JP6228602B2 - 最適化されたプリント回路基板 - Google Patents

最適化されたプリント回路基板 Download PDF

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Publication number
JP6228602B2
JP6228602B2 JP2015521128A JP2015521128A JP6228602B2 JP 6228602 B2 JP6228602 B2 JP 6228602B2 JP 2015521128 A JP2015521128 A JP 2015521128A JP 2015521128 A JP2015521128 A JP 2015521128A JP 6228602 B2 JP6228602 B2 JP 6228602B2
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JP
Japan
Prior art keywords
printed circuit
circuit board
light emitting
pcb
fingers
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Active
Application number
JP2015521128A
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English (en)
Japanese (ja)
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JP2015530731A5 (enExample
JP2015530731A (ja
Inventor
マルタイン ヘンリ リシャルト ランクホルスト
マルタイン ヘンリ リシャルト ランクホルスト
アントニウス ペトルス マリヌス ディンヘマンス
アントニウス ペトルス マリヌス ディンヘマンス
ナウト ヨハネス フルーレン
ナウト ヨハネス フルーレン
ベルトラント ヤン ベルナルト ナヴァッロ
ベルトラント ヤン ベルナルト ナヴァッロ
カミル メルト カカル
カミル メルト カカル
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Signify Holding BV
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Signify Holding BV
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Publication date
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Application filed by Signify Holding BV filed Critical Signify Holding BV
Publication of JP2015530731A publication Critical patent/JP2015530731A/ja
Publication of JP2015530731A5 publication Critical patent/JP2015530731A5/ja
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Publication of JP6228602B2 publication Critical patent/JP6228602B2/ja
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP2015521128A 2012-07-12 2013-07-10 最適化されたプリント回路基板 Active JP6228602B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261670682P 2012-07-12 2012-07-12
EP12176205 2012-07-12
US61/670,682 2012-07-12
EP12176205.8 2012-07-12
PCT/IB2013/055677 WO2014009906A1 (en) 2012-07-12 2013-07-10 Optimized printed circuit board

Publications (3)

Publication Number Publication Date
JP2015530731A JP2015530731A (ja) 2015-10-15
JP2015530731A5 JP2015530731A5 (enExample) 2016-08-25
JP6228602B2 true JP6228602B2 (ja) 2017-11-08

Family

ID=49915479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015521128A Active JP6228602B2 (ja) 2012-07-12 2013-07-10 最適化されたプリント回路基板

Country Status (5)

Country Link
US (1) US9383069B2 (enExample)
EP (1) EP2873310B1 (enExample)
JP (1) JP6228602B2 (enExample)
CN (1) CN104472026B (enExample)
WO (1) WO2014009906A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12399398B2 (en) 2023-09-18 2025-08-26 Samsung Electronics Co., Ltd. Display apparatus

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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DE102013206728A1 (de) * 2013-04-15 2014-11-06 Osram Gmbh Leuchtsystem
DE102016203883A1 (de) * 2016-03-09 2017-09-14 Osram Gmbh Leuchtdiodenanordnung für eine Flächenleuchte
WO2021037815A1 (en) * 2019-08-28 2021-03-04 Signify Holding B.V. A layout generation system, corresponding method and computer program for generating a layout of a printed circuit board
EP4459369A4 (en) * 2022-05-11 2025-03-19 LG Electronics Inc. Backlight unit and display device
WO2025091333A1 (zh) * 2023-11-01 2025-05-08 京东方科技集团股份有限公司 结构件、发光基板、背光模组及显示装置
KR20250065150A (ko) * 2023-11-03 2025-05-12 삼성전자주식회사 디스플레이 장치
KR20250082495A (ko) * 2023-11-30 2025-06-09 삼성전자주식회사 광원 장치, 그 제조 방법 및 광원 장치를 포함하는 디스플레이 장치
US12321064B1 (en) 2023-12-01 2025-06-03 Samsung Electronics Co., Ltd. Display apparatus

Family Cites Families (18)

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DE19712879A1 (de) 1997-03-27 1998-10-01 Turck Werner Kg Verfahren zum Herstellen einer Schaltung und zugehöriges Nutzen
JP2001332769A (ja) * 2000-05-22 2001-11-30 Mitsubishi Cable Ind Ltd 発光ダイオード照明具
JP2003331604A (ja) * 2002-05-16 2003-11-21 Harison Toshiba Lighting Corp バックライトユニット
US7901102B2 (en) * 2004-10-22 2011-03-08 Samsung Electronics Co., Ltd. Backlight unit and liquid crystal display apparatus employing the same
DE102006033894B4 (de) * 2005-12-16 2019-05-09 Osram Gmbh Beleuchtungseinrichtung und Anzeigegerät mit einer Beleuchtungseinrichtung
JP4151717B2 (ja) * 2006-07-21 2008-09-17 ソニー株式会社 光源モジュール、光源装置及び液晶表示装置
JP4290753B2 (ja) * 2007-08-10 2009-07-08 シャープ株式会社 Led光源、led光源の製造方法、面光源装置、および映像表示装置
CN201188301Y (zh) * 2008-04-29 2009-01-28 李金传 可任意扩充的发光二极管显示模块
JP2010062456A (ja) * 2008-09-05 2010-03-18 Sharp Corp 光源、映像表示装置、および照明装置、ならびにそれらの製造方法
DE102008049057B4 (de) * 2008-09-26 2019-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Organisches opto-elektrisches Bauelement und ein Verfahren zur Herstellung eines organischen opto-elektrischen Bauelements
KR101020992B1 (ko) * 2009-03-02 2011-03-09 엘지이노텍 주식회사 발광 모듈 및 이를 구비한 라이트 유닛
TWM366267U (en) * 2009-04-16 2009-10-01 Taiwan Oasis Technology Co Ltd LED substrate
US8083373B2 (en) * 2009-07-23 2011-12-27 James William Zimmerman LED retrofit for fluorescent backlit signs
US8547702B2 (en) 2009-10-26 2013-10-01 Ibiden Co., Ltd. Multi-piece board and method for manufacturing the same
DE102010008876B4 (de) * 2010-02-22 2017-07-27 Integrated Micro-Electronics Bulgaria Lichtquelle mit Array-LEDs zum direkten Betrieb am Wechselspannungsnetz und Herstellungsverfahren hierfür
US8307547B1 (en) * 2012-01-16 2012-11-13 Indak Manufacturing Corp. Method of manufacturing a circuit board with light emitting diodes
FR2993634A1 (fr) * 2012-07-19 2014-01-24 Chromlech Module lumineux et systeme lumineux modulaire correspondant
JP6171796B2 (ja) * 2012-10-03 2017-08-02 日亜化学工業株式会社 発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12399398B2 (en) 2023-09-18 2025-08-26 Samsung Electronics Co., Ltd. Display apparatus

Also Published As

Publication number Publication date
EP2873310B1 (en) 2019-02-27
CN104472026A (zh) 2015-03-25
WO2014009906A1 (en) 2014-01-16
EP2873310A1 (en) 2015-05-20
JP2015530731A (ja) 2015-10-15
CN104472026B (zh) 2018-06-01
US20150198293A1 (en) 2015-07-16
US9383069B2 (en) 2016-07-05

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