JP6243923B2 - 電気光学的配置を提供する装置 - Google Patents
電気光学的配置を提供する装置 Download PDFInfo
- Publication number
- JP6243923B2 JP6243923B2 JP2015541782A JP2015541782A JP6243923B2 JP 6243923 B2 JP6243923 B2 JP 6243923B2 JP 2015541782 A JP2015541782 A JP 2015541782A JP 2015541782 A JP2015541782 A JP 2015541782A JP 6243923 B2 JP6243923 B2 JP 6243923B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mounting
- printed circuit
- circuit board
- electrical connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Combinations Of Printed Boards (AREA)
Description
Claims (6)
- 前面、後面、底面、第1電気コネクタ、及び第2電気コネクタを有するプリント回路基板を有し、
前記後面は、前記プリント回路基板の前記前面の反対側の面であり、なおかつ前記前面と平行であり、
前記底面は、前記前面から前記後面へ向けて延伸し、前記前面及び前記後面と共に前記プリント回路基板の周辺出力を形成し、前記前面及び前記後面に対して略垂直であり、
前記第1電気コネクタは、実装基板上の第1導線に接続しており、少なくともその一部が前記前面と前記底面に沿って延伸するように前記プリント回路基板上に形成されており、
前記第2電気コネクタは、前記実装基板上の第2導線に接続しており、少なくともその一部が前記後面と前記底面に沿って延伸するように前記プリント回路基板上に形成されており、
前記プリント回路基板は、前記底面上にある前記第1電気コネクタの一部と前記第2電気コネクタの一部が前記実装基板の実装面に対して平行になるように、前記実装基板に対して固定されており、
前記プリント回路基板の前記前面上に、前記第1電気コネクタと電気的に連結された光電子ダイを有し、
前記光電子ダイは、前記前面に対して略平行な光学面を有し、
前記プリント回路基板は第1係合機能部を有し、
前記第1係合機能部は前記プリント回路基板の上面にパターンされており、
前記上面は、前記底面と略平行であり、前記前面に対して略垂直であり、
第2係合機能部と第3係合機能部とを有する支持部材が、前記第1係合機能部を前記第2係合機能部と係合することにより、前記プリント回路基板に連結されており、
前記支持部材は、前記第3係合機能部を第4係合機能部と係合することによりファイバホルダに連結されており、
前記第4係合機能部は、前記ファイバホルダの後面にパターンされており、
前記ファイバホルダは、前記実装基板の前記実装面に対して略平行にファイバを保持する、電気光学的配置を提供する光電子アセンブリ。 - 前記プリント回路基板は、前記底面が前記実装基板の前記実装面と対向するように、前記実装基板に固定されている、請求項1に記載の光電子アセンブリ。
- 前記第2係合機能部は、前記支持部材の上面にパターンされており、
前記第3係合機能部は、前記支持部材の前面にパターンされており、
前記支持部材の前記上面は、前記支持部材の前記前面と略垂直である、請求項1に記載の光電子アセンブリ。 - 前記ファイバホルダの前面は、前記ファイバホルダの前記後面と略平行である、請求項3に記載の光電子アセンブリ。
- 前記プリント回路基板に対して光入力を提供するファイバをさらに有し、
前記ファイバは、前記ファイバホルダにある第1開口と、前記支持部材にある第2開口とを通る、請求項4に記載の光電子アセンブリ。 - 前記第1開口と前記第2開口はそれぞれ、前記実装基板の前記実装面と略平行な方向へ形成されており、
前記第1開口は、前記ファイバホルダの前記前面から前記ファイバホルダの前記後面へ延伸しており、
前記第2開口は、前記支持部材の前記前面から前記支持部材の後面へ延伸している、請求項5に記載の光電子アセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/671,527 | 2012-11-07 | ||
US13/671,527 US9497860B2 (en) | 2012-11-07 | 2012-11-07 | Methods and Apparatuses to provide an electro-optical alignment |
PCT/US2013/065433 WO2014107216A2 (en) | 2012-11-07 | 2013-10-17 | Methods and apparatuses to provide an electro-optical alignment |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016502267A JP2016502267A (ja) | 2016-01-21 |
JP2016502267A5 JP2016502267A5 (ja) | 2016-12-08 |
JP6243923B2 true JP6243923B2 (ja) | 2017-12-06 |
Family
ID=50622465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015541782A Expired - Fee Related JP6243923B2 (ja) | 2012-11-07 | 2013-10-17 | 電気光学的配置を提供する装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9497860B2 (ja) |
EP (1) | EP2917986A4 (ja) |
JP (1) | JP6243923B2 (ja) |
KR (1) | KR20150084930A (ja) |
CN (1) | CN104956556A (ja) |
TW (1) | TWI591394B (ja) |
WO (1) | WO2014107216A2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9772460B2 (en) * | 2010-02-23 | 2017-09-26 | Luxtera, Inc. | Method and system for implementing high-speed interfaces between semiconductor dies in optical communication systems |
TWI577100B (zh) * | 2014-10-31 | 2017-04-01 | 高準精密工業股份有限公司 | 表面固定型雷射模組 |
