JP6239999B2 - Electronic component storage package and electronic device - Google Patents
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本発明は電子部品を収納するための電子部品収納用パッケージに関し、特に枠体に設けられる入出力端子の接合性を改良したものに関する。 The present invention relates to an electronic component storage package for storing electronic components, and more particularly to an improved input / output terminal connection property provided on a frame.
従来の高周波半導体素子を収納するための電子部品収納用パッケージ（以下、単にパッケージともいう）を図５に示す。同図において、１０１はメタルパッケージ、１０３は金属製の板、１０４は金属リードを示す。 FIG. 5 shows an electronic component storage package (hereinafter also simply referred to as a package) for storing a conventional high-frequency semiconductor element. In the figure, 101 is a metal package, 103 is a metal plate, and 104 is a metal lead.
金属リード１０４は、金属製の板１０３の貫通穴１０３ａにほう珪酸ガラス等の絶縁材を介して接合され、外部電気回路との間の電気信号の入出力を行う。金属リード１０４と金属製の板１０３には複数の貫通孔１０３ａが形成され、それぞれの貫通穴１０３ａに金属リード１０４が接合される。複数の金属リード１０４が金属製の板１０３に固定されることによって、複数の電気信号が入出力される入出力端子が構成される。 The metal lead 104 is joined to the through hole 103a of the metal plate 103 via an insulating material such as borosilicate glass, and inputs / outputs an electric signal to / from an external electric circuit. A plurality of through holes 103a are formed in the metal lead 104 and the metal plate 103, and the metal lead 104 is joined to each through hole 103a. By fixing the plurality of metal leads 104 to the metal plate 103, input / output terminals for inputting / outputting a plurality of electrical signals are configured.
メタルパッケージ１０１の側壁には一つの大きな貫通孔１０１ａが形成されている。金属製の板１０３は、貫通孔１０１ａを塞ぐように、貫通孔１０１ａの周囲にろう付けまたは溶接によって接合される。このようにして従来のパッケージは組み立てられている。 One large through hole 101 a is formed on the side wall of the metal package 101. The metal plate 103 is joined around the through hole 101a by brazing or welding so as to close the through hole 101a. Thus, the conventional package is assembled.
しかしながら、従来のパッケージにおいて、メタルパッケージ１０１の側壁に金属製の板１０３をろう付けする際に、メタルパッケージ１０１と金属製の板１０３とを一定の強度を保つように接合できない場合があった。 However, in the conventional package, when the metal plate 103 is brazed to the side wall of the metal package 101, the metal package 101 and the metal plate 103 may not be joined so as to maintain a certain strength.
ろう付けは、金属製の板１０３とメタルパッケージ１０１との間にろう材のプリフォーム等を配置し、所定温度の炉内に投入してろう材を溶融させ、その後に除冷してろう材を固化させることによって行なわれる。炉内で溶融したろう材は、金属製の板１０３とメタルパッケージ１０１との隙間に濡れ広がり、その後、固化する。ところが、ろう材が金属製の板１０３とメタルパッケージ１０１との間の隙間に均等に濡れ広がらない場合、接合強度不足等の不具合を生じる場合がある。 In brazing, a brazing material preform or the like is disposed between the metal plate 103 and the metal package 101, and the brazing material is poured into a furnace at a predetermined temperature to melt the brazing material, and then cooled to remove the brazing material. This is done by solidifying. The brazing material melted in the furnace wets and spreads in the gap between the metal plate 103 and the metal package 101 and then solidifies. However, when the brazing material does not spread evenly in the gap between the metal plate 103 and the metal package 101, a problem such as insufficient bonding strength may occur.
従って、本発明は上記不具合に鑑み完成されたものであり、その目的は、入出力端子の接合不良によって不具合を生じにくい電子部品収納用パッケージおよび電子装置を提供することにある。 Accordingly, the present invention has been completed in view of the above problems, and an object of the present invention is to provide an electronic component storage package and an electronic device that are less likely to cause problems due to poor connection of input / output terminals.
本発明の電子部品収納用パッケージは、上面に素子を実装するための実装領域を有する基板と、この基板上に前記実装領域を取り囲むように設けられ、内外を貫通する複数の第１貫通孔を有する金属製の枠体と、前記第１貫通孔の位置と一致させて両主面間を貫通するように第２貫通孔が複数形成された金具および前記複数の第２貫通孔にそれぞれ絶縁材を介して挿着された複数の金属製のピン端子から成り、前記複数の第１貫通孔に前記複数のピン端子がそれぞれ挿通されるとともに前記金具の一主面が前記枠体にろう付された入
出力端子とを具備する。そして、前記第１貫通孔の間に前記枠体の内外を貫通する第３貫通孔が配置されているか、または前記第２貫通孔の間に前記金具の両主面を貫通する第４貫通孔が配置されていることを特徴とする。
An electronic component storage package according to the present invention includes a substrate having a mounting region for mounting an element on an upper surface thereof, and a plurality of first through holes provided on the substrate so as to surround the mounting region and penetrating inside and outside. And a metal frame having a metal frame, a metal fitting having a plurality of second through holes formed so as to penetrate between both main surfaces so as to coincide with the position of the first through hole, and an insulating material in each of the plurality of second through holes The plurality of pin terminals are inserted through the plurality of first through holes, and one main surface of the metal fitting is brazed to the frame body. Input / output terminals. And the 3rd through-hole which penetrates the inside and outside of the said frame is arrange | positioned between the said 1st through-holes, or the 4th through-hole which penetrates both the main surfaces of the said metal fitting between the said 2nd through-holes Is arranged.
上記電子部品収納用パッケージにおいて、前記３貫通孔または前記第４貫通孔は、前記ピン端子が挿通されている前記第１貫通孔または前記第２貫通孔よりも小径であるのがよい。 In the electronic component housing package, the 3 through hole or the fourth through hole may have a smaller diameter than the first through hole or the second through hole through which the pin terminal is inserted.
