JP6255865B2 - Sensor unit, electronic device, and moving object - Google Patents

Description

  The present invention relates to a sensor unit, an electronic device including the sensor unit, and a moving body.

  Conventionally, for example, as disclosed in Patent Document 1, electronic components such as an inertial sensor such as a vibration type angular velocity sensor that vibrates a drive unit on a circuit board supported by a pedestal or an acceleration sensor provided with a movable body, and a connector. There is known a sensor module that is mounted and a circuit board and electronic components are covered with a lid member. In this sensor module, the substrate is supported by a plurality of protrusions provided on the pedestal. In this sensor module, the connector is exposed at the opening provided on the side surface of the lid member. Electrical connection between the mounting board (control circuit) of the electronic device on which the sensor module is mounted and the sensor module is performed by a connecting member such as a cable or a flexible wiring board extending from the fitted connector.

JP 2013-18826 A

  However, in the above-described configuration, since the plurality of protrusions are provided, the height of each of the protrusions is likely to vary, and the positional relationship between the base and the base supported by the base via these protrusions varies. The so-called substrate is likely to vary in posture accuracy. If the posture accuracy varies, the detection axis of the sensor device may vary when the sensor unit is mounted on a mounting substrate or the like, and the detection accuracy of the sensor may be reduced. Further, in the above-described configuration, the electrical connection between the mounting board of the electronic device and the sensor module is performed by a connection member such as a cable or a flexible wiring board extending from the fitted connector. The connecting member has a resonance frequency at which a portion extending from the connector resonates. When a vibration having a frequency near the resonance frequency is applied, the resonance state is generated and the vibration is amplified, and the vibration propagates to the circuit board and the inertial sensor through the connector. Specifically, the vibration propagates to the drive unit of the vibration type angular velocity sensor and the movable body of the acceleration sensor, which may affect the detection and output characteristics of the inertial sensor.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A sensor unit according to this application example includes a substrate provided with a sensor device including an electrode disposed on an outer surface, a connector connected to the sensor device, and the sensor in plan view. A component storage portion provided at a position overlapping with the device, a board joining portion that is thicker than the component storage portion and extends in two intersecting directions, and an opening through which at least a part of the connector is exposed And the base is connected to the substrate bonding portion.

  According to this application example, the board joint portion having a thickness larger than that of the component storage portion is provided so as to extend in two intersecting directions. Then, the substrate to which the sensor device and the connector are connected is connected to the substrate bonding portion. Since the board joint extends in two intersecting directions with a large thickness, it has high rigidity and can be made to have a uniform height based on the bottom surface of the pedestal, thus suppressing variations in height. And the bonding posture of the substrates can be stabilized. As a result, it is possible to align the posture of the substrate with respect to the bottom surface of the pedestal (connection surface to the mounting substrate) (to reduce the variation), and as a result, it is possible to suppress variations in the detection axis direction of the sensor device and detect Accuracy can be stabilized. Further, since the connector is exposed from the opening of the pedestal, the connector on the mounting substrate to which the sensor unit is connected and the connector of the sensor unit can be directly connected. This eliminates the need for previously used wiring and flexible wiring boards, and prevents the resonance phenomenon of wiring and flexible wiring boards from propagating to the inertial sensor through the board and affecting the characteristics of the inertial sensor. it can.

  Application Example 2 In the sensor unit according to the application example described above, the substrate is disposed along a first surface and a second surface, side surfaces, and a contour of the first surface that are in a front-back relationship with each other. It is preferable that at least one of the sensor devices includes a terminal, the outer surface faces the side surface of the substrate, and the electrode and the conductive terminal are bonded to each other by a conductor and fixed to the substrate. .

  According to this application example, the sensor device can be mounted facing the side surface of the substrate, and the electrode of the sensor device and the conductive terminal of the substrate can be securely and electrically fixed by the conductor. A small and low-profile sensor unit can be provided using a sensor package.

  Application Example 3 In the sensor unit according to the application example described above, it is preferable that a gap is provided between the sensor device and the pedestal.

  According to this application example, by providing a gap between the sensor device and the pedestal, it is possible to prevent the impact received by the pedestal from the outside or stress such as deformation from being directly transmitted to the sensor device. It is possible to improve the detection accuracy of.

  Application Example 4 In the sensor unit according to the application example described above, a portion that overlaps the sensor device mounted on the side surface of the component storage portion in plan view is thinner than the other component storage portions. Is preferred.

  According to this application example, the height of the sensor unit can be reduced by thinning the pedestal of the portion that overlaps the sensor device mounted on the side surface of the substrate in plan view.

  Application Example 5 In the sensor unit according to the application example described above, it is preferable that the board joint portion is provided around the component storage portion.

  According to this application example, since the board is supported by being joined to the board joint portion at the outer peripheral portion thereof, flapping and bending of the board are suppressed, and the attachment / detachment of the connector connected to the board is more smoothly performed. It can be done reliably.

  Application Example 6 In the sensor unit according to the application example described above, it is preferable that a filler is provided between the outer periphery of the connector and the periphery of the opening.

  According to this application example, the opening provided between the outer periphery of the connector and the periphery of the opening is blocked by the filler provided between the outer periphery of the connector and the periphery of the opening. It is possible to prevent foreign matter such as moisture and dust from entering.

  Application Example 7 In the sensor unit according to the application example described above, it is preferable that the input / output surface of the connector is located inside the pedestal.

  According to this application example, the connector does not protrude from the surface of the pedestal opposite to the surface to which the substrate is connected, that is, the surface of the pedestal on the mounting substrate side. Thereby, it is possible to prevent the connector from being damaged due to an unexpected situation.

  Application Example 8 In the sensor unit according to the application example described above, it is preferable that a lid member that covers the substrate is provided, and the lid member is connected to the pedestal.

  According to this application example, since the lid member is connected to the pedestal, the lid member can protect components such as a sensor device and a connector that are connected to and mounted on the substrate. In addition, foreign matter such as moisture and dust can be prevented from entering, and the reliability of the sensor unit can be improved.

