JP2013019826A - Circuit board, sensor module, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board, a sensor module and an electronic apparatus, which can have excellent reliability while decreasing in size.SOLUTION: A sensor module 1 includes: a mounting board 4 having an analog circuit part 421 formed on an undersurface 42 and a digital circuit part 411 formed on an upper surface 41; a circuit board 2 where two angular velocity sensors 712, 713 provided on the side of the undersurface 42 of the mounting board 4 are placed in a direction perpendicular to the mounting board 4; and a pedestal 3 which is arranged in a manner to face to the undersurface 42 of the mounting board 4 and which supports the circuit board 2.

Description

  The present invention relates to a circuit board, a sensor module, and an electronic device.

  Conventionally, in the case of a circuit board in which a digital circuit and an analog circuit are mixed, it is known that high-frequency noise generated from the digital circuit is propagated to the analog circuit and inhibits the operation of the analog circuit. Therefore, in order to solve such a problem, for example, a circuit board (semiconductor device) as disclosed in Patent Document 1 has been developed. However, in the circuit board described in Patent Document 1, since the analog circuit and the digital circuit are formed side by side in the surface direction of the board, there is a problem that the circuit board becomes large and cannot be reduced in size.

JP 2007-96170 A

  An object of the present invention is to provide a circuit board, a sensor module, and an electronic device that can exhibit excellent reliability while achieving downsizing.

Such an object is achieved by the present invention described below.
The circuit board of the present invention has a mounting board having an analog circuit part formed on one surface and a digital circuit part formed on the other surface,
Having at least one sensor element provided on the one surface side of the mounting substrate;
At least one of the sensor elements is provided vertically with respect to the mounting substrate.
Thereby, a circuit board capable of exhibiting excellent reliability while achieving downsizing can be obtained.

In the sensor module of the present invention, a mounting substrate having an analog circuit portion formed on one surface and a digital circuit portion formed on the other surface, and at least one provided on the one surface side of the mounting substrate A circuit board having at least one sensor element provided vertically with respect to the mounting board;
And a pedestal arranged to face the one surface or the other surface of the mounting substrate and supporting the circuit substrate.
Thereby, a sensor module capable of exhibiting excellent reliability while achieving downsizing can be obtained.

In the sensor module of the present invention, it is preferable that the pedestal is disposed so as to face the one surface of the mounting substrate.
Thereby, while being able to suppress the thickness of a sensor module, the magnitude | size by planar view can also be suppressed. Further, the sensor element can be protected by positioning the sensor element between the mounting substrate and the pedestal.

In the sensor module of the present invention, the pedestal has a base and a protruding portion that protrudes from the base toward the circuit board,
It is preferable that the one surface of the mounting substrate is fixed to the top of the protruding portion.
Thereby, while the structure of a base becomes simple, the space which positions a sensor element can be ensured.

In the sensor module of the present invention, it is preferable that a connector for outputting a signal from the circuit board is provided between the circuit board and the base body.
This facilitates signal output.
In the sensor module of the present invention, the sensor element is preferably an angular velocity sensor.
Thereby, a sensor module can be used as a gyro sensor.

The sensor module of the present invention has the three angular velocity sensors provided so that the detection axes are orthogonal to each other,
Of the three angular velocity sensors, two angular velocity sensors are provided vertically with respect to the mounting substrate, and the remaining one angular velocity sensor is provided horizontally with respect to the mounting substrate. preferable.
Thus, a three-axis detection type gyro sensor is obtained.

In the sensor module of the present invention, the sensor module includes a support member that is provided on the one surface of the mounting substrate and supports the angular velocity sensor.
The support member has a first fixing surface orthogonal to the one surface of the mounting substrate, and a second fixing surface orthogonal to the one surface and the first fixing surface,
It is preferable that one of the two angular velocity sensors provided vertically with respect to the mounting substrate is fixed to the first fixed surface and the other is fixed to the second fixed surface.
Thereby, the angular velocity sensor can be arranged vertically with a simple configuration.
An electronic apparatus according to the present invention includes the sensor module according to the present invention.
Thereby, an electronic device having excellent reliability can be obtained.

It is a perspective view which shows suitable embodiment of the sensor module of this invention. It is sectional drawing of the sensor module shown in FIG. It is a perspective view of the circuit board which the sensor module shown in FIG. 1 has. It is a top view which shows an example of the angular velocity sensor with which the sensor module shown in FIG. 1 is provided. It is a perspective view of the base which the sensor module shown in FIG. 1 has. It is a figure which shows an example of a structure of the electronic device carrying a sensor module.

