JP2019033263A - Package and light-emitting device using the same - Google Patents

Abstract

To provide a package having excellent light extraction efficiency and/or a light-emitting device using the package.SOLUTION: A package 100 comprising a first lead electrode 10, a second lead electrode 20, and a resin molding 30 molded integrally with the first and second lead electrodes includes a recess 110 in which a light-emitting device is accommodated. The recess is composed of a base part 111 and a side wall part 119. The base part includes: an element mounting region 113 in which a top surface of the first lead electrode is exposed from the resin molding; and a wire connection region 117 in which a top surface of the second lead electrode is exposed from the resin molding. The element mounting region has a top view shape approximately along a contour of the light-emitting device. The wire connection region is adjacent to the element mounting region and is smaller than the element mounting region. The side wall part's surface is inclined or curved upwards from the element mounting region and the wire connection region so that the recess's opening diameter increases.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to a package and a light emitting device using the same.

  Conventionally, as a package for a light emitting diode (LED), for example, package structures described in Patent Documents 1 and 2 have been proposed.

JP 2010-153861 A JP 2006-324317 A

  However, the conventional package has a problem that light reflection is repeated on the inner surface, and the light from the light emitting element cannot be extracted efficiently.

  Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide a package having excellent light extraction efficiency and / or a light emitting device using the same.

In order to solve the above-described problems, the present invention includes a first lead electrode, a second lead electrode, and a resin molded body formed integrally with the first and second lead electrodes, and emits light. A package having a recess for accommodating an element, wherein the recess includes a base portion and a side wall portion, and the base portion has an upper surface of the first lead electrode exposed from the resin molded body. An element placement area, and a wire connection area where the upper surface of the second lead electrode is exposed from the resin molded body, and the element placement area is a top view substantially along the outer shape of the light emitting element. The wire connection area is adjacent to the element placement area and is smaller than the element placement area, and the surface of the side wall portion extends upward from the element placement area and the wire connection area. The opening diameter of the recess increases toward Wherein the inclined or curved.

  According to the present invention, it is possible to reduce the repetition of light reflection on the inner surface of the package and to efficiently extract light from the light emitting element.

It is a schematic perspective view of the package which concerns on one embodiment of this invention. 1 is a schematic top view of a light emitting device according to an embodiment of the present invention. It is a schematic sectional drawing which shows the AA cross section in FIG. 1B. 1 is a schematic top view of a light emitting device according to an embodiment of the present invention. It is a schematic sectional drawing which shows the BB cross section in FIG. 2A.

  Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the package and the light-emitting device described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. The contents described in one embodiment and example are applicable to other embodiments and examples. In addition, the size, positional relationship, and the like of members illustrated in each drawing may be exaggerated for clarity of explanation.

<Embodiment 1>
1A is a schematic perspective view of a package according to Embodiment 1. FIG. 1B is a schematic top view of the light-emitting device according to Embodiment 1, and FIG. 1C is a schematic cross-sectional view showing a cross section AA in FIG. 1B.

  As shown in FIG. 1A, a package 100 according to Embodiment 1 is an LED package whose outer shape is a square shape when viewed from above. The package 100 includes a first lead electrode 10, a second lead electrode 20, and a resin molded body 30. The resin molded body 30 is molded integrally with the first lead electrode 10 and the second lead electrode 20. The package 100 has a recess 110 in which the light emitting element is accommodated.

  The recess 110 includes a base part 111 and a side wall part 119. The base portion 111 includes an element placement region 113 and a wire connection region (first wire connection region) 117. The element mounting area 113 is an area where the upper surface of the first lead electrode 10 is exposed from the resin molded body 30. The wire connection region 117 is a region where the upper surface of the second lead electrode 20 is exposed from the resin molded body 30. The element placement region 113 has a top view shape substantially along the outer shape of the light emitting element. The wire connection area 117 is adjacent to the element placement area 113 and is smaller than the element placement area 113. The surface of the side wall 119 is inclined so that the opening diameter of the recess 110 increases from the element placement region 113 and the wire connection region 117 upward.

