JP6229455B2 - Light emitting device and manufacturing method thereof - Google Patents

Light emitting device and manufacturing method thereof Download PDF

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JP6229455B2
JP6229455B2 JP2013242623A JP2013242623A JP6229455B2 JP 6229455 B2 JP6229455 B2 JP 6229455B2 JP 2013242623 A JP2013242623 A JP 2013242623A JP 2013242623 A JP2013242623 A JP 2013242623A JP 6229455 B2 JP6229455 B2 JP 6229455B2
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light emitting
emitting element
metal
metal wire
covering portion
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JP2015103643A (en
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慎平 笹岡
慎平 笹岡
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Nichia Corp
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Nichia Corp
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Description

本発明は、発光素子と、それを封止する封止部材と、を備えた発光装置及びその製造方法に関するものである。   The present invention relates to a light emitting device including a light emitting element and a sealing member for sealing the light emitting element, and a method for manufacturing the same.

従来、発光装置において、固化前の封止部材を堰き止め、その形成範囲を制御する堰には、白色樹脂が一般的に使用されている（例えば特許文献１参照）。   Conventionally, in a light emitting device, a white resin is generally used for a weir that dams a sealing member before solidification and controls the formation range thereof (see, for example, Patent Document 1).

特開２０１２−００９７９４号公報JP 2012-009794 A 特開２０１３−１２０８７４号公報JP 2013-120874 A

しかしながら、樹脂で構成される堰は、「濡れ」の理論から高さと幅の関係に制約があり、固化前の封止部材を堰き止めるのに十分な高さを得るには、幅方向にも比較的大きく形成する必要がある。   However, the weir made of resin has a restriction on the relationship between height and width based on the theory of “wetting”, and in order to obtain a sufficient height to dam the sealing member before solidification, it is also necessary in the width direction. It needs to be formed relatively large.

そこで、本発明は、かかる事情に鑑みてなされたものであり、封止部材の構成を小型に制御可能な発光装置を提供することを目的とする。   Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide a light emitting device capable of controlling the configuration of a sealing member in a small size.

上記課題を解決するために、本発明の発光装置は、金属部材と、前記金属部材の上面に載置される発光素子と、前記金属部材の上面に接続する金属線と、前記発光素子を封止する封止部材と、を備え、前記金属線は、上面視において、前記発光素子を挟む又は囲むように設けられており、前記封止部材は、前記発光素子を覆う第１被覆部を含み、前記第１被覆部の縁は、前記金属線に沿うように設けられていることを特徴とする。   In order to solve the above problems, a light-emitting device of the present invention seals a metal member, a light-emitting element placed on the upper surface of the metal member, a metal wire connected to the upper surface of the metal member, and the light-emitting element. And the metal wire is provided so as to sandwich or surround the light emitting element in a top view, and the sealing member includes a first covering portion that covers the light emitting element. The edge of the first covering portion is provided along the metal wire.

また、本発明の発光装置の製造方法は、金属部材の上面に発光素子を載置する工程と、前記金属部材の上面に接続する金属線を、上面視において、前記発光素子を挟む又は囲むように設ける工程と、前記発光素子を覆う第１被覆部を含む封止部材によって前記発光素子を封止する工程と、を備え、前記第１被覆部は、少なくとも一部が前記金属線によって堰き止められた状態で固化されることを特徴とする。   Further, in the method for manufacturing a light emitting device of the present invention, the step of placing the light emitting element on the upper surface of the metal member and the metal wire connected to the upper surface of the metal member sandwich or surround the light emitting element in a top view. And a step of sealing the light emitting element with a sealing member including a first covering portion that covers the light emitting element, and at least a part of the first covering portion is dammed by the metal wire It is characterized by being solidified.

本発明によれば、幅狭で高い堰を形成しやすい金属線を用いて固化前の封止部材（被覆部）を堰き止めることで、封止部材の構成を小型に制御することができる。   According to the present invention, the configuration of the sealing member can be controlled to be small by damming the sealing member (covering portion) before solidification using a metal wire that is narrow and easy to form a high weir.

本発明の一実施の形態に係る発光装置の概略正面図（ａ）と、そのＡ−Ａ断面における概略断面図（ｂ）である。It is the schematic front view (a) of the light-emitting device which concerns on one embodiment of this invention, and the schematic sectional drawing (b) in the AA cross section. 本発明の一実施の形態に係る発光装置の製造方法の一例を説明する概略断面図である。It is a schematic sectional drawing explaining an example of the manufacturing method of the light-emitting device which concerns on one embodiment of this invention. 本発明の一実施の形態に係る発光装置の概略正面図（ａ）と、そのＢ−Ｂ断面における概略断面図（ｂ）である。It is the schematic front view (a) of the light-emitting device which concerns on one embodiment of this invention, and the schematic sectional drawing (b) in the BB cross section.

以下、発明の実施の形態について適宜図面を参照して説明する。但し、以下に説明する発光装置及びその製造方法は、本発明の技術思想を具体化するためのものであって、特定的な記載がない限り、本発明を以下のものに限定しない。また、一の実施の形態、実施例において説明する内容は、他の実施の形態、実施例にも適用可能である。また、各図面が示す部材の大きさや位置関係等は、説明を明確にするため、誇張していることがある。   Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device and the manufacturing method thereof described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. The contents described in one embodiment and example are applicable to other embodiments and examples. In addition, the size, positional relationship, and the like of members illustrated in each drawing may be exaggerated for clarity of explanation.

＜実施の形態１＞
図１（ａ）は実施の形態１に係る発光装置の概略上面図であり、図１（ｂ）は図１（ａ）におけるＡ−Ａ断面を示す概略断面図である。 <Embodiment 1>
FIG. 1A is a schematic top view of the light-emitting device according to Embodiment 1, and FIG. 1B is a schematic cross-sectional view showing the AA cross section in FIG.

図１に示すように、実施の形態１に係る発光装置１００は、金属部材１０と、発光素子２０と、金属線３０と、封止部材４０と、を備えている。発光素子２０は、金属部材１０の上面に載置されている。金属線３０は、金属部材１０の上面に接続している。封止部材４０は、発光素子２０を封止している。   As shown in FIG. 1, the light emitting device 100 according to Embodiment 1 includes a metal member 10, a light emitting element 20, a metal wire 30, and a sealing member 40. The light emitting element 20 is placed on the upper surface of the metal member 10. The metal wire 30 is connected to the upper surface of the metal member 10. The sealing member 40 seals the light emitting element 20.