Hereinafter, a circuit board, a sensor module, and an electronic device of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
1. 1 is a perspective view showing a preferred embodiment of the sensor module of the present invention, FIG. 2 is a cross-sectional view of the sensor module shown in FIG. 1, and FIG. 3 is a circuit board of the sensor module shown in FIG. 4 is a plan view showing an example of an angular velocity sensor included in the sensor module shown in FIG. 1, and FIG. 5 is a perspective view of a pedestal included in the sensor module shown in FIG.

  In the following description, for convenience of explanation, the upper side in FIG. 1 will be described as “upper” and the lower side as “lower”. Further, as shown in FIG. 1, three axes orthogonal to each other are referred to as an “x axis”, a “y axis”, and a “z axis”. The z-axis is an axis parallel to the thickness direction of the pedestal, the x-axis is an axis parallel to the extending direction of a pair of opposing sides of the pedestal in plan view of the sensor module, and y An axis | shaft is an axis | shaft parallel to the extension direction of other 1 side of a pair which a pedestal opposes. Hereinafter, a direction parallel to the x-axis is referred to as an “x-axis direction”, a direction parallel to the y-axis is referred to as a “y-axis direction”, and a direction parallel to the z-axis is referred to as a “z-axis direction”. A plane formed by the x-axis and the y-axis is referred to as an “xy plane”, a plane formed by the y-axis and the z-axis is referred to as a “yz plane”, and a plane formed by the z-axis and the x-axis is Let it be “xz plane”.

The sensor module 1 includes three angular velocity sensors 711, 712, and 713, and is a three-axis gyro sensor device that can detect angular velocities around the x-axis, y-axis, and z-axis that are orthogonal to each other. Such a sensor module 1 is excellent in convenience, and can be suitably used for, for example, motion tracing, motion tracking, a motion controller, PDR (pedestrian position and orientation measurement), and the like.
As shown in FIGS. 1 and 2, such a sensor module 1 includes a circuit board (the circuit board of the present invention) 2, a base 3 that supports the circuit board 2, and a lid member (cap) that covers the circuit board 2. 8. Hereinafter, the circuit board 2, the pedestal 3, and the lid member 8 will be described in detail.

[Circuit board]
As illustrated in FIG. 3, the circuit board 2 includes a mounting substrate 4, three angular velocity sensors (sensor elements) 711 to 713, and electronic components 7 other than the angular velocity sensors 711 to 713.
The mounting substrate 4 is formed of a rigid substrate that is hard and hardly deformed. As such a mounting substrate 4, for example, a known rigid substrate such as a glass epoxy substrate can be used.

  Further, the mounting substrate 4 has a plate shape, and has a substantially rectangular shape extending in the x-axis direction in the xy plan view. Such a mounting substrate 4 has a digital circuit portion 411 in which a digital circuit is formed on an upper surface (the other surface) 41 and an analog circuit portion 421 in which an analog circuit is formed on a lower surface (one surface) 42. doing. A support member 43 that supports the angular velocity sensors 712 and 713 is provided on the lower surface 42 of the mounting substrate 4.

  The support member 43 includes a block (cuboid) base 431 fixed to the lower surface 42, and a pair of plate members 432 and 433 fixed to the base 431. The plate member 432 includes a first fixed surface 432a configured with a surface parallel to the yz plane, and the plate member 433 includes a second fixed surface 433a configured with a surface parallel to the xz plane. Yes. The first fixed surface 432a is a surface for fixing the angular velocity sensor 712, and the second fixed surface 433a is a surface for fixing the angular velocity sensor 713. By having such a support member 43, the angular velocity sensors 712 and 713 can be easily placed vertically with respect to the mounting substrate 4 as will be described later.