  In the package 100 having such a configuration, the end of the side wall portion 119 (that is, the boundary between the side wall portion 119 and the base portion 111) is provided in the vicinity of the light emitting element, so that light emitted from the light emitting element is directly transmitted. It is easy to deflect on the opening side of the recess 110 by reflecting on the surface of the side wall 119. Accordingly, it is possible to reduce the repetition of light reflection on the inner surface of the package and to efficiently extract light from the light emitting element.

  As illustrated in FIGS. 1B and 1C, the light-emitting device 150 according to Embodiment 1 includes a package 100, a light-emitting element 40, a wire 50, and a sealing member 60. The light emitting element 40 is mounted on the element mounting region 113 of the package. The wire 50 connects the light emitting element 40 and the wire connection region 117 of the package. The sealing member 60 is filled in the recess 110 of the package and seals the light emitting element 40.

  The light emitting device 150 having such a configuration can exhibit the function of the package 100 and efficiently extract light from the light emitting element 40.

  Hereinafter, preferred embodiments of the package 100 and the light emitting device 150 will be described.

  As shown in FIGS. 1A to 1C, the element mounting region 113 and the wire connection region 117 preferably form one continuous planar region. Thereby, generation | occurrence | production of a burr | flash is suppressed at the time of shaping | molding of the resin molding 30, and it is easy to form the element mounting area | region 113 and the wire connection area | region 117 accurately. Further, it is easy to connect the wire 50 to the wire connection region 117.

  As shown in FIGS. 1A and 1B, the top view shape of the element mounting region 113 is a square shape with rounded corners. Since the top view shape of many light emitting elements 40 is rectangular, the top view shape of the element mounting region 113 is preferably a rectangular shape or a rectangular shape with rounded corners. Thereby, the end of the side wall part 119 is easily provided close to the light emitting element 40, and the light emitted from the light emitting element 40 is easily reflected directly on the surface of the side wall part 119. The element placement region 113 is substantially parallel to the outer shape of the resin molded body 30 and the opening of the recess 110 in a top view.

  As shown in FIGS. 1A and 1B, the wire connection region 117 is preferably positioned so that one side constituting the periphery of the wire connection region 117 is substantially collinear with the one side constituting the periphery of the element placement region 113. Thereby, from the viewpoint of molding the resin molded body 30, the element mounting region 113 and the wire connection region 117 are easily formed. In addition, the light emitting element 40 having a rectangular shape in a top view often has at least one of a pair of positive and negative electrodes (pad electrodes) disposed in the vicinity of the corner, and the wire 50 is easily formed correspondingly.

  As shown in FIGS. 1A and 1B, the opening shape of the recess 110 is a rectangular shape with rounded corners substantially along the outer shape of the resin molded body 30 in a top view. Since the top view of the outer shape of many packages is rectangular, the opening shape of the recess 110 is rectangular or substantially rectangular along the outer shape of the resin molded body 30 when viewed from the top. It is preferable that Thereby, the opening of the recess 110 is easily provided, and the light emitted from the light emitting element is easily extracted efficiently. Note that the polarity notch (see the lower left portion of the package in FIG. 1B) is not considered as the opening shape of the recess 110.

  As shown in FIGS. 1A and 1B, the area of the element mounting region 113 (in a top view) is 1.67 times the area of the light emitting element 40 in terms of design (about 1.3 times the length of one side). It is. Thus, the area of the element mounting region 113 is preferably not more than twice the area of the light emitting element 40, more preferably not more than 1.5 times the area of the light emitting element 40, and More preferably, it is 1.2 times or less of the area. With the element mounting region 113 having such a size, the end of the side wall part 119 is easily provided close to the light emitting element 40, and light emitted from the light emitting element 40 is directly reflected on the surface of the side wall part 119. Easy to reflect. The lower limit of the area of the element mounting area 113 is not particularly limited as long as the light emitting element 40 can be fixed to the element mounting area 113, but is preferably larger than the area (one time) of the light emitting element 40. In addition, the adhesive that bonds the light emitting element 40 is preferably separated from the side wall portion 119, but may cover a part of the surface of the side wall portion 119 as long as it is translucent.