また、上記電子部品収納用パッケージにおいて、前記第１貫通孔または前記第２貫通孔は一直線上に配置されており、前記第３貫通孔または前記第４貫通孔は前記一直線とは異なる直線上に配置されているのがよい。 In the electronic component storage package, the first through hole or the second through hole is arranged on a straight line, and the third through hole or the fourth through hole is on a straight line different from the straight line. It is good to be arranged.
さらに、上記電子部品収納用パッケージにおいて、前記金具が接合される側壁の外
側面または内側面の部位が座刳られているのがよい。
Further, in the electronic component storing package, part of the outer surface or inner surface of the side wall in which the fitting Ru is joined good to have saddle seat.
本発明の電子装置は、上記構成の電子部品収納用パッケージと、前記実装領域に載置固定されるとともに前記入出力端子に電気的に接続された電子部品と、前記枠体の上面に接合された蓋体とを具備したことを特徴とする。 An electronic device according to the present invention is bonded to the electronic component storage package having the above-described configuration, an electronic component that is placed and fixed in the mounting area and electrically connected to the input / output terminal, and an upper surface of the frame. And a lid.
本発明の電子部品収納用パッケージは、枠体に形成された第１貫通孔の間に第３貫通孔が配置されているか、または、金具に形成された第２貫通孔の間に第４貫通孔が配置されている。これら第３貫通孔または第４貫通孔から入出力端子の接合状況を確認することができるので、入出力端子の接合不良を生じにくい電子部品収納用パッケージを提供することができる。 In the electronic component storage package according to the present invention, the third through hole is disposed between the first through holes formed in the frame body, or the fourth through hole is formed between the second through holes formed in the metal fitting. A hole is arranged. Since the connection state of the input / output terminals can be confirmed from the third through hole or the fourth through hole, it is possible to provide an electronic component storage package that is unlikely to cause poor connection of the input / output terminals.
上記電子部品収納用パッケージにおいて、第３貫通孔または第４貫通孔が、ピン端子が挿通されている第１貫通孔または第２貫通孔よりも小径であると、入出力端子の接合強度をより強くする点で好ましい。 In the electronic component housing package, when the third through hole or the fourth through hole has a smaller diameter than the first through hole or the second through hole through which the pin terminal is inserted, the joint strength of the input / output terminal is further increased. It is preferable in terms of strengthening.
また、上記電子部品収納用パッケージにおいて、第１貫通孔または第２貫通孔は一直線上に配置されており、第３貫通孔または第４貫通孔は前記一直線とは異なる直線上に配置されていると、第１貫通孔または第２貫通孔を密に形成することができる。 In the electronic component storage package, the first through hole or the second through hole is arranged on a straight line, and the third through hole or the fourth through hole is arranged on a straight line different from the straight line. The first through hole or the second through hole can be formed densely.
さらに、上記電子部品収納用パッケージにおいて、金具が接合される側壁の外側面または内側面の部位が座刳られていると、金具と枠体とを接合する接合材が座刳られている部位に溜められる。よって、接合材を介した金具と枠体との接合強度を向上できる。 Further, in the electronic component storage package, when the outer side surface or the inner side surface portion of the side wall to which the metal fitting is bonded is seated, the bonding material that joins the metal fitting and the frame body is seated. Can be stored. Therefore, it is possible to improve the bonding strength between the metal fitting and the frame body via the bonding material.
本発明の電子装置は、上記構成の電子部品収納用パッケージと、実装領域に載置固定されるとともに入出力端子に電気的に接続された電子部品と、枠体の上面に接合された蓋体とを具備したことにより、上記本発明のパッケージを用いた信頼性の高い電子装置を提供できる。 An electronic device according to the present invention includes an electronic component storage package having the above-described configuration, an electronic component that is placed and fixed in a mounting area and is electrically connected to an input / output terminal, and a lid that is bonded to an upper surface of a frame. With this, it is possible to provide a highly reliable electronic device using the package of the present invention.
マイクロ波帯やミリ波帯等の高周波半導体素子、半導体レーザ（ＬＤ：Lasor Diode）
，フォトダイオード（ＰＤ：Photodiode）等の光半導体素子、または電気光学変調器に用いられるニオブ酸リチウム（ＬＮ：LiNbO3）素子等の電気光学結晶を収納するための本発明の電子部品収納用パッケージについて、以下に詳細に説明する。
High-frequency semiconductor elements such as microwave band and millimeter wave band, semiconductor laser (LD: Lasor Diode)
Electronic component storage package of the present invention for storing an electro-optic crystal such as an optical semiconductor element such as a photodiode (PD: Photodiode) or a lithium niobate (LN: LiNbO 3 ) element used in an electro-optic modulator Will be described in detail below.
図１は、電子部品としてＬＤ，ＰＤ等の光半導体素子またはＬＮ素子等の電気光学結晶を用いる場合のパッケージの実施の形態の一例を示す斜視図である。図２は図１のパッケージの入出力端子３部分を分解した分解斜視図である。また、図３は、図２のパッケージの入出力端子３が固定された部分を平面視した断面を示す断面図であり、図３（ａ）はピン端子５が挿通された第１貫通孔２ａが配置されている位置に沿った要部拡大断面図、図３（ｂ）は第３貫通孔２ｂが配置されている位置に沿った要部拡大断面図である。 FIG. 1 is a perspective view showing an example of an embodiment of a package when an optical semiconductor element such as an LD or PD or an electro-optic crystal such as an LN element is used as an electronic component. FIG. 2 is an exploded perspective view in which the input / output terminal 3 portion of the package of FIG. 1 is disassembled. 3 is a cross-sectional view showing a cross-sectional view of a portion of the package of FIG. 2 where the input / output terminal 3 is fixed, and FIG. 3A is a first through hole 2a through which the pin terminal 5 is inserted. The principal part expanded sectional view along the position where this is arrange | positioned, FIG.3 (b) is a principal part expanded sectional view along the position where the 3rd through-hole 2b is arrange | positioned.