US10638601B2 (en) * | 2017-08-11 | 2020-04-28 | Seagate Technology Llc | Apparatus comprising conductive traces configured to transmit differential signals in printed circuit boards |
US20200400901A1 (en) * | 2019-06-24 | 2020-12-24 | Te Connectivity Nederland B.V. | Interposer |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5812717A (en) * | 1996-01-18 | 1998-09-22 | Methode Electronics, Inc. | Optical package with alignment means and method of assembling an optical package |
US5815623A (en) * | 1996-01-18 | 1998-09-29 | Methode Electronics, Inc. | Optical package with alignment means and method of assembling an optical package |
US5774614A (en) * | 1996-07-16 | 1998-06-30 | Gilliland; Patrick B. | Optoelectronic coupling and method of making same |
US5768456A (en) * | 1996-11-22 | 1998-06-16 | Motorola, Inc. | Optoelectronic package including photonic device mounted in flexible substrate |
US6040624A (en) * | 1997-10-02 | 2000-03-21 | Motorola, Inc. | Semiconductor device package and method |
US6318909B1 (en) * | 1999-02-11 | 2001-11-20 | Agilent Technologies, Inc. | Integrated packaging system for optical communications devices that provides automatic alignment with optical fibers |
WO2002027874A2 (en) | 2000-09-29 | 2002-04-04 | Cielo Communications, Inc. | High speed optical subassembly with ceramic carrier |
US6799902B2 (en) | 2000-12-26 | 2004-10-05 | Emcore Corporation | Optoelectronic mounting structure |
JP2002365487A (ja) * | 2001-01-18 | 2002-12-18 | Auto Network Gijutsu Kenkyusho:Kk | 光コネクタ及び光コネクタ用のシールドケース |
US6873799B2 (en) | 2001-06-20 | 2005-03-29 | Jds Uniphase Corporation | Optical subassembly for optical communications |
US7023705B2 (en) * | 2001-08-03 | 2006-04-04 | National Semiconductor Corporation | Ceramic optical sub-assembly for optoelectronic modules |
JP2003124480A (ja) * | 2001-08-08 | 2003-04-25 | Hosiden Corp | 光コネクタ及び光素子 |
JP3870915B2 (ja) | 2003-03-05 | 2007-01-24 | セイコーエプソン株式会社 | 光通信モジュール、光通信装置、及びその製造方法 |
US8755644B2 (en) | 2003-09-30 | 2014-06-17 | International Business Machines Corporation | Silicon based optical vias |
JP2006047682A (ja) * | 2004-08-04 | 2006-02-16 | Fujitsu Ltd | 基板および光素子相互接続用基板 |
US20060110110A1 (en) | 2004-11-22 | 2006-05-25 | Yi Robert H | Optical turn system for optoelectronic modules |
US20090003763A1 (en) * | 2007-06-29 | 2009-01-01 | Mohammed Edris M | Forming a surface-mount opto-electrical subassembly (SMOSA) |
JP5302714B2 (ja) | 2009-02-26 | 2013-10-02 | 富士通コンポーネント株式会社 | 光コネクタ |
JP2010258308A (ja) * | 2009-04-27 | 2010-11-11 | Sharp Corp | 半導体装置およびコネクタ |
US8260097B2 (en) | 2010-06-16 | 2012-09-04 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Opto-electronic alignment system and method |
TW201211606A (en) | 2010-09-03 | 2012-03-16 | Univ Nat Central | Optical transmission module with optical waveguide structure |
JP5609451B2 (ja) * | 2010-09-09 | 2014-10-22 | 富士通株式会社 | コネクタ、光伝送装置およびコネクタ接続方法 |
US9057850B2 (en) * | 2011-03-24 | 2015-06-16 | Centera Photonics Inc. | Optoelectronic module |
-
2012
- 2012-11-07 US US13/671,527 patent/US9497860B2/en active Active
-
2013