Since the support member 43 includes the block-shaped base body 431, the plate members 432 and 433 can be positioned more accurately with respect to the lower surface 42 of the mounting substrate 4. Specifically, since the base body 431 has a block shape, it has a large contact area with the lower surface 42 and can be more firmly fixed to the lower surface 42. Further, if the base 431 is fixed to the lower surface 42 so that the side surfaces are parallel to the xz plane and the yz plane, the plate members 432 and 433 fixed to the side surfaces become the first fixed surface 432a and the second fixed surface 432a as described above. The fixing surface 433a is provided. In addition, since the contact area between the plate members 432 and 433 and the base 431 can be increased, the parallelism with the yz plane of the plate member 432 and the parallelism with the xz plane of the plate member 433 can be more accurately taken. The plate members 432 and 433 can be firmly fixed to the base 431.
The method for fixing the base 431 to the mounting substrate 4 and the method for fixing the plate members 432 and 433 to the base 431 are not particularly limited, and examples thereof include a method using an adhesive.

  Of the three angular velocity sensors 711 to 713, the angular velocity sensor 711 is mounted on the lower surface 42 of the mounting substrate 4, and the angular velocity sensor 712 is mounted (fixed) on the first fixed surface 432 a of the support member 43. The angular velocity sensor 713 is mounted (fixed) on the second fixed surface 433a of the support member 43. Since the lower surface 42, the first fixed surface 432a and the second fixed surface 433a are orthogonal to each other, the detection axes A1, A2, A3 of the three angular velocity sensors 711, 712, 713 fixed thereto are mutually It will be in an orthogonal state. Thus, as described above, the sensor module 1 can detect the angular velocities around the three axes orthogonal to each other.

In the present embodiment, each of the angular velocity sensors 711 to 713 has a flat shape whose thickness direction is a direction parallel to the detection axes A1 to A3. From this, it can be said that the angular velocity sensor 711 is provided horizontally with respect to the mounting substrate 4, and the angular velocity sensors 711 and 712 are provided vertically with respect to the mounting substrate 4. Thus, by providing the angular velocity sensors 712 and 713 vertically with respect to the mounting substrate 4, the installation space for the angular velocity sensors 711 to 713 when viewed in xy plan view can be further reduced. 4 can be reduced, and thus the sensor module 1 can be reduced in size.
The angular velocity sensors 711 to 713 are not particularly limited as long as the angular velocity can be detected, and a known uniaxial detection type angular velocity sensor can be used. As such angular velocity sensors 711 to 713, for example, a sensor having the resonator element 5 as shown in FIG. 4 can be used.

  The resonator element 5 is made of quartz (piezoelectric material). The resonator element 5 includes a base 51, a pair of detection vibrating arms 52 and 53 extending in the vertical direction from both sides of the base 51, and a pair of connecting arms extending in the horizontal direction from both sides of the base 51. 54 and 55, and a pair of drive vibrating arms 56, 57, 58, and 59 that extend in the vertical direction from the both sides of the front ends of the connecting arms 54 and 55, respectively. Further, detection electrodes (not shown) are formed on the surfaces of the detection vibrating arms 52 and 53, and driving electrodes (not shown) are formed on the surfaces of the driving vibration arms 56, 57, 58 and 59. ) Is formed.

  In such a vibrating piece 5, by applying a voltage to the driving electrode, the driving vibrating arms 56 and 58 and the driving vibrating arms 57 and 59 are vibrated so as to repeatedly approach and separate from each other. When an angular velocity ω around the normal A of the vibrating piece 5 is applied, a Coriolis force is applied to the vibrating piece 5 and the vibrations of the vibrating arms for detection 52 and 53 are excited. The angular velocity applied to the resonator element 5 can be obtained by detecting the distortion of the detection vibrating arms 52 and 53 generated by the vibration of the detection vibrating arms 52 and 53 with the detection electrode.

  As shown in FIG. 3A, a digital circuit portion 411 provided on the upper surface 41 of the mounting substrate 4 includes, as electronic components 7, a microcontroller 76 that performs desired control, a nonvolatile memory 77 such as an EEPROM, and the like. An azimuth sensor (magnetic sensor) 78 for detecting the azimuth and a timing device 79 including a crystal resonator are mounted. These electronic components 7 are electrically connected via a conductor pattern (not shown) to form a digital circuit. Note that the electronic components included in the digital circuit are not limited to those described above, and at least one of the electronic components may be omitted, or a new electronic component may be added.