以下、図１，図２に示すように、ＬＮ素子を搭載するＬＮ光変調器用パッケージを例にして説明する。 Hereinafter, as shown in FIGS. 1 and 2, an LN optical modulator package on which an LN element is mounted will be described as an example.
本発明の基体１は、その上側主面にＬＮ素子等の電気光学結晶や、電気光学結晶にバイアス電圧や変調信号を入力するための配線基板等が実装される実装領域を有し、略四角形の形状である。この基体１は、Ｆｅ−Ｎｉ−Ｃｏ合金，Ｆｅ−Ｎｉ合金，Ｃｕ−Ｗ複合材，ＳＵＳ（ステンレス鋼），ＳＰＣ（鉄）等の金属材料、Ａｌ２Ｏ３，ＡｌＮ，３Ａｌ２Ｏ３・２ＳｉＯ２等のセラミックス（焼結体）から成る。金属材料から成る場合、例えば、Ｆｅ−Ｎｉ−Ｃｏ合金のインゴット（塊）に圧延加工や打ち抜き加工等の従来周知の金属加工法を施すことによって所定の形状に製作される。一方、セラミックスから成る場合、その原料粉末に適当な有機バインダや溶剤等を添加混合しペースト状と成し、このペーストをドクターブレード法やカレンダーロール法によってセラミックグリーンシートと成し、しかる後、セラミックグリーンシートに適当な打ち抜き加工を施し、これを複数枚積層し焼成することによって作製される。 The base body 1 of the present invention has a mounting area on which an upper surface of an electro-optic crystal such as an LN element, a wiring board for inputting a bias voltage and a modulation signal to the electro-optic crystal, and the like are mounted. It is the shape. The substrate 1 is made of a metal material such as Fe—Ni—Co alloy, Fe—Ni alloy, Cu—W composite material, SUS (stainless steel), SPC (iron), Al 2 O 3 , AlN, 3Al 2 O 3. It consists of ceramics (sintered body) such as 2SiO 2 . When made of a metal material, for example, it is manufactured into a predetermined shape by applying a conventionally known metal processing method such as rolling or punching to an ingot (lumb) of an Fe—Ni—Co alloy. On the other hand, when it is made of ceramics, an appropriate organic binder or solvent is added to the raw material powder and mixed to form a paste, and this paste is formed into a ceramic green sheet by the doctor blade method or calendar roll method. The green sheet is produced by performing an appropriate punching process, laminating a plurality of the green sheets, and firing them.
なお、基体１が金属材料から成る場合、その表面に耐蝕性に優れかつろう材との濡れ性に優れる金属、具体的には厚さ０．５〜９μｍのＮｉ層と厚さ０．５〜５μｍのＡｕ層をメッキ法により順次被着しておくのがよい。基体１が酸化腐蝕するのを防止するとともに、基体１の実装領域にＬＮ素子や配線基板、それらを載置する台座を強固に接着固定することができる。一方、基体１がセラミックスから成る場合、ＬＮ素子や配線基板、それらを載置する台座等を載置する実装領域に耐蝕性に優れかつろう材との濡れ性に優れる金属、具体的には厚さ０．５〜９μｍのＮｉ層と厚さ０．５〜５μｍのＡｕ層をメッキ法により順次被着しておくのがよい。基体１の上側主面の実装領域にＬＮ素子や配線基板、それらを載置する台座等を強固に接着固定することができる。 When the substrate 1 is made of a metal material, a metal having excellent corrosion resistance and wettability with the brazing material on the surface, specifically, a Ni layer having a thickness of 0.5 to 9 μm and a thickness of 0.5 to A 5 μm Au layer is preferably deposited sequentially by plating. The base 1 can be prevented from being oxidized and corroded, and the LN element, the wiring board, and the base on which the base is placed can be firmly bonded and fixed to the mounting region of the base 1. On the other hand, when the substrate 1 is made of ceramic, a metal having excellent corrosion resistance and excellent wettability with a brazing material in a mounting region for mounting an LN element, a wiring board, a pedestal for mounting them, etc. It is preferable to sequentially deposit a 0.5 to 9 μm thick Ni layer and a 0.5 to 5 μm thick Au layer by plating. An LN element, a wiring board, a pedestal for mounting them, and the like can be firmly bonded and fixed to the mounting region on the upper main surface of the base 1.
枠体２は、基体１の上側主面に実装領域を囲繞するように設けられ、側部に複数の第１および第３貫通孔２ａ，２ｂが形成された平面視形状が略四角枠状のものである。この枠体２は基体１と同様の金属またはセラミックスを用いて形成することができる。好ましくはＦｅ−Ｎｉ−Ｃｏ合金から成り、Ｆｅ−Ｎｉ−Ｃｏ合金のインゴットをプレス加工や切削加工により所定の枠状となすことによって製作される。また、枠体２の他の側部にはさらに他の貫通孔が形成され、内部に収容するＬＮ素子に光信号を入出力するための光ファイバが挿通固定される筒状の光ファイバ固定部材７が、Ａｇろう等のろう材を介して接合されている。また、内部に収納するＬＮ素子にバイアス電圧を入力する機能を有する他の入出力端子８が嵌着され、接合されている。 The frame body 2 is provided on the upper main surface of the base body 1 so as to surround the mounting region, and the shape in plan view in which a plurality of first and third through holes 2a and 2b are formed on the side portion is substantially a square frame shape. Is. The frame 2 can be formed using the same metal or ceramic as the base 1. Preferably, it is made of an Fe—Ni—Co alloy, and is produced by forming an ingot of the Fe—Ni—Co alloy into a predetermined frame shape by pressing or cutting. Further, another through hole is formed in the other side portion of the frame body 2, and a cylindrical optical fiber fixing member into which an optical fiber for inputting / outputting an optical signal to and from an LN element accommodated therein is inserted and fixed 7 are joined via a brazing material such as Ag brazing. Further, another input / output terminal 8 having a function of inputting a bias voltage is fitted and joined to the LN element accommodated therein.