  Application Example 9 An electronic apparatus according to this application example includes the sensor unit according to any one of the application examples described above.

  According to this application example, resonance vibration and stress fluctuation applied to the sensor device from the outside are suppressed, and more stable measurement can be performed, variation in the detection axis of the sensor device is suppressed, and sensor detection accuracy is improved. Since the improved sensor unit is provided, a more reliable electronic device can be provided.

  Application Example 10 A moving object according to this application example includes the sensor unit according to any one of the application examples described above.

  According to this application example, resonance vibration and stress fluctuation applied to the sensor device from the outside are suppressed, and more stable measurement can be performed, variation in the detection axis of the sensor device is suppressed, and sensor detection accuracy is improved. Since the improved sensor unit is provided, a more reliable moving body can be provided.

The schematic structure of the sensor unit which concerns on 1st Embodiment is shown, (a) is a top view, (b) is a front sectional view, (c) is a bottom view. The perspective view which shows the outline of the base in 1st Embodiment. The front sectional view showing an example of mounting of the sensor unit. The schematic structure of the sensor unit which concerns on 2nd Embodiment is shown, (a) is a top view, (b) is AA sectional drawing of (a), (c) is a bottom view. The perspective view which shows the outline of the base in 2nd Embodiment. The perspective view which shows the modification of a base. 1 is a block diagram schematically showing a configuration of an electronic device according to an embodiment. 1 is a block diagram schematically showing a configuration of a moving object according to an embodiment. 1 is a block diagram schematically showing a configuration of a machine according to an embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

(First embodiment)
(Configuration of sensor unit)
FIG. 1 is a diagram schematically showing an external appearance of a sensor unit according to the first embodiment. FIG. 1A is a plan view, FIG. 1B is a front sectional view, and FIG. 1C is a bottom view. It is. In FIG. 1A, a cap as a lid member is omitted in order to make the drawing easier to see. FIG. 2 is a perspective view schematically showing a pedestal in the first embodiment.

  As shown in FIG. 1, the sensor unit 10 according to the first embodiment includes a substrate 11 provided with a first sensor device 23 as a sensor device and a connector 14 connected to the first sensor device 23, and a substrate 11 and a pedestal 20 provided with a through hole 13 as an opening through which the connector 14 is exposed. Further, the sensor unit 10 includes a cap 24 as a lid member that is connected to the base 20 and covers the substrate 11. The first sensor device 23 is disposed at a position overlapping the component storage portion 19 that is a gap provided between the substrate 11 and the pedestal 20 in plan view (when viewed from the Z-axis direction in the drawing). In the present embodiment, an example in which an inertial sensor is used as the first sensor device will be described. Hereinafter, details of the constituent members including other constituent members will be described.

(substrate)
The substrate 11 is provided with main surfaces on the front and back sides, a first surface 11a that is one main surface, a second surface 11b that is the other main surface in front and back relation with the first surface 11a, and a first surface 11a. A side surface connecting the second surface 11b is provided. And the board | substrate 11 is connected to the board | substrate junction part 22a, 22b, 22c of the base 20 mentioned later in the position of the connection area | region R1 shown by hatching in a figure. The substrate 11 is formed of an insulator such as resin or ceramic. On the first surface 11a and the second surface 11b of the substrate 11, wiring patterns (mounting wiring, conductive terminals, electrodes, etc.) formed from a conductive material, for example, by plating film formation are formed. Yes.

  A first sensor device 23 and a second sensor device 18 are mounted on the first surface 11a in a region overlapping the component storage portion 19 of the substrate 11 connected to the base 20 in a plan view (viewed in the Z-axis direction). Yes. The first sensor device 23, which is an inertial sensor, has a flat and substantially rectangular parallelepiped outer shape, and the outer surface has a rectangular outline. As for the 1st sensor device 23, the external electrode as a some electrode which is not shown in figure is arrange | positioned on the outer surface. The first sensor device 23 is disposed in a region overlapping the component storage unit 19 in plan view so that the bottom surface as the outer surface is superimposed on the first surface 11 a of the substrate 11. The first sensor device 23 is mounted on the substrate 11 with the electrodes provided on the outer surface and the conductive terminals provided on the substrate 11 being electrically connected. For connection in mounting, a bonding material such as a solder material is used. The first sensor device 23 is composed of an angular velocity sensor having a single detection axis 50, that is, a gyro sensor. In the angular velocity sensor, the detection axis 50 is orthogonal to the bottom surface, and the angular velocity around the detection axis 50 is detected. In this example, the configuration in which one first sensor device 23 is used as the angular velocity sensor is illustrated, but a plurality of sensor devices similar to the first sensor device 23 are used as in the second embodiment to be described later, and the multi-axis is used. It is also possible to adopt a configuration capable of detecting the angular velocity around the direction detection axis. For example, when detecting the angular velocities in the three orthogonal directions, each sensor device can be realized by mounting the sensor device on the substrate 11 with the bottom surfaces facing the three orthogonal directions.

  The second sensor device 18 is composed of, for example, an acceleration sensor. In this example, a sensor capable of detecting acceleration in the direction of one axis (detection axis 50) is illustrated, and acceleration can be detected along the detection axis 50. In addition, the 2nd sensor device 18 may be comprised by the triaxial acceleration sensor which can detect the acceleration of a multiaxial direction, for example. If a triaxial acceleration sensor is used, acceleration can be detected along three orthogonal axes.