On the other hand, as shown in FIG. 3B, an analog circuit portion 421 provided on the lower surface 42 of the mounting substrate 4 includes a three-axis detection type acceleration sensor 72 and a power supply circuit 73 for driving various electronic components. And an amplification circuit 74 that amplifies output signals from the sensors (711 to 713, 72), and an analog / digital conversion circuit that converts the analog signal amplified by the amplification circuit 74 into a digital signal and transmits it to the digital circuit 75 is implemented. These are electrically connected via a conductor pattern (not shown) to constitute an analog circuit. Note that the electronic components included in the analog circuit are not limited to those described above, and at least one of the electronic components may be omitted, or a new electronic component may be added.
Further, a connector (interface connector) 9 for outputting a signal is provided on the lower surface 42 of the mounting substrate 4. This facilitates signal output.

  As described above, in the circuit board 2, the analog circuit and the digital circuit are formed on different surfaces of the mounting board 4, so that generation of noise and transmission of noise from the digital circuit to the analog circuit are effectively suppressed. be able to. Therefore, the detection accuracy of the sensor module 1 becomes higher. Further, since the angular velocity sensors 711 to 713 are positioned on the opposite side of the microcontroller 76 via the mounting substrate 4, radiation noise from the microcontroller 76 is reduced by a ground layer (not shown) provided in the mounting substrate 4. It can block | block and can prevent the fall of the detection accuracy of the angular velocity sensors 711-713.

[Pedestal 3]
As shown in FIG. 5, the pedestal 3 is provided so as to face the lower surface 42 of the mounting substrate 4. Such a pedestal 3 has a plate-like base 31 provided so as to face the lower surface 42, and four protrusions 321, 322, 323, and 324 that protrude from the base 31. By configuring the base 3 in such a configuration, the thickness of the sensor module 1 can be suppressed, and the sensor module 1 can be reduced in size. As will be described later, the circuit board 2 can be easily supported, and the connector 9, the angular velocity sensors 711 to 713, and the electronic component 7 provided on the lower surface 42 are provided between the mounting board 4 and the base 31. Space to be accommodated can be secured.

The base 31 has an upper surface 311 and a lower surface 312 that are both parallel to the xy plane. In addition, the base 31 has a substantially rectangular shape extending in the x-axis direction in the xy plan view, and missing portions 313, 314, and 315 are formed at three corners of the four corners. Yes. The base 31 is provided so as to include the entire area of the circuit board 2 in the xy plan view.
The four projecting portions 321, 322, 323, and 324 are provided so as to project upward from the upper surface 311 of the base 31. Further, the four protruding portions 321 to 324 are provided so as to be separated from each other and correspond to the edge portion of the mounting substrate 4. Moreover, each upper surface (top surface) of the four protrusions 321 to 324 is located on the same plane parallel to the xy plane. The circuit board 2 is placed on the upper surfaces of the protrusions 321 to 324 such that the detection axis A2 of the angular velocity sensor 712 is parallel to the x axis and the detection axis A3 of the angular velocity sensor 713 is parallel to the y axis direction. Placed and fixed.
When the circuit board 2 is fixed in this manner, a space is formed between the mounting board 4 and the base 31, and the connector 9, the angular velocity sensors 711 to 713 and the electronic component 7 are accommodated in the space. Thereby, contact with these parts and the base 3 is prevented, and the reliability of the sensor module 1 improves.

  The method for fixing the circuit board 2 (mounting board 4) to the protrusions 321 to 324 is not particularly limited, but it is preferable to use fixing with an adhesive and screwing together. Thereby, the circuit board 2 can be reliably fixed to the projecting portions 321 to 324. Further, since the adhesive layer is interposed between the pedestal 3 and the circuit board 2, the adhesive absorbs and relieves vibration from the pedestal 3, and unnecessary vibration of the circuit board 2 is suppressed. As a result, the detection accuracy of the sensor module 1 is further improved.

  The height of the protrusions 321 to 324 is not particularly limited as long as it is longer than the thickness of the connector 9, but is preferably substantially equal to the thickness of the connector 9. As a result, the sensor module 1 can be reduced in size (thinner and lower in profile). When the height of the protrusions 321 to 324 is equal to the thickness of the connector 9, the upper surface 311 of the base 31 and the lower surface of the connector 9 come into contact with each other. Thereby, the mechanical strength of the sensor module 1 is improved.

  The constituent material of the pedestal 3 is not particularly limited, but is preferably a material having vibration damping characteristics. Thereby, unnecessary vibration of the circuit board 2 is suppressed, and the detection accuracy of the angular velocity sensors 711 to 713 and the like is improved. Examples of such materials include various damping alloys such as magnesium alloys, iron alloys, copper alloys, manganese alloys, and Ni-Ti alloys.

