JP6224943B2 - One-component solvent-free room temperature curable organosiloxane silicone resin adhesive and method for producing the same - Google Patents

Description

The present invention has a high thermal conductivity having the composition of the binder及beauty radiating filler composed of a polymer alloy of an organic resin such as silicone resin and non-solvent type urethane resin, one-component solvent-free cold-curing nonconducting The present invention relates to an organosiloxane silicone resin adhesive and a method for producing the same.

For example, a light emitting component such as an LED module generates heat by driving, and if the state continues for a long time, the generated heat accumulates and the temperature of the component rises, resulting in a decrease in luminous efficiency. A heat radiator such as a heat radiating fin is attached to increase the heat radiation efficiency from the light emitting component.

This radiator is fixed to the heat-generating component using an adhesive. However, since many adhesives for fixing the heat-generating component and the heat-dissipator used in the past have low thermal conductivity, the heat-generating component is used. However, even if the heat sink is attached, heat is accumulated and the beating efficiency (light emission efficiency in the case of a light emitting component) is greatly reduced with the driving time.

For example, conventionally, a urethane-modified epoxy resin composition has been used as an adhesive for fixing a heat-generating component and a radiator. However, 240 to 260 is used as an adhesive for fixing a radiator in order to stack a number of metals of an electronic device. Since heat of about 0 ° C. was generated, the resins themselves deteriorated, and an adhesive obtained by adding a heat radiation filler to a urethane resin-modified epoxy resin was not sufficient. Therefore, an adhesive using a silicon resin instead of an epoxy resin is presented in Japanese Patent Laid-Open No. 3-74483.

The adhesive presented in this publication uses a water-based silica aqueous sol and a silane coupling agent, presents a heat-resistant adhesive to which inorganic refractory powder is added, and is used as an adhesive for electrical equipment. However, the inorganic material heat radiation filler used is a powder using quartz, feldspar, feldspar, aluminum silicate, zirconium silicate, mullite, zirconia, alumina, silicon nitride, silicon carbide, talc, mica, etc. Further, it has been desired to employ an inorganic material heat dissipating filler having a high thermal conductivity.

On the other hand, JP 2009-167420 A discloses a room temperature curable organopolysiloxane composition having excellent flame retardancy in which a platinum complex having a silicon atom as a flame retardancy imparting agent or a platinum complex and the organosiloxane are mixed. However, this invention improves the flame retardancy of the organosiloxane resin itself, and cannot be said to improve heat conductivity and heat resistance.

JP-A-3-74483 JP 2009-167420 A

In the adhesive for fixing the heat-generating component and the radiator, the present invention can adopt a heat-dissipating filler having excellent thermal conductivity, has excellent flame retardancy after curing, and is incombustible even when exposed to high temperatures for a long time. It is an object of the present invention to provide an organosiloxane-based silicone resin adhesive that hardly deteriorates in properties and a method for producing the same.

（式中Ｒ^１及びＲ^２は、それぞれ独立にメチル基又はフェニル基より選ばれる同一もしく
は異なる基を示し、Ｒ^３はメチル基、フェニル基又は、炭素数１〜５のアルコキシル基よ
り選ばれる同一もしくは異なる基を示し、ｎ個のＲ^３のうち少なくとも一個はアルコキシ
ル基で表される。ｎは４〜２０の数を示す。）
One-part solventless ambient temperature curable organosiloxane silicone fat resin adhesive composition is a present invention has been made to solve the above problems, organopolysiloxane emissions 100 weight represented by the following general formula (1) relative parts, gamma-aminopropyltriethoxysilane, gamma (2-aminoethyl) aminopropyl trimethoxysilane, gamma (2-aminoethyl) Aminopuro pills triethoxysilane, 5 a silane coupling agent selected from aminopropyl methyl dimethoxy silane In addition to using aluminum nitride (AlN) as a binder composed of a room temperature curable composition containing 40 parts by weight, silicon nitride, boron nitride, zinc oxide, crystalline silica, manganese, ferrite (FeMn) ₂ O ₃ , ferric oxide _{(Fe 2 O} 3), silica nanoparticles, alumina nanoparticles Alumina _{(Al 2 O} 3), silicon carbide, silicon carbide (SiC), magnesium oxide (MgO), an average particle diameter that combines at least one or more of the titanium oxide (TiO ₂ (rutile)) is 0.4Myuemu～1. the heat radiating filler is 5μm relative to the total of the adhesive, characterized in that is 30-50 wt% free Yes.

