JP6221059B2 - Thermocompression bonding equipment - Google Patents

Description

  The present invention relates to a thermocompression bonding apparatus for thermocompression bonding an electronic component to a substrate with a thermocompression tool heated by a heater.

  2. Description of the Related Art Conventionally, a thermocompression bonding apparatus used in the manufacture of a liquid crystal panel or the like is a thermocompression bonding tool heated by a heater on a substrate on which electronic components are mounted (temporary pressure bonding) via an adhesive such as an ACF (Anisotropic Conductive Film) The electronic component is thermocompression-bonded (main-compression bonding) to the substrate. In such a thermocompression bonding apparatus, the temperature of the thermocompression bonding tool is detected by temperature detection means such as a thermocouple, and the temperature control circuit controls the heater power supply circuit based on the detected temperature of the thermocompression bonding tool, thereby The temperature of the crimping tool is always kept at an appropriate temperature. In addition, since the thermocompression bonding tool needs to press all the parts temporarily bonded onto the substrate evenly against the substrate, its lower surface (component pressing surface) is against the upper surface of the backup stage that supports the substrate from below. It is attached so as to be parallel with extremely high accuracy (for example, Patent Document 1).

JP 2002-151835 A

  However, in the above-described conventional thermocompression bonding apparatus, when the temperature of the thermocompression bonding tool is changed, for example, when the power supply is temporarily stopped, such as during maintenance, the parallelism of the thermocompression bonding tool is lost. After restarting the power supply, it was necessary to adjust the parallelism of the thermocompression bonding tool. Adjusting the parallelism of this thermocompression bonding tool is difficult, and it takes a long time for the thermocompression bonding tool to stabilize at a constant temperature after the power supply is resumed. Although there is a risk, it is not preferable from the viewpoint of safety and power saving to keep supplying power to the tool lifting / lowering part that raises and lowers the thermocompression bonding tool during the maintenance work and the main control part that controls its operation. Stopping the power supply to the part is inevitable.

  Therefore, an object of the present invention is to provide a thermocompression bonding apparatus that does not need to adjust the parallelism of the thermocompression bonding tool again even when power supply is stopped during maintenance or the like.

The thermocompression bonding apparatus according to claim 1 is a thermocompression bonding apparatus for thermocompression bonding of an electronic component to a substrate by a thermocompression bonding tool heated by a heater, and operates by receiving power supply from a main power source. A heater power supply circuit for supplying current, a tool elevating unit that operates by receiving power supply from the main power supply, elevates the thermocompression tool and presses the electronic component against the substrate, and the thermocompression bonding A temperature detecting means for detecting the temperature of the tool; and a temperature that operates upon receiving power from the main power supply and controls the heater power supply circuit based on the temperature of the thermocompression bonding tool detected by the temperature detecting means. A main control unit that operates by receiving electric power from the main power source and controls the operation of the tool elevating unit and the temperature control circuit, and the main control unit and the tool control unit from the main power source. Parts, the heater power supply circuit and the power supply to the temperature control circuit is made, when the heater power supply circuit is operated in the operating state of performing a current supply to the heater, the heater power supply circuit from the main power source and the temperature A first power cut-off unit that cuts off power supply from the main power source to the main control unit and the tool lifting / lowering unit without cutting off power supply to the control circuit.

  The thermocompression bonding apparatus according to claim 2 is the thermocompression bonding apparatus according to claim 1, wherein the first power cut-off unit operation state in which the operation of the first power cut-off unit is performed from the operation state or the operation state. And a second power cut-off unit that cuts off power supply from the main power supply to the heater power supply circuit.

  The thermocompression bonding apparatus according to claim 3 is the thermocompression bonding apparatus according to claim 2, wherein the thermocompression bonding tool detected by the temperature detection means in the operation state or the first power cut-off unit operation state. And a safety circuit that operates the second power shut-off unit so that power supply from the main power supply to the heater power supply circuit is shut off when the temperature control circuit detects an abnormality based on the temperature of the heater.