より詳細には、発光装置１００は、表面実装型ＬＥＤである。発光装置１００は、発光素子２０と、発光素子２０を収納する凹部が設けられたパッケージと、凹部の内側において発光素子２０を覆うように設けられた封止部材４０と、を備える。パッケージは、正負一対のリード電極と、そのリード電極を一体的に保持する樹脂成形体である包囲体５０と、を有する。金属部材１０は、正負一対のリード電極の一方である。パッケージの凹部の底面の一部は、正負一対のリード電極の上面により構成されている。発光素子２０は、ＬＥＤ素子であり、パッケージの凹部の底面に接着剤で接着され、各リード電極にワイヤで接続されている。   More specifically, the light emitting device 100 is a surface mount type LED. The light emitting device 100 includes a light emitting element 20, a package provided with a recess for housing the light emitting element 20, and a sealing member 40 provided so as to cover the light emitting element 20 inside the recess. The package includes a pair of positive and negative lead electrodes and an enclosure 50 that is a resin molded body that integrally holds the lead electrodes. The metal member 10 is one of a pair of positive and negative lead electrodes. A part of the bottom surface of the concave portion of the package is constituted by the upper surfaces of a pair of positive and negative lead electrodes. The light emitting element 20 is an LED element, which is bonded to the bottom surface of the recess of the package with an adhesive and connected to each lead electrode with a wire.

金属線３０は、上面視において、発光素子２０を囲むように設けられている。封止部材４０は、発光素子２０を覆う第１被覆部４１を含んでいる。そして、第１被覆部４１の縁は、金属線３０に沿うように設けられている。   The metal wire 30 is provided so as to surround the light emitting element 20 in a top view. The sealing member 40 includes a first covering portion 41 that covers the light emitting element 20. And the edge of the 1st coating | coated part 41 is provided so that the metal wire 30 may be followed.

このような構成を有する発光装置１００は、第１被覆部４１の形成範囲が金属線３０によって小型に制御されている。このように、金属線は、封止部材用の堰を比較的狭い領域に且つ比較的高く形成できるので、小型の発光装置においても封止部材の構成を制御しやすい。   In the light emitting device 100 having such a configuration, the formation range of the first covering portion 41 is controlled to be small by the metal wire 30. Thus, the metal wire can form the weir for the sealing member in a relatively narrow region and relatively high, so that the configuration of the sealing member can be easily controlled even in a small light emitting device.

また、発光装置１００は、発光素子２０から側方に出射される光を、金属線３０により装置正面方向（本例では上方）に反射させることができるので、装置の正面光度を高めることができる。   Further, since the light emitting device 100 can reflect the light emitted from the light emitting element 20 to the side by the metal wire 30 in the front direction of the device (upward in this example), the front luminance of the device can be increased. .

なお、金属線３０は、図示するように、上面視において発光素子２０を囲むように設けられていることで、封止部材４０の形成範囲を制御しやすく好ましいが、上面視において少なくとも発光素子２０を挟むように設けられていれば、固化前の封止部材４０の一方向の堰き止め機能を発揮できる。   As shown in the drawing, the metal wire 30 is preferably provided so as to surround the light emitting element 20 in a top view, so that the formation range of the sealing member 40 can be easily controlled, but at least the light emitting element 20 in the top view. If it is provided so as to sandwich, the damming function in one direction of the sealing member 40 before solidification can be exhibited.

また、図１に示すように、封止部材４０は、第１被覆部４１を覆う該第１被覆部４１とは異なる第２被覆部４２を含んでいる。これにより、第２被覆部４２により金属線３０を覆うことができ、金属線３０の外気や水分による腐食を抑え、金属線３０の光吸収による光損失を抑制することができる。また、金属線３０により形成範囲を制御される封止部材４０の部位が内部側の第１被覆部４１であることで、金属線３０から外側への意図しない封止部材４０の漏出による影響を軽減することができる。   As shown in FIG. 1, the sealing member 40 includes a second covering portion 42 that is different from the first covering portion 41 that covers the first covering portion 41. Thereby, the metal wire 30 can be covered with the 2nd coating | coated part 42, the corrosion by the external air and the water | moisture content of the metal wire 30 can be suppressed, and the optical loss by the light absorption of the metal wire 30 can be suppressed. Moreover, since the site | part of the sealing member 40 by which the formation range is controlled by the metal wire 30 is the 1st coating | coated part 41 of an inner side, the influence by the leakage of the sealing member 40 from the metal wire 30 to the outer side is influenced. Can be reduced.

なお、第１被覆部４１は、発光素子２０の上方と側方を連続的に覆ってもよいし、発光素子２０の上方を露出させて発光素子２０の側方を覆ってもよい。後者の場合、第１被覆部４１は、充填剤を含有し、光反射性つまり白色に形成されてもよい。第２被覆部４２は、発光素子２０及び第１被覆部４１の上方と側方を連続的に覆ってもよいし、第１被覆部４１の側方を露出させて発光素子２０及び第１被覆部４１の上方を覆ってもよい。第２被覆部４２は省略することも可能であり、金属線３０により堰き止められるのが封止部材４０の最外郭であってもよい。   The first covering portion 41 may continuously cover the upper side and the side of the light emitting element 20, or may expose the upper side of the light emitting element 20 to cover the side of the light emitting element 20. In the latter case, the first covering portion 41 may contain a filler and be light-reflective, that is, white. The second covering part 42 may continuously cover the upper side and the side of the light emitting element 20 and the first covering part 41, or the side of the first covering part 41 is exposed to expose the light emitting element 20 and the first covering part 42. The upper portion of the portion 41 may be covered. The second covering portion 42 may be omitted, and the outermost wall of the sealing member 40 may be blocked by the metal wire 30.

封止部材４０の各被覆部の形状は、金属線３０のほか、その被覆部の母材の量などにより制御することができる。本例において、第１被覆部４１は、上部が上方に向かって凸状に形成されているが、上部が略平坦に形成されてもよい。また、第２被覆部４２は、パッケージの凹部を満たすように充填され、上面が略平坦に形成されているが、上面が上方に向かって凸状に形成されていてもよい。   The shape of each covering portion of the sealing member 40 can be controlled by the amount of the base material of the covering portion in addition to the metal wire 30. In this example, although the upper part of the first covering part 41 is formed in a convex shape upward, the upper part may be formed substantially flat. Further, the second covering portion 42 is filled so as to fill the concave portion of the package and the upper surface is formed substantially flat, but the upper surface may be formed in a convex shape upward.