  Of the main surface of the substrate 11, the second surface 11 b that is in a front-back relationship with the first surface 11 a includes a connector 14, other electronic components 15 such as a chip resistor and a chip capacitor, and an IC chip (integrated circuit) 17. Has been implemented. For connection in mounting, for example, a bonding material such as a solder material is used. A chip resistor or a chip capacitor may be used to improve the output characteristics from the sensor device. The connector 14, the other electronic components 15, the IC chip (integrated circuit) 17 and the like are electrically connected to each other with a wiring pattern (not shown). The connector 14 is disposed such that its bottom surface (fixed surface) overlaps the second surface of the substrate 11, and is attached to the second surface 11 b of the substrate 11. Thus, by attaching the connector 14, the direction of the detection shaft 50 of the first sensor device 23 and the insertion direction of the connector 14 can be matched via the substrate 11.

  In the above description, the first sensor device 23 and the second sensor device 18 are mounted on the first surface 11a of the substrate 11, and the connector 14, the electronic component 15, and the IC chip (integrated circuit) are mounted on the second surface 11b. Although an example in which 17 or the like is mounted has been described, the mounting surface and the combination are not specified. For example, the electronic component 15 and the IC chip (integrated circuit) 17 are mounted on the first surface 11a, and the connector 14, the first sensor device 23, and the second sensor device 18 are mounted on the second surface 11b. It may be a configuration.

(pedestal)
Here, the details of the pedestal 20 will be described with reference to FIG. The pedestal 20 is provided so as to face the second surface 11 b of the substrate 11. The pedestal 20 has a plate-like base 25 provided so as to face the second surface 11 b of the substrate 11, and a substrate protruding from the base 25 toward the second surface 11 b of the substrate 11 along the outer periphery of the base 25. Junction parts 22a, 22b, and 22c are provided. The pedestal 20 has a bottom surface (outer bottom surface) 20b, a top surface 20a that is a front-back relationship with the bottom surface 20b and that is the inner bottom surface of the base body 25, and a bonding surface 22f between the substrate 11 that is the top surface of the substrate bonding portions 22a, 22b, and 22c. And have. The bonding surfaces 22f of the substrate bonding portions 22a, 22b, and 22c are formed on the same surface.

  The substrate bonding portions 22a, 22b, and 22c have a thickness H2 (thickness: the thickness between the bonding surface 22f and the lower surface 20b) larger than the thickness H1 (thickness: the thickness between the upper surface 20a and the lower surface 20b) of the base body 25. doing. That is, the substrate bonding portions 22 a, 22 b, and 22 c protrude from the upper surface 20 a of the base body 25. Further, in this example, the protruding portion is formed by the substrate bonding portion 22a at the end in the X-axis direction and extending in the Y-axis direction, and the substrate bonding portions 22b and 22c at both ends in the Y-axis direction and extending in the X-axis method. 22 is formed. A space region formed by the projecting inner surfaces of the substrate bonding portions 22 a, 22 b, and 22 c and the upper surface 20 a of the base body 25 is the component storage portion 19.

  A through hole 13 that penetrates from the bonding surface 22f to the lower surface 20b is provided in the board bonding portion 22a of the base 20. The through-hole 13 is provided so as to accommodate the connector 14 connected to the substrate 11 when the substrate 11 is connected to the pedestal 20 as will be described later. The through hole 13 is a hole having a shape that is slightly larger than the outer shape of the connector 14. The through hole 13 in this example is a hole having a rectangular opening. Further, the pedestal 20 is provided with a collar portion 21 provided in a thin shape at the outer peripheral end portion of the base body 25.

  And in connection area | region R1 containing the outer peripheral part of the board | substrate 11, and the outer peripheral part of the through-hole 13 which inserts the connector 14, the board | substrate 11 is connected on the base 20 by connecting on the board | substrate junction part 22a, 22b, 22c. Is supported. Although the connection method of the board | substrate 11 is not specifically limited, For example, the connection by an adhesive agent, fixation by screwing, etc. can be used. Note that it is preferable to use fixing with an adhesive and screwing together, whereby the substrate 11 can be reliably fixed to the protruding portion 22. Further, since the adhesive layer is interposed between the pedestal 20 and the substrate 11, the adhesive absorbs and relaxes vibrations from the pedestal 20, and unnecessary vibrations of the substrate 11 are suppressed. As a result, the detection accuracy of the sensor unit 10 is further improved.

  The substrate bonding portions 22a, 22b, and 22c only need to extend in at least two intersecting directions, and the substrate 11 can be reliably connected. For example, a plurality of protrusions may be provided in each of the X-axis direction and the Y-axis direction, or one protrusion that extends in the X-axis direction from the center part in the Y-axis direction of the substrate bonding portion 22a. It may be provided. As described above, since the substrate 11 is supported by being bonded to the substrate bonding portions 22a, 22b, and 22c provided around the component storage portion 19 at the outer peripheral portion thereof, flapping and bending of the substrate 11 are suppressed. Thus, the connector 14 connected to the substrate 11 can be attached and detached more smoothly and reliably. Moreover, since the board | substrate 11 and the base 20 are joined in the circumference | surroundings of the connector 14, the circumference | surroundings board | substrate 11 to which the connector 14 is connected becomes difficult to bend, and the removal | desorption of the connector 14 can be performed more smoothly and reliably. it can.

  The height of the protruding portion 22 with respect to the upper surface 20 a is set so that the input / output surface 14 a of the connector 14 is within the through hole 13 when the substrate 11 is connected to the protruding portion 22. In other words, when the board is connected to the protrusion 22, the input / output surface 14 a of the connector 14 is positioned on the inner side (upper surface 20 a side) than the lower surface 20 b (the lower surface of the base 20) of the base body 25. With this configuration, it is possible to prevent an impact or load from being applied to the connector 14 even if an unexpected situation occurs, and to prevent the connector 14 from being damaged. A filler 16 is disposed in the gap between the through hole 13 and the outer peripheral portion of the connector 14. Since the gap is filled with the filler 16 in this way, the opening to the lower surface of the pedestal 20 (the lower surface 20b of the base body 25) is blocked, so that the substrate 11 and the pedestal 20 are connected to each other from the lower surface side of the pedestal 20. It becomes possible to prevent entry of foreign matter such as moisture and dust into the component storage portion 19 which is a gap provided therebetween.