枠体２の寸法は、パッケージの仕様に応じて決められるが、図１のパッケージにおいては、例えば縦８８ｍｍ，幅１６ｍｍ，高さ５ｍｍの枠状である。なお、本実施形態では、基体１の上側主面外周部に枠体２を接合した例を示したが、これに限らず、基体１と枠体２とを一体に形成した容器としてもよい。この場合、容器の底部が基体１に相当し、容器の側壁が枠体２に相当することになる。 The dimensions of the frame body 2 are determined according to the package specifications. In the package shown in FIG. In the present embodiment, the example in which the frame body 2 is joined to the outer peripheral portion of the upper main surface of the base body 1 is shown. However, the present invention is not limited to this, and a container in which the base body 1 and the frame body 2 are integrally formed may be used. In this case, the bottom of the container corresponds to the base 1, and the side wall of the container corresponds to the frame 2.
入出力端子３は、金具４とピン端子５とピン端子５および金具４の間に介在する絶縁材６とで構成されている。金具４は、枠体２の第１貫通孔２ａと略同じ開口形状の直径１．５ｍｍ乃至２．５ｍｍの第２貫通孔４ａを有する。第２貫通孔４ａは、第１貫通孔２ａの位置と一致させ、同じ配置で両主面間を貫通するように金具４に複数形成されている。そして、ピン端子５は、第２貫通孔４ａを挿通され、第２貫通孔４ａの内面に絶縁材６を介して固着されている。入出力端子３は、ピン端子５の一端を枠体２の第１貫通孔２ａに挿通させ、金具４の一方主面を第１貫通孔２ａの周囲にろう付けすることによって枠体２に固定される。なお、第２貫通孔４ａは、中心を第１貫通孔２ａの中心と一致させておくと、第２貫通孔４ａおよび第１貫通孔２ａを通ずるピン端子５における周波数特性を向上することができる。 The input / output terminal 3 includes a metal fitting 4, a pin terminal 5, a pin terminal 5, and an insulating material 6 interposed between the metal fittings 4. The metal fitting 4 has a second through hole 4a having a diameter of 1.5 mm to 2.5 mm, which has substantially the same opening shape as the first through hole 2a of the frame body 2. A plurality of second through holes 4a are formed in the metal fitting 4 so as to coincide with the positions of the first through holes 2a and penetrate between both main surfaces in the same arrangement. The pin terminal 5 is inserted through the second through hole 4a and fixed to the inner surface of the second through hole 4a with an insulating material 6 interposed therebetween. The input / output terminal 3 is fixed to the frame body 2 by inserting one end of the pin terminal 5 into the first through hole 2a of the frame body 2 and brazing one main surface of the metal fitting 4 around the first through hole 2a. Is done. If the center of the second through hole 4a is aligned with the center of the first through hole 2a, the frequency characteristics of the pin terminal 5 passing through the second through hole 4a and the first through hole 2a can be improved. .
また、枠体２の入出力端子３が接合される部分には、ピン端子５が挿通される第１貫通孔２ａの間にピン端子５が挿通されない残余の貫通孔すなわち第３貫通孔２ｂが形成されている。それぞれの第３貫通孔２ｂは、隣接する２つの第１貫通孔２ａの間、例えば２つの第１貫通孔２ａの間の中央に配置される。また、金具４の幅方向においては、金具４が接合される範囲内に配置される。 Further, in the portion where the input / output terminal 3 of the frame body 2 is joined, the remaining through-hole, that is, the third through-hole 2b through which the pin terminal 5 is not inserted is inserted between the first through-hole 2a through which the pin terminal 5 is inserted. Is formed. Each 3rd through-hole 2b is arrange | positioned in the center between the two adjacent 1st through-holes 2a, for example, between the two 1st through-holes 2a. Moreover, in the width direction of the metal fitting 4, it arrange | positions in the range to which the metal fitting 4 is joined.
金具４と枠体２とを接合する際は、例えば先ず金具４と枠体２との間にろう材のプリフォームをセットし、ろう材溶融温度に設定された炉内に投入する。すると、溶融したろう材が金具４と枠体２との間の隙間を伝って流れ、その後、徐冷されることによってろう材が固化し、金具４と枠体２とが接合される。接合後に、電子部品収納用パッケージの内側から第３貫通孔２ｂの底部になる金具４の一方主面のろう材の流れ具合や、第３貫通孔２ｂから枠体２の内周面に沿ったろう材の流れ具合を目視によって確認することにより、ろう材が第３貫通孔２ｂのところまで濡れ広がったかどうかが分かる。 When joining the metal fitting 4 and the frame body 2, for example, first, a preform of brazing material is set between the metal fitting 4 and the frame body 2 and put into a furnace set to the brazing material melting temperature. Then, the molten brazing material flows through the gap between the metal fitting 4 and the frame body 2, and then the brazing material is solidified by being gradually cooled, so that the metal fitting 4 and the frame body 2 are joined. After joining, the flow of the brazing material on the one main surface of the metal fitting 4 that becomes the bottom of the third through hole 2b from the inside of the electronic component storage package, and the wax from the third through hole 2b along the inner peripheral surface of the frame By visually confirming the flow of the material, it can be determined whether or not the brazing material has spread to the third through hole 2b.
