JP6228602B2 - 最適化されたプリント回路基板 - Google Patents
最適化されたプリント回路基板 Download PDFInfo
- Publication number
- JP6228602B2 JP6228602B2 JP2015521128A JP2015521128A JP6228602B2 JP 6228602 B2 JP6228602 B2 JP 6228602B2 JP 2015521128 A JP2015521128 A JP 2015521128A JP 2015521128 A JP2015521128 A JP 2015521128A JP 6228602 B2 JP6228602 B2 JP 6228602B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- light emitting
- pcb
- fingers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Structure Of Printed Boards (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261670682P | 2012-07-12 | 2012-07-12 | |
| EP12176205 | 2012-07-12 | ||
| US61/670,682 | 2012-07-12 | ||
| EP12176205.8 | 2012-07-12 | ||
| PCT/IB2013/055677 WO2014009906A1 (en) | 2012-07-12 | 2013-07-10 | Optimized printed circuit board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015530731A JP2015530731A (ja) | 2015-10-15 |
| JP2015530731A5 JP2015530731A5 (enExample) | 2016-08-25 |
| JP6228602B2 true JP6228602B2 (ja) | 2017-11-08 |
Family
ID=49915479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015521128A Active JP6228602B2 (ja) | 2012-07-12 | 2013-07-10 | 最適化されたプリント回路基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9383069B2 (enExample) |
| EP (1) | EP2873310B1 (enExample) |
| JP (1) | JP6228602B2 (enExample) |
| CN (1) | CN104472026B (enExample) |
| WO (1) | WO2014009906A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12399398B2 (en) | 2023-09-18 | 2025-08-26 | Samsung Electronics Co., Ltd. | Display apparatus |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013206728A1 (de) * | 2013-04-15 | 2014-11-06 | Osram Gmbh | Leuchtsystem |
| DE102016203883A1 (de) * | 2016-03-09 | 2017-09-14 | Osram Gmbh | Leuchtdiodenanordnung für eine Flächenleuchte |
| WO2021037815A1 (en) * | 2019-08-28 | 2021-03-04 | Signify Holding B.V. | A layout generation system, corresponding method and computer program for generating a layout of a printed circuit board |
| EP4459369A4 (en) * | 2022-05-11 | 2025-03-19 | LG Electronics Inc. | Backlight unit and display device |
| WO2025091333A1 (zh) * | 2023-11-01 | 2025-05-08 | 京东方科技集团股份有限公司 | 结构件、发光基板、背光模组及显示装置 |
| KR20250065150A (ko) * | 2023-11-03 | 2025-05-12 | 삼성전자주식회사 | 디스플레이 장치 |
| KR20250082495A (ko) * | 2023-11-30 | 2025-06-09 | 삼성전자주식회사 | 광원 장치, 그 제조 방법 및 광원 장치를 포함하는 디스플레이 장치 |
| US12321064B1 (en) | 2023-12-01 | 2025-06-03 | Samsung Electronics Co., Ltd. | Display apparatus |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19712879A1 (de) | 1997-03-27 | 1998-10-01 | Turck Werner Kg | Verfahren zum Herstellen einer Schaltung und zugehöriges Nutzen |
| JP2001332769A (ja) * | 2000-05-22 | 2001-11-30 | Mitsubishi Cable Ind Ltd | 発光ダイオード照明具 |
| JP2003331604A (ja) * | 2002-05-16 | 2003-11-21 | Harison Toshiba Lighting Corp | バックライトユニット |
| US7901102B2 (en) * | 2004-10-22 | 2011-03-08 | Samsung Electronics Co., Ltd. | Backlight unit and liquid crystal display apparatus employing the same |
| DE102006033894B4 (de) * | 2005-12-16 | 2019-05-09 | Osram Gmbh | Beleuchtungseinrichtung und Anzeigegerät mit einer Beleuchtungseinrichtung |
| JP4151717B2 (ja) * | 2006-07-21 | 2008-09-17 | ソニー株式会社 | 光源モジュール、光源装置及び液晶表示装置 |
| JP4290753B2 (ja) * | 2007-08-10 | 2009-07-08 | シャープ株式会社 | Led光源、led光源の製造方法、面光源装置、および映像表示装置 |
| CN201188301Y (zh) * | 2008-04-29 | 2009-01-28 | 李金传 | 可任意扩充的发光二极管显示模块 |
| JP2010062456A (ja) * | 2008-09-05 | 2010-03-18 | Sharp Corp | 光源、映像表示装置、および照明装置、ならびにそれらの製造方法 |
| DE102008049057B4 (de) * | 2008-09-26 | 2019-01-31 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organisches opto-elektrisches Bauelement und ein Verfahren zur Herstellung eines organischen opto-elektrischen Bauelements |
| KR101020992B1 (ko) * | 2009-03-02 | 2011-03-09 | 엘지이노텍 주식회사 | 발광 모듈 및 이를 구비한 라이트 유닛 |
| TWM366267U (en) * | 2009-04-16 | 2009-10-01 | Taiwan Oasis Technology Co Ltd | LED substrate |
| US8083373B2 (en) * | 2009-07-23 | 2011-12-27 | James William Zimmerman | LED retrofit for fluorescent backlit signs |
| US8547702B2 (en) | 2009-10-26 | 2013-10-01 | Ibiden Co., Ltd. | Multi-piece board and method for manufacturing the same |
| DE102010008876B4 (de) * | 2010-02-22 | 2017-07-27 | Integrated Micro-Electronics Bulgaria | Lichtquelle mit Array-LEDs zum direkten Betrieb am Wechselspannungsnetz und Herstellungsverfahren hierfür |
| US8307547B1 (en) * | 2012-01-16 | 2012-11-13 | Indak Manufacturing Corp. | Method of manufacturing a circuit board with light emitting diodes |
| FR2993634A1 (fr) * | 2012-07-19 | 2014-01-24 | Chromlech | Module lumineux et systeme lumineux modulaire correspondant |
| JP6171796B2 (ja) * | 2012-10-03 | 2017-08-02 | 日亜化学工業株式会社 | 発光装置 |
-
2013
- 2013-07-10 US US14/413,013 patent/US9383069B2/en active Active
- 2013-07-10 EP EP13765478.6A patent/EP2873310B1/en active Active
- 2013-07-10 CN CN201380036783.2A patent/CN104472026B/zh active Active
- 2013-07-10 JP JP2015521128A patent/JP6228602B2/ja active Active
- 2013-07-10 WO PCT/IB2013/055677 patent/WO2014009906A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12399398B2 (en) | 2023-09-18 | 2025-08-26 | Samsung Electronics Co., Ltd. | Display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2873310B1 (en) | 2019-02-27 |
| CN104472026A (zh) | 2015-03-25 |
| WO2014009906A1 (en) | 2014-01-16 |
| EP2873310A1 (en) | 2015-05-20 |
| JP2015530731A (ja) | 2015-10-15 |
| CN104472026B (zh) | 2018-06-01 |
| US20150198293A1 (en) | 2015-07-16 |
| US9383069B2 (en) | 2016-07-05 |
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