  By configuring the pedestal 20 in such a configuration, the substrate 11 can be easily supported, and other electronic components 15 such as a chip resistor and a chip capacitor, and an IC chip (between the substrate 11 and the base body 25). A space (component housing portion 19) for housing the integrated circuit) 17 and the like can be secured. When the substrate 11 is fixed in this manner, a space is formed between the substrate 11 and the base body 25, and the electronic component 15, the IC chip (integrated circuit) 17, and the like are accommodated in the space. Thereby, contact with these parts and the base 20 is prevented, and the reliability of the sensor unit 10 improves. Further, a cap 24 as a lid member to be described later is joined to the collar portion 21. The cap 24 can be easily joined to the pedestal 20 by using, for example, a resin adhesive based on an epoxy resin.

  The constituent material of the pedestal 20 is not particularly limited, but is preferably a material having vibration damping characteristics. Thereby, unnecessary vibration of the substrate 11 is suppressed, and the detection accuracy of the first sensor device 23 and the second sensor device 18 is improved. Examples of such materials include various damping alloys such as magnesium alloys, iron alloys, copper alloys, manganese alloys, and Ni-Ti alloys.

(Cover member)
The cap 24 as a lid member has a box shape and is fixed to the pedestal 20 at the flange portion 21 so as to cover the substrate 11. The cap 24 has a substantially rectangular opening along the flange portion 21 of the pedestal 20, is arranged so that the opening faces the pedestal 20, and is joined to the pedestal 20 with a resin adhesive or the like. In addition, the method of joining the cap 24 to the pedestal 20 may use screwing.

  The constituent material of such a cap 24 is not particularly limited. For example, polyolefin such as polyethylene, polypropylene, ethylene-propylene copolymer, polyvinyl chloride, polystyrene, polyamide, polyimide, polycarbonate, poly- (4-methyl). Pentene-1), ionomer, acrylic resin, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer, polyethylene terephthalate (PET) ), Polyester such as polybutylene terephthalate (PBT), polyether, polyetherketone (PEK), polyetheretherketone (PEEK), polyetherimide, polyacetal (POM) Polyphenylene oxide, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluorine resins, epoxy resins, phenol resins, urea resins, melamine resins, Silicone resin, polyurethane, and the like, or copolymers, blends, polymer alloys, and the like mainly containing these, can be used, and one or more of these can be used in combination. Further, a cap 24 formed by press molding or the like using a material obtained by subjecting a thin plate such as aluminum, stainless steel, iron-based alloy, or copper-based alloy to a surface treatment can also be applied.

  A configuration for mounting the sensor unit 10 described above on the mounting substrate will be described with reference to FIG. FIG. 3 is a front sectional view showing an example of mounting the sensor unit. In the figure, the same reference numerals are given to the same components as those in the above-described embodiment, and the components related to the mounting substrate are indicated by two-dot chain lines. The description of the same configuration as that of the above-described embodiment is omitted.

  As shown in FIG. 3, in the sensor unit 10, a connector 31 (female connector) on the mounting substrate 30 side is inserted into a connector 14 (male connector), and the lower surface 20 b of the pedestal 20 is placed on the upper surface 30 a of the mounting substrate 30. Are arranged and connected so as to overlap. In this way, the connector 14 of the sensor unit 10 and the connector 31 of the mounting board 30 are directly connected. The connector 14 is a male connector and the connector 31 is a female connector. However, the opposite configuration, that is, the connector 14 may be a female connector and the connector 31 may be a male connector.

  Further, the lower part of the outer periphery of the sensor unit 10 (the range indicated by the symbol W in the figure) may be joined by the adhesive 28 or the like. By this bonding, the sensor unit 10 can be firmly bonded to the mounting substrate 30. The adhesive 28 may be applied between the bottom surface of the sensor unit 10 (the lower surface 20b of the base 25 of the base 20) and the mounting substrate 30. By applying the adhesive 28 over the entire circumference of the lower outer periphery of the sensor unit 10, a sealing effect is produced. In this way, by applying the adhesive 28 over the entire circumference of the lower part of the outer periphery of the sensor unit 10, foreign matter can be prevented from entering from the through hole 13 located on the bottom surface of the sensor unit 10 (the lower surface 20 b of the base 25 of the base 20). It becomes possible to do.

  Moreover, it is preferable to perform the process for improving the wettability of the adhesive agent 28 on the surface of the cap 24 located in the outer periphery lower part (the range shown by the symbol W in the figure) of the sensor unit 10. As this processing method, honing or a process for roughening the surface of the cap 24 by etching or the like (for example, MAT process) can be used. Further, when the material of the cap 24 is aluminum, it is possible to apply a method in which the alumite treatment is performed except the range indicated by the symbol W in the figure and the alumite treatment is not performed in the range indicated by the symbol W in the figure. . In addition, it is preferable that the range shown with the code | symbol W is about 1 mm from the edge which the cap 24 opens.

  In this way, by performing the processing of the lower outer periphery of the sensor unit 10 (the range indicated by the symbol W in the drawing), the wettability of the adhesive 28 in the range indicated by the symbol W in the drawing can be improved. Application can be performed reliably. Further, it is possible to prevent the adhesive 28 from flowing out of the range indicated by the symbol W in the drawing. By these, the application quantity of the adhesive agent 28 can be stabilized and the sealing effect can be made more reliable.