Wherein R ¹ and R ² each independently represent the same or different group selected from a methyl group or a phenyl group, and R ³ is the same selected from a methyl group, a phenyl group, or an alkoxyl group having 1 to 5 carbon atoms. Alternatively, it represents a different group, and at least one of n R ³ is represented by an alkoxyl group. N represents a number of 4 to 20.)

In addition, aluminum nitride (AlN) is always used as the heat dissipating filler, and silicon nitride, boron nitride, zinc oxide, crystalline silica, manganese, ferrite (FeMn) ₂ O ₃ , and ferric oxide (Fe ₂ O ₃ ) are used. , At least one of silica nanoparticles around 100 nm, alumina nanoparticles , alumina (Al ₂ O ₃ ), silicon carbide (SiC), magnesium oxide (MgO), and titanium oxide (TiO ₂ (rutile type)) The above is used in combination. In particular, the heat dissipating filler is characterized in that aluminum nitride (AlN) is always used, and in addition, any one or three of silicon carbide and alumina are mixed and dispersed.

In particular, it is preferable that the average particle diameter of the heat dissipation filler is 0.4 μm to 1.5 μm , and 30% to 50% is added to the entire adhesive.

（式中Ｒ^１及びＲ^２は、それぞれ独立にメチル基又はフェニル基より選ばれる同一もしくは異なる基を示し、Ｒ^３はメチル基、フェニル基又は、炭素数１〜５のアルコキシル基より選ばれる同一もしくは異なる基を示し、ｎ個のＲ^３のうち少なくとも一個はアルコキシル基で表される。ｎは４〜２０の数を示す。）
Furthermore, the process for producing a one-component solventless room temperature curable organosiloxane resin adhesive according to the present invention is based on 100 parts by weight of organopolysiloxane represented by the following general formula (1), and γ-aminopropyltriethoxysilane. , gamma (2-aminoethyl) aminopropyl trimethoxysilane, gamma (2-aminoethyl) Aminopuro pills triethoxysilane, one-component solventless contain a silane coupling agent 5-40 parts by weight selected from aminopropyl methyl dimethoxy silane A binder comprising the room temperature curable composition is generated, and after adding a dispersant to the obtained binder and stirring, aluminum nitride (AlN) is always used, and silicon nitride, boron nitride, zinc oxide, crystalline silica, manganese, ferrite _(FeMn) 2 _{O 3,} ferric oxide _{(Fe 2 O} 3), silica Bruno particles, alumina nanoparticles, alumina _{(Al 2 O} 3), silicon carbide, silicon carbide (SiC), magnesium oxide (MgO), average particle which is a combination of at least one or more of the titanium oxide (TiO ₂ (rutile)) diameter characterized by uniformly stirring the radiating filler is 5 to 300 parts by weight added pressure is 0.4Myuemu～1.5Myuemu.

Wherein R ¹ and R ² each independently represent the same or different group selected from a methyl group or a phenyl group, and R ³ is the same selected from a methyl group, a phenyl group, or an alkoxyl group having 1 to 5 carbon atoms. Alternatively, it represents a different group, and at least one of n R ³ is represented by an alkoxyl group. N represents a number of 4 to 20.)

In particular, the binder, a solvent-free urethane, polyester resin, better effect when mixing at least one of the urethane-modified epoxy resin obtained.

The one-component solventless room temperature curable organopolysiloxane composition cured by the condensation reaction of the present invention as described above is excellent in flame retardancy after curing, and the flame retardancy decreases even when exposed to high temperature for a long time. A coating that does not lose its properties even under severe heat (260-360 ° C.) conditions and does not cause peeling or cracking. Form. For this reason, it is useful as a coating agent, an adhesive agent, or a sealing agent in applications where such characteristics are required, for example, in applications of electronic devices and electrical devices.

  Hereinafter, the present invention will be described in detail based on embodiments.

The one-component solventless room temperature curable organosiloxane resin adhesive of the present invention is a room temperature curable composition formed by mixing an amine silane coupling agent as a curing component and a dispersing agent with an organosiloxane as a main component. Various heat-dissipating fillers are mixed with a binder made of a material, and if necessary, the resin is produced on the basis of adding a resin such as urethane or polyester simultaneously with or after the curing component. This will be described in detail below.