  As shown in FIGS. 1A and 1C, the inclination angle θ of the surface of the side wall portion 119 (the angle inside the resin molding 30 with respect to the upper surface of the lead electrode) depends on the configuration (shape and arrangement) of the base portion 111. Change. For this reason, the surface of the side wall part 119 is composed of a plurality of surfaces having different inclination angles θ. The inclination angle θ of the surface of the side wall portion 119 is not particularly limited, but is preferably as small as possible from the viewpoint of light extraction efficiency (however, the predetermined depth of the concave portion 110 can be ensured). Specifically, the inclination angle θ is, for example, greater than 0 ° and 45 ° or less, preferably 5 ° or more and 40 ° or less, and more preferably 5 ° or more and 35 ° or less. In addition, when the surface of the side wall part 119 is curving like Embodiment 2 mentioned later, it shall consider with the tangent in a tangent plane or a cross section.

  As shown in FIG. 1C, the sealing member 60 preferably does not substantially contain a phosphor. Thereby, the surface of the side wall part 119 is most easily used as a reflecting surface without being coated with a phosphor, and the light emitted from the light emitting element 40 is easily reflected directly on the surface of the side wall part 119.

  As illustrated in FIG. 1B, the package 100 may include a protection element 70. The protective element 70 is buried in the resin molded body 30, specifically, the resin molded body 30 constituting the side wall portion 119. Thereby, the light incidence to the protection element 70 and the light absorption by it can be suppressed or avoided. In the package 100, since the inclination angle θ of the surface of the side wall part 119 is relatively small, and the proportion of the side wall part 119 in the recess 110 is relatively large, the protection element 70 can be easily embedded in the resin molded body 30.

  As shown in FIGS. 1A and 1B, in the package 100, the base portion 111 includes a second wire connection region 115. The second wire connection region 115 is a region where the upper surface of the first lead electrode 10 is exposed from the resin molded body 30, which is different from the element mounting region 113. That is, the base portion 111 of the package 100 includes an element placement region 113, a first wire connection region 117, a separation region between the first lead electrode 10 and the second lead electrode 20, and a second wire connection region 115. It is configured to include. And in this Embodiment, these area | regions have comprised one plane area | region continuously. For example, the second wire connection region 115 may be located substantially symmetrical to the first wire connection region 117 with respect to the element placement region 113.

  Further, “smaller than the element mounting area 113” with respect to the wire connection area 117 (also the second wire connection area 115) means that the area is smaller than the element mounting area 113 when viewed from above. Is not particularly limited. However, in the top view, when the direction in which the first lead electrode 10 and the second lead electrode 20 are arranged is the horizontal direction and the direction orthogonal thereto is the vertical direction, at least the length of the wire connection region 117 in the vertical direction It is preferable that the thickness (width) is smaller than that of the element mounting region 113. Further, it is preferable that the length (width) of the wire connection region 117 in the horizontal direction is smaller than that of the element mounting region 113.

<Embodiment 2>
2A is a schematic top view of the light-emitting device according to Embodiment 2, and FIG. 2B is a schematic cross-sectional view showing a BB cross section in FIG. 2A.

  As shown in FIGS. 2A and 2B, a package 200 according to Embodiment 2 is a rectangular LED package whose outer shape is long in the horizontal direction when viewed from above. The package 200 includes a first lead electrode 10, a second lead electrode 20, and a resin molded body 30. The resin molded body 30 is molded integrally with the first lead electrode 10 and the second lead electrode 20. The package 200 has a recess 210 in which the light emitting element is accommodated. The recess 210 includes a base part 211 and a side wall part 219. The base portion 211 includes an element placement area 213 and a wire connection area 217. The element mounting area 213 is an area where the upper surface of the first lead electrode 10 is exposed from the resin molded body 230. The wire connection region 217 is a region where the upper surface of the second lead electrode 20 is exposed from the resin molded body 30. The element mounting area 213 has a top view shape substantially along the outer shape (in this example, a square shape) of the light emitting element. The wire connection area 217 is adjacent to the element placement area 213 and is smaller than the element placement area 213. The surface of the side wall portion 219 is curved so that the opening diameter of the recess 210 increases from the element placement region 213 and the wire connection region 217 upward.