  According to the sensor unit 10 of the first embodiment described above, the two directions (the X-axis direction, the substrate bonding portion 22a, the substrate bonding portion 22b, and the substrate bonding portion 22c having a thickness thicker than the component storage portion 19 intersect. (Y-axis direction) is provided. For example, the substrate 11 to which the first sensor device 23 and the connector 14 are connected is connected to the substrate bonding portions 22a, 22b, and 22c. The substrate bonding portions 22a, 22b, and 22c are thick in thickness and extend in two intersecting directions, so that the substrate bonding portions 22a, 22b, and 22c have high rigidity, and the height of the bonding surface 22f integrally with respect to the bottom surface (lower surface 20b) of the base 20. Therefore, variation in height can be suppressed, and the bonding posture of the substrate 11 can be stabilized. This makes it possible to align the posture of the substrate 11 with respect to the bottom surface of the pedestal 20 (the lower surface 20b that is a connection surface to the mounting substrate) (to reduce variations), and as a result, a sensor device such as the first sensor device 23 or the like. In the detection axis direction can be suppressed, and the detection accuracy can be stabilized.

  Further, according to the sensor unit 10, since the connector 14 is exposed in the through hole 13 as the opening of the base 20, the connector 31 of the mounting substrate 30 to which the sensor unit 10 is connected and the connector of the sensor unit 10. 14 can be connected directly. This eliminates the need for wiring and flexible wiring boards that have been used in the past, and the resonance phenomenon of the wiring and flexible wiring board propagates to the first sensor device 23 as an inertial sensor through the board. Will no longer affect Further, since the first sensor device 23 is connected to the substrate 11 at a position other than the pedestal bonding region R1 where the pedestal 20 and the substrate 11 are connected, the stress fluctuation (thermal distortion, vibration, impact) received from the pedestal 20 Etc.) are difficult to propagate to the first sensor device 23. Therefore, the sensor unit 10 of this example can suppress resonance vibration and stress fluctuation from the outside and perform more stable measurement.

(Second Embodiment)
Next, 2nd Embodiment of a sensor unit is described with reference to FIG. 4 and FIG. FIG. 4 shows a schematic configuration of a sensor unit according to the second embodiment, FIG. 4 (a) is a plan view, FIG. 4 (b) is a cross-sectional view taken along line AA in FIG. 4 (a), and FIG. Is a bottom view. In FIG. 4A, a cap as a lid member is omitted for easy understanding of the drawing. FIG. 5 is a perspective view showing an outline of a pedestal in the second embodiment. In addition, the same code | symbol is attached | subjected about the structure similar to the above-mentioned 1st Embodiment. In addition, description of the same configuration may be omitted.

  As shown in FIG. 4, the sensor unit 60 according to the second embodiment includes a first sensor device 23 as a sensor device, a third sensor device 33, a fourth sensor device 43, and first, third, and third sensors. The board 11 provided with the connector 14 connected to the four sensor devices 23, 33, 43, and the base 40 provided with the through-hole 13 as an opening on which the board 11 is placed and the connector 14 is exposed. Including. The sensor unit 60 includes a cap 24 as a lid member that is connected to the base 40 and covers the substrate 11. The first sensor device 23 has a first surface 11a of the substrate 11 at a position overlapping the component storage portion 19 that is a gap provided between the substrate 11 and the pedestal 40 in plan view (when viewed from the Z-axis direction in the drawing). Are arranged in a so-called horizontal orientation. Further, the third sensor device 33 and the fourth sensor device 43 are mounted on the notches 11h and 11k of the substrate 11 in a so-called vertical arrangement. The mounting of the first sensor device 23, the third sensor device 33, and the fourth sensor device 43 will be described later. In the present embodiment, an example in which inertial sensors are used as the first sensor device 23, the third sensor device 33, and the fourth sensor device 43 will be described. Hereinafter, details of the constituent members including other constituent members will be described.

(substrate)
The substrate 11 is provided with main surfaces on the front and back sides, a first surface 11a that is one main surface, a second surface 11b that is the other main surface in front and back relation with the first surface 11a, and a first surface 11a. A side surface connecting the second surface 11b is provided. In addition, the substrate 11 of this example has a notch 11h and a notch 11k at two corners. The notch 11h has a side surface 11c in the Y-axis direction perpendicular to the Z-axis direction, which is the direction in which the first surface 11a of the substrate 11 faces. Further, the notch 11k has a side surface 11d in the X-axis direction orthogonal to both the Z-axis direction and the Y-axis direction. And the board | substrate 11 is connected to the board | substrate junction part 22a, 22b, 22c of the base 40 mentioned later in the position of the connection area | region R1 shown by hatching in the figure. The substrate 11 is formed of an insulator such as resin or ceramic. On the first surface 11 a and the second surface 11 b of the substrate 11, wiring patterns (mounting wiring, conductive terminals, electrodes, etc.) formed from a conductive material by plating film formation, for example, are formed. Conductive terminals for mounting a third sensor device 33 and a fourth sensor device 43 to be described later are arranged on the first surface 11a along the edges (contours of the first surface) of the notches 11h and 11k. . These wiring patterns (mounting wiring, conductive terminals, electrodes, etc.) are not shown.

  The first sensor device 23 and the second sensor device 18 are mounted on the first surface 11a in a region overlapping the component storage portion 19 of the substrate 11 connected to the base 40 in plan view (Z-axis direction view). Yes. The first sensor device 23, which is an inertial sensor, has a flat and substantially rectangular parallelepiped outer shape, and the outer surface has a rectangular outline. As for the 1st sensor device 23, the external electrode as a some electrode which is not shown in figure is arrange | positioned on the outer surface. The first sensor device 23 is disposed in a region overlapping the component storage unit 19 in plan view so that the bottom surface as the outer surface is superimposed on the first surface 11 a of the substrate 11. The first sensor device 23 is mounted on the substrate 11 by electrically connecting the conductive terminals provided on the outer surface and the electrodes provided on the substrate 11. For connection in mounting, for example, a bonding material such as a solder material is used, but is omitted in the drawing. The first sensor device 23 is composed of an angular velocity sensor having a single detection axis 50, that is, a gyro sensor. In the angular velocity sensor, the detection axis 50 is orthogonal to the bottom surface, and the angular velocity around the detection axis 50 is detected.

