JP6255865B2 - センサーユニット、電子機器、および移動体 - Google Patents

センサーユニット、電子機器、および移動体 Download PDF

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Publication number
JP6255865B2
JP6255865B2 JP2013208893A JP2013208893A JP6255865B2 JP 6255865 B2 JP6255865 B2 JP 6255865B2 JP 2013208893 A JP2013208893 A JP 2013208893A JP 2013208893 A JP2013208893 A JP 2013208893A JP 6255865 B2 JP6255865 B2 JP 6255865B2
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substrate
sensor unit
pedestal
sensor device
connector
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JP2015072232A (ja
JP2015072232A5 (enExample
Inventor
佳邦 齋藤
佳邦 齋藤
木下　裕介
裕介 木下
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Seiko Epson Corp
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Seiko Epson Corp
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JP2013208893A 2013-10-04 2013-10-04 センサーユニット、電子機器、および移動体 Active JP6255865B2 (ja)

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JP2013208893A JP6255865B2 (ja) 2013-10-04 2013-10-04 センサーユニット、電子機器、および移動体

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JP2013208893A JP6255865B2 (ja) 2013-10-04 2013-10-04 センサーユニット、電子機器、および移動体

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JP2015072232A JP2015072232A (ja) 2015-04-16
JP2015072232A5 JP2015072232A5 (enExample) 2016-10-06
JP6255865B2 true JP6255865B2 (ja) 2018-01-10

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106662446B (zh) 2014-07-16 2019-10-25 精工爱普生株式会社 传感器单元、电子设备以及移动体
JP6597069B2 (ja) * 2015-09-02 2019-10-30 セイコーエプソン株式会社 センサーユニット、電子機器、および移動体
JP6926568B2 (ja) 2017-03-24 2021-08-25 セイコーエプソン株式会社 物理量センサー、電子機器および移動体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462530B1 (en) * 2001-01-25 2002-10-08 Bei Technologies, Inc. Redundant rate sensor and method
JP2003258454A (ja) * 2002-03-04 2003-09-12 Hitachi Unisia Automotive Ltd 箱形制御ユニット
JP2004163367A (ja) * 2002-11-15 2004-06-10 Ngk Insulators Ltd 振動ジャイロパッケージの実装構造
US7536909B2 (en) * 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
JP2007218731A (ja) * 2006-02-16 2007-08-30 Tdk Corp 衝撃検知装置
JP2012237664A (ja) * 2011-05-12 2012-12-06 Seiko Epson Corp 物理量センサー、電子機器
JP5845672B2 (ja) * 2011-07-13 2016-01-20 セイコーエプソン株式会社 センサーデバイスおよび電子機器

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