JP3131128B2 - Package for storing semiconductor elements - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device housing package for housing a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, a semiconductor device housing package for housing a semiconductor device, particularly a semiconductor device operating at a high frequency, is generally made of a metal such as an iron-nickel-cobalt alloy or a copper-tungsten alloy, and has a central portion on the upper surface. A bottom plate having a mounting portion on which a semiconductor element is mounted, a frame-shaped side wall having a through hole in a part of the bottom plate and being erected around an outer peripheral portion of an upper surface of the bottom plate; A ceramic terminal having a metallized wiring layer which is inserted into the through hole and is joined to the inner wall of the through hole so as to hermetically separate the inside and outside of the side wall, and is connected to the upper surface of the side wall; A metal lid for hermetically sealing a space surrounded by the upper surface and the inner surface of the side wall; a semiconductor element is mounted on the mounting portion of the bottom plate; And mounted and fixed in a state of being mounted on a ceramic circuit board having a wiring conductor connected to the wiring conductor, and electrically connecting the wiring conductor of the circuit board and the metallized wiring layer of the ceramic terminal via a bonding wire. Then, a metal lid is joined to the upper surface of the side wall by using a welding method such as a brazing method or a seam welding method, and the semiconductor element is hermetically sealed in a container including the bottom plate, the side wall, the ceramic terminal and the lid. By stopping, the metallized wiring layer of the ceramic terminal led out of the side wall is electrically connected to the wiring conductor of the external electric circuit board to which the semiconductor element is electrically connected via, for example, a metal ribbon. As a result, the semiconductor element housed inside is electrically connected to an external electric circuit.

However, recently, as the operating frequency of a semiconductor device has been further increased, an external electric circuit board to which the semiconductor device is electrically connected has been continuously provided with a constant characteristic impedance as its wiring conductor. In addition, coaxial cables having excellent electromagnetic wave shielding properties from the outside have been used.

Therefore, a semiconductor element housing package for housing the semiconductor element is also connected to a wiring conductor of the external electric circuit board in order to facilitate electrical connection with a coaxial cable which is a wiring conductor of the external electric circuit board. As an electrically connected terminal, a terminal provided with a coaxial connector instead of a conventional ceramic terminal has been proposed.

FIG. 5 shows a semiconductor device housing package provided with the coaxial connector. In the figure, 11 is a bottom plate, 12
Is a side wall, 13 is a coaxial connector, 14 is a lid, 15 is a semiconductor element, and 16 is a ceramic circuit board.

In a package for housing a semiconductor element having this coaxial connector, a semiconductor element 15 is electrically connected to an electrode of the semiconductor element 15 via a bonding wire 17 on a mounting portion 11a provided at the center of the upper surface of the bottom plate 11. It is mounted and fixed while being mounted on the circuit board 16 having the connected wiring conductor 16a.

In the package for housing a semiconductor device having the coaxial connector, a through-hole 12a into which the coaxial connector 13 is inserted and fixed is formed in a part of the side wall 12, and the coaxial connector is provided in the through-hole 12a. 13, the coaxial connector 13 and the inner wall of the through hole 12a are joined via a sealing material 18 such as solder.

The coaxial connector 13 has a cylindrical outer conductor 13 made of a metal such as an iron-nickel-cobalt alloy.
A rod-shaped central conductor 13b, also made of a metal such as an iron-nickel-cobalt alloy, is fixed to the central portion of a through a glass member 13c, and the outer peripheral conductor 13a is electrically connected to the side wall 12 via a sealing material 18. The center conductor 13b is connected to the wiring conductor 16a of the circuit board 16 via solder.
Is electrically connected to

In the semiconductor element housing package provided with the coaxial connector, the coaxial connector 13 is connected to a coaxial cable, which is a wiring conductor of an external electric circuit board, so that the semiconductor element 15 housed inside is electrically connected to the external electric circuit. Will be connected.

The side wall 12 is formed with a sealing material insertion hole 12b extending from the upper surface to the through hole 12a.
The coaxial connector 13 is inserted into the through hole 12a, and a sealing material such as solder is inserted into the sealing material insertion hole 12b. Thereafter, the sealing material is heated to melt the sealing material such as the solder.
The fused sealing material is removed from the coaxial connector 13 by capillary action.
The coaxial connector 13 is fixed in the through hole 12a of the side wall 12 via a sealing material 18 such as solder by filling the gap between the hole and the inner wall of the through hole 12a.