また、封止部材４０は、蛍光体や充填剤を含有していてもよく、各被覆部における蛍光体や充填剤の含有／非含有を選択して組み合わせることができる。本実施の形態１の第１被覆部４１は、蛍光体を含有しているが、蛍光体を実質的に含有していなくてもよく、図示する例とは逆に、第２被覆部４２が蛍光体を含有していてもよい。   Further, the sealing member 40 may contain a phosphor or a filler, and the inclusion / non-containment of the phosphor or the filler in each covering portion can be selected and combined. Although the 1st coating | coated part 41 of this Embodiment 1 contains fluorescent substance, it does not need to contain fluorescent substance substantially and the 2nd coating | coated part 42 is contrary to the example to show in figure. It may contain a phosphor.

このほか、封止部材４０の構成として、例えば第１被覆部４１に第２被覆部４２より高屈折率の母材を用いるなど、各被覆部に互いに異なる種類の母材を用いることにより、各被覆部の屈折率を変え、配光や光取り出し効率を調整することができる。また、例えばガスバリア性、線膨張率、弾性率、硬度、固化前の粘度など、光学的性質以外の性質により、各被覆部に用いる母材の種類を選択してもよい。このように、第２被覆部４２は、性質又は構成材料を第１被覆部４１と異なるものとすることができる。   In addition, as a configuration of the sealing member 40, for example, by using a different base material for each covering portion, such as using a base material having a higher refractive index than the second covering portion 42 for the first covering portion 41, By changing the refractive index of the covering portion, the light distribution and the light extraction efficiency can be adjusted. In addition, the type of base material used for each covering portion may be selected depending on properties other than optical properties such as gas barrier properties, linear expansion coefficient, elastic modulus, hardness, viscosity before solidification, and the like. In this way, the second covering portion 42 can be different in nature or constituent material from the first covering portion 41.

図２は、実施の形態１に係る発光装置の製造方法の一例を説明する概略断面図である。図２に示すように、発光装置１００は、例えば、以下に示す工程（ｉ）〜（ｖ）を経て製造することができる。なお、本例では、複数の発光装置用の金属部材１０がマトリクス状に配置された複合基板（本例ではリードフレーム）を用いているが、単一の発光装置について図示する。   FIG. 2 is a schematic cross-sectional view illustrating an example of a method for manufacturing the light emitting device according to Embodiment 1. As shown in FIG. 2, the light emitting device 100 can be manufactured through the following steps (i) to (v), for example. In this example, a composite substrate (in this example, a lead frame) in which a plurality of metal members 10 for light emitting devices are arranged in a matrix is used, but a single light emitting device is illustrated.

まず、金属部材１０の上面に発光素子２０を載置する（工程（ｉ））。具体的には、発光素子２０を接着剤により金属部材１０の上面に接着する。また本例では、発光素子２０と金属部材１０をワイヤにより接続する。   First, the light emitting element 20 is mounted on the upper surface of the metal member 10 (step (i)). Specifically, the light emitting element 20 is bonded to the upper surface of the metal member 10 with an adhesive. In this example, the light emitting element 20 and the metal member 10 are connected by a wire.

次に、金属部材１０の上面に接続する金属線３０を、上面視において、発光素子２０を挟む又は囲むように設ける（工程（ｉｉ））。具体的には、ワイヤボンディング装置等を用いて、金属部材１０の上面同士を接続する金属線３０を、上面視において発光素子２０を挟む又は囲むように形成する。   Next, the metal wire 30 connected to the upper surface of the metal member 10 is provided so as to sandwich or surround the light emitting element 20 when viewed from above (step (ii)). Specifically, using a wire bonding apparatus or the like, the metal wire 30 that connects the upper surfaces of the metal members 10 is formed so as to sandwich or surround the light emitting element 20 in a top view.

なお、工程（ｉ）と工程（ｉｉ）は、順序を問わず、どちらが先でも後でもよい。より詳細には、工程（ｉｉ）は、発光素子２０を金属部材１０に接着する工程の前でも後でもよい。また、本例のように、発光素子２０の金属部材１０への電気的接続にワイヤを用いる場合、本工程（ｉｉ）を発光素子２０のワイヤボンディング工程の前又は後に連続して行うと、生産性が良い。金属線３０は、発光素子２０に接続するワイヤとの高さや形成順序の関係によって、上面視において発光素子２０に接続するワイヤと交差するように形成することができる。また逆に、金属線３０は、上面視において発光素子２０に接続するワイヤから離間して形成することで、発光素子２０に接続するワイヤとの干渉を避けることができる。   In addition, process (i) and process (ii) may be before or after regardless of the order. More specifically, the step (ii) may be performed before or after the step of bonding the light emitting element 20 to the metal member 10. Moreover, when using a wire for the electrical connection of the light emitting element 20 to the metal member 10 as in this example, if this step (ii) is continuously performed before or after the wire bonding step of the light emitting element 20, production is performed. Good sex. The metal wire 30 can be formed so as to intersect the wire connected to the light emitting element 20 in a top view depending on the height of the wire connected to the light emitting element 20 and the relationship of the order of formation. Conversely, the metal wire 30 is formed away from the wire connected to the light emitting element 20 in a top view, so that interference with the wire connected to the light emitting element 20 can be avoided.