The one-component solvent-free room temperature curable organosiloxane-based silicone resin adhesive composition of the present invention is based on 100 parts by weight of the organopolysiloxane represented by the following general formula (1), γ-aminopropyltriethoxysilane, gamma (2-aminoethyl) aminopropyl trimethoxysilane, gamma (2-aminoethyl) Aminopuro pills triethoxysilane, relative to the silane coupling agent 100 by weight portion selected from aminopropyl methyl dimethoxy silane, 5-40 by weight parts Is a one-component paint comprising a binder of a solvent-free room temperature curable composition. (In the general formula (1), R ¹ and R ² each independently represent the same or different group selected from a methyl group or a phenyl group, and R ³ represents a methyl group, a phenyl group, or a C 1-5 carbon atom. The same or different groups selected from alkoxyl groups, at least one of n R ³ is represented by an alkoxyl group, and n represents a number from 4 to 20.) Also, the silane coupling agent is contained. Aluminum binder (AlN) is always used as a binder composed of a room temperature curable composition, and silicon nitride, boron nitride, zinc oxide, crystalline silica, manganese, ferrite (FeMn) ₂ O ₃ , ferric oxide (Fe _{2) are used.} O _3), before and after the silica nanoparticles 100 nm, alumina nanoparticles, alumina (Al2O _3), silicon carbide, silicon carbide (SiC), magnesium oxide (M O), titanium oxide (TiO ₂ (rutile) overall adhesive radiating filler is an average particle diameter that combines at least one or more of the) is 0.4μm~1.5μm to 30-50 wt% characterized in that it was containing Yes.

More specifically, it is as follows.

Method for Producing Special Silicone Resin A method for producing a one-component solventless room temperature curable organosiloxane resin of the present invention is described in detail below.

(A) an organopolysiloxane (B) gamma-aminopropyl triethoxysilane shown above in formula (1), gamma (2-aminoethyl) aminopropyl trimethoxysilane, gamma (2-aminoethyl) Aminopuro pills triethoxysilane, amino A coating material comprising a solvent-free room temperature curable composition containing 5 to 40 parts by weight of a silane coupling agent selected from propylmethyldimethoxysilane with respect to 100 parts by weight of (A). The present invention relates to an organosiloxane composition excellent in curability at room temperature and a coating comprising the same. More specifically, the present invention has strong adhesion to adhesion between metals and severe heat (260 to 360). The coating film is formed without losing the properties of the coating film even under the conditions of [° C.] without causing peeling or cracking. In the present invention, the one-pack room-temperature solvent-free organosiloxane resin uses “binder A” as the binder having the following composition among many binders. The method is as follows. In the binder of the present invention, R ¹ and R ² represent a methoxy system, and R ³ represents a phenyl system.

Characterized in that it consists of (C) radiating inorganic filler (5-300 parts by weight), which is a normally temperature curable moisture-curable organopolysiloxane composition.

On the other hand, most of the heat dissipating filler used in the present invention is commercially available, and the product used in the present invention is aluminum nitride filler (aluminum nitride (AlN)) (Shape H grade average particle diameter 1 mm). , SER-06 manufactured by Shinano Denki Smelting Co., Ltd. ( average particle size 0.43 μm to 1.53 μm ) The smaller the average particle size, the higher the heat dissipation and the use of these.

In addition, the heat dissipation filler is characterized in that aluminum nitride (AlN) is always used, and in addition, any one of silicon carbide (SiC) and alumina (Al ₂ O ₃ ) or three types are mixed and dispersed. .

In addition to silicon carbide (SiC) and alumina (Al ₂ O ₃ ), boron nitride (BN), magnesium oxide (MgO), oxalic acid (SiO ₂ ), silicon nitride (Si), which are inorganic materials with high thermal conductivity such as the following, are used. ₃ N _4), zinc oxide, crystalline silica, titanium oxide, manganese ferrite _{((FeMn) 2 O 3)} , ferric oxide _{(Fe 2} O 3), 100nm silica nanoparticles before and after the alumina nanoparticles, etc. Can also be used together. All of the above inorganic substances are non-conductive. Aluminum nitride cannot be used because it decomposes with an aqueous binder and cannot be used in combination with a platinum complex. It has a thermal expansion coefficient close to that of silicon, has a purity as high as 99.99%, and an average particle diameter of 0.96 to 1.1 μm and can exhibit the effect in a small amount. This is because it has the best corrosion resistance against halogen plasma on various substrates. Silicon carbide (SiC) <silicon nitride (Si ₃ N ₄ ) <alumina (Al ₂ O ₃ ) <aluminum nitride (AlN) Further, the thermal conductivity of aluminum nitride alone is 200 W / m. The advantage is clear from K.