[0011]

However, this conventional package for housing a semiconductor element has a sealing material insertion hole 12.
b is provided only on the upper surface side of the side wall 12, so that when the sealing material such as solder inserted into the sealing material insertion hole 12b is melted, the molten sealing material is connected to the coaxial connector 13 and the through hole. Of the sealing material insertion hole 12a in the gap with the inner wall 12a.
The gap on the side opposite to b is not sufficiently filled. As a result, the airtightness between the inside and outside of the side wall portion 12 is not sufficiently ensured, and the semiconductor element 15 housed therein cannot be operated normally and stably for a long period of time. Had the disadvantage that

[0012]

According to the present invention, there is provided a bottom plate having a mounting portion on which a semiconductor element is mounted on an upper surface, and an erect outer peripheral portion of the upper surface of the bottom plate surrounding the mounting portion. A frame-shaped side wall provided with a through hole in which a coaxial connector is partially inserted and fixed, and a coaxial connector inserted into the through hole of the side wall and fixed to the inner wall of the through hole with a sealing material, A semiconductor element housing package comprising: a lid joined to the upper surface of the frame-shaped side wall and hermetically sealing a space surrounded by the upper surface of the bottom plate and the inner surface of the side wall;
The through hole provided in the side wall has a sealing material insertion portion on at least one of the inner surface side and the outer surface side of the side wall, in which the diameter of the through hole spreads stepwise or tapered over the entire circumference toward the side wall surface. And a solder which serves as a sealing material for inserting the coaxial connector into the through hole and joining the inner wall of the through hole and the connector over the entire periphery of the sealing material insertion portion. When the material is inserted and held and the solder material is heated and melted, the gap between the inner wall of the through hole and the coaxial connector is filled with the sealing material over the entire circumference.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the accompanying drawings. 1 to 3 show one embodiment of a package for housing a semiconductor device according to the present invention, wherein 1 is a bottom plate, 2 is a side wall,
3 is a coaxial connector and 4 is a lid.

The bottom plate 1 is a substantially rectangular plate made of a metal such as an iron-nickel-cobalt alloy or a copper-tungsten alloy, and a mounting portion 1a for mounting a semiconductor element is provided at the center of the upper surface. Is formed, and the mounting portion 1a
The semiconductor device 5 is mounted on a circuit board 6 made of, for example, alumina ceramics and having on its upper surface a wiring conductor 16a electrically connected to electrodes of the semiconductor device 5 via bonding wires 7. Fixed.

A mounting portion 1 is provided on the outer peripheral portion of the upper surface of the bottom plate 1.
A frame-shaped side wall 2 is erected so as to surround a. The side wall 2 functions to form a space accommodating the semiconductor element 5 together with the bottom plate 1.

The side wall 2 is made of a metal such as an iron-nickel-cobalt alloy or a copper-tungsten alloy similarly to the bottom plate 1 and is formed integrally with the bottom plate 1 or the brazing material such as silver brazing is formed on the bottom plate 1. Or brazed through
The bottom plate 1 is erected on the outer periphery of the upper surface of the bottom plate 1 by being welded by a welding method such as a seam welding method.

The side wall 2 has a through hole 2a in which a coaxial connector is inserted and fixed. The coaxial connector 3 is inserted into the through hole 2a, and the coaxial connector 3 and the through hole 2a are inserted into the through hole 2a. The inner wall is fixed via a sealing material 8 made of solder.

Further, a through hole 2a formed in the side wall 2 is provided.
Has a sealing material insertion portion 2b whose diameter is spread stepwise over the entire circumference toward the outer surface, as shown in FIG. 2, and the sealing material insertion portion 2b is coaxial with the through hole 2a. Connector 3
When the solder is used as the sealing material 8 for fixing the inner wall of the through hole 2a and the coaxial connector 3 when the inner wall of the through hole 2a is inserted and fixed via the sealing material 8, It functions to hold along the entire circumference of the gap between the inner wall of the through hole 2a and the coaxial connector 3.

The through hole 2a formed in the side wall 2 has a sealing material insertion portion 2b whose diameter is stepwise spread over the entire circumference toward the outer surface. The connector 3 is inserted, and a solder material serving as a sealing material 8 for joining the inner wall of the through hole 2a and the connector 3 is inserted and held over the entire periphery of the sealing material insertion portion 2b, and the solder material is heated and melted. For example, the gap between the inner wall of the through hole 2a and the coaxial connector 3 is filled with the sealing material 8 over the entire circumference, and therefore the inside and outside of the side wall 2 are completely airtightly partitioned.