  Further, the third sensor device 33 is mounted on the side surface 11 c of the notch portion 11 h of the substrate 11. In the third sensor device 33, external electrodes (not shown) as a plurality of electrodes are arranged on the outer surface (bottom surface). The third sensor device 33 is in a region overlapping the step portion 19b (see FIG. 5) in the component storage portion 19 in a plan view, and the bottom surface is opposed to the side surface 11c of the notch portion 11h. In this state, it is mounted (fixed) on the substrate 11. The third sensor device 33 includes an electrode (not shown) provided on the bottom surface (outer surface) and a conductive terminal (not shown) provided along the edge of the notch 11h, for example, solder. It is mounted by being electrically connected by a conductor 38 as a bonding material such as a material. The third sensor device 33 is composed of an angular velocity sensor having a uniaxial detection axis 51, that is, a gyro sensor. In the angular velocity sensor, the detection axis 51 is orthogonal to the bottom surface, and the angular velocity around the detection axis 51 along the Y-axis direction is detected.

  Similarly to the third sensor device 33, the fourth sensor device 43 is also mounted on the substrate 11. The fourth sensor device 43 is disposed in the notch 11k of the substrate 11. In the fourth sensor device 43, a plurality of electrodes (not shown) are arranged on the outer surface (bottom surface). The fourth sensor device 43 is in a region overlapping with the step portion 19c (see FIG. 5) in the component storage portion 19 in a plan view, and the bottom surface faces and contacts the side surface 11d of the notch portion 11k. In this state, it is mounted (fixed) on the substrate 11. The fourth sensor device 43 includes an electrode (not shown) provided on the bottom surface (outer surface) and a conductive terminal (not shown) provided along the edge of the notch 11k, for example, solder. It is mounted by being electrically connected by a conductor 39 as a bonding material such as a material. The fourth sensor device 43 is constituted by an angular velocity sensor having a uniaxial detection axis 52, that is, a gyro sensor. In the angular velocity sensor, the detection axis 52 is orthogonal to the bottom surface, and the angular velocity around the detection axis 52 along the X-axis direction is detected.

  The second sensor device 18 is composed of, for example, an acceleration sensor. In this example, a sensor capable of detecting acceleration in the direction of one axis (detection axis 50) is illustrated, and acceleration can be detected along the detection axis 50. In addition, the 2nd sensor device 18 may be comprised by the triaxial acceleration sensor which can detect the acceleration of a multiaxial direction, for example. If a triaxial acceleration sensor is used, acceleration can be detected along three orthogonal axes.

  Of the main surface of the substrate 11, the second surface 11 b that is in a front-back relationship with the first surface 11 a includes a connector 14, other electronic components 15 such as a chip resistor and a chip capacitor, and an IC chip (integrated circuit) 17. Has been implemented. For connection in mounting, for example, a bonding material such as a solder material is used. A chip resistor or a chip capacitor may be used to improve the output characteristics from the sensor device. The connector 14, the other electronic components 15, the IC chip (integrated circuit) 17 and the like are electrically connected to each other with a wiring pattern (not shown). The connector 14 is disposed such that the bottom surface (fixed surface) thereof overlaps the second surface 11 b of the substrate 11, and is attached to the second surface 11 b of the substrate 11. Thus, by attaching the connector 14, the direction of the detection shaft 50 of the first sensor device 23 and the insertion direction of the connector 14 can be matched via the substrate 11.

  In the above description, the first sensor device 23 and the second sensor device 18 are mounted on the first surface 11a of the substrate 11, and the connector 14, the electronic component 15, and the IC chip (integrated circuit) are mounted on the second surface 11b. Although an example in which 17 or the like is mounted has been described, the mounting surface and the combination are not specified. For example, the electronic component 15 and the IC chip (integrated circuit) 17 are mounted on the first surface 11a, and the connector 14, the first sensor device 23, and the second sensor device 18 are mounted on the second surface 11b. It may be a configuration.

(pedestal)
Here, the details of the pedestal 40 will be described with reference to FIG. The pedestal 40 is provided so as to face the second surface 11 b of the substrate 11. The base 40 is a plate-like base body 25 provided so as to face the second surface 11 b of the substrate 11, and a substrate that protrudes from the base body 25 toward the second surface 11 b of the substrate 11 along the outer periphery of the base body 25. Junction parts 22a, 22b, and 22c are provided. The pedestal 40 has a bottom surface (outer bottom surface) 20b, a top surface 20a that is a front-back relationship with the bottom surface 20b and is the inner bottom surface of the base body 25, and a bonding surface 22f between the substrate 11 that is the top surface of the substrate bonding portions 22a, 22b, and 22c. And have. The bonding surfaces 22f of the substrate bonding portions 22a, 22b, and 22c are formed on the same surface. The substrate bonding portions 22a, 22b, and 22c have a thickness H2 (thickness: the thickness between the bonding surface 22f and the lower surface 20b) larger than the thickness H1 (thickness: the thickness between the upper surface 20a and the lower surface 20b) of the base body 25. doing. That is, the substrate bonding portions 22 a, 22 b, and 22 c protrude from the upper surface 20 a of the base body 25. Further, in this example, the protruding portion is formed by the substrate bonding portion 22a at the end in the X-axis direction and extending in the Y-axis direction, and the substrate bonding portions 22b and 22c at both ends in the Y-axis direction and extending in the X-axis method. 22 is formed.

  Further, the two corners opposite to the side where the substrate bonding portion 22a is provided have a step from the upper surface 20a, and a step 19b and a step having a thickness H3 which is thinner than the upper surface 20a. A portion 19c is provided. The third sensor device 33 and the fourth sensor device 43 described above are arranged on the step portion 19b and the step portion 19c. By providing the step portions 19b and 19c in this way, regions having different thicknesses are provided in the component storage portion 19, and the rigidity of the component storage portion 19 can be increased. Thereby, the rigidity of the pedestal 40 is also increased, and deformation of the pedestal 40 can be made difficult to occur. A space region formed by the projecting inner surfaces of the substrate bonding portions 22a, 22b, and 22c, the upper surface 20a of the base 25, the step portion 19b, and the upper surface 20c of the step portion 19c is the component storage portion 19.

