A (ko) * | 2005-05-24 | 2008-04-11 | 엔테그리스, 아이엔씨. | Cmp 리테이닝 링 |
JP2008062355A (ja) * | 2006-09-08 | 2008-03-21 | Fujitsu Ltd | 研磨装置及び電子装置の製造方法 |
JP2009202333A (ja) * | 2008-01-29 | 2009-09-10 | Nobuhiko Wakizaka | Cmpリテーナーリング構造 |
-
2013
- 2013-08-14 JP JP2013168718A patent/JP6256737B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111482893A (zh) * | 2020-04-16 | 2020-08-04 | 华海清科股份有限公司 | 一种化学机械抛光保持环和化学机械抛光承载头 |
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JP2015037143A (ja) | 2015-02-23 |
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