第３貫通孔２ｂにより、金具４と枠体２とに隠れて見えない部分のろう付け状況を確認することができ、接合不良のものを選別することができる。さらに、第３貫通孔２ｂは、金具４の一方主面を枠体２に接合する際の余剰のろう材の排出口として機能する。ろう材が第３貫通孔２ｂの内周面まで濡れ広がるようにすると、接合強度を向上できるという点でも好ましい。 With the third through-hole 2b, it is possible to confirm the brazing condition of a portion that is hidden behind the metal fitting 4 and the frame body 2 and cannot be seen. Further, the third through hole 2 b functions as an exhaust port for excess brazing material when the one main surface of the metal fitting 4 is joined to the frame body 2. It is also preferable that the brazing material can be spread to the inner peripheral surface of the third through hole 2b so that the bonding strength can be improved.
また、第３貫通孔２ｂは、金具４の一方主面と枠体２との接合部に残存ずる気体の排出口として機能する。なお、ろう材にはペースト状のものを使用してもよい。この場合第３貫通孔２ｂはペースト状ろう材のフラックス等から発生するガスを排出する孔として機能させることも可能である。ただし、ガスはろう材の流れを阻害するので、ガスを発生しないろう材を用いる方がよい。 Further, the third through hole 2 b functions as a discharge port for the gas remaining at the joint portion between the one main surface of the metal fitting 4 and the frame body 2. The brazing material may be a paste. In this case, the third through hole 2b can also function as a hole for discharging a gas generated from the flux or the like of the paste-like brazing material. However, since gas obstructs the flow of the brazing material, it is better to use a brazing material that does not generate gas.
ろう材の存在を確認できればよいので、第３貫通孔２ｂの直径は、第１貫通孔２ａの直径よりも小さくてよい。一例として、第１貫通孔２ａの直径は１．９ｍｍ、第３貫通孔２ｂの直径は０．３ｍｍ程度である。第３貫通孔２ｂの直径が小さいほうが、金具４と枠体２との接合強度を確保するためにも好ましい。ろう材は、上記のように第３貫通孔２ｂの内周面から開口まで濡れ広がることもあり、開口から枠体２の内周面まで濡れ広がることもある。従って、入出力端子３を枠体２に接合した後に、電子部品収納用パッケージの内側から第３貫通孔２ｂやその周辺におけるろう材の流れ具合を目視によって確認すること
により、枠体２と入出力端子３とがろう材によって強固に接合されているかどうかを確認できる。
Since it is only necessary to confirm the presence of the brazing material, the diameter of the third through hole 2b may be smaller than the diameter of the first through hole 2a. As an example, the diameter of the first through hole 2a is about 1.9 mm, and the diameter of the third through hole 2b is about 0.3 mm. A smaller diameter of the third through hole 2b is also preferable in order to ensure the bonding strength between the metal fitting 4 and the frame body 2. As described above, the brazing material may spread from the inner peripheral surface of the third through-hole 2 b to the opening, or may spread from the opening to the inner peripheral surface of the frame 2. Therefore, after the input / output terminal 3 is joined to the frame 2, the flow of the brazing material in the third through hole 2 b and its periphery is visually confirmed from the inside of the electronic component storage package, so It can be confirmed whether or not the output terminal 3 is firmly joined by the brazing material.
また、第３貫通孔２ｂは、開口に向けて直径が大きくなるような形状にすると、電子部品収納用パッケージの内側からのろう付け状態の確認がより容易になる。 Further, if the third through hole 2b has a shape that increases in diameter toward the opening, it is easier to check the brazed state from the inside of the electronic component storage package.
第１貫通孔２ａおよび第３貫通孔２ｂは、例えば図１，図２，図３に示すように、隣接する２つの第１貫通孔２ａの中心を結ぶ直線より上方位置に第３貫通孔２ｂが配置される。図４（ａ）は、このように第１貫通孔２ａ，第３貫通孔２ｂが配置された入出力端子３が接合される部分の枠体２を正面図で示すものである。このように第１貫通孔２ａおよび第３貫通孔２ｂを配置すると、第１貫通孔２ａの間隔を密に配置することができる。また、第１貫通孔２ａと第３貫通孔２ｂとの間隔を広げることができる。その結果、入出力端子３が接合される接合部における枠体２の剛性を高めることができ、枠体２の側壁および第１貫通孔２ａの変形を抑制できる。 For example, as shown in FIGS. 1, 2 and 3, the first through hole 2a and the third through hole 2b are located above the straight line connecting the centers of the two adjacent first through holes 2a. Is placed. FIG. 4A is a front view showing the frame body 2 at a portion to which the input / output terminal 3 in which the first through hole 2a and the third through hole 2b are arranged is joined. Thus, if the 1st through-hole 2a and the 3rd through-hole 2b are arrange | positioned, the space | interval of the 1st through-hole 2a can be arrange | positioned closely. Moreover, the space | interval of the 1st through-hole 2a and the 3rd through-hole 2b can be expanded. As a result, the rigidity of the frame 2 at the joint where the input / output terminal 3 is joined can be increased, and deformation of the side wall of the frame 2 and the first through hole 2a can be suppressed.
この他にも、図４（ｂ）に示すように２つの第１貫通孔２ａの中心を結ぶ直線の下方位置に配置してもよいし、第１貫通孔２ａを多数並べて配置する場合は、図４（ｃ）に示すように、それぞれ隣り合う第３貫通孔２ｂを直線の上方と下方に互い違いに配置してもよい。第３貫通孔２ｂを図４（ｂ）のように配置することによっても第１貫通孔２ａの間隔を密に配置することができる。 In addition to this, as shown in FIG. 4B, it may be arranged at a position below a straight line connecting the centers of the two first through holes 2a, or when arranging a large number of the first through holes 2a side by side, As shown in FIG. 4C, the adjacent third through holes 2b may be alternately arranged above and below the straight line. By arranging the third through holes 2b as shown in FIG. 4B, the intervals between the first through holes 2a can be arranged closely.