The thermocompression bonding apparatus according to claim 4 is the thermocompression bonding apparatus according to claim 3 , further comprising a third power cut-off unit that cuts off power supply from the main power source to the main control unit and the tool lifting / lowering unit. The safety circuit includes the second power shut-off unit to shut off power supply from the main power source to the heater power source circuit when an emergency stop command means is operated in the first power shut-off unit operating state. When the emergency stop command means is operated in the operating state, the second power cut-off unit is operated so that the power supply from the main power supply to the heater power supply circuit is cut off, The third power cut-off unit is operated so that power supply from the main power source to the main control unit and the tool lifting / lowering unit is cut off.

  In the present invention, the heater power supply circuit and the temperature control circuit are operated from the main power supply when the main power supply is operated to the main control unit, the tool lifting / lowering unit, the heater power supply circuit, and the temperature control circuit (operating state). A first power cut-off unit that cuts off the power supply from the main power supply to the main control unit and the tool lifting / lowering unit without cutting off the power supply to the main power supply is provided. By doing so, it is possible to keep the temperature of the thermocompression bonding tool at an appropriate temperature while cutting off the power supply from the main power source to the main control unit and the tool lifting / lowering unit. For this reason, it is not necessary to perform the adjustment work of the thermocompression bonding tool after the power supply is resumed, and accordingly, it is possible to prevent the productivity of the thermocompression bonding apparatus from being lowered.

The perspective view of the thermocompression bonding apparatus in one embodiment of this invention The block diagram which shows the control system of the thermocompression bonding apparatus in one embodiment of this invention The flowchart which shows the flow of the process which the main control part of the thermocompression bonding apparatus in one embodiment of this invention performs at the time of starting

  Embodiments of the present invention will be described below with reference to the drawings. The thermocompression bonding apparatus 1 shown in FIG. 1 constitutes a liquid crystal panel production line together with an ACF adhering device and a component mounting device (none of which are shown) arranged on the upstream process side, and the components on the upstream process side After receiving the substrate 2 of the liquid crystal panel from the mounting device, a plurality of electronic components 3 mounted (temporary pressure bonding) on the edge of the substrate 2 are thermocompression bonded (main pressure bonding) to other devices on the downstream process side. It is an apparatus that repeatedly executes the thermocompression work to be carried out. In this embodiment, an IC chip is described as an example of the electronic component 3, but the electronic component 3 may be an FPC (flexible substrate), a TCP (tape carrier package), or the like.

  As shown in FIG. 1, the thermocompression bonding apparatus 1 has a front-rear direction viewed from an operator OP as a Y-axis direction, a left-right direction as an X-axis direction, and a vertical direction as a Z-axis direction. A back-up stage 13 provided extending in the X-axis direction at a position behind the substrate positioning unit 12 (back side as viewed from the operator OP) and a pressure-bonding head 14 provided above the back-up stage 13 are provided.

  In FIG. 1, the substrate positioning unit 12 includes a substrate holding table 12 a that holds the substrate 2 in a horizontal posture and an orthogonal coordinate robot 12 b that moves the substrate holding table 12 a. The orthogonal coordinate robot 12 b holds the substrate 2 that holds the substrate 2. The substrate 12 is positioned by moving the table 12a in the horizontal plane.

  In FIG. 1, the crimping head 14 is attached to a portal frame 21 provided on the base 11 and has a thermocompression bonding tool 15 extending in the X-axis direction. The thermocompression bonding tool 15 can be moved up and down by a tool elevating unit 22 that uses a motor or the like provided in the portal frame 21 as a power source, and a heater 23 for heating the thermocompression bonding tool 15 is provided in the vicinity.

  In FIG. 2, the tool elevating part 22 for elevating the thermocompression bonding tool 15 is driven via a driver circuit 22a. Here, the driver circuit 22a and the tool lifting / lowering unit 22 constitute one of a plurality of actuator driving units 31 that drive each unit of the thermocompression bonding apparatus 1. Such an actuator driving unit 31 includes a driving unit (not shown) of the Cartesian coordinate robot 12b constituting the substrate positioning unit 12 and the like.