  Further, the substrate bonding portion 22a of the pedestal 40 is provided with a through hole 13 that penetrates from the bonding surface 22f to the lower surface 20b. The through hole 13 is provided so as to accommodate the connector 14 connected to the substrate 11 when the substrate 11 is connected to the pedestal 40 as will be described later. The through hole 13 is a hole having a shape that is slightly larger than the outer shape of the connector 14. The through hole 13 in this example is a hole having a rectangular opening. The pedestal 40 is provided with a flange 21 provided in a thin shape at the outer peripheral end of the base body 25.

  And in connection area | region R1 containing the outer peripheral part of the board | substrate 11, and the outer peripheral part of the through-hole 13 which inserts the connector 14, the board | substrate 11 is connected to the base 40 by connecting on the board | substrate junction part 22a, 22b, 22c. Is supported. Since the support of the substrate 11 to the pedestal 40 is the same as in the first embodiment described above, a description thereof is omitted here.

  The height of the protruding portion 22 with respect to the upper surface 20 a is set so that the input / output surface 14 a of the connector 14 is within the through hole 13 when the substrate 11 is connected to the protruding portion 22. In other words, when the board is connected to the protruding portion 22, the input / output surface 14 a of the connector 14 is positioned on the inner side (upper surface 20 a side) than the lower surface 20 b (the lower surface of the base 40) of the base body 25. With this configuration, it is possible to prevent an impact or load from being applied to the connector 14 even if an unexpected situation occurs, and to prevent the connector 14 from being damaged. A filler 16 is disposed in the gap between the through hole 13 and the outer peripheral portion of the connector 14. Since the gap is filled with the filler 16 in this way, the opening to the lower surface of the pedestal 40 (the lower surface 20b of the base body 25) is closed, so that the substrate 11 and the pedestal 20 are connected from the lower surface side of the pedestal 40. It becomes possible to prevent entry of foreign matter such as moisture and dust into the component storage portion 19 which is a gap provided therebetween.

  Further, when the substrate 11 is connected to the substrate bonding portions 22a, 22b, and 22c of the base 40, the third sensor device 33 and the fourth sensor device 43 are located between the step portion 19b and the upper surface 20c of the step portion 19c. Are arranged so that a gap is provided. Thus, by providing the gap, it is possible to prevent the impact received by the pedestal 40 from the outside or the stress such as deformation from being directly transmitted to the sensor devices such as the third sensor device 33 and the fourth sensor device 43. The detection accuracy of the sensor device can be increased.

  By configuring the pedestal 40 in such a configuration, the substrate 11 can be easily supported, and other electronic components 15 such as a chip resistor and a chip capacitor, and an IC chip (between the substrate 11 and the base body 25). A space (component housing portion 19) for housing the integrated circuit) 17 and the like can be secured. When the substrate 11 is fixed in this manner, a space is formed between the substrate 11 and the base body 25, and the electronic component 15, the IC chip (integrated circuit) 17, and the like are accommodated in the space. Thereby, contact with these components and the base 40 is prevented, and the reliability of the sensor unit 10 improves. Further, a cap 24 as a lid member to be described later is joined to the collar portion 21. The cap 24 can be easily joined to the pedestal 40 by using, for example, a resin adhesive based on an epoxy resin. Note that the cap 24 as a lid member is the same as that of the first embodiment described above, and a description thereof will be omitted.

  The constituent material of the pedestal 40 is not particularly limited, but is preferably a material having vibration damping characteristics. Thereby, unnecessary vibration of the substrate 11 is suppressed, and the detection accuracy of the first sensor device 23 and the second sensor device 18 is improved. Examples of such materials include various damping alloys such as magnesium alloys, iron alloys, copper alloys, manganese alloys, and Ni-Ti alloys.

  The sensor unit 60 described above can be mounted on the mounting board in the same manner as in the first embodiment described above. The mounting configuration, the surface treatment of the cap 24, and the like are the same as those in the first embodiment, and a description thereof will be omitted.

  According to the sensor unit 60 of the first embodiment described above, the same effect as that of the first embodiment described above is obtained, and the following effect is also obtained. In the description here, description of effects that are the same as those in the first embodiment is omitted, and only different effects are described.

  In the sensor unit 60, the third sensor device 33 is mounted on the side surface 11c of the cutout portion 11h of the substrate 11, and the fourth sensor device 43 is mounted on the side surface 11d of the cutout portion 11k of the substrate 11. In this way, the sensor device is mounted so as to face the side surfaces 11c and 11d of the substrate 11, and the conductors 38 using the electrodes of the third sensor device 33 and the fourth sensor device 43 and the conductive terminals of the substrate 11 as bonding materials, By securely and electrically fixing with 39, a small and low-profile sensor unit can be provided using the existing sensor package. Further, in the sensor unit 60, step portions 19b and 19c are provided on the base 40. By providing the step portions 19b and 19c as described above, the dimension in the height direction of the sensor unit can be reduced.

(Modification of pedestal)
A modification of the pedestal will be described with reference to FIG. 6. FIG. 6 is a perspective view showing a modification of the pedestal. The pedestal 80 shown in FIG. 6 is different from the pedestal 40 described in the second embodiment in the configuration of the substrate bonding portion. In this description, a configuration different from the pedestal 40 of the second embodiment will be described, and description of the same configuration will be omitted.

  The pedestal 80 is provided with a substrate bonding portion 22d in addition to the substrate bonding portions 22a, 22b, and 22c provided in the pedestal 40 of the second embodiment. The substrate bonding portion 22d is located on the end side opposite to the end where the substrate bonding portion 22a is provided, and is provided between the step portion 19b and the step portion 19c. The substrate bonding portion 22d has an upper surface that is flush with the other substrate bonding portions 22a, 22b, and 22c.