次に、発光素子２０を覆う第１被覆部４１を含む封止部材４０によって発光素子２０を封止する。具体的には、ディスペンサ等を用いて、流動性を有する状態（液状、ゾル状、又はスラリー状）の封止部材４０を、発光素子２０を被覆するように滴下した後、封止部材４０を加熱又は冷却等により固化させる。本例では、第１被覆部４１の滴下−固化（工程（ｉｉｉ））と、第２被覆部４２の滴下−固化（工程（ｉｖ））と、を順次行う。そして、このとき、第１被覆部４１は、少なくとも一部が金属線３０によって堰き止められた状態で固化される。なお、第１被覆部４１の固化は、第２被覆部４２の滴下以前に行うことで第１被覆部４１の形状を制御しやすく、第２被覆部４２の固化と同時に行うことで第１被覆部４１と第２被覆部４２との高い密着性が得られやすい。また、第２被覆部４２の滴下以前に第１被覆部４１を半固化させることで、上記の形状制御と密着性の両立を図ることができる。   Next, the light emitting element 20 is sealed by the sealing member 40 including the first covering portion 41 that covers the light emitting element 20. Specifically, using a dispenser or the like, after dropping the sealing member 40 in a fluid state (liquid, sol, or slurry) so as to cover the light emitting element 20, the sealing member 40 is Solidify by heating or cooling. In this example, the first covering portion 41 is dropped and solidified (step (iii)) and the second covering portion 42 is dropped and solidified (step (iv)) sequentially. At this time, the first covering portion 41 is solidified in a state where at least a part thereof is blocked by the metal wire 30. The first covering portion 41 is solidified before the second covering portion 42 is dropped, so that the shape of the first covering portion 41 can be easily controlled, and simultaneously with the solidification of the second covering portion 42, the first covering portion 41 is solidified. High adhesion between the portion 41 and the second covering portion 42 is easily obtained. In addition, the first covering portion 41 is semi-solidified before the second covering portion 42 is dropped, so that both shape control and adhesion can be achieved.

最後に、発光装置１００を個片化する（工程（ｖ））。   Finally, the light emitting device 100 is singulated (step (v)).

なお、封止部材４０（の被覆部）が「金属線３０によって堰き止められた状態」や封止部材４０（の被覆部）の「縁が金属線３０に沿うように設けられている」とは、封止部材４０が金属線３０から外側に全く出ていない状態のみを指すのではなく、金属線３０によって金属線３０から外側への封止部材４０の漏出が抑止された状態を含む。より具体的には、固化前の封止部材４０の表面張力等によって、封止部材４０が金属線３０に纏い付くように金属線３０の近隣で止まっていれば、封止部材４０が金属線３０から外側に出ている状態も含み得る。   In addition, the sealing member 40 (the covering portion thereof) is “in a state where it is dammed by the metal wire 30” or “the edge of the sealing member 40 (the covering portion thereof) is provided along the metal wire 30”. Includes not only the state in which the sealing member 40 does not protrude outward from the metal wire 30 but also the state in which the leakage of the sealing member 40 from the metal wire 30 to the outside is suppressed by the metal wire 30. More specifically, if the sealing member 40 stops in the vicinity of the metal wire 30 so that the sealing member 40 is attached to the metal wire 30 due to the surface tension of the sealing member 40 before solidification, the sealing member 40 becomes the metal wire. It may also include a state of protruding outward from 30.

以下、金属線３０の好ましい形態について説明する。   Hereinafter, the preferable form of the metal wire 30 is demonstrated.

金属線３０は、金属部材１０の上面同士を接続する１つのアーチを１つの単位として考えることができる。この１単位は、上面視において線状に設けられる。金属線３０は、上面視において枠状に設けられることで、固化前の封止部材４０を堰き止めやすく、封止部材４０の形成範囲を制御しやすい。特に、金属線３０は、上面視円形状に設けられることが理想的であるが、多くの発光素子２０が上面視矩形状であり、上面視においてｎが４以上のｎ角形状に設けられるとよい。また、金属線３０は、上面視において、単位と単位が離間していてもよい、すなわち破線状に設けられてよいが、単位と単位を連続させることもできる。   In the metal wire 30, one arch connecting the upper surfaces of the metal members 10 can be considered as one unit. This one unit is provided in a line shape in a top view. The metal wire 30 is provided in a frame shape in a top view, so that the sealing member 40 before solidification can be easily dammed and the formation range of the sealing member 40 can be easily controlled. In particular, the metal wire 30 is ideally provided in a circular shape when viewed from the top, but many light emitting elements 20 are rectangular when viewed from the top, and n is provided in an n-square shape with n being 4 or more when viewed from the top. Good. In addition, the metal wire 30 may have a unit and a unit that are separated from each other when viewed from above, that is, may be provided in a broken line shape, but the unit and the unit may be continuous.

金属線３０は、発光素子２０の１つの側面に対向して、１単位で（単一のアーチを描くように）設けられてもよいが、複数の単位で（複数のアーチを描くように）設けられることが好ましい。これにより、金属線３０を発光素子２０の側面に対向して密に配置することができる。したがって、金属線３０により、固化前の封止部材４０を堰き止めやすく、封止部材４０の形成範囲を制御しやすい。また、発光素子２０から側方に出射される光を金属線３０により反射させやすい。   The metal wire 30 may be provided in one unit (to draw a single arch) facing one side surface of the light emitting element 20, but in a plurality of units (to draw a plurality of arches). It is preferable to be provided. Thereby, the metal wire 30 can be densely arranged so as to face the side surface of the light emitting element 20. Therefore, it is easy to dam the sealing member 40 before solidification by the metal wire 30, and it is easy to control the formation range of the sealing member 40. Further, the light emitted from the light emitting element 20 to the side is easily reflected by the metal wire 30.

金属線３０の高さ（金属部材１０の上面を基準とし金属線３０の最高点で定義できる）が発光素子２０の上面より高ければ、固化前の封止部材４０を堰き止めやすく、封止部材４０の形成範囲を制御しやすい。また、発光素子２０の側面から出射される光を、金属部材１０の上面と金属線３０との間を通過させて取り出しやすい。一方、金属線３０の高さが発光素子２０の上面より低ければ、金属線３０の多くの部分が発光素子２０の側面に対向して配置されやすく、発光素子２０の側面から出射される光を上方に反射させやすい。   If the height of the metal wire 30 (which can be defined by the highest point of the metal wire 30 with reference to the upper surface of the metal member 10) is higher than the upper surface of the light emitting element 20, the sealing member 40 before solidification can be easily dammed, and the sealing member It is easy to control the formation range of 40. In addition, light emitted from the side surface of the light emitting element 20 can be easily extracted by passing between the upper surface of the metal member 10 and the metal wire 30. On the other hand, if the height of the metal wire 30 is lower than the upper surface of the light emitting element 20, many portions of the metal wire 30 are easily disposed to face the side surface of the light emitting element 20, and light emitted from the side surface of the light emitting element 20 is reduced. Easy to reflect upward.

金属線３０は、金属部材１０の上面に対して、略垂直に設けられるのが簡便で良いが、外側又は内側に傾斜して設けられていてもよい。   The metal wire 30 may be simply provided to be substantially perpendicular to the upper surface of the metal member 10, but may be provided to be inclined outward or inward.