また、第３貫通孔２ｂを図４（ｃ）のように配置すると、第１貫通孔２ａの間隔を密に配置することができる上に、枠体２と入出力端子３とを接合するろう材の流れ具合を確認する際に、隣接する２つの第１貫通孔２ａの中心を結ぶ直線の上方位置もしくは下方位置に偏ることなく、第３貫通孔２ｂを介してろう材の流れ具合を確認できる。よって、枠体２と入出力端子３との接合性を向上することができる。 If the third through holes 2b are arranged as shown in FIG. 4C, the first through holes 2a can be arranged closely, and the frame body 2 and the input / output terminals 3 are joined. When checking the flow of the material, check the flow of the brazing material via the third through hole 2b without being biased to the upper or lower position of the straight line connecting the centers of the two adjacent first through holes 2a. it can. Therefore, the bondability between the frame 2 and the input / output terminal 3 can be improved.
さらに、図４（ｄ）に示すように、第１貫通孔２ａの中心を結ぶ直線の上下位置にそれぞれ第３貫通孔２ｂを配置してもよく、この場合は、上記と同様に枠体２と入出力端子３とを接合するろう材の流れ具合を確認する際に、隣接する２つの第１貫通孔２ａの中心を結ぶ直線の上方位置もしくは下方位置に偏ることなく、第３貫通孔２ｂを介してろう材の流れ具合を確認することができる。さらに、枠体２と入出力端子３との接合部に残存ずる空気の排出口、および余剰のろう材の排出口として機能させ易くできる。 Furthermore, as shown in FIG. 4 (d), the third through holes 2b may be respectively arranged at the vertical positions of the straight line connecting the centers of the first through holes 2a. In this case, the frame 2 is similar to the above. The third through hole 2b is not biased to the upper or lower position of the straight line connecting the centers of the two adjacent first through holes 2a when confirming the flow of the brazing material that joins the I / O terminals 3 to each other. The flow of the brazing material can be confirmed via Furthermore, it can be made to function easily as an exhaust port for air remaining at the joint portion between the frame body 2 and the input / output terminal 3 and an exhaust port for excess brazing material.
また、図４（ｅ）に示すように、第１貫通孔２ａの中心を結ぶ直線上に第３貫通孔２ｂを配置してもよい。この場合は、２つの第１貫通孔２ａを迂回して、両第１貫通孔２ａの間までろう材が濡れ広がっているかを確認することができる。なお、言うまでもないが、第１貫通孔２ａ，第３貫通孔２ｂは必ずしも横一列の直線上に配置する必要はなく、必要に応じて、上下互い違いにジグザク状に配置したり、複数列に配置したりしてもよい。 Further, as shown in FIG. 4 (e), the third through hole 2b may be arranged on a straight line connecting the centers of the first through holes 2a. In this case, it is possible to confirm whether or not the brazing material spreads between the first through holes 2a by bypassing the two first through holes 2a. Needless to say, the first through holes 2a and the third through holes 2b do not necessarily have to be arranged in a horizontal line, and may be arranged in a zigzag pattern in a staggered manner or in a plurality of lines as necessary. You may do it.
入出力端子３の金具４は、例えばＦｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金等の金属から成り、プレス加工や切削加工により、所定形状に加工される。また、表面には厚さ０．５〜９μｍのＮｉ層と厚さ０．５〜５μｍのＡｕ層をメッキ法により順次被着しておくのがよい。入出力端子３は、例えばピン端子５の配列方向に垂直な方向の高さは３ｍｍ、ピン端子５の配列方向に沿った幅は１８ｍｍであるが、パッケージの仕様および寸法に応じて適宜の大きさとされる。 The metal fitting 4 of the input / output terminal 3 is made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy, and is processed into a predetermined shape by pressing or cutting. Further, a Ni layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 5 μm are preferably sequentially deposited on the surface by a plating method. The input / output terminal 3 has, for example, a height of 3 mm perpendicular to the arrangement direction of the pin terminals 5 and a width along the arrangement direction of the pin terminals 5 of 18 mm. It is assumed.
図１，図２，図３に示す金具４は厚さが２ｍｍ乃至４ｍｍ程度とされている。従って第２貫通孔４ａの長さは比較的長い。この第２貫通孔４ａにピン端子５が挿通されて絶縁材を介して固定されることによって、同軸線路が形成される。高周波線路の接続方法に応じ
て、図１，図２，図３に示すようにピン端子５を第２貫通孔４ａの長さよりも短くし、枠体２の外側において、ピン端子５の先端が第２貫通孔４ａの開口の内側に配置されるようにしてもよい。もちろん、必要に応じてピン端子５の先端が第２貫通孔４ａの開口の外側に突出するようにしてもよい。
The metal fitting 4 shown in FIGS. 1, 2 and 3 has a thickness of about 2 mm to 4 mm. Therefore, the length of the second through hole 4a is relatively long. A pin line 5 is inserted into the second through hole 4a and fixed through an insulating material, whereby a coaxial line is formed. Depending on the connection method of the high frequency line, the pin terminal 5 is made shorter than the length of the second through hole 4a as shown in FIGS. You may make it arrange | position inside the opening of the 2nd through-hole 4a. Of course, you may make it the front-end | tip of the pin terminal 5 protrude outside the opening of the 2nd through-hole 4a as needed.