[Cover member]
As shown in FIG. 1, the lid member (cap) 8 has a box shape and is fixed to the base 3 so as to cover the circuit board 2. The lid member 8 has an opening 81 on its side surface, and the connector 9 is exposed to the outside through the opening 81. Thereby, the output of the signal from the sensor module 1 can be performed easily.

The lid member 8 has three projecting portions 821, 822, and 823 projecting downward. Among these, the projecting portion 821 is located in the missing portion 313 of the base 3, and the projecting portion 822 is located in the missing portion 314. The protrusion 823 is located in the defect 315. With such a configuration, the lid member 8 can be easily positioned with respect to the pedestal 3, so that the lid member 8 can be easily and accurately fixed to the pedestal 3.
In addition, the method of fixing the cover member 8 to the base 3 is not specifically limited, For example, the method of fixing using an adhesive agent, screwing, etc. are mentioned.

The constituent material of the lid member 8 is not particularly limited. For example, polyolefin such as polyethylene, polypropylene, ethylene-propylene copolymer, polyvinyl chloride, polystyrene, polyamide, polyimide, polycarbonate, poly- (4- Methylpentene-1), ionomer, acrylic resin, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer, polyethylene terephthalate ( PET), polyesters such as polybutylene terephthalate (PBT), polyether, polyether ketone (PEK), polyether ether ketone (PEEK), polyether imide, polyacetal (POM), polyester Phenylene oxide, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, aromatic polyester (liquid crystal polymer), polytetrafluoroethylene, polyvinylidene fluoride, other fluororesins, epoxy resins, phenol resins, urea resins, melamine resins, Silicone resin, polyurethane, and the like, or copolymers, blends, polymer alloys, and the like mainly containing these, can be used, and one or more of these can be used in combination.
The sensor module 1 has been described in detail above.

According to such a sensor module 1, since the angular velocity sensors 712 and 713 are arranged vertically, the sensor module 1 can be reduced in size in the xy plan view. Although the angular velocity sensors 712 and 713 are placed vertically, there is a problem that the thickness of the sensor module 1 increases accordingly. However, the angular velocity between the base 31 of the base formed by the connector 9 and the mounting substrate 4 is considered. Since the sensors 712 and 712 are accommodated, such a problem does not occur.
Moreover, according to the sensor module 1, since the analog circuit and the digital circuit are formed on different surfaces, the high frequency noise generated from the digital circuit can be prevented from being propagated to the analog circuit, and excellent reliability is exhibited. can do.

  When the sensor module 1 is mounted on a circuit board such as a mother board, the detection axes A2 of the angular velocity sensors 712 and 713 are obtained by using the two orthogonal side surfaces 31a and 31b of the base 3 (base 31) as a reference. A3 can be easily directed in a desired direction. Specifically, the side surface 31a is a surface parallel to the detection axis A3, and the side surface 31b is a surface parallel to the detection axis A2. Therefore, by positioning with respect to the circuit board based on the side surfaces 31a and 31b, the detection axes A2 and A3 of the angular velocity sensors 712 and 713 can be directed in a desired direction easily and reliably. In particular, since there are no defect portions (defect portions such as 313, 314, and 315) between the side surfaces 31a and 31b, they intersect with each other by using the corner portion 31c as a reference. Positioning can be performed easily.

2. Electronic device The sensor module 1 as described above can be incorporated into various electronic devices. Hereinafter, the electronic device of the present invention on which the sensor module 1 is mounted will be described. FIG. 6 is a diagram illustrating an example of a configuration of an electronic device 500 in which the sensor module 1 is mounted. The electronic device 500 is not particularly limited, and examples thereof include a digital camera, a video camera, a car navigation system, a mobile phone, a mobile PC, a robot, a game machine, and a game controller.

  An electronic apparatus 500 illustrated in FIG. 6 includes the sensor module 1, a processing unit 520, a memory 530, an operation unit 540, and a display unit 550. These are connected by a bus 560. A processing unit (CPU, MPU, etc.) 520 performs control of the sensor module 1 and the like and overall control of the electronic device 500. The processing unit 520 performs processing based on the angular velocity information detected by the sensor module 1. For example, processing for camera shake correction, attitude control, GPS autonomous navigation, and the like is performed based on the angular velocity information. The memory 530 stores control programs and various data, and functions as a work area and a data storage area. The operation unit 540 is for the user to operate the electronic device 500. The display unit 550 displays various information to the user.