封止部材４０の１つの被覆部を制御する金属線３０は、発光素子２０が載置された金属部材１０（本例では一方のリード電極）上にのみ設けられてもよいし、比較的大きい被覆部を制御する場合には、発光素子２０が載置された金属部材１０上に加えて、別の金属部材（本例では他方のリード電極）上にも設けられてもよい。   The metal wire 30 that controls one covering portion of the sealing member 40 may be provided only on the metal member 10 (one lead electrode in this example) on which the light emitting element 20 is placed, or is relatively large. When controlling the covering portion, in addition to the metal member 10 on which the light emitting element 20 is placed, it may be provided on another metal member (the other lead electrode in this example).

金属部材１０の上面の発光素子２０の周囲に、金属部材１０の保護被膜やアンダーフィルが設けられる場合、金属線３０は、その保護被膜やアンダーフィルに被覆されていてもよい。なお、保護被膜は例えば酸化アルミニウムや酸化珪素の薄膜、アンダーフィルは例えば酸化チタンなどの充填剤を含む／含まない樹脂、で構成することができる。また、金属線３０は、例えば酸化チタンなどの光反射性粒子の凝集体又はそれに樹脂が含浸したものに被覆されていてもよい。但し、これら金属線３０の被覆は、金属線３０が固化前の封止部材４０の堰としての機能を果たすことが可能な程度とする。具体的には、例えば、金属線３０の形状が維持可能な程度の薄さでの被覆、又は金属線３０の一部（例えば上部）が露出される被覆などが挙げられる。   When a protective coating or underfill of the metal member 10 is provided around the light emitting element 20 on the upper surface of the metal member 10, the metal wire 30 may be covered with the protective coating or underfill. The protective film can be made of, for example, a thin film of aluminum oxide or silicon oxide, and the underfill can be made of a resin that contains / does not contain a filler such as titanium oxide. Further, the metal wire 30 may be covered with an aggregate of light reflecting particles such as titanium oxide or a resin impregnated therein. However, the coating of these metal wires 30 is such that the metal wires 30 can function as a weir of the sealing member 40 before solidification. Specifically, for example, a coating with such a thin thickness that the shape of the metal wire 30 can be maintained, or a coating in which a part of the metal wire 30 (for example, the upper portion) is exposed, etc.

＜実施の形態２＞
図３（ａ）は実施の形態２に係る発光装置の概略上面図であり、図３（ｂ）は図３（ａ）におけるＢ−Ｂ断面を示す概略断面図である。 <Embodiment 2>
3A is a schematic top view of the light-emitting device according to Embodiment 2, and FIG. 3B is a schematic cross-sectional view showing a BB cross section in FIG. 3A.

図３に示すように、実施の形態２に係る発光装置２００は、金属部材１０と、複数の発光素子２１，２２（第１素子２１、第２素子２２）と、金属線３０と、封止部材４０と、を備えている。発光素子２１，２２は、金属部材１０の上面に載置されている。金属線３０は、金属部材１０の上面に接続している。封止部材４０は、発光素子２１，２２を封止している。   As shown in FIG. 3, the light-emitting device 200 according to Embodiment 2 includes a metal member 10, a plurality of light-emitting elements 21 and 22 (first element 21 and second element 22), a metal wire 30, and a sealing. And a member 40. The light emitting elements 21 and 22 are placed on the upper surface of the metal member 10. The metal wire 30 is connected to the upper surface of the metal member 10. The sealing member 40 seals the light emitting elements 21 and 22.

より詳細には、発光装置２００は、表面実装型ＬＥＤである。発光装置２００は、発光素子２１，２２と、発光素子２１，２２を収納する凹部が設けられたパッケージと、凹部の内側において発光素子２１，２２を覆うように設けられた封止部材４０と、を備える。パッケージは、正負一対のリード電極と、そのリード電極を一体的に保持する樹脂成形体である包囲体５０と、を有する。金属部材１０は、正負一対のリード電極の一方である。パッケージの凹部の底面の一部は、正負一対のリード電極の上面により構成されている。発光素子２１，２２は其々、ＬＥＤ素子であり、パッケージの凹部の底面に接着剤で接着され、各リード電極にワイヤで接続されている。   More specifically, the light emitting device 200 is a surface mount type LED. The light-emitting device 200 includes a light-emitting element 21 and 22, a package provided with a recess for housing the light-emitting elements 21 and 22, a sealing member 40 provided so as to cover the light-emitting elements 21 and 22 inside the recess, Is provided. The package includes a pair of positive and negative lead electrodes and an enclosure 50 that is a resin molded body that integrally holds the lead electrodes. The metal member 10 is one of a pair of positive and negative lead electrodes. A part of the bottom surface of the concave portion of the package is constituted by the upper surfaces of a pair of positive and negative lead electrodes. Each of the light emitting elements 21 and 22 is an LED element, which is adhered to the bottom surface of the concave portion of the package with an adhesive and connected to each lead electrode with a wire.

金属線３０は、上面視において、発光素子２１，２２を各々、挟む又は囲むように設けられている。封止部材４０は、第１素子２１を覆う第１被覆部４１と、第２素子２２を覆う第１及び第２被覆部４１，４２とは異なる第３被覆部４３と、第１及び第３被覆部４１，４３を覆う第２被覆部４２と、を含む。そして、第１及び第３被覆部４１，４３の縁は、金属線３０に沿うように設けられている。   The metal wire 30 is provided so as to sandwich or surround the light emitting elements 21 and 22 in a top view. The sealing member 40 includes a first covering portion 41 that covers the first element 21, a third covering portion 43 that is different from the first and second covering portions 41 and 42 that cover the second element 22, and the first and third portions. And a second covering portion 42 that covers the covering portions 41 and 43. The edges of the first and third covering parts 41 and 43 are provided along the metal wire 30.

このような構成を有する発光装置２００は、第１被覆部４１及び第３被覆部４３の形成範囲が其々、金属線３０によって小型に制御されている。このように、発光素子及びそれを被覆する被覆部が複数になっても、その被覆部の形成範囲を金属線３０によって小型に制御することができる。   In the light emitting device 200 having such a configuration, the formation ranges of the first covering portion 41 and the third covering portion 43 are controlled to be small by the metal wire 30. As described above, even when there are a plurality of light emitting elements and covering portions covering the light emitting elements, the formation range of the covering portions can be controlled to be small by the metal wire 30.