また、上記例では、入出力端子３が接合される部位の枠体２の厚さは０．１ｍｍ乃至０．５ｍｍ程度であり、金具４の厚さが枠体２の厚さよりも厚い。そこで、第３貫通孔２ｂが枠体２と入出力端子３との接合部に設けられている。枠体２の方が金具４よりも薄く、第３貫通孔２ｂの長さが短くなるので、ろう材の状況を確認しやすい。金具４の厚さが枠体２よりも薄い場合は、第３貫通孔２ｂに代えて、金具４の側の第２貫通孔４ａの間に残余の貫通孔となる第４貫通孔（不図示）を設けてもよい。 In the above example, the thickness of the frame 2 at the portion to which the input / output terminal 3 is joined is about 0.1 mm to 0.5 mm, and the thickness of the metal fitting 4 is thicker than the thickness of the frame 2. Therefore, the third through hole 2 b is provided at the joint between the frame body 2 and the input / output terminal 3. Since the frame 2 is thinner than the metal fitting 4 and the length of the third through hole 2b is shortened, it is easy to check the state of the brazing material. When the thickness of the metal fitting 4 is thinner than that of the frame body 2, a fourth through hole (not shown) which becomes a remaining through hole between the second through holes 4 a on the metal fitting 4 side instead of the third through hole 2 b. ) May be provided.
さらに、図１，図２，図３に示す実施形態においては、入出力端子３が接合される枠体２の外側部分に座刳り２ｃを設け、この座刳り２ｃの内側に金具４を嵌着するように入出力端子３が枠体２に接合されている。このように枠体２に座刳り２ｃを設け、この内側に金具４を嵌着するように入出力端子３を接合すれば、入出力端子３の位置決めが容易になる。また、入出力端子３を枠体２に接合する際に、ろう材等の接合材が座刳り２ｃに溜められる。よって、枠体２と入出力端子３との間に接合材を設け易くできる。 Further, in the embodiment shown in FIGS. 1, 2 and 3, a seat 2c is provided on the outer side of the frame 2 to which the input / output terminal 3 is joined, and the metal fitting 4 is fitted inside the seat 2c. Thus, the input / output terminal 3 is joined to the frame 2. If the seat 2c is provided on the frame 2 in this way and the input / output terminal 3 is joined so that the metal fitting 4 is fitted inside, the positioning of the input / output terminal 3 is facilitated. Further, when the input / output terminal 3 is joined to the frame body 2, a joining material such as a brazing material is stored in the seat 2 c. Therefore, it is possible to easily provide a bonding material between the frame body 2 and the input / output terminal 3.
なお、座刳り２ｃに溜められる余剰な接合材は、第３貫通孔２ｂを介して枠体２の内側に排出される。余剰な接合材（ろう材）を排出するためにも、第３貫通孔２ｂを細径とし、ろう材の表面張力によってろう材が開口まで濡れ広がるようにしておくのがよい。 In addition, the surplus joining material stored in the pocket 2c is discharged to the inside of the frame body 2 through the third through hole 2b. In order to discharge the excessive bonding material (brazing material), it is preferable that the third through hole 2b has a small diameter so that the brazing material spreads to the opening by the surface tension of the brazing material.
枠体２の座刳り２ｃは、枠体２の外側ではなく、内側に設けてもよい。この場合は、枠体２の外側からろう付け状況を確認することができる。また、座刳り２ｃは、ろう材のプリフォームの設置を容易にしたり、入出力端子３を挿入し易くしたりする等の理由で、開口側に向けて次第に幅が広くなる多段形状にしてもよい。 The counterbore 2c of the frame 2 may be provided not on the outside of the frame 2 but on the inside. In this case, the brazing status can be confirmed from the outside of the frame 2. Further, the counterbore 2c is formed in a multi-stage shape that gradually becomes wider toward the opening side for the purpose of facilitating the installation of the preform of the brazing material or for easy insertion of the input / output terminal 3. Good.
ピン端子５は、入出力端子３の第２貫通孔４ａに絶縁材を介して接合され、外部電気回路とパッケージ内部のＬＮ素子等の駆動電気信号の入出力を行うものである。ピン端子５は、例えば直径０．１ｍｍ乃至０．５ｍｍ、長さ１ｍｍ乃至１０ｍｍのＦｅ−Ｎｉ−Ｃｏ合金等の金属線材から成る。絶縁材には、ホウケイ酸ガラス，リン酸ガラス，ケイ酸ガラス等の低融点ガラス材、Ａｌ２Ｏ３，ＡｌＮ，３Ａｌ２Ｏ３・２ＳｉＯ２等のセラミックス材、プラスチックス等の各種絶縁材を用いることができる。 The pin terminal 5 is joined to the second through hole 4a of the input / output terminal 3 via an insulating material, and inputs / outputs drive electric signals such as an external electric circuit and an LN element inside the package. The pin terminal 5 is made of a metal wire material such as an Fe—Ni—Co alloy having a diameter of 0.1 mm to 0.5 mm and a length of 1 mm to 10 mm, for example. The insulating material, borosilicate glass, phosphate glass, low-melting glass material such as silicate glass, Al 2 O 3, AlN, 3Al 2 O 3 · 2SiO 2 etc. ceramic material, various insulating materials such as plastics Can be used.
その他、パッケージには、光ファイバが接続される光ファイバ固定部材７が接合される。光ファイバ固定部材７は、Ｆｅ−Ｎｉ−Ｃｏ合金やＦｅ−Ｎｉ合金等の金属から成る。光ファイバ固定部材７は、例えばＦｅ−Ｎｉ合金のインゴット（塊）をプレス加工や切削加工により所定の筒状に製作される。 In addition, the optical fiber fixing member 7 to which the optical fiber is connected is joined to the package. The optical fiber fixing member 7 is made of a metal such as an Fe—Ni—Co alloy or an Fe—Ni alloy. The optical fiber fixing member 7 is manufactured in a predetermined cylindrical shape by pressing or cutting, for example, an Fe-Ni alloy ingot.
