JP6234756B2 - Thermal shock test equipment - Google Patents

Description

  The present invention relates to a thermal shock test apparatus for performing a thermal shock test by alternately applying a low temperature environment and a high temperature environment to a test object of an electronic component or its material.

  Electronic components and materials such as LED elements, organic EL display units, and IC chips are often used in environments with various temperatures and rapid temperature changes. Durability is required in an environment where there is a rapid temperature change between a high temperature environment and a high temperature environment.

  For this reason, when developing new products with electronic components and their materials, the electronic components and their materials are exposed to various low-temperature environments and high-temperature environments, or environments where sudden temperature changes occur between low-temperature environments and high-temperature environments. And thermal shock tests are being conducted.

  Conventionally, as a thermal test apparatus for performing a thermal shock test, a cooling coil and a heater having a heat exchange performance sufficiently large with respect to the capacity of the test chamber, and air in the test chamber are passed through a suction port, an outlet, a cooling coil and a heater. A refrigeration unit that is provided with a fan forcibly circulating and a cover that covers these to form an air circulation path, and circulates the refrigerant through the cooling coil in a space opposite to the circulation path partitioned by the cover in the apparatus housing. There is known a rapid heating / cooling type thermal testing apparatus equipped with a control means for storing a machine and controlling the rotation of a fan and the operation of a refrigerator and a heater to rapidly increase or decrease the temperature in the test chamber (for example, , See Patent Document 1).

Japanese Patent Laid-Open No. 08-136442

  However, in the test apparatus as disclosed in Patent Document 1, a heater and a forced circulation fan are used for heating, and a cooling machine and a forced circulation fan are used for cooling. It is difficult to quickly assimilate the electronic component and the material under test thereof in a low temperature environment or a high temperature environment.

  In addition, it is desired to obtain a low temperature environment at a lower temperature and a high temperature environment at a higher temperature.

  From the viewpoint of solving this problem, the present invention is to quickly assimilate a test object of an electronic component or its material to a low temperature environment or a high temperature environment of a test room, and further, to test the test object at a lower temperature. It is an object of the present invention to provide a thermal shock test apparatus that can be exposed to a low temperature environment and a high temperature environment at a higher temperature.

In view of the above problems, a thermal shock test apparatus of the present invention includes a heat sink for heat exchange, a thermo module assembly composed of a plurality of thermo modules arranged in contact with an upper surface of the heat sink, A test tank placed in contact with the top surface of the top thermo module unit of the thermo module assembly, a power source for supplying power to each thermo module unit, and a large amount of power supplied from the power source to each thermo module unit And a controller for controlling the timing and time, and for connecting thermoelectric elements in at least some of the thermomodules that are exposed to at least a high temperature among the stacked thermomodules. It is characterized by using high temperature solder.

  According to this thermal shock test apparatus, it is possible to quickly assimilate a test object of an electronic component or its material into a low-temperature environment or a high-temperature environment of a test room, and further, the test object can be converted to a low temperature at a lower temperature. It can be exposed to the environment and higher temperature environment.

In this thermal shock test apparatus, the uppermost thermo module unit is composed of a plurality of thermo module units arranged side by side so as to be in contact with the heat transfer plate of the test tank, and the part using the high-temperature solder is used. A single thermo module may be used as a single thermo module that is exposed to a temperature exceeding 200 degrees Celsius in the plurality of thermo modules arranged in a stacked manner.

  In this thermal shock test apparatus, the heat sink may include a fan or a pump that performs air cooling or water cooling.

  According to the present invention, it is possible to quickly assimilate a test object of an electronic component or its material into a low temperature environment or a high temperature environment of a test room, and further, the test object is set to a low temperature environment or a higher temperature. It is possible to provide a thermal shock test apparatus that can be exposed to a high temperature environment.

It is a perspective view which simplifies and shows the structure of the thermal shock test apparatus which concerns on embodiment of this invention. It is a perspective view which simplifies and shows the structure of the thermo module assembly of the thermal shock test apparatus which concerns on embodiment of this invention.

  Hereinafter, a thermal shock test apparatus 1 according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2. In the drawings, the dimensions of the constituent parts of the device are appropriately enlarged or reduced from the viewpoint of facilitating understanding of the configuration of the device.

  The thermal shock test apparatus 1 includes a test tank 10, a lid 5 of the test tank 10, a thermo module assembly 20, a heat sink 30, and a power source and a control unit (not shown). Alternatively, the test tank 10 may be simplified so that only a plate such as the bottom of the test tank 10 is used.

  The test chamber 10 has a test space that gives a low-temperature environment and a high-temperature environment to the electronic component D to be tested arranged inside. The test tank 10 is formed in a rectangular parallelepiped shape having a width (W1), a depth (d1), and a height (h1) of 40 mm, 40 mm, and 30 mm, respectively, and an upper portion is open.

  The open upper part of the test chamber 10 can be covered with the lid 5.

  Moreover, the test tank 10 is comprised in the box shape by which the upper part was open | released by the heat-transfer plate which forms a bottom part, and the heat-transfer plate which forms the side wall extended upwards from each edge | side of a bottom part. This box-shaped internal space becomes the test space 15. The heat transfer plate is formed of a member having a high heat transfer efficiency, for example, an aluminum plate or a copper plate.

  As shown in FIG. 1, the electronic component D to be tested is placed directly on the heat transfer plate at the bottom of the test chamber 10 surrounded by the heat transfer plates at the bottom and side walls. However, a jig may be arranged on the bottom heat transfer plate, and the electronic component D may be arranged on the jig so that the electronic component D is floated in the test space 15.

  The opened upper part of the test tank 10 is covered with the lid part 5, thereby preventing release of heat from the test tank 10 or inflow of heat into the test tank 10. The lid 5 may be covered with a heat insulating material.

  A thermo module assembly 20 is disposed below the heat transfer plate at the bottom of the test tank 10. The thermo module assembly 20 is formed by stacking thermo module units 20-1 to 20-n. The structure of each thermomodule unit 20-1 to 20-n is the same.

  The upper surface of the single thermomodule stacked on the top is in contact with the lower surface of the heat transfer plate at the bottom of the test chamber 10, and the heat of the thermomodule assembly 20 is efficiently transferred to the bottom and side wall heat transfer plates of the test chamber 10. Is transmitted to.

  From the viewpoint of improving the contact between the upper surface of the single thermomodule stacked on the top and the lower surface of the heat transfer plate at the bottom of the test chamber 10, for example, silicon grease may be applied between them.

  For example, as shown in detail in FIG. 2, the thermo module single unit 20-1 is formed by superposing a ceramic plate 22 and a ceramic plate 24.

  A large number of Peltier elements in which p-type semiconductor elements and n-type semiconductor elements are alternately connected are arranged between the ceramic plate 22 and the ceramic plate 24. Adjacent Peltier elements are connected by solder to metal plates attached to the ceramic plate 22 and the ceramic plate 24 by baking. In the present embodiment, high-temperature solder having a melting temperature exceeding 300 degrees Celsius is used as the solder.

  As a result, the thermo-module unit 20-1 can function even when exposed to a high temperature exceeding 300 degrees Celsius. Note that it is not necessary to use high-temperature solder in a single thermomodule that is not exposed to high temperatures when stacked like the thermomodules 20-1 to 20-n.

  Lead wires L1 and L2 for supplying a current to the thermoelectric element are connected to each basic element 28 of the thermoelectric element at one end and the other end of the thermoelectric element. The lead wires L1 and L2 are supplied with a predetermined current and voltage from a power source by a control unit (not shown) at a predetermined timing for a predetermined time. Depending on the direction of the supplied current, the ceramic plates 22 and 24 generate heat and absorb heat.