  The light emitting device 250 according to the second embodiment includes a package 200, a light emitting element 41, a wire 50, and a sealing member 60. The light emitting element 41 is mounted on the element mounting region 213 of the package. The wire 50 connects the light emitting element 41 and the wire connection region 217 of the package. The sealing member 60 is filled in the recess 210 of the package and seals the light emitting element 41.

  The package 200 and the light emitting device 250 having such a configuration can also reduce light reflection on the inner surface of the package and efficiently extract light from the light emitting element.

  Hereinafter, preferred embodiments of the package 200 and the light emitting device 250 will be described.

  As shown in FIGS. 2A and 2B, the element placement region 213 and the wire connection region 217 are preferably separated by a protrusion of the resin molded body 30. Thereby, the light emitted from the light emitting element 41 is reflected by the protrusions of the resin molded body 30, and light incident on the wire 50 (particularly in the vicinity of the connection portion with the wire connection region 217) and light absorption thereby are reduced. Can do. In addition, although the protrusion of this resin molding 30 is provided in the separation area of the 1st lead electrode 10 and the 2nd lead electrode 20 in this example, it is the 1st lead electrode 10 or the 2nd lead electrode. 20 may be provided in a biased manner.

  As shown in FIG. 2A, the wire connection region 217 is preferably an extension of a diagonal line of the element mounting region 213 and adjacent to the corner of the element mounting region 213 in a top view. As a result, the proportion of the end of the side wall portion 219 located at the edge of the element mounting region 213 can be made relatively large, and the light emitted from the light emitting element 41 can be easily reflected directly on the surface of the side wall portion 219. When at least one of a pair of positive and negative electrodes (pad electrodes) is a light emitting element having a rectangular shape when viewed from above, a wire is easily formed correspondingly. In addition, the element mounting area 213 is inclined with respect to the outer shape of the resin molded body 30 and the opening of the recess 210 in the top view (rotated by about 45 ° in this example).

  As shown in FIG. 2B, the light emitting element 41 has an upper surface (substrate side) smaller than a lower surface (element structure side), and a side surface is inclined. For this reason, the luminous intensity of the light emitting element 41 is higher in the oblique direction than in the directly upward direction. The light emitting device 250 is configured to easily extract the light emitted from the light emitting element 41 in an oblique direction by directly reflecting the light from the surface of the side wall portion 119.

  As shown in FIG. 2B, the sealing member 60 includes a phosphor 80. The phosphors 80 are dispersed over substantially the entire area within the sealing member 60. Thereby, the coating of the surface of the side wall part 119 with the phosphor 80 is reduced, and the surface of the side wall part 119 is relatively easily used as a reflection surface. Therefore, even when the phosphor 80 is included in the sealing member 60, the light emitted from the light emitting element 41 can be relatively easily reflected directly on the surface of the side wall portion 119.

  In addition to this, even if the phosphor is unevenly distributed in the vicinity of the light emitting element in the sealing member or the phosphor is held by the light emitting element itself, the surface of the side wall portion 119 is less covered with the phosphor, and the side wall is reduced. The surface of the part 119 can be easily used as a reflecting surface.

  As described above, a top-view (upper surface light emission) type package has been described as an embodiment. However, if the package includes the first and second lead electrodes and the resin molded body and has a recess in which the light emitting element is accommodated, A side view (side light emission) type package may be used, and the structure of the external connection terminal is not particularly limited.

  Hereinafter, each component in the package and light-emitting device of the present invention will be described.