- 2013-10-17 KR KR1020157015213A patent/KR20150084930A/ko not_active Application Discontinuation
- 2013-10-17 JP JP2015541782A patent/JP6243923B2/ja not_active Expired - Fee Related
- 2013-10-17 EP EP13870098.4A patent/EP2917986A4/en not_active Withdrawn
- 2013-10-17 WO PCT/US2013/065433 patent/WO2014107216A2/en active Application Filing
- 2013-10-17 CN CN201380058055.1A patent/CN104956556A/zh active Pending
- 2013-10-18 TW TW102137637A patent/TWI591394B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US9497860B2 (en) | 2016-11-15 |
EP2917986A4 (en) | 2016-08-03 |
CN104956556A (zh) | 2015-09-30 |
JP2016502267A (ja) | 2016-01-21 |
WO2014107216A3 (en) | 2014-10-09 |
US20140126863A1 (en) | 2014-05-08 |
KR20150084930A (ko) | 2015-07-22 |
TWI591394B (zh) | 2017-07-11 |
EP2917986A2 (en) | 2015-09-16 |
WO2014107216A2 (en) | 2014-07-10 |
TW201418814A (zh) | 2014-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7366375B2 (en) | Optical waveguide device, manufacturing method thereof, optical information processing apparatus, and electronic equipment | |
US9647762B2 (en) | Integrated parallel optical transceiver | |
TWI771662B (zh) | 光學收發模組及光纖纜線模組 | |
US7651279B2 (en) | Optical-electrical transmission connector, optical-electrical transmission device and electronic device | |
JP2006235115A (ja) | 光信号入力装置およびそれを用いた電子機器 | |
JP6243923B2 (ja) | 電気光学的配置を提供する装置 | |
TW202134717A (zh) | 光發射元件、光學收發模組及光纖纜線模組 | |
US11409062B2 (en) | Optical transceiver module and optical cable module | |
WO2014141451A1 (ja) | 光コネクタ装置、光ケーブル装置、及び光インターコネクト装置 | |
US8870467B2 (en) | Optical interface and splitter with micro-lens array | |
CN111722327A (zh) | 光学收发模组及光纤缆线模块 | |
KR101266616B1 (ko) | 광전 배선 모듈 | |
TWI737386B (zh) | 光學收發模組及光纖纜線模組 | |
KR101276508B1 (ko) | 광전 배선 모듈 | |
JP2006201500A (ja) | 半導体集積回路およびそれを用いた電子機器 | |
JP2006145789A (ja) | 光素子アレイ、光導波路アレイ、それを用いた光電複合装置および電子機器 | |
KR101477381B1 (ko) | 광전 배선 모듈 및 리셉터클과 이를 이용한 광 커넥터 | |
KR101477379B1 (ko) | 광전 배선 모듈 | |
CN104101960A (zh) | 光通讯装置 | |
KR101419503B1 (ko) | 전자기기의 외부기기와의 인터페이싱을 위한 광모듈 일체형 능동 광전 커넥터 유니트 | |
CN219916014U (zh) | 一种光模块 | |
US20240134134A1 (en) | Optical module | |
JP2007025310A (ja) | 光情報処理装置 | |
JP2009218395A (ja) | 集積回路パッケージ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20160822 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161017 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161017 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20161017 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20170111 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170117 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20170118 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170417 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170606 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170912 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20170920 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20171107 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20171110 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6243923 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |