JP2015038165A5 - - Google Patents
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- Publication number
- JP2015038165A5 JP2015038165A5 JP2013157251A JP2013157251A JP2015038165A5 JP 2015038165 A5 JP2015038165 A5 JP 2015038165A5 JP 2013157251 A JP2013157251 A JP 2013157251A JP 2013157251 A JP2013157251 A JP 2013157251A JP 2015038165 A5 JP2015038165 A5 JP 2015038165A5
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- nitride
- silicon carbide
- oxide
- aluminum nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N Silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 239000002105 nanoparticle Substances 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N N#B Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910015136 FeMn Inorganic materials 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N Iron(III) oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N TiO Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 2
- 229910000460 iron oxide Inorganic materials 0.000 claims description 2
- 229910000529 magnetic ferrite Inorganic materials 0.000 claims description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052748 manganese Inorganic materials 0.000 claims description 2
- 239000011572 manganese Substances 0.000 claims description 2
- 229910001929 titanium oxide Inorganic materials 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 229910000859 α-Fe Inorganic materials 0.000 claims description 2
- 230000001070 adhesive Effects 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229910017083 AlN Inorganic materials 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011256 inorganic filler Substances 0.000 claims 1
- 229910003475 inorganic filler Inorganic materials 0.000 claims 1
- 229910003465 moissanite Inorganic materials 0.000 claims 1
- 125000000962 organic group Chemical group 0.000 claims 1
- 125000005375 organosiloxane group Chemical group 0.000 claims 1
- 125000005373 siloxane group Chemical group [SiH2](O*)* 0.000 claims 1
- 235000010215 titanium dioxide Nutrition 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 210000002381 Plasma Anatomy 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052904 quartz Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Description
炭化ケイ素（ＳｉＣ）、アルミナ（Ａｌ２Ｏ３）以外に次のような熱伝導率の高い無機質である窒化硼素（ＢＮ）、酸化マグネシウム（ＭｇＯ）、硅酸（ＳｉＯ２），窒化ケイ素（Ｓｉ３Ｎ４）、酸化亜鉛、結晶シリカ、酸化チタン、マンガン・フェライト（（ＦｅＭｎ）２Ｏ３）、酸化第二鉄（Ｆｅ２Ｏ３），１００ｎｍ前後のシリカ・ナノ粒子、アルミナ・ナノ粒子等との併用も可能である。以上の無機物質はいずれも非電導性である。
窒化アルミは水系バインダーでは分解し使用できないし、白金錯体とは併用できない。シリコンに近い熱膨張率を有すること、純度が９９．９９％と高く粒度も０．９６〜１．１μｍ微細で少量で効果を発揮できる。など、各種基盤のハロゲンプラズマに対する耐食性が一番すぐれているからである。炭化ケイ素（ＳｉＣ）＜窒化ケイ素（Ｓｉ３Ｎ４）＜アルミナ（Aｌ２O３）＜窒化アルミニウム（AｌN）さらに窒化アルミニウム単独の熱伝導率が２００Ｗ／ｍ．Ｋであることから優位性は明らかである。
In addition to silicon carbide (SiC) and alumina (Al2O3), boron nitride (BN), magnesium oxide (MgO), oxalic acid (SiO2), silicon nitride (Si3N4), and zinc oxide, which are inorganic materials with high thermal conductivity such as the following, , Crystalline silica, titanium oxide, manganese / ferrite ((FeMn) 2 O 3), ferric oxide (Fe 2 O 3), silica / nanoparticles around 100 nm, alumina / nanoparticles, and the like are also possible. All of the above inorganic substances are non-conductive.
Aluminum nitride cannot be used because it decomposes with an aqueous binder and cannot be used in combination with a platinum complex. It has a thermal expansion coefficient close to that of silicon, has a high purity of 99.99%, and a fine particle size of 0.96 to 1.1 μm, and can exert its effect in a small amount. This is because it has the best corrosion resistance against halogen plasma on various substrates. Silicon carbide (SiC) <silicon nitride (Si3N4) <alumina (Al2O3) <aluminum nitride (AlN) Further, the thermal conductivity of aluminum nitride alone is 200 W / m. The advantage is clear from K.