The present invention relates to organosiloxane compositions excellent in curability at ordinary temperature, more specifically, the condition of having a strong adhesion to the adhesive at the metal between and severe thermal (260-360 ° C.) Needless to say, it forms a coating film that does not lose its coating properties and does not cause peeling or cracking, and can be used as a coating material.

In the present invention , the organosiloxane resin is preferably a binder having the following composition among many binders, and the method is as follows. In the binder of the present invention, R ¹ and R ² are methoxy and R ³ is phenyl.

Methoxy modified silicone (trade name [DC-3037] (manufactured by Dow Corning Toray Co., Ltd.)) as the organosiloxane resin used in the present invention the average molecular weight: 1400, a methoxy group content: with 18% silicone. Further, 10 to 15% of γ-aminopropyltriethoxysilane is used, and the binder of the present invention is a one-part room temperature curing type and is touch-dried for 30 minutes and cured in about 1 hour.

Therefore, it is extremely useful as an organosiloxane resin for line coating.

  In the present invention, the one-component room-temperature solventless organosiloxane resin can be used for the following applications because of its excellent properties.

A) Thermal countermeasures and heat radiation for various electrical products (improving the reliability of electronic circuits)
B) Heat countermeasures and heat radiation of automobile-related electronic components (hybrid vehicles, electric vehicles, etc.)
C) Thermal countermeasures and heat radiation for LED lighting (improving luminous efficiency and extending life)
D) Thermal measures for solar power generation (higher efficiency of solar cell modules)
E) Downsizing of heat dissipation fan → Downsizing of products (air conditioner outdoor unit, etc.)
F) Temperature drop of the entire casing G) Heat absorption effect of steel plates and roof tiles → No heat storage H) Countermeasure against heat stroke due to heat absorption of body temperature I) Heat dissipation countermeasures for other components that easily store heat When solvent - free urethane (Bond KU822S manufactured by Konishi Co., Ltd.) is mixed and used at a weight percent of 10% to 20% in the production, further good results are obtained in the falling ball test.

  In addition, in the production of the silicon resin, when the polyester resin (DIC Corporation Barnock D-161) is used in a mixture of 2.5 to 810%, the tackiness is improved. In the production of a silicone resin, when a urethane-modified epoxy resin EPU 11F (Adeka Co., Ltd.) is used in a mixture of 4 to 10% by weight, good results can be obtained in the adhesion test of plastics.

  Further, the ratio of the organic resin-modified one-part solvent-free room-temperature-drying organosiloxane resin is preferably 47 to 60 from the measurement of the thermal conductivity λ by the hot wire method and the viscosity suitability. Others are heat dissipation filler and titanium oxide powder. Such a ratio yielded a product preferred as an adhesive. Titanium oxide serves as a dispersant.

The application of the present invention is an adhesive for fixing a heat radiator with a compact heat-generating component, and cannot be used unless the heat resistance of the resin itself is good, and requires conventional high heat. Although it could not be used for a purpose, it is made possible by the present invention. That is, it is possible to supply a product having a high thermal conductivity with an adhesive composed of a heat resistant resin that can withstand 300 ° C. to 500 ° C. and a heat dissipating filler.

Next, Examples 1 to 13 of the present invention will be described.

Binder, 92 parts of one-part silicone resin, 8 parts of solvent - free urethane 100 parts Aluminum nitride AlN Shapepal H grade (made by Tokuyama) 20 parts Alumina Al ₂ O ₃ AL-47-1 (made by Showa Denko) 80 parts After mixing for 3 hours, a viscous adhesive was obtained.