  When a current is supplied to each of the thermo module units 20-1 to 20-n via the lead wires L1 and L, the thermo module unit disposed on one surface of the thermo module assembly 20 is at that time. The temperature difference between the thermo module itself is generated by using the temperature obtained by adding the temperature difference to the ambient temperature as the reference temperature. Add. In this way, the uppermost thermomodule unit generates a temperature obtained by adding a temperature difference that can be generated by the thermomodule assembly to the reference temperature.

  The control unit controls the magnitude, timing, time, and the like of power supplied from the power source to the thermo module alone according to the contents of the test program.

  For example, when a predetermined current and voltage are supplied to the thermo module unit 20-1, in the case of heat generation, the thermo module unit 20-1 can generate heat of, for example, about 72 degrees Celsius. For this reason, when, for example, four thermo module units 20-1 are stacked, the thermo module assembly 20 including the thermo module units 20-1 to 20-4 causes a temperature difference of 72 × 4 = 288 (degrees). An exotherm can be obtained.

  As described above, in order to obtain a low temperature and high temperature environment for the electronic component D to be tested, a thermo module assembly in which a required number of the thermo modules 20-1 are superposed is used.

  In addition, the width | variety, depth, and height h2 of the thermomodule single-piece | unit 20-1 are 40 mm, 40 mm, and 4 mm, respectively, for example. In addition, for example, silicon grease is applied between adjacent contact surfaces of a plurality of thermomodules constituting the thermomodule assembly 20 from the viewpoint of increasing the adhesion and increasing the heat transfer efficiency.

  Further, the upper surface of the heat sink 30 for heat exchange is in contact with the lower surface of the thermo module unit 20-n at the lowest side of the thermo module assembly 20. In the heat sink 30, air cooling or water cooling may be performed using a fan or a pump (not shown).

  Further, in order to enhance the adhesion between the lower surface of the thermomodule unit 20-n at the lowest side of the thermomodule assembly 20 and the upper surface of the heat sink 30, for example, silicon grease may be applied between them. Good.

  Although omitted in FIG. 2, the entire periphery of the thermal shock test apparatus 1 is covered with a heat transfer member having a predetermined thickness.

  Below, an example of the usage method of the thermal shock test apparatus 1 is demonstrated.

  First, a thermal shock test apparatus 1 having a thermomodule assembly 20 capable of creating a low temperature environment and a high temperature environment according to the test environment of the electronic component D to be tested is prepared. As described above, the magnitude of the temperature change in the low temperature environment and the high temperature environment is determined by the number of the thermo module units 20-1 to 20-n superimposed.

  For this reason, when the test is performed in a high temperature environment close to 300 degrees Celsius, the thermal shock test apparatus 1 including the thermo module assembly 20 in which the thermo module single units 20-1 to 20-4 are overlapped is used.

  Next, the electronic component D to be tested is placed on the heat transfer plate at the bottom of the test tank 10, and the lid 5 is placed over the opening of the test tank 10. Thereby, a low temperature or a high temperature is supplied directly to the electronic component D from the heat transfer plate.

  Next, a test program for creating a low temperature environment and a high temperature environment according to the test environment of the electronic component D to be tested is set in a control unit (not shown). When this test program is executed, a predetermined voltage / current is supplied from the power source to each of the lead wires L1 and L2 of the thermo module units 20-1 to 20-n according to the contents of the test program.

  Thereby, each thermomodule single-piece | unit 20-1 to 20-n performs predetermined | prescribed heat_generation | fever and heat absorption, These test | inspection object put on it via the heat-transfer plate of the bottom part of the test tank 10 on it. To the electronic component D.

  In this manner, in the thermal shock test, after the electronic component D to be tested is exposed to a high temperature environment of, for example, 250 degrees Celsius or 300 degrees for 30 minutes according to the content of the test program set in the control unit. The process of being exposed to a low temperature environment of -40 degrees Celsius for 1 hour can be performed thousands of times or more.