(First lead electrode 10 and second lead electrode 20)
As the lead electrode, a metal member that is electrically connected to the light emitting element can be used. Specifically, copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum, or alloys thereof, phosphor bronze, iron-containing copper, and the like can be given. The various shapes of the lead electrode can be formed by subjecting the metal plate material to processing such as pressing, rolling, and etching. Further, the surface layer of the lead electrode may be provided with a light reflecting film such as silver, aluminum, rhodium, gold, copper, or an alloy thereof by plating or the like, and among them, silver that is most excellent in light reflectivity is preferable. .

(Resin molding 30)
As the base material of the resin molded body, a thermosetting resin or a thermoplastic resin can be used. Examples of the thermosetting resin include an epoxy resin, an epoxy-modified resin, a silicone resin, a silicone-modified resin, a polybismaleimide triazine resin, a polyimide resin, and a polyurethane resin. Among these, any one of an epoxy resin, an epoxy-modified resin, a silicone resin, and a silicone-modified resin is preferable. Thermoplastic resins include aliphatic polyamide resin, semi-aromatic polyamide resin, polyethylene terephthalate, polycyclohexane terephthalate, liquid crystal polymer, polycarbonate resin, syndiotactic polystyrene, polyphenylene ether, polyphenylene sulfide, polyether sulfone resin, polyether ketone resin. And polyarylate resin. Of these, aliphatic polyamide resin or polycyclohexane terephthalate is preferable. In these base materials, as a filler or a coloring pigment, glass, silica, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, wollastonite, Mica, zinc oxide, barium titanate, potassium titanate, aluminum borate, aluminum oxide, zinc oxide, silicon carbide, antimony oxide, zinc stannate, zinc borate, iron oxide, chromium oxide, manganese oxide, carbon black, etc. Particles or fibers can be incorporated. Among these, it is preferable to use silica as a filler and titanium oxide or zinc oxide as a color pigment (reflecting material).

(Light emitting elements 40 and 41)
As the light emitting element, a semiconductor light emitting element such as a light emitting diode element can be used. The light emitting element only needs to have an element structure formed of various semiconductors and a pair of positive and negative electrodes. In particular, a light emitting element of a nitride semiconductor (In _x Al _y Ga _1-xy N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) capable of emitting light in the ultraviolet to visible region is preferable. In addition, a gallium arsenide-based or gallium phosphorus-based semiconductor light emitting element emitting green to red light may be used. Many light emitting devices have a substrate. The substrate is preferably translucent, but is not limited thereto. Examples of the base material of the substrate include sapphire, spinel, gallium nitride, aluminum nitride, silicon, silicon carbide, gallium arsenide, gallium phosphorus, indium phosphorus, zinc sulfide, zinc oxide, and zinc selenide. In the case of a light emitting element in which a pair of positive and negative electrodes are provided on the same surface side, each electrode is connected to a lead electrode with a wire and is mounted face up. In the case of a light emitting element having a counter electrode structure in which a pair of positive and negative electrodes are provided on opposite surfaces, the lower electrode is bonded to the lead electrode with a conductive adhesive, and the upper electrode is connected to the lead electrode with a wire. The number of light emitting elements mounted on one package may be one or plural. The plurality of light emitting elements can be connected in series or in parallel by wires. Further, for example, three light emitting elements of blue, green, and red light emission may be mounted on one package.

(Wire 50)
The wire is a conductive wire that connects the electrode of the light emitting element and the lead electrode. Specifically, gold, copper, silver, platinum, aluminum, or a metal wire of these alloys can be used. In particular, a gold wire that is unlikely to break due to stress from the sealing member and is excellent in thermal resistance or the like is preferable. In order to improve light reflectivity, at least the surface may be made of silver.

(Sealing member 60)
The sealing member is a member that seals the light emitting element, the wire, and the like to protect them from dust, moisture, external force, and the like. The base material of the sealing member has only to be electrically insulative and can transmit light emitted from the light emitting element and / or the phosphor (preferably having a transmittance of 70% or more). Specifically, a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, a modified resin thereof, or a hybrid resin containing one or more of these resins can be given. Among these, a silicone resin or a modified resin thereof is preferable because it is excellent in heat resistance and light resistance and has little volume shrinkage after solidification. The sealing member may be mixed with particles having various functions such as a filler and a phosphor in the base material. As the filler, a diffusing agent, a coloring agent, or the like can be used. Specifically, silica, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide, glass And carbon black.