  In FIG. 2, the heater power supply circuit 32 is a circuit that supplies a current based on a command from the temperature control circuit 34 to the heater 23, and operates by receiving power from the main power supply V. The heater 23 receives heat from the heater power supply circuit 32 and generates heat. The heater power supply circuit 32 is connected to a heater power supply indicator lamp 37 as a heater supply indicator. The heater power supply energization indicator 37 is lit in a state where the heater power supply circuit 32 is heating the heater 23, that is, in a state where the heater power supply circuit 32 is operating upon receiving power supply. The heater energization display means need not be an indicator lamp as long as it is displayed by a method that can be visually recognized by the operator. You may make it carry out.

  The temperature adjustment circuit 34 adjusts the current supplied to the heater 23 by controlling the heater power supply circuit 32 so that the temperature of the thermocompression bonding tool 15 becomes the target temperature. The temperature of the thermocompression bonding tool 15 is detected by a thermocouple 33 as temperature detection means attached to the thermocompression bonding tool 15, and the temperature adjustment circuit 34 is based on the temperature of the thermocompression bonding tool 15 detected by the thermocouple 33. The circuit 32 is controlled. Further, the temperature adjustment circuit 34 has a function of notifying the safety circuit 39 of the abnormality when detecting an abnormality in the thermocouple 33 or the heater power supply circuit 32.

  The main control unit 35 performs operation control of the plurality of actuator driving units 31 including the tool lifting / lowering unit 22 and control of the temperature adjustment circuit 34. The main control unit 35 sets the target temperature and control parameters that have been set based on the initialization process for setting the target temperature and the control parameters for the temperature adjustment circuit 34 and the contents input by the operation of the operation / display unit 36. Perform the change process.

  The main control unit 35 performs a thermocompression bonding operation of the electronic component 3 by performing operation control of the plurality of actuator driving units 31. Specifically, after the substrate 2 on which the electronic component 3 is mounted (temporary pressure bonding) is received from the component mounting device on the upstream process side and placed on the substrate holding table 12a, the substrate positioning unit 12 is operated to 2, the substrate 2 is positioned at a work position where each electronic component 3 on 2 is located below the thermocompression bonding tool 15 (above the backup stage 13). Then, the thermocompression bonding tool 15 held at an appropriate temperature (target temperature) by the heater 23 that receives a current supply from the heater power supply circuit 32 is lowered by the tool elevating unit 22, and the thermocompression bonding tool 15 performs a plurality of operations on the substrate 2. The electronic component 3 is pressed against the backup stage 13 together with the substrate 2 to press each electronic component 3 against the substrate 2. As a result, an ACF (not shown) interposed between each electronic component 3 and the substrate 2 is heated through each electronic component 3, and each electronic component 3 is thermocompression bonded to the substrate 2.

  In FIG. 2, an operation / display unit 36 is connected to the main control unit 35. The operation / display unit 36 includes an operation unit and a display unit for inputting data necessary for operation and operation of the thermocompression bonding apparatus 1.

  In FIG. 2, electric power is supplied to the thermocompression bonding apparatus 1 from a main power source V which is a power source in the factory. The electric power from the main power supply V is supplied to the whole thermocompression bonding apparatus 1 via the main power switch SW0. Normally, the main power switch SW0 is in an energized state, and cuts off the power supply only when the operation of the thermocompression bonding apparatus 1 is suspended for a long time, or when transporting, moving, or repairing.

  A first switch SW1 is arranged on the power supply line connecting the main power switch SW0 and the actuator driving unit 31 and the main control unit 35, and further a second switch is arranged on the power supply line connecting the first switch SW1 and the actuator driving unit 31. The third switch SW3 is disposed on the power supply line connecting the first switch SW1 and the main control unit 35 with SW2. Accordingly, power is supplied to each actuator drive unit 31 via the main power switch SW0, the first switch SW1, and the second switch SW2, and the main control unit 35 is supplied with the main power switch SW0, the first switch SW1, and the third switch. It is supplied via the switch SW3. The first switch SW1 is used when the operation of the thermocompression bonding apparatus 1 is temporarily stopped to cut off the power supply to the actuator drive unit 31 and the main control unit 35 to suppress power consumption. For example, the supply of electric power to the thermocompression bonding apparatus 1 is interrupted by the first switch SW1 from the start of today's work to the start of the next day's start of work.