  In this embodiment, high-temperature solder is used to connect the Peltier elements of the thermomodules 20-1 to 20-n. However, since high-temperature solder tends to be easily oxidized at the time of connection, it is not necessary to use high-temperature solder in all of the thermomodule units 20-1 to 20-n constituting the thermomodule assembly 20. Thus, only a thermo module that may be exposed to a temperature exceeding 200 degrees Celsius may be used that uses high-temperature solder.

  According to this embodiment, the heat generated in the thermomodule assembly 20 is supplied to the electronic component D to be tested directly from the heat transfer plate of the test tank 10. For this reason, heat can be utilized efficiently.

  Further, according to this embodiment, the heat generated in the thermomodule assembly 20 is supplied to the electronic component D to be tested directly from the heat transfer plate of the test tank 10. For this reason, unlike the conventional vapor phase equipment, which heats and cools parts and materials made of solids with a large specific heat by air with a small specific heat, the sample is heated and cooled by a heat transfer plate that is a metal body with a similar specific heat. Therefore, the inside or the inside of the sample can be heated or cooled quickly and efficiently.

  In addition, according to this embodiment, a large machine such as a compressor used in a conventional thermal shock test apparatus is not required, the conventional high temperature air or low temperature air is not required, and the conventional machine part is movable. By removing the part, the life and failure average time can be extended and downsized.

  In addition, in the present thermal shock test apparatus, the upper limit of the test temperature of 120 degrees Celsius or 200 degrees Celsius was the upper limit, and in the present embodiment, the upper limit of the test temperature could be increased to 250 degrees Celsius or 300 degrees Celsius. Thermal analysis tests exceeding 200 degrees Celsius can be easily performed.

[Other embodiments]
In the above embodiment, the thermo module assembly 20 is configured by superimposing the thermo module single units 20-1 to 20-n in the vertical direction. On the other hand, the thermo module single units 20-1 to 20-n are arranged in the horizontal direction to constitute the thermo module assembly 20 to increase the area of the thermo module assembly 20, and at the same time, a heat transfer plate at the bottom having a large area. The test tank 10 may be used. Thereby, a test room can be enlarged.

  Moreover, in said embodiment, what formed the test tank 10 in the box shape with which the upper part was closed by the cover part 5 was used, but the test tank 10 is arrange | positioned at a flat heat-transfer plate and its circumference | surroundings. And a heat transfer plate on the side wall.

  In the case of this embodiment, a plurality of types of heat transfer plates having different side wall heights are prepared, and the height of the test space in the test chamber 10 is determined by properly using them depending on the height difference of the electronic component D to be tested. Can be set to an appropriate size.

DESCRIPTION OF SYMBOLS 1 Thermal shock test apparatus 5 Lid part 10 Test tank 20 Thermo module assembly 20-1 to 20-n Thermo module single unit 22, 24 Ceramic plate 28 Basic element 30 Heat sink

Claims (3)

A heat sink for heat exchange,
A thermo module assembly consisting of a plurality of thermo modules arranged in contact with the upper surface of the heat sink; and
A test chamber disposed in contact with the upper surface of the uppermost thermomodule unit of the thermomodule assembly;
A power supply for supplying power to each thermo module alone;
A controller for controlling the magnitude, timing, and time of power supplied from the power source to each thermo module alone;
A thermal shock test apparatus characterized in that high-temperature solder is used for connection of thermoelectric elements in at least some of the thermomodules exposed to high temperatures among the plurality of thermomodules arranged in a stacked manner. . The uppermost thermo module unit consists of a plurality of thermo module units arranged side by side so as to be in contact with the heat transfer plate of the test tank,
The one part of the thermo module using the high-temperature solder is used as a single thermo module exposed to a temperature exceeding 200 degrees Celsius in the plurality of thermo modules arranged in a stacked manner. Item 2. The thermal shock test apparatus according to Item 1.   The thermal shock test apparatus according to claim 1, wherein the heat sink includes a fan or a pump that performs air cooling or water cooling.

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