Thermal conductivity (λ) 2.9 w / m · K Tensile shear adhesive strength 1.1 N / mm ²

Binder, 92 parts of one-part silicone resin, 8 parts of urethane-modified epoxy resin 100 parts Aluminum nitride AlN 20 parts Silicon carbide SER-06 (Shinano Denki Smelting) 20 parts Alumina Al ₂ O ₃ 60 parts Thermal conductivity (λ) 8w / m · K Tensile shear adhesive strength 1.3N / mm ²

Binder, One-part silicone resin 92 parts, Polyester 8 parts 100 parts Aluminum nitride AlN 20 parts Magnesium oxide MgO # 5000 (Tatejo Chemical) 80 parts Thermal conductivity (λ) 2.8 w / m · K Tensile shear adhesive strength 1.1 N / Mm ²

Binder, one-part silicone resin 95 parts, urethane-modified epoxy resin 5 parts 100 parts Aluminum nitride AlN 10 parts Alumina Al ₂ O ₃ 90 parts Thermal conductivity (λ) 2.3 w / m · K Tensile shear adhesive strength 0.9 N / mm ²

Binder, one-part silicone resin alone 100 parts Aluminum nitride AlN 20 parts Alumina Al ₂ O ₃ 80 parts Thermal conductivity (λ) 4.0 w / m · K Tensile shear adhesive strength 0.6 N / mm ²

Binder, 87 parts of one-part silicone resin, 8 parts of solvent - free urethane,
Urethane-modified epoxy 5 parts 100 parts Aluminum nitride AlN 20 parts Alumina Al ₂ O ₃ 80 parts Thermal conductivity (λ) 2.1 w / m · K Tensile shear adhesive strength 1.3 N / mm ²

Binder, one-part silicone resin 100 parts Aluminum nitride AlN 10 parts
Silicon carbide SiC SER-06 10 parts Alumina Al ₂ O ₃ 80 parts Thermal conductivity (λ) 3.2 w / m · K Tensile shear adhesive strength 0.67 N / mm ²

Binder, one-part silicone resin 90 parts
Solvent - free urethane 5 parts
Urethane modified epoxy 5 parts 100 parts Aluminum nitride 10 parts
Silicon carbide SiC SER-06 10 parts Alumina Al ₂ O ₃ 80 parts Thermal conductivity (λ) 2.9 w / m · K Tensile shear adhesive strength 1.2 N / mm ²

Binder, one-part silicone resin 88 parts Polyester 8 parts
Solvent - free urethane 4 parts 100 parts
10 parts of aluminum nitride
Silicon carbide SER-06 10 parts Alumina AL-47-1 60 parts Rutile titanium oxide 20 parts Thermal conductivity (λ) 3.1 w / m · K Tensile shear adhesive strength 1.4 N / mm ²

One-part silicone resin 80 parts Solvent - free urethane 20 parts 100 parts Aluminum nitride 20 parts Magnesium oxide MgO # 5000 (Tateho Chemical) 20 parts
60 parts of alumina Al ₂ O ₃

One part silicone resin 80 parts Urethane modified epoxy 10 parts
Solvent-free urethane 10 parts 100 parts Aluminum nitride 100 parts
Thermal conductivity (λ) 4.2 w / m · K Tensile shear adhesive strength 1.1 N / mm ²

One part silicone resin 80 parts Urethane modified epoxy 10 parts
Solvent - free urethane 10 parts 100 parts Silicon carbide SIC SER-06 100 parts Thermal conductivity (λ) 2.2 w / m · K Tensile shear adhesive strength 1.2 N / mm ²

One-part silicone resin 70 parts Solvent - free urethane 20 parts Polyester 10 parts 100 parts Aluminum nitride 20 parts Alumina 80 parts Thermal conductivity (λ) 4.2 w / m · K Tensile shear adhesive strength 1.6 N / mm ²
Next, Table 1 summarizes the measurement results of thermal conductivity and tensile shear adhesive strength for Examples 1 to 13. As for the thermal conductivity measurement method, TCR-01 manufactured by Kyoto Denshi Kogyo Co., Ltd. was used, but the hot wire method was used to directly measure the thermal conductivity from the amount of heat generated and the temperature rise of a very simple hot wire (heater wire). It was. Specifically, measurement was performed on commercially available 100 mm porcelain square tiles (thickness 5 mm) with coating thicknesses of 0.5 mm and 0.2 mm. Good samples were dry to the touch in 25 to 30 minutes and measured after 24 hours.

In addition, as for the tensile shear adhesive strength, the test equipment: Chemical Substance Evaluation and Research Institute tester load cell type 10 kN (temperature and humidity measurement method: 23 ± 2 ° C., 50 ± 10% RH) is used. Submitted to the Evaluation Health Organization and tested. Specifically, the sample was applied to both surfaces of the metal and allowed to stand at 23 ± 2 ° C. and 50 ± 10% RH for 15 minutes and dried. The metal coated with the sample was bonded, loaded with 1 kg at 23 ± 2 ° C. and 50 ± 10% RH, and allowed to stand for 96 hours.

