JP2015072232A5 - - Google Patents

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Publication number
JP2015072232A5
JP2015072232A5 JP2013208893A JP2013208893A JP2015072232A5 JP 2015072232 A5 JP2015072232 A5 JP 2015072232A5 JP 2013208893 A JP2013208893 A JP 2013208893A JP 2013208893 A JP2013208893 A JP 2013208893A JP 2015072232 A5 JP2015072232 A5 JP 2015072232A5
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JP
Japan
Prior art keywords
sensor unit
unit according
substrate
pedestal
sensor
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JP2013208893A
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Japanese (ja)
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JP2015072232A (en
JP6255865B2 (en
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Priority to JP2013208893A priority Critical patent/JP6255865B2/en
Priority claimed from JP2013208893A external-priority patent/JP6255865B2/en
Publication of JP2015072232A publication Critical patent/JP2015072232A/en
Publication of JP2015072232A5 publication Critical patent/JP2015072232A5/ja
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Claims (10)

電極を備えたセンサーデバイスと、前記センサーデバイスに電気的に接続されたコネクターと、が設けられた基板と、  A substrate provided with a sensor device comprising an electrode and a connector electrically connected to the sensor device;
前記基板に接続される台座と、を備え、  A pedestal connected to the substrate,
前記台座は前記基板の厚さ方向からの平面視で、前記センサーデバイスと重なる位置に設けられた部品収納部と、前記コネクターの少なくとも一部が露出する開口部と、前記基板の周縁に沿って延在する肉厚部と、が備えられていることを特徴とするセンサーユニット。  The pedestal is in a plan view from the thickness direction of the substrate, along with a component storage portion provided at a position overlapping the sensor device, an opening through which at least a part of the connector is exposed, and a peripheral edge of the substrate A sensor unit comprising: a thick wall portion extending.
前記基板は、互いに表裏関係にある第1面および第2面と、側面と、前記第1面の輪郭に沿って配置されている導電端子と、を備え、
少なくとも一つの前記センサーデバイスは、前記基板の前記側面と対向し、前記電極と前記導電端子とが導電体により接合されていることを特徴とする請求項1に記載のセンサーユニット。
The substrate includes a first surface and a second surface that are in a front-back relationship with each other, a side surface, and a conductive terminal disposed along an outline of the first surface,
At least one of the sensor device, and the side facing the front Stories substrate, the sensor unit according to claim 1 and the electrode and the conductive terminals, characterized in Tei Rukoto bonded by conductor.
前記センサーデバイスと前記台座との間に、間隙を有していることを特徴とする請求項1または請求項2に記載のセンサーユニット。 Sensor unit according to claim 1 or claim 2, characterized in that between the base and the sensor device has a gap. 前記平面視において、前記側面に実装された前記センサーデバイスと前記部品収納部とが重なる領域は、他の前記部品収納部よりも薄肉になっていることを特徴とする請求項2に記載のセンサーユニット。 3. The sensor according to claim 2, wherein, in the plan view, a region where the sensor device mounted on the side surface and the component storage portion overlap is thinner than the other component storage portions. unit. 前記基板と前記台座とが接続される基板接合部は、前記部品収納部の周囲に設けられていることを特徴とする請求項1ないし請求項4のいずれか一項に記載のセンサーユニット。 The sensor unit according to any one of claims 1 to 4, wherein a board joint portion to which the board and the pedestal are connected is provided around the component storage section. 前記コネクターの外周部と前記開口部を形成する前記台座との間には、充填材が設けられていることを特徴とする請求項1ないし請求項5のいずれか一項に記載のセンサーユニット。 The sensor unit according to any one of claims 1 to 5, wherein a filler is provided between an outer peripheral portion of the connector and the pedestal forming the opening. 前記コネクターの入出力面は、前記台座の内側に位置していることを特徴とする請求項1ないし請求項6のいずれか一項に記載のセンサーユニット。   The sensor unit according to any one of claims 1 to 6, wherein an input / output surface of the connector is positioned inside the pedestal. 前記基板を覆う蓋部材を備え、
前記蓋部材は、前記台座に接続されていることを特徴とする請求項1ないし請求項7のいずれか一項に記載のセンサーユニット。
A lid member covering the substrate;
The sensor unit according to claim 1, wherein the lid member is connected to the pedestal.
請求項1ないし請求項8のいずれか一項に記載のセンサーユニットを備えていることを特徴とする電子機器。   An electronic apparatus comprising the sensor unit according to any one of claims 1 to 8. 請求項1ないし請求項8のいずれか一項に記載のセンサーユニットを備えていることを特徴とする移動体。   A moving body comprising the sensor unit according to any one of claims 1 to 8.
JP2013208893A 2013-10-04 2013-10-04 Sensor unit, electronic device, and moving object Active JP6255865B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013208893A JP6255865B2 (en) 2013-10-04 2013-10-04 Sensor unit, electronic device, and moving object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013208893A JP6255865B2 (en) 2013-10-04 2013-10-04 Sensor unit, electronic device, and moving object

Publications (3)

Publication Number Publication Date
JP2015072232A JP2015072232A (en) 2015-04-16
JP2015072232A5 true JP2015072232A5 (en) 2016-10-06
JP6255865B2 JP6255865B2 (en) 2018-01-10

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ID=53014692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013208893A Active JP6255865B2 (en) 2013-10-04 2013-10-04 Sensor unit, electronic device, and moving object

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JP (1) JP6255865B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110645970B (en) 2014-07-16 2022-12-27 精工爱普生株式会社 Sensor unit, electronic apparatus, and moving object
JP6597069B2 (en) * 2015-09-02 2019-10-30 セイコーエプソン株式会社 Sensor unit, electronic device, and moving object
JP6926568B2 (en) 2017-03-24 2021-08-25 セイコーエプソン株式会社 Physical quantity sensors, electronics and mobiles

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6462530B1 (en) * 2001-01-25 2002-10-08 Bei Technologies, Inc. Redundant rate sensor and method
JP2003258454A (en) * 2002-03-04 2003-09-12 Hitachi Unisia Automotive Ltd Control unit in box shape
JP2004163367A (en) * 2002-11-15 2004-06-10 Ngk Insulators Ltd Mounting structure of vibration gyro package
US7536909B2 (en) * 2006-01-20 2009-05-26 Memsic, Inc. Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same
JP2007218731A (en) * 2006-02-16 2007-08-30 Tdk Corp Impact detector
JP2012237664A (en) * 2011-05-12 2012-12-06 Seiko Epson Corp Physical quantity sensor and electronic apparatus
JP5845672B2 (en) * 2011-07-13 2016-01-20 セイコーエプソン株式会社 Sensor devices and electronics

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