本実施の形態２では、第１被覆部４１は蛍光体を実質的に含有しておらず、第２被覆部４２は第２被覆部４２内の下方側に多く分布する蛍光体を含有している。これにより、発光素子２１，２２から上方に出射される光を、蛍光体による散乱や光吸収を抑えて取り出すことができ、装置の正面光度を高めることができると共に、発光素子２１，２２から側方に出射される光により蛍光体を励起して波長変換光を取り出すことができる。   In the second embodiment, the first covering portion 41 does not substantially contain phosphors, and the second covering portion 42 contains phosphors distributed in a large amount on the lower side in the second covering portion 42. Yes. As a result, light emitted upward from the light emitting elements 21 and 22 can be taken out while suppressing scattering and light absorption by the phosphor, and the front luminance of the apparatus can be increased. The wavelength-converted light can be extracted by exciting the phosphor with the light emitted in the direction.

このほか、第１被覆部４１と第３被覆部４３が其々互いに異なる蛍光体を含有するなどしてもよく、その場合、第２被覆部４２は、蛍光体を実質的に含有していなくてもよいし、第１及び第３被覆部とは異なる蛍光体を含有してもよいし、又は充填剤を含有していてもよい。   In addition, the 1st coating | coated part 41 and the 3rd coating | coated part 43 may contain the mutually different fluorescent substance, respectively, in that case, the 2nd coating | coated part 42 does not contain a fluorescent substance substantially. Alternatively, a phosphor different from the first and third covering portions may be contained, or a filler may be contained.

以下、本発明の発光装置の各構成要素について説明する。   Hereinafter, each component of the light emitting device of the present invention will be described.

（金属部材１０）
金属部材は、パッケージの樹脂成形体に保持されるリード電極の形態と、配線基板の上面に設けられる配線の形態と、が挙げられる。 (Metal member 10)
Examples of the metal member include a form of a lead electrode held by a resin molded body of a package and a form of a wiring provided on the upper surface of the wiring board.

（リード電極）
リード電極の母体は、銅、アルミニウム、金、銀、タングステン、鉄、ニッケル、コバルト、モリブデン、又はこれらの合金、燐青銅、鉄入り銅などの金属板に、プレスやエッチング、圧延など各種の加工を施したものが挙げられる。特に、銅を主成分とする銅合金が好ましい。また、その母体の表面に、銀、アルミニウム、ロジウム、金、銅、又はこれらの合金などの鍍金や光反射膜が設けられていてもよく、なかでも光反射性に最も優れる銀が好ましい。 (Lead electrode)
The base of the lead electrode is a metal plate such as copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum, or an alloy thereof, phosphor bronze, iron-containing copper, and various processing such as pressing, etching, and rolling. Is given. In particular, a copper alloy containing copper as a main component is preferable. Further, a plating or light reflecting film such as silver, aluminum, rhodium, gold, copper, or an alloy thereof may be provided on the surface of the base, and silver that is most excellent in light reflectivity is preferable.

（配線）
配線基板の母体は、電気的絶縁性のものがよいが、導電性であっても、絶縁膜などを介することで配線と電気的に絶縁させることができる。配線基板の母体の材料としては、酸化アルミニウム、窒化アルミニウム又はこれらの混合物を含むセラミックスや、銅、鉄、ニッケル、クロム、アルミニウム、銀、金、チタン又はこれらの合金を含む金属や、エポキシ樹脂、ＢＴレジン、ポリイミド樹脂などの樹脂又はこれらの繊維強化樹脂（強化材はガラスなど）が挙げられる。また、配線基板は、平板状の形態に限らず、パッケージと同様の凹部を有する形態であってもよい。配線は、配線基板の母体の少なくとも上面に形成され、母体の内部、下面や側面にも形成されていてもよい。また、配線は、発光素子が接合されるランド（ダイパッド）部、外部接続用の端子部、これらを接続する引き出し配線部などを有するものでもよい。配線の材料としては、銅、ニッケル、パラジウム、タングステン、クロム、チタン、アルミニウム、銀、金又はそれらの合金が挙げられる。特に、銅又は銅合金が好ましい。また、その表層に、銀、アルミニウム、ロジウム、金、銅、又はこれらの合金などの鍍金や光反射膜が設けられていてもよく、なかでも光反射性に最も優れる銀が好ましい。 (wiring)
The base of the wiring board is preferably electrically insulating, but even if it is conductive, it can be electrically insulated from the wiring through an insulating film or the like. As a base material of the wiring board, ceramics including aluminum oxide, aluminum nitride or a mixture thereof, metal including copper, iron, nickel, chromium, aluminum, silver, gold, titanium or an alloy thereof, epoxy resin, Examples thereof include resins such as BT resin and polyimide resin, or fiber reinforced resins thereof (the reinforcing material is glass or the like). The wiring board is not limited to a flat plate shape, and may have a concave portion similar to the package. The wiring is formed on at least the upper surface of the mother body of the wiring substrate, and may be formed on the inside, lower surface, and side surfaces of the mother body. Further, the wiring may have a land (die pad) portion to which the light emitting element is bonded, a terminal portion for external connection, a lead-out wiring portion for connecting them, and the like. Examples of the wiring material include copper, nickel, palladium, tungsten, chromium, titanium, aluminum, silver, gold, and alloys thereof. In particular, copper or a copper alloy is preferable. Further, the surface layer may be provided with a plating such as silver, aluminum, rhodium, gold, copper, or an alloy thereof, or a light reflection film, and among them, silver that is most excellent in light reflectivity is preferable.