(Protective element 70)
The protection element is an element for protecting the light emitting element from static electricity or a high voltage surge. Specifically, a Zener diode is mentioned.

(Phosphor 80)
The phosphor absorbs at least part of the primary light emitted from the light emitting element, and emits secondary light having a wavelength different from that of the primary light. Specifically, cerium activated yttrium, aluminum, garnet, europium and / or chromium activated nitrogen-containing calcium aluminosilicate, europium activated sialon, europium activated silicate, activated by manganese Examples include potassium fluorosilicate. Thus, a light emitting device that emits mixed light (for example, white light) of primary light and secondary light having a visible wavelength, or a light emitting device that emits visible light secondary light when excited by the primary light of ultraviolet light is used. Can do.

(adhesive)
The adhesive is a member that adheres the light emitting element to the lead electrode. As the insulating adhesive, an epoxy resin, a silicone resin, a polyimide resin, or a modified resin or a hybrid resin thereof can be used. As the conductive adhesive, conductive pastes such as silver, gold, and palladium, tin-bismuth, tin-copper, tin-silver, and gold-tin solders can be used.

Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.
<Example 1>
The light-emitting device of Example 1 is a substantially rectangular parallelepiped top-view type SMD LED having the structure of the light-emitting device 150 of the example shown in FIGS. 1B and 1C (excluding the protective element 70). Hereinafter, description will be made by specifying the vertical (up and down) and horizontal (left and right) directions of the package and the light emitting device shown in FIG. 1B.

  The package has a length of 3.0 mm, a width of 3.0 mm, and a thickness of 0.52 mm, and is formed by integrally molding a resin molded body on a pair of positive and negative (first and second) lead electrodes. Yes. In this package, a processed metal plate (lead frame) consisting of multiple sets of lead electrodes connected vertically and horizontally via suspension leads is placed in a mold, and the liquid resin molding material is injected and solidified. After being released from the mold, it is produced by cutting (dividing into pieces).

  Each of the first and second lead electrodes is a copper alloy plate-shaped piece having a maximum thickness of 0.2 mm and having a surface plated with silver. The exposed areas of the lower surfaces of the first and second lead electrodes are substantially the same surface as the lower surface of the resin molded body and constitute the lower surface of the package. In the first and second lead electrodes, the cut suspension lead portions are exposed at the end surfaces of the package (resin molded body).

  The resin molded body has a square shape with a top view of 3.0 mm length and a width of 3.0 mm, a maximum thickness of 0.52 mm, and is made of an epoxy resin containing silica and titanium oxide. At the approximate center of the upper surface of the resin molded body, that is, the upper surface of the package, there is an opening of 2.6 mm in length and 2.6 mm in width (excluding notches for polarity identification) with rounded corners when viewed from above. A recess having a depth of 0.32 mm is formed.

The recessed part is comprised by the base part and the side wall part. The element mounting region of the base (the corner is rounded) is an exposed region (vertical position is the center, horizontal position is the right end) on the upper surface of the first lead electrode, and the vertical region is 840 μm, This is a substantially square region having a width of 840 μm. The second wire connection region is an exposed region on the upper surface of the first lead electrode (continuous to the left of the element mounting region and the lower side is located on the same straight line), and has a substantially rectangular shape with a length of 420 μm and a width of 310 μm. It is an area. The first wire connection region is an exposed region on the upper surface of the second lead electrode (in the vertical direction, the upper side is positioned on the same straight line as the upper side of the element mounting region, and the horizontal direction is the left end). It is a substantially rectangular region of 420 μm and lateral 230 μm. Between the element mounting region of the base portion and the first wire connection region, there is a separation region of the first lead electrode and the second lead electrode, which is constituted by the surface of the resin molded body. The surface of the side wall portion is formed of a resin molded body, and is inclined with the peripheral edge of the base portion as a substantially starting point (termination). The inclination angle θ of the surface of the side wall portion is 18 to 33 °.