The coaxial connector 3 inserted and fixed in the through-hole 2a functions to electrically connect the semiconductor element 5 housed therein to a coaxial cable as a wiring conductor of an external electric circuit board. An iron-like material is also provided at the center of the cylindrical outer conductor 3a made of a metal such as a nickel-cobalt alloy.
Center conductor 3b made of metal such as nickel-cobalt alloy
Has a structure in which the outer conductor 3a is fixed to the side wall 2 via the sealing material 8 and the center conductor 3b is fixed to the wiring conductor 6a of the circuit board 6 by soldering or the like. Each is electrically connected via an adhesive.

In order to fix the coaxial connector 3 in the through hole 2a of the side wall 2 via the sealing material 8, FIG.
(A) As shown in (b), the coaxial connector 3 is inserted into the through hole 2a of the side wall 2 and, for example, a ring-shaped solder material serving as the sealing material 8 is inserted into the sealing material insertion portion 2b of the through hole 2a. A is inserted so as to surround the connector 3, and thereafter, a method is adopted in which the solder material A is once heated and melted and then solidified by cooling. In this case, the molten ring-shaped solder material A is connected to the inner wall of the through hole 2 a. The sealing material 8 is filled over the entire circumference of the gap between the coaxial connector 3 and the sealing material 8. As a result, the inside and outside airtightness of the side wall 2 is not impaired at all.

Thus, according to the semiconductor element housing package of the present invention, the semiconductor element 5 is mounted on the mounting portion 1a of the bottom plate 1 by the wiring conductor 6a electrically connected to the electrode of the semiconductor element 5.
The wiring conductor 6a of the circuit board 6 and the center conductor 3b of the coaxial connector 3 are electrically connected to each other via solder, and finally the side wall 2 is fixed. A semiconductor device as a product is obtained by joining a lid made of a metal such as an iron-nickel-cobalt alloy on the upper surface by a soldering method or a seam welding method, and a coaxial cable as a wiring conductor of the coaxial connector 3 and an external electric circuit board. The semiconductor element 5 housed inside is electrically connected to an external electric circuit by fitting the two.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
Although the step-like sealing material insertion portion 2b is provided in the through hole 2a formed in the first embodiment, as shown in FIG. 4, this may be changed to a tapered sealing material insertion portion 2b. Then side wall 2
The sealing material insertion portion 2b is provided on the outer surface side of the
May be provided on the inner surface side or on both the inner surface side and the outer surface side.

[0024]

According to the semiconductor device housing package of the present invention, the through hole provided in the side wall has at least one of the inner surface side and the outer surface side of the side wall, and the diameter of the through hole extends over the entire circumference toward the side wall surface. Because it has a sealing material insertion portion that spreads in a stepped or tapered shape, it is necessary to insert the coaxial connector into the through hole and to join the through hole inner wall and the connector over the entire circumference of the sealing material insertion portion. If a solder material serving as a sealing material is inserted and held, and the solder material is heated and melted, the gap between the inner wall of the through hole and the coaxial connector is filled with the sealing material over the entire circumference, and as a result, the side wall The inside and the outside are completely airtightly partitioned, so that the airtightness of the container housing the semiconductor element is not impaired, and the semiconductor element housed inside can be operated normally and stably for a long time.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing one embodiment of a semiconductor element storage package according to the present invention.

2 is an enlarged cross-sectional view of a main part of the package for housing a semiconductor element shown in FIG. 1;

FIGS. 3A and 3B are cross-sectional views for explaining a method of inserting and fixing a coaxial connector via a sealing material into a through hole provided in a side wall of the package for housing a semiconductor element shown in FIG. 1; It is.

FIG. 4 is a cross-sectional view of a principal part showing another embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a conventional semiconductor device housing package.

[Explanation of symbols]

 1 Bottom plate 1a Mounting part 2 Side wall 2a Through hole 2b Sealing material insertion part 3 Coaxial connector 4 Lid 5 Semiconductor element 8 Sealing material

Claims (1)

(57) [Claims] 1. A bottom plate having a mounting portion on which a semiconductor element is mounted on an upper surface, and a coaxial connector is inserted and fixed on an outer peripheral portion of the upper surface of the bottom plate so as to surround the mounting portion. A frame-shaped side wall provided with a through hole to be provided, a coaxial connector inserted into the through hole of the side wall and fixed to the inner wall of the through hole via a sealing material, and joined to an upper surface of the frame-shaped side wall And a lid for hermetically sealing a space enclosed by the upper surface of the bottom plate and the inner surface of the side wall, wherein the through-hole provided in the side wall has an inner surface side or an outer surface side of the side wall. Characterized in that at least one of the above has a sealing material insertion portion in which the diameter of the through hole expands stepwise or tapered toward the side wall surface.