（発光素子２０）
発光素子は、ＬＥＤ（発光ダイオード）素子などの半導体発光素子を用いることができる。発光素子は、種々の半導体で構成される素子構造に正負一対の電極が設けられたものであればよい。特に、蛍光体を効率良く励起可能な窒化物半導体（ＩｎｘＡｌｙＧａ１−ｘ−ｙＮ、０≦ｘ、０≦ｙ、ｘ＋ｙ≦１）の発光素子が好ましい。このほか、ガリウム砒素系、ガリウム燐系半導体の発光素子でもよい。正負一対の電極が同一面側に設けられた発光素子は、各電極をワイヤでリード電極や配線と接続するフェイスアップ実装されるか、各電極を導電性接着剤でリード電極や配線と接続するフェイスダウン（フリップチップ）実装される。正負一対の電極が互いに反対の面に各々設けられた発光素子は、下面電極が導電性接着剤でリード電極や配線に接着され、上面電極がワイヤでリード電極や配線と接続される。１つの発光装置に搭載される発光素子の個数は１つでも複数でもよい。複数の発光素子は、直列又は並列に接続することができる。 (Light emitting element 20)
As the light emitting element, a semiconductor light emitting element such as an LED (light emitting diode) element can be used. The light emitting element may be any element in which a pair of positive and negative electrodes is provided in an element structure composed of various semiconductors. In particular, a light-emitting element of a nitride semiconductor (In x Al y Ga 1-xy N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) that can excite the phosphor efficiently is preferable. In addition, a gallium arsenide-based or gallium phosphorus-based semiconductor light-emitting element may be used. A light-emitting element in which a pair of positive and negative electrodes are provided on the same surface side is mounted face-up by connecting each electrode to a lead electrode or wiring with a wire, or each electrode is connected to the lead electrode or wiring with a conductive adhesive Face down (flip chip) mounting. In a light emitting element in which a pair of positive and negative electrodes are provided on opposite surfaces, a lower electrode is bonded to a lead electrode or wiring with a conductive adhesive, and an upper electrode is connected to the lead electrode or wiring with a wire. The number of light emitting elements mounted on one light emitting device may be one or plural. The plurality of light emitting elements can be connected in series or in parallel.

（金属線３０）
金属線は、発光素子の電極と金属部材を接続するワイヤと同じものを利用すれば簡便で良く、固化前の封止部材の堰としての機能を考慮して前記ワイヤとは異なるもの（例えば前記ワイヤより線径の大きいもの）を利用してもよい。具体的には、金、銅、銀、白金、アルミニウム又はこれらの合金の金属線を用いることができる。特に、金属線は、少なくとも表面が銀を主成分とする金属で構成されていることが好ましい。これにより、金属線の光吸収による光損失を抑えて、高い光の取り出し効率を得ることできる。また、封止部材からの応力による破断が生じにくく、熱抵抗などに優れる金線も好ましい。銅線は比較的安価で良い。金属線は、線径が例えば１０μｍ以上５００μｍ以下のものを利用でき、固化前の封止部材の堰としての機能の面では、線径が２０μｍ以上２００μｍ以下のものが好ましく、３０μｍ以上１００μｍ以下のものがより好ましい。なお、金属線を第１の金属線、発光素子の電極と金属部材を接続するワイヤを第２の金属線と呼称してもよい。 (Metal wire 30)
The metal wire may be simple if the same wire as the wire connecting the electrode of the light emitting element and the metal member is used, and is different from the wire in consideration of the function as the weir of the sealing member before solidification (for example, the above-described wire). You may utilize the thing of a wire diameter larger than a wire. Specifically, gold, copper, silver, platinum, aluminum, or a metal wire of these alloys can be used. In particular, it is preferable that at least the surface of the metal wire is made of a metal whose main component is silver. Thereby, high light extraction efficiency can be obtained while suppressing light loss due to light absorption of the metal wire. Further, a gold wire that is less likely to break due to stress from the sealing member and is excellent in thermal resistance or the like is also preferable. Copper wire may be relatively inexpensive. A metal wire having a wire diameter of, for example, 10 μm or more and 500 μm or less can be used. In terms of the function as a weir of the sealing member before solidification, the wire diameter is preferably 20 μm or more and 200 μm or less, and preferably 30 μm or more and 100 μm or less. More preferred. The metal wire may be referred to as a first metal wire, and the wire connecting the electrode of the light emitting element and the metal member may be referred to as a second metal wire.

（封止部材４０）
封止部材の母材は、電気的絶縁性を有し、発光素子から出射される光を透過可能（好ましくは透過率７０％以上）であればよい。具体的には、シリコーン樹脂、エポキシ樹脂、フェノール樹脂、ポリカーボネート樹脂、アクリル樹脂、ＴＰＸ樹脂、ポリノルボルネン樹脂、又はこれらの変性樹脂やハイブリッド樹脂が挙げられる。なかでも、シリコーン樹脂又はその変性樹脂は、耐熱性や耐光性に優れ、固化後の体積収縮が少ないため、好ましい。 (Sealing member 40)
The base material of the sealing member may be any material as long as it has electrical insulation and can transmit light emitted from the light emitting element (preferably a transmittance of 70% or more). Specifically, a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, or a modified resin or a hybrid resin thereof can be given. Among these, a silicone resin or a modified resin thereof is preferable because it is excellent in heat resistance and light resistance and has little volume shrinkage after solidification.

（充填剤）
充填剤は、シリカ（酸化珪素）、酸化チタン、酸化マグネシウム、炭酸マグネシウム、水酸化マグネシウム、炭酸カルシウム、水酸化カルシウム、珪酸カルシウム、酸化亜鉛、酸化ジルコニウム、チタン酸バリウム、酸化アルミニウムなどが挙げられる。充填剤の粒子の形状は、破砕状でも球状でもよい。また、充填剤は、中空又は多孔質のものでもよい。 (filler)
Examples of the filler include silica (silicon oxide), titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, zirconium oxide, barium titanate, and aluminum oxide. The shape of the filler particles may be crushed or spherical. The filler may be hollow or porous.

（蛍光体）
蛍光体は、発光素子から出射される一次光の少なくとも一部を吸収して、一次光とは異なる波長の二次光を出射する。具体的には、セリウムで賦活されたイットリウム・アルミニウム・ガーネット、ユウロピウム及び／又はクロムで賦活された窒素含有アルミノ珪酸カルシウム、ユウロピウムで賦活されたサイアロン、ユウロピウムで賦活されたシリケート、マンガンで賦活されたフッ化珪酸カリウムなどが挙げられる。 (Phosphor)
The phosphor absorbs at least part of the primary light emitted from the light emitting element, and emits secondary light having a wavelength different from that of the primary light. Specifically, cerium activated yttrium, aluminum, garnet, europium and / or chromium activated nitrogen-containing calcium aluminosilicate, europium activated sialon, europium activated silicate, activated by manganese Examples include potassium fluorosilicate.