  A fourth switch SW4 is arranged on the power supply line connecting the main power switch SW0 and the heater power circuit 32. Accordingly, power is supplied to the heater power supply circuit 32 via the fourth switch SW4 without passing through the first switch SW1. The temperature control circuit 34 and the safety circuit 39 are connected to a DC power source 38 connected to the main power switch SW0. The DC power source 38 converts alternating current into direct current and supplies power to the temperature control circuit 34 and the safety circuit 39. Therefore, power is supplied to the temperature control circuit 34 and the safety circuit 39 via the DC power source 38 without passing through the first switch SW1 and the fourth switch SW4. The second switch SW2 to the fourth switch SW4 are normally energized and actuated by the safety circuit 39.

  The safety circuit 39 has a function of shutting off the power supply by operating the second switch SW2 to the fourth switch SW4 when the operation of the emergency stop switch 40 is detected or when the above notification is received from the temperature control circuit 34. Have. Specifically, the second switch SW2 to the fourth switch SW4 are operated when the operation of the emergency stop switch 40 is detected, and the fourth switch SW4 is operated when an abnormality is notified from the temperature control circuit 34, thereby Shut off the supply.

  Here, power is supplied from the main power source V to the main control unit 35, the plurality of actuator driving units 31 including the tool lifting / lowering unit 22, the heater power source circuit 32, and the temperature adjustment circuit 34, and the thermocompression bonding apparatus 1 is normally operated. When the first switch SW1 is operated in the state (the state shown in FIG. 2 and called the operation state), the power supply from the main power supply V to the heater power supply circuit 32 and the temperature control circuit 34 is not cut off, but from the main power supply V The power supply to the main control unit 35 and each actuator drive unit 31 is cut off. That is, the first switch SW1 is operated from the main power source V to the main control unit 35 and the tool lifting / lowering unit without shutting off the power supply from the main power source V to the heater power source circuit 32 and the temperature control circuit 34 when operated in the operating state. 22 is a means for shutting off the power supply to 22 (referred to as a first power shut-off unit).

  As described above, the thermocompression bonding apparatus 1 according to the present embodiment includes the first switch SW1 serving as the first power cut-off unit, thereby temporarily stopping the operation of the thermocompression bonding apparatus 1 during maintenance. And the like, by operating the first switch SW1, the power supply from the main power source V to the plurality of actuator driving units 31 including the main control unit 35 and the tool lifting / lowering unit 22 is cut off from the main power source V. The power supply to the circuit 32 and the temperature control circuit 34 can be maintained and the temperature of the thermocompression bonding tool 15 can be maintained at an appropriate temperature.

  In the state where the power supply from the main power source V to the main control unit 35 is interrupted in this way, the current temperature display of the thermocompression bonding tool 15 in the operation / display unit 36 is not performed, while Even when the power supply is cut off, the heater power supply circuit 32 continues to supply current to the heater 23 and the thermocompression bonding tool 15 is maintained in a high temperature state. As described above, the heater power supply circuit 32 is connected to the heater 23. Since the heater power supply energization indicator lamp 37 is always turned on when heating is performed, the operator OP is alerted. This prevents an unsafe situation where the operator OP inadvertently touches the hot thermocompression bonding tool 15 in advance.

  Further, as can be seen from FIG. 2, the fourth switch SW4 is activated (that is, opened from the closed position) when the first switch SW1 is operated from the above operating state or the operating state (referred to as the first power cut-off unit operating state). When the power is supplied to the heater power supply circuit 32, the main power supply V is cut off. That is, in the present embodiment, the fourth switch SW4 operates in the operating state or the first power cut-off unit operation state, and means for cutting off the power supply from the main power supply V to the heater power supply circuit 32 (second power cut-off unit and Called).