  According to such a pedestal 80, the outer circumferences in the four directions of the substrate 11 can be connected. Therefore, compared to the pedestal 40 of the second embodiment, the connected substrate 11 is less likely to flutter or bend. The reliability of joining of the third sensor device 33, the fourth sensor device 43, and the connector 14 that are connected to each other can be increased. Further, the connector 14 can be attached and detached more smoothly and reliably.

(Application example of sensor unit)
The sensor units 10 and 60 as described above can be applied to electronic devices, moving objects, and other machines. Hereinafter, the configuration using the sensor unit 10 will be exemplified and described in detail.

<Electronic equipment>
The sensor unit 10 as described above can be used by being incorporated in an electronic device 101 as shown in FIG. 7, for example. In the electronic apparatus 101, for example, an arithmetic processing circuit 103 and a connector 104 are mounted on a main board (mounting board) 102. For example, the connector 14 of the sensor unit 10 can be coupled to the connector 104. A detection signal can be supplied from the sensor unit 10 to the arithmetic processing circuit 103. The arithmetic processing circuit 103 processes the detection signal from the sensor unit 10 and outputs a processing result. Examples of the electronic device 101 include a motion sensing unit, a consumer game device, a motion analysis device, a surgical navigation system, and an automobile navigation system.

<Moving object>
For example, as shown in FIG. 8, the sensor unit 10 can be used by being incorporated in a moving body 105. In the moving body 105, for example, a control circuit 107 and a connector 108 are mounted on a control board (mounting board) 106. For example, the connector 14 of the sensor unit 10 can be coupled to the connector 108. A detection signal can be supplied from the sensor unit 10 to the control circuit 107. The control circuit 107 can process the detection signal from the sensor unit 10 and control the movement of the moving body 105 according to the processing result. Examples of such control include behavior control of a moving body, navigation control of an automobile, activation control of an airbag for an automobile, inertial navigation control of an airplane or a ship, guidance control, and the like.

<Other machines>
For example, as shown in FIG. 9, the sensor unit 10 can be used by being incorporated in a machine 109. In the machine 109, for example, a control circuit 112 and a connector 113 are mounted on a control board (mounting board) 111. For example, a connector 14 of the sensor unit 10 can be coupled to the connector 113. A detection signal can be supplied from the sensor unit 10 to the control circuit 112. The control circuit 112 can process the detection signal from the sensor unit 10 and control the operation of the machine 109 according to the processing result. Examples of such control include vibration control and operation control of industrial machines and motion control of robots.

  Although the present embodiment has been described in detail as described above, it will be easily understood by those skilled in the art that many modifications can be made without departing from the novel matters and effects of the present invention. Therefore, all such modifications are included in the scope of the present invention. For example, a term described with a different term having a broader meaning or the same meaning at least once in the specification or the drawings can be replaced with the different term in any part of the specification or the drawings. Further, the configurations and operations of the sensor unit 10, the substrate 11, the first sensor device 23, the second sensor device 18, the electronic component 15, and the like are not limited to those described in the present embodiment, and various modifications are possible. .

  DESCRIPTION OF SYMBOLS 10,60 ... Sensor unit, 11 ... Board | substrate, 11a ... 1st surface of a board | substrate, 11b ... 2nd surface of a board | substrate, 13 ... Through-hole, 14 ... Connector, 14a ... Input / output surface of a connector, 15 ... Electronic component, 16 DESCRIPTION OF SYMBOLS ... Filler, 17 ... IC chip (integrated circuit), 18 ... 2nd sensor device, 19 ... Component storage part, 19b, 19c ... Step part, 20 ... Base, 20a ... Upper surface of base | substrate, 20b ... Lower surface of base | substrate (outside Bottom surface), 21 ... eaves part, 22 ... protrusion part, 22a, 22b, 22c, 22d ... board | substrate junction part, 22f ... joining surface, 23 ... 1st sensor device, 24 ... cap as a lid member, 25 ... base | substrate, 28 ... Adhesive, 30 ... Mounting board, 30a ... Upper surface of mounting board, 31 ... Connector on mounting board side, 33 ... Third sensor device, 40 ... Pedestal, 43 ... Fourth sensor device, 50, 51, 52 ... Dejiku, 80 ... pedestal, R1 ... pedestal junction region.

Claims (10)

A substrate provided with a sensor device comprising an electrode and a connector electrically connected to the sensor device;
A pedestal connected to the substrate,
The pedestal is a plan view from the thickness direction of the substrate, and the component housing section provided in a position overlapping with the sensor device, an opening at least partially exposed in said connector, at least a portion of said opening And a thick portion disposed so as to extend in two intersecting directions,
The sensor unit, wherein the substrate is bonded to the thick portion . The substrate includes a first surface and a second surface that are in a front-back relationship with each other, a side surface, and a conductive terminal disposed along an outline of the first surface,
The sensor unit according to claim 1, wherein the at least one sensor device is opposed to the side surface of the substrate, and the electrode and the conductive terminal are joined by a conductor.   The sensor unit according to claim 1, wherein a gap is provided between the sensor device and the pedestal. In the plan view, heavy Naru area and the sensor device that is mounted on the side surface of the component housing, the sensor unit according to claim 2, characterized in that it is thinner than other regions.   The sensor unit according to any one of claims 1 to 4, wherein a board joint portion to which the board and the pedestal are connected is provided around the component storage section.   The sensor unit according to any one of claims 1 to 5, wherein a filler is provided between an outer peripheral portion of the connector and the pedestal forming the opening.   The sensor unit according to any one of claims 1 to 6, wherein an input / output surface of the connector is positioned inside the pedestal. A lid member covering the substrate;
The sensor unit according to claim 1, wherein the lid member is connected to the pedestal.   An electronic apparatus comprising the sensor unit according to any one of claims 1 to 8.   A moving body comprising the sensor unit according to any one of claims 1 to 8.

Images