（包囲体５０）
包囲体は、発光素子を包囲する部材であり、通常、その内側に封止部材が設けられる。包囲体は、パッケージの樹脂成形体の形態と、配線基板上に設けられる枠体の形態と、が挙げられる。包囲体は、エポキシ樹脂、シリコーン樹脂、又はこれらの変性樹脂やハイブリッド樹脂などの熱硬化性樹脂、若しくは、脂肪族ポリアミド樹脂、半芳香族ポリアミド樹脂、ポリシクロヘキサンテレフタレートなどの熱可塑性樹脂を母材として用いることができる。また、包囲体は、これらの母材中に、充填剤又は着色顔料として、ガラス、珪酸カルシウム、チタン酸カリウム、酸化チタン、カーボンブラックなどの粒子又は繊維を含有していてもよい。包囲体の光反射率は、発光素子の発光波長において、７５％以上であることが好ましく、９０％以上であることがより好ましい。 (Enclosure 50)
The envelope is a member that surrounds the light emitting element, and a sealing member is usually provided inside the envelope. Examples of the enclosure include a form of a resin molded body of the package and a form of a frame provided on the wiring board. The enclosure is made of epoxy resin, silicone resin, thermosetting resin such as modified resin or hybrid resin thereof, or thermoplastic resin such as aliphatic polyamide resin, semi-aromatic polyamide resin or polycyclohexane terephthalate as a base material. Can be used. Further, the envelope may contain particles or fibers of glass, calcium silicate, potassium titanate, titanium oxide, carbon black, or the like as a filler or a color pigment in these base materials. The light reflectance of the enclosure is preferably 75% or more, and more preferably 90% or more, at the emission wavelength of the light emitting element.

本発明に係る発光装置は、液晶ディスプレイのバックライト光源、各種照明器具、大型ディスプレイ、広告や行き先案内等の各種表示装置、さらには、デジタルビデオカメラ、ファクシミリ、コピー機、スキャナ等における画像読取装置、プロジェクタ装置などに利用することができる。   The light emitting device according to the present invention includes a backlight source of a liquid crystal display, various lighting devices, a large display, various display devices such as advertisements and destination guidance, and an image reading device in a digital video camera, a facsimile, a copier, a scanner, and the like. It can be used for projector devices.

１０…金属部材
２０…発光素子（２１…第１素子、２２…第２素子）
３０…金属線
４０…封止部材（４１…第１被覆部、４１ａ…固化前の第１被腹部、４２…第２被覆部、４２ａ…固化前の第２被腹部、４３…第３被覆部）
５０…包囲体
１００，２００…発光装置 DESCRIPTION OF SYMBOLS 10 ... Metal member 20 ... Light emitting element (21 ... 1st element, 22 ... 2nd element)
DESCRIPTION OF SYMBOLS 30 ... Metal wire 40 ... Sealing member (41 ... 1st coating part, 41a ... 1st stomach part before solidification, 42 ... 2nd coating part, 42a ... 2nd stomach part before solidification, 43 ... 3rd coating part )
50 ... Enclosure 100, 200 ... Light emitting device

Claims (6)

金属部材と、前記金属部材の上面に載置される発光素子と、前記金属部材の上面に接続する金属線と、前記発光素子を封止する封止部材と、を備え、
前記封止部材は、前記発光素子を覆う第１被覆部を含み、
前記発光素子と前記第１被覆部の外側における前記金属部材はワイヤにより接続されており、
前記金属線は、前記金属部材の上面同士を接続するアーチ形状であり、上面視において、前記ワイヤから離間し、前記発光素子を挟む又は囲むように設けられており、
前記第１被覆部の縁は、前記金属線に沿うように設けられている発光装置。 A metal member, a light emitting element placed on the upper surface of the metal member, a metal wire connected to the upper surface of the metal member, and a sealing member for sealing the light emitting element,
The sealing member includes a first covering portion that covers the light emitting element,
The metal member on the outside of the light emitting element and the first covering portion is connected by a wire,
The metal wire has an arch shape that connects the upper surfaces of the metal members, and is provided so as to be separated from the wire and sandwich or surround the light emitting element in a top view.
The edge of the said 1st coating | coated part is a light-emitting device provided along the said metal wire. 前記封止部材は、前記第１被覆部を覆う該第１被覆部とは異なる第２被覆部を含む請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the sealing member includes a second covering portion different from the first covering portion that covers the first covering portion. 前記発光素子は、第１素子と第２素子を含み、
前記金属線は、上面視において、前記第１及び第２素子を各々、挟む又は囲むように設けられており、
前記封止部材は、前記第１素子を覆う前記第１被覆部と、前記第２素子を覆う前記第１及び第２被覆部とは異なる第３被覆部と、前記第１及び第３被覆部を覆う前記第２被覆部と、を含み、
前記第１及び第３被覆部の縁は、前記金属線に沿うように設けられている請求項２に記載の発光装置。 The light emitting element includes a first element and a second element,
The metal wire is provided so as to sandwich or surround each of the first and second elements in a top view,
The sealing member includes the first covering portion that covers the first element, a third covering portion that is different from the first and second covering portions that cover the second element, and the first and third covering portions. The second covering portion covering
The light emitting device according to claim 2, wherein edges of the first and third covering portions are provided along the metal wire. 前記金属線は、少なくとも表面が銀を主成分とする金属で構成されている請求項１乃至３のいずれか一項に記載の発光装置。   4. The light emitting device according to claim 1, wherein at least a surface of the metal wire is made of a metal having silver as a main component. 5. 金属部材の上面に発光素子を載置する工程と、
前記金属部材の上面に接続する金属線を、ワイヤボンディングにより、上面視において、前記発光素子を挟む又は囲むように設ける工程と、
前記発光素子を覆う第１被覆部を含む封止部材によって前記発光素子を封止する工程と、を備え、
前記第１被覆部は、少なくとも一部が前記金属線によって堰き止められた状態で固化される発光装置の製造方法。 Placing the light emitting element on the top surface of the metal member;
Providing a metal wire connected to the upper surface of the metal member by wire bonding so as to sandwich or surround the light emitting element in a top view;
Sealing the light emitting element with a sealing member including a first covering portion that covers the light emitting element, and
The method of manufacturing a light emitting device, wherein the first covering portion is solidified in a state where at least a part thereof is blocked by the metal wire. 前記発光素子を載置する工程の後に、前記発光素子と前記金属部材をワイヤにより接続する工程を有し、
前記金属線を設ける工程は、前記ワイヤにより接続する工程の前又は後に連続して行う請求項５に記載の発光装置の製造方法。 After the step of placing the light emitting element, the step of connecting the light emitting element and the metal member with a wire,
The method of manufacturing a light emitting device according to claim 5 , wherein the step of providing the metal wire is performed continuously before or after the step of connecting with the wire.
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