  In FIG. 2, the safety circuit 39 and the temperature control circuit 34 are in a state in which the power supply to the plurality of actuator driving units 31 including the main control unit 35 and the tool lifting / lowering unit 22 is cut off by operating the first switch SW1. However, since power is supplied, it functions in the same manner as in the operating state. Therefore, even when the first power cut-off unit is in operation, when the temperature control circuit 34 detects an abnormality in the thermocouple 33, the heater power supply circuit 32, etc., the fourth switch SW4 is activated to cut off the power supply to the heater power supply circuit 32. can do. For this reason, the situation where the heater 23 and the thermocompression bonding tool 15 are damaged due to overheating or the like is prevented.

  Further, since the safety circuit 39 is supplied with power even in the first power cut-off unit operating state, when the emergency stop switch 40 as an emergency stop command means is operated, the main power source V supplies the heater power circuit 32 to the safety circuit 39. The fourth switch SW4 is operated so that the power supply is cut off.

  Thus, in the present embodiment, the second switch SW2 and the third switch SW3 are means for cutting off the power supply from the main power source V to the plurality of actuator driving units 31 including the main control unit 35 and the tool lifting / lowering unit 22 ( The safety circuit 39 supplies power from the main power supply V to the heater power supply circuit 32 when the emergency stop switch 40 is operated in the operation state of the first power cut-off section. When the second power cut-off unit (fourth switch SW4) is operated to cut off and the emergency stop switch 40 is operated in the operating state, the power supply from the main power supply V to the heater power supply circuit 32 is cut off. The plurality of actuator driving units including the main control unit 35 and the tool lifting / lowering unit 22 from the main power source V while operating the second power cut-off unit (fourth switch SW4) And it is adapted to operate the third power cutoff unit so that the power supply to 1 is cut off (the second switch SW2 and the third switch SW3). Therefore, when the operator OP operates the emergency stop switch 40, the power supply to all parts except the temperature control circuit 34 can be cut off, and the safety of the operation of the operator OP in an emergency is ensured.

  By the way, the temperature control circuit 34 is operated when the power supply to the main control unit 35 is cut off after the initialization process or the change process is performed by the main control unit 35 (the first switch SW1 is operated by the operator OP). Even when the second switch SW2 and the third switch SW3 are operated by the safety circuit 39), the power supply is cut off unless the power supply from the main power supply V to the thermocompression bonding apparatus 1 itself is cut off. No, the control of the heater power supply circuit 32 is continued. For this reason, if the main control part 35 performs the initialization process of the temperature control circuit 34 again after the main control part 35 is restarted, the heater power supply circuit 32 performed by the temperature control circuit 34 will be reset. It is not preferable. For this reason, in the thermocompression bonding apparatus 1 according to the present embodiment, the main control unit 35 performs its own (main control unit 35) initialization process as a processing step at the time of activation (shown in FIG. 3). In step ST1), it is determined whether or not the temperature adjustment circuit 34 is in a state of performing the control operation of the heater power supply circuit 32 (step ST2). As a result, the temperature adjustment circuit 34 controls the heater power supply circuit 32. If not, the temperature adjustment circuit 34 is initialized (step ST3). If the heater power supply circuit 32 is being controlled, the temperature adjustment circuit 34 is initialized. The processing process at the time of starting is completed without performing the process. Note that the situation in which it is determined in step ST2 that the temperature adjustment circuit 34 is not controlling the heater power supply circuit 32 is, for example, that the power supply from the main power supply V to the thermocompression bonding apparatus 1 itself is interrupted by the main power switch SW0. This can happen when the power supply to the thermocompression bonding apparatus 1 is started from the state.