この光ファイバ固定部材７は、光ファイバ（図示せず）を挿通可能な貫通孔を有する筒体であり、枠体２内側の端部がサファイアやガラス等の透光性材料から成る窓部材で塞がれており、外側端部から光ファイバの一端が挿通固定されたり、光ファイバの一端が枠体２の内側まで挿入されてＬＮ素子と光学的に接続され、光ファイバが光ファイバ固定部材７に固定されたりする。また、光ファイバは、その先端部に金属製フランジが設けられており、その金属製フランジをＹＡＧレーザ溶接法等で光ファイバ固定部材７の外側端部に溶接することにより枠体２に固定される。これにより、光ファイバを介して内部に収容するＬＮ素子や光半導体素子等の光素子と外部との光信号の授受が可能となる。 The optical fiber fixing member 7 is a cylindrical body having a through-hole through which an optical fiber (not shown) can be inserted, and an end portion inside the frame body 2 is a window member made of a translucent material such as sapphire or glass. One end of the optical fiber is inserted and fixed from the outer end, or one end of the optical fiber is inserted to the inside of the frame body 2 and optically connected to the LN element, and the optical fiber is an optical fiber fixing member. 7 or fixed. The optical fiber is provided with a metal flange at its tip, and is fixed to the frame 2 by welding the metal flange to the outer end of the optical fiber fixing member 7 by YAG laser welding or the like. The As a result, an optical signal can be exchanged between an optical element such as an LN element or an optical semiconductor element housed inside via an optical fiber and the outside.
また、枠体２には他の入出力端子８も接合されている。この入出力端子８は、例えばＬ
Ｎ変調器に収納されるＬＮ素子にバイアス電圧の入力を行なう機能を有したり、光半導体装置に収納される光半導体素子や駆動回路にＤＣ電圧の入力を行う機能を有したりする。入出力端子８は、セラミックスや低融点ガラス等の絶縁材を貫通させて金属ピンが設けられている。
Further, another input / output terminal 8 is also joined to the frame 2. The input / output terminal 8 is, for example, L
It has a function of inputting a bias voltage to the LN element housed in the N modulator, or has a function of inputting a DC voltage to the optical semiconductor element and driving circuit housed in the optical semiconductor device. The input / output terminal 8 is provided with a metal pin through an insulating material such as ceramics or low melting point glass.
このようにして構成されたパッケージは、基体１の実装領域１ａに例えばＬＮ素子が台座を介して接着固定され、ＬＮ素子の電極をボンディングワイヤや配線基板等を介してピン端子５や入出力端子８に電気的に接続する。次に、枠体２の光ファイバ固定部材７に光ファイバの一端を挿入するとともにＬＮ素子と光学的に接続し、光ファイバを半田等の接着剤またはＹＡＧ溶接等によって接合して、光ファイバを枠体２に固定する。 In the package thus configured, for example, an LN element is bonded and fixed to the mounting region 1a of the base 1 via a pedestal, and the electrode of the LN element is connected to a pin terminal 5 or an input / output terminal via a bonding wire or a wiring board. 8 is electrically connected. Next, one end of the optical fiber is inserted into the optical fiber fixing member 7 of the frame 2 and optically connected to the LN element, and the optical fiber is joined by an adhesive such as solder or YAG welding. Fix to the frame 2.
最後に、枠体２の上面に蓋体を接合してＬＮ素子を気密に収容することによって、最終製品としてのＬＮ光変調器となる。そして、光ファイバを介して内部に収容するＬＮ素子にて光信号が変調され、この変調された光信号が出力されるＬＮ変調器もしくは電子装置となる。 Finally, a lid is joined to the upper surface of the frame body 2 to contain the LN element in an airtight manner, whereby an LN optical modulator as a final product is obtained. Then, an optical signal is modulated by an LN element housed inside via an optical fiber, and an LN modulator or an electronic device that outputs the modulated optical signal is obtained.
なお、本発明は上記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内であれば種々の変更は可能である。 The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
１：基体
２：枠体
２ａ：第１貫通孔
２ｂ：第３貫通孔
２ｃ：座刳り
３：入出力端子
４：金具
４ａ：第２貫通孔
５：ピン端子
６：絶縁材
1: Base body 2: Frame body 2a: First through hole 2b: Third through hole 2c: Counterbore 3: Input / output terminal 4: Metal fitting 4a: Second through hole 5: Pin terminal 6: Insulating material
Claims (5)
該基板上に前記実装領域を取り囲むように設けられ、内外を貫通する複数の第１貫通孔を有する金属製の枠体と、前記第１貫通孔の位置と一致させて両主面間を貫通するように第２貫通孔が複数形成された金具および前記複数の第２貫通孔にそれぞれ絶縁材を介して挿着された複数の金属製のピン端子から成り、前記複数の第１貫通孔に前記複数のピン端子がそれぞれ挿通されるとともに前記金具の一主面が前記枠体にろう付された入出力端子とを具備した電子部品収納用パッケージにおいて、前記第１貫通孔の間に前記枠体の内外を貫通する第３貫通孔が配置されているか、または前記第２貫通孔の間に前記金具の両主面を貫通する第４貫通孔が配置されていることを特徴とする電子部品収納用パッケージ。 A substrate having a mounting area for mounting elements on the upper surface;
A metal frame having a plurality of first through-holes that are provided on the substrate so as to surround the mounting region, and penetrates between both main surfaces so as to coincide with the positions of the first through-holes. And a plurality of metal pin terminals respectively inserted into the plurality of second through holes via an insulating material, the plurality of second through holes being formed in the plurality of first through holes. In the electronic component storage package, wherein the plurality of pin terminals are respectively inserted, and an input / output terminal having one main surface of the metal fitting brazed to the frame body, the frame is interposed between the first through holes. A third through-hole penetrating the inside and outside of the body is disposed, or a fourth through-hole penetrating both main surfaces of the metal fitting is disposed between the second through-holes. Storage package.
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