  One light emitting element is bonded to the element mounting area of the package with an adhesive which is dimethyl silicone resin. This light emitting element is an LED element having a vertical 650 μm, a horizontal 650 μm, and a thickness of 150 μm capable of emitting blue light (center wavelength: about 453 nm), in which a nitride semiconductor element structure is laminated on a sapphire substrate. In the light emitting element, the n electrode is connected to the second wire connection region by a wire, and the p electrode is connected to the first wire connection region by a wire. The wire is a gold wire having a wire diameter of 25 μm.

  The recess of the package is filled with a sealing member and covers the light emitting element. The sealing member uses a phenyl silicone resin as a base material, and contains a silica filler therein. The upper surface of the sealing member is substantially the same surface as the upper surface of the package, and is a substantially flat surface (strictly concave surface due to curing shrinkage). The sealing member is formed by dropping a liquid constituent material into the recess of the package by a dispenser or the like and solidifying it by heating.

  The light emitting device of the first embodiment configured as described above can emit light with a radiant flux Φe = 117.1 mW at a current of 65 mA. This is an opening having the same shape when viewed from above, and is a radiant flux Φe = 107.8 mW of a light emitting device manufactured in the same manner except that it is a recess having a side wall surface uniformly inclined at an inclination angle θ = 63 °. The value is as high as 8.7%.

  The light emitting device according to the present invention is used in a backlight device of a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guidance, a projector device, and a digital video camera, a facsimile, a copier, a scanner, etc. It can be used for an image reading device or the like.

DESCRIPTION OF SYMBOLS 100,200 ... Package 110,210 ... Concave part 111, 211 ... Base part (113, 213 ... Element mounting area, 115 ... 2nd wire connection area, 117, 217 ... Wire connection area (1st wire connection area) )
119, 219 ... side wall 10 ... first lead electrode 20 ... second lead electrode 30 ... resin molding 150, 250 ... light emitting device 40, 41 ... light emitting element 50 ... wire 60 ... sealing member 70 ... protective element 80 ... phosphor

Claims (10)

A package comprising a first lead electrode, a second lead electrode, and a resin molded body molded integrally with the first and second lead electrodes, and having a recess for accommodating a light emitting element. ,
The concave portion is constituted by a base portion and a side wall portion,
The base portion includes an element placement region in which an upper surface of the first lead electrode is exposed from the resin molded body, a wire connection region in which an upper surface of the second lead electrode is exposed from the resin molded body, Including
The element mounting area is a top view shape substantially along the outer shape of the light emitting element,
The wire connection area is adjacent to the element placement area and is smaller than the element placement area;
The package in which the surface of the side wall portion is inclined or curved so that the opening diameter of the concave portion increases from the element placement region and the wire connection region upward.   The package according to claim 1, wherein the element mounting area and the wire connection area form one continuous plane area.   The package according to claim 1, wherein the element placement area and the wire connection area are separated by a protrusion of the resin molded body.   The package according to any one of claims 1 to 3, wherein a top view shape of the element mounting region is a rectangular shape or a rectangular shape with rounded corners.   5. The package according to claim 4, wherein the wire connection region has a side that constitutes a periphery of the wire connection region located substantially on the same straight line as a side that constitutes the periphery of the element mounting region.   The package according to claim 4, wherein the wire connection region is on an extension of a diagonal line of the element mounting region in a top view and is adjacent to a corner of the element mounting region.   The opening shape of the concave portion (not considering the notch for polarity identification) is a rectangular shape or a rectangular shape with rounded corners substantially along the outer shape of the resin molded body in a top view. The package according to any one of claims 1 to 6.   The package according to any one of claims 1 to 7, wherein an area of the element mounting region is larger than an area of the light emitting element and not more than twice an area of the light emitting element. A package according to any one of claims 1 to 8;
A light emitting element placed in the element placement area;
A wire connecting the wire connection region and the light emitting element;
And a sealing member that fills the recess and seals the light emitting element.   The light emitting device according to claim 9, wherein the sealing member does not substantially contain a phosphor.

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