  As described above, in the thermocompression bonding apparatus 1 according to the present embodiment, power is supplied from the main power source V to the main control unit 35, the plurality of actuator driving units 31 including the tool elevating unit 22, the heater power source circuit 32, and the temperature adjustment circuit 34. When operated in a state where the power is being supplied (operating state), the main controller 35 and the tool ascend / descend from the main power V without interrupting the power supply from the main power V to the heater power circuit 32 and the temperature control circuit 34. The first switch SW1 (first power cut-off unit) that cuts off the power supply to the plurality of actuator drive units 31 including the unit 22 is provided. By operating the first switch SW1 during maintenance or the like, While cutting off the power supply from the power source V to the plurality of actuator driving units 31 including the main control unit 35 and the tool lifting / lowering unit 22, the temperature of the thermocompression bonding tool 15 is set to an appropriate temperature. One can be. For this reason, it is not necessary to perform the adjustment work of the thermocompression bonding tool 15 after restarting the power supply, and accordingly, the productivity of the thermocompression bonding apparatus 1 can be prevented from being lowered.

  Provided is a thermocompression bonding apparatus that does not need to adjust the parallelism of a thermocompression bonding tool again even when power supply is stopped during maintenance or the like.

DESCRIPTION OF SYMBOLS 1 Thermocompression bonding apparatus 2 Board | substrate 3 Electronic component 15 Thermocompression bonding tool 22 Tool raising / lowering part 23 Heater 32 Heater power supply circuit 33 Thermocouple (temperature detection means)
34 Temperature control circuit 35 Main control part 39 Safety circuit SW1 1st switch (1st electric power interruption part)
SW2 Second switch (third power cut-off unit)
SW3 3rd switch (3rd power interruption part)
SW4 4th switch (2nd power cutoff unit)
V Main power supply

Claims (4)

A thermocompression bonding apparatus for thermocompression bonding an electronic component to a substrate with a thermocompression bonding tool heated by a heater,
A heater power supply circuit that operates by receiving power supply from a main power supply and supplies current to the heater;
A tool elevating unit that operates by receiving power supply from the main power source, elevates the thermocompression bonding tool, and presses the electronic component against the substrate;
Temperature detecting means for detecting the temperature of the thermocompression bonding tool;
A temperature control circuit that operates by receiving power supply from the main power supply, and controls the heater power supply circuit based on the temperature of the thermocompression bonding tool detected by the temperature detection means;
A main control unit that operates by receiving power supply from the main power source and performs operation control of each of the tool elevating unit and the temperature control circuit;
When power is supplied from the main power source to the main control unit, the tool lifting / lowering unit, the heater power source circuit, and the temperature control circuit, and the heater power source circuit is operated in an operating state in which current is supplied to the heater. A first power cut-off unit that cuts off power supply from the main power source to the main control unit and the tool lifting / lowering unit without cutting off power supply from the main power source to the heater power supply circuit and the temperature control circuit; A thermocompression bonding apparatus characterized by comprising:   The second power cut-off unit that operates in the first power cut-off unit operation state in which the operation of the first power cut-off unit is performed from the operation state or the operation state and cuts off power supply from the main power source to the heater power supply circuit. The thermocompression bonding apparatus according to claim 1, further comprising:   When the temperature adjustment circuit detects an abnormality based on the temperature of the thermocompression bonding tool detected by the temperature detection means in the operation state or the first power cut-off unit operation state, the main power supply supplies the heater power supply. The thermocompression bonding apparatus according to claim 2, further comprising a safety circuit that operates the second power cut-off unit so that power supply to the circuit is cut off. A third power cut-off unit that cuts off power supply from the main power source to the main control unit and the tool lifting / lowering unit, and the safety circuit has an emergency stop command means operated in the first power cut-off unit operating state In this case, when the second power cut-off unit is operated so as to cut off the power supply from the main power supply to the heater power supply circuit, and the emergency stop command means is operated in the operating state, the main power supply The second power cut-off unit is operated so that power supply from the heater power supply circuit to the power supply circuit is cut off, and power supply from the main power supply to the main control unit and the tool lifting / lowering unit is cut off. The thermocompression bonding apparatus according to claim 3 , wherein the third power interruption unit is operated.

Images