From the measurement results in Table 1, the adhesive obtained by combining the organic resin-modified organosiloxane resin of the present invention and the heat-dissipating filler increases the thermal conductivity λ to 3.0 to 4.2 w / m · k, It was proved that the heat storage of parts could be suppressed and the range of application to electronic parts was widened. In addition, with a tensile shearing adhesive strength of 1.0 N / mm ² or more, reliable temporary adhesion is possible with a setting time of about 30 minutes, and it is easy to dry quickly as a silicone resin adhesive, and line coating is also possible It was also elucidated. Furthermore, by containing 5 to 20 % of solvent-free urethane resin, polyester resin and urethane-modified epoxy resin with respect to the entire adhesive, it becomes possible to temporarily dry in 30 minutes or less, and line coating becomes possible. It was found that the adhesive became flexible and the tensile shear force was improved.

Claims (4)

Respect to 100 weight parts of the organopolysiloxane represented by the following general formula (1), gamma-aminopropyltriethoxysilane, gamma (2-aminoethyl) aminopropyl trimethoxysilane, gamma (2-aminoethyl) Aminopuro pills triethoxysilane In addition, aluminum nitride (AlN) is always used as a binder made of a room temperature curable composition containing 5 to 40 parts by weight of a silane coupling agent selected from aminopropylmethyldimethoxysilane, and silicon nitride, boron nitride, and oxidation are used. Zinc, crystalline silica, manganese, ferrite (FeMn) ₂ O ₃ , ferric oxide (Fe ₂ O ₃ ), silica nanoparticles, alumina nanoparticles, alumina (Al ₂ O ₃ ), silicon carbide (SiC), magnesium oxide (MgO), titanium oxide (TiO ₂ (rutile)) At least one liquid-average particle diameter that combines more than is characterized in that is 30-50 wt% containing chromatic respect to the total of the adhesive radiating filler is 0.4μm~1.5μm solventless normal temperature Curable organosiloxane resin adhesive.

Wherein R ¹ and R ² each independently represent the same or different group selected from a methyl group or a phenyl group, and R ³ is the same selected from a methyl group, a phenyl group, or an alkoxyl group having 1 to 5 carbon atoms. Alternatively, it represents a different group, and at least one of n R ³ is represented by an alkoxyl group. N represents a number of 4 to 20.) The one-component solvent-free room temperature, wherein at least one of a solvent-free urethane resin, a polyester resin, and a urethane-modified epoxy resin is mixed with the binder in an amount of 5 to 20% by weight based on the entire adhesive. Curable organosiloxane resin adhesive. Respect to 100 weight parts of the organopolysiloxane represented by the following general formula (1), gamma-aminopropyltriethoxysilane, gamma (2-aminoethyl) aminopropyl trimethoxysilane, gamma (2-aminoethyl) Aminopuro pills triethoxysilane , contain a silane coupling agent 5-40 by weight parts selected from aminopropylmethyldimethoxysilane generates binder consisting of room temperature curing composition of one-part solvent-free, and adding a dispersant to the resulting binder After stirring, be sure to use aluminum nitride (AlN), silicon nitride, boron nitride, zinc oxide, crystalline silica, manganese, ferrite (FeMn) ₂ O ₃ , ferric oxide (Fe ₂ O ₃ ), silica nanoparticles, alumina nanoparticles, alumina _{(Al 2 O} 3), silicon carbide (SiC), oxidized Magnesium (MgO), titanium oxide (TiO ₂ (rutile)) of at least an average particle diameter that combines more than is dissipated filler 5 to 300 parts by weight of added pressure to a 0.4μm~1.5μm from A method for producing a one-component solventless room temperature curable organosiloxane resin adhesive, characterized by stirring uniformly.

Wherein R ¹ and R ² each independently represent the same or different group selected from a methyl group or a phenyl group, and R ³ is the same selected from a methyl group, a phenyl group, or an alkoxyl group having 1 to 5 carbon atoms. Alternatively, it represents a different group, and at least one of n R ³ is represented by an alkoxyl group. N represents a number of 4 to 20.) The one-component solvent-free room temperature of claim 3, wherein at least one of a solvent-free urethane resin, a polyester resin, and a urethane-modified epoxy resin is mixed with the binder in an amount of 5 to 20% by weight based on the entire adhesive. A method for producing a curable organosiloxane resin adhesive.