As described above, the circuit board, the sensor module, and the electronic device of the present invention have been described based on the illustrated embodiments. However, the present invention is not limited to this, and the configuration of each part is an arbitrary function having the same function. It can be replaced with the configuration of
In the embodiment described above, the configuration in which the three angular velocity sensors are mounted on the mounting substrate has been described. However, the number of angular velocity sensors is not limited to this, and may be one or two. Further, the number of rigid substrates may be changed according to the number of angular velocity sensors.

In the above-described embodiment, the mounting substrate is configured by a rigid substrate. However, the configuration of the mounting substrate is not limited thereto, and may be configured by, for example, a rigid flexible substrate.
In the above-described embodiment, the configuration in which the electronic component mounted on the mounting substrate is fixed to the casing is described. However, the present invention is not limited to this, and the mounting substrate is omitted and each electronic component is directly fixed to the casing. Also good. In this case, a wire or the like for electrically connecting electronic components may be separately formed.

  DESCRIPTION OF SYMBOLS 1 ... Sensor module 2 ... Circuit board 3 ... Base 31 ... Base 31a, 31b ... Side surface 31c ... Corner | angular part 311 ... Upper surface 312 ... Lower surface 313, 314, 315 ... Defect part 321, 322, 323, 324 ... Projection part 4 ... Mounting board 41 ... Top face 411 ... Digital circuit part 42 ... Bottom face 421 ... Analog circuit part 43 ... Support member 431 ... Base body 432, 433 ... Plate member 432a ... ··· First fixing surface 433a ··· Second fixing surface 5 ··· Vibrating piece 51 ··· Base 52, 53 ··· Vibrating arm for detection 54 and 55 · · · Connecting arm 56, 57, 58, 59 · · · For driving Vibration arm 7 ... Electronic components 711, 712, 713 ... Angular velocity sensor 72 ... Acceleration sensor 73 ... Power supply circuit 74 ... Amplification circuit 75 ... Analog / digital Conversion circuit 76 Microcontroller 77 Nonvolatile memory 78 Direction sensor 79 Timing device 8 Lid member 81 Opening 821, 822, 823 Projection 9 Connector 500 Electronic device 520 ... Processing section 530 ... Memory 540 ... Operation section 550 ... Display section 560 ... Bus A1, A2, A3 ... Detection axis

Claims (9)

A mounting board having an analog circuit portion formed on one surface and a digital circuit portion formed on the other surface;
Having at least one sensor element provided on the one surface side of the mounting substrate;
The circuit board, wherein the at least one sensor element is provided vertically with respect to the mounting board. A mounting substrate having an analog circuit portion formed on one surface and a digital circuit portion formed on the other surface; and at least one sensor element provided on the one surface side of the mounting substrate; A circuit board in which at least one sensor element is provided vertically with respect to the mounting board;
A sensor module comprising: a pedestal arranged to face the one surface or the other surface of the mounting substrate and supporting the circuit substrate.   The sensor module according to claim 2, wherein the base is disposed so as to face the one surface of the mounting substrate. The pedestal has a base and a protruding portion that protrudes from the base toward the circuit board,
The sensor module according to claim 3, wherein the one surface of the mounting substrate is fixed to a top portion of the protruding portion.   The sensor module according to claim 2, wherein a connector for outputting a signal from the circuit board is provided between the circuit board and the base body.   The sensor module according to claim 2, wherein the sensor element is an angular velocity sensor. Three angular velocity sensors provided so that detection axes are orthogonal to each other;
The two angular velocity sensors of the three angular velocity sensors are provided vertically with respect to the mounting substrate, and the remaining one angular velocity sensor is provided horizontally with respect to the mounting substrate. 6. The sensor module according to 6. Provided on the one surface of the mounting substrate, and having a support member for supporting the angular velocity sensor;
The support member has a first fixing surface orthogonal to the one surface of the mounting substrate, and a second fixing surface orthogonal to the one surface and the first fixing surface,
The one of the two angular velocity sensors provided vertically with respect to the mounting board is fixed to the first fixed surface, and the other is fixed to the second fixed surface. Sensor module.   An electronic device comprising the sensor module according to claim 2.

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