Claims (1)
As the heat radiating filler, aluminum nitride AlN is always used, and further, silicon nitride, boron nitride, zinc oxide, crystalline silica, manganese, ferrite (FeMn) 2 O 3, ferric oxide (Fe 2 O 3), silica nanoparticles around 100 nm, 2. The organo according to claim 1, wherein at least one of alumina nanoparticle, alumina nanoparticle, alumina Al2O3, silicon carbide SiC, magnesium oxide MgO, and titanium oxide TiO2 (rutile type) is used in combination. Siloxane resin adhesive. 2. The organosiloxane resin adhesive according to claim 1, wherein the inorganic filler is always made of aluminum nitride, and in addition, either silicon carbide or alumina, or three kinds thereof are mixed and dispersed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013157251A JP6224943B2 (en) | 2013-07-17 | 2013-07-30 | One-component solvent-free room temperature curable organosiloxane silicone resin adhesive and method for producing the same |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013148318 | 2013-07-17 | ||
| JP2013148318 | 2013-07-17 | ||
| JP2013157251A JP6224943B2 (en) | 2013-07-17 | 2013-07-30 | One-component solvent-free room temperature curable organosiloxane silicone resin adhesive and method for producing the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015038165A JP2015038165A (en) | 2015-02-26 |
| JP2015038165A5 true JP2015038165A5 (en) | 2016-06-30 |
| JP6224943B2 JP6224943B2 (en) | 2017-11-01 |
Family
ID=52631426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013157251A Expired - Fee Related JP6224943B2 (en) | 2013-07-17 | 2013-07-30 | One-component solvent-free room temperature curable organosiloxane silicone resin adhesive and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6224943B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6610429B2 (en) * | 2016-05-24 | 2019-11-27 | 信越化学工業株式会社 | Thermally conductive silicone composition, cured product thereof and method for producing the same |
| CN107090264B (en) * | 2017-06-22 | 2020-05-15 | 武汉市科达云石护理材料有限公司 | Toughened environment-friendly back mesh adhesive as well as preparation method and application thereof |
| CN108276949B (en) * | 2018-01-31 | 2021-03-23 | 广州吉必盛科技实业有限公司 | Two-component polyurethane pouring sealant and preparation method and use method thereof |
| CN109111896A (en) * | 2018-07-05 | 2019-01-01 | 常州思宇知识产权运营有限公司 | A kind of preparation method of high-intensity weather-proof high casting glue |
| KR101932890B1 (en) * | 2018-08-07 | 2018-12-28 | 임춘옥 | Structure for contruct sheet glass |
| KR101932891B1 (en) * | 2018-08-07 | 2018-12-28 | 임춘옥 | Windows having pair glass |
| KR101932889B1 (en) * | 2018-08-07 | 2018-12-28 | 임춘옥 | Windows system improved in shock-resistance |
| CN113088244B (en) * | 2021-04-09 | 2023-03-21 | 绵阳惠利电子材料有限公司 | Low-viscosity flowing type high-heat-conductivity flame-retardant packaging material and preparation method thereof |
| CN114179471A (en) * | 2021-12-15 | 2022-03-15 | 宁波通冠电气自动化设备有限公司 | Composite waterproof membrane and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02173159A (en) * | 1988-12-27 | 1990-07-04 | Ube Ind Ltd | Polyurethane resin composition |
| JPH05230375A (en) * | 1992-02-24 | 1993-09-07 | Suzuki Sangyo Kk | Heating type solvent-free, catalyst-free organosiloxane composition and its use |
| JP5278943B2 (en) * | 2005-09-15 | 2013-09-04 | ニホンハンダ株式会社 | Thermosetting silicone rubber composition, electronic component and electronic device |
-
2013
- 2013-07-30 JP JP2013157251A patent/JP6224943B2/en not_active Expired - Fee Related
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