JP6215957B2 - ディスペンサーを校正する方法及び装置 - Google Patents

ディスペンサーを校正する方法及び装置 Download PDF

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JP6215957B2
JP6215957B2 JP2015546480A JP2015546480A JP6215957B2 JP 6215957 B2 JP6215957 B2 JP 6215957B2 JP 2015546480 A JP2015546480 A JP 2015546480A JP 2015546480 A JP2015546480 A JP 2015546480A JP 6215957 B2 JP6215957 B2 JP 6215957B2
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Prior art keywords
dispenser
amount
supplied
plate
substrate
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JP2015546480A
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Japanese (ja)
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JP2016502672A5 (enExample
JP2016502672A (ja
Inventor
ジョエル ブルーム ジョナサン
ジョエル ブルーム ジョナサン
ジェイ．カーリンスキー トーマス
ジェイ．カーリンスキー トーマス
アン シュルツ トラシ
アン シュルツ トラシ
Original Assignee
イリノイ トゥール ワークス インコーポレイティド
イリノイ トゥール ワークス インコーポレイティド
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Publication of JP2016502672A5 publication Critical patent/JP2016502672A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01G—WEIGHING
    • G01G23/00—Auxiliary devices for weighing apparatus
    • G01G23/01—Testing or calibrating of weighing apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2015546480A 2012-12-03 2013-11-05 ディスペンサーを校正する方法及び装置 Active JP6215957B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/692,057 US9057642B2 (en) 2012-12-03 2012-12-03 Method and apparatus for calibrating a dispenser
US13/692,057 2012-12-03
PCT/US2013/068477 WO2014088746A1 (en) 2012-12-03 2013-11-05 Method and apparatus for calibrating a dispenser

Publications (3)

Publication Number Publication Date
JP2016502672A JP2016502672A (ja) 2016-01-28
JP2016502672A5 JP2016502672A5 (enExample) 2016-12-28
JP6215957B2 true JP6215957B2 (ja) 2017-10-18

Family

ID=49667565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015546480A Active JP6215957B2 (ja) 2012-12-03 2013-11-05 ディスペンサーを校正する方法及び装置

Country Status (9)

Country Link
US (1) US9057642B2 (enExample)
EP (1) EP2926637B1 (enExample)
JP (1) JP6215957B2 (enExample)
KR (1) KR102195227B1 (enExample)
CN (1) CN104938044B (enExample)
MY (1) MY183877A (enExample)
PH (1) PH12015501236A1 (enExample)
SG (1) SG11201504304PA (enExample)
WO (1) WO2014088746A1 (enExample)

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US20140060144A1 (en) * 2012-08-30 2014-03-06 Illnois Tool Works Inc. Method and apparatus for calibrating dispensed deposits
US9411779B2 (en) * 2012-09-28 2016-08-09 Illinois Tool Works Inc. Method of dispensing material based on edge detection
JP2016128152A (ja) * 2015-01-09 2016-07-14 サンユレック株式会社 樹脂体形成方法及びその形成物
US10646893B2 (en) 2015-08-31 2020-05-12 Nordson Corporation Automatic piezo stroke adjustment
US10434537B2 (en) * 2017-09-20 2019-10-08 Illinois Tool Works Inc. Rotation of an array of dispensing pumps to enable simultaneous dispensing with multiple dispensing pumps on multiple electronic substrates
CN113188579B (zh) * 2021-02-24 2023-03-07 常德市计量测试检定所 一种计量检测设备

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US5320250A (en) * 1991-12-02 1994-06-14 Asymptotic Technologies, Inc. Method for rapid dispensing of minute quantities of viscous material
US5795390A (en) 1995-08-24 1998-08-18 Camelot Systems, Inc. Liquid dispensing system with multiple cartridges
US6082289A (en) 1995-08-24 2000-07-04 Speedline Technologies, Inc. Liquid dispensing system with controllably movable cartridge
US5819983A (en) 1995-11-22 1998-10-13 Camelot Sysems, Inc. Liquid dispensing system with sealing augering screw and method for dispensing
JP3561353B2 (ja) * 1995-11-29 2004-09-02 株式会社日立ハイテクインスツルメンツ 基板組立ラインの管理装置
US6412328B1 (en) 1996-10-25 2002-07-02 Speedline Technologies, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US5837892A (en) 1996-10-25 1998-11-17 Camelot Systems, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US6112588A (en) 1996-10-25 2000-09-05 Speedline Technologies, Inc. Method and apparatus for measuring the size of drops of a viscous material dispensed from a dispensing system
US6258165B1 (en) 1996-11-01 2001-07-10 Speedline Technologies, Inc. Heater in a conveyor system
US5985029A (en) 1996-11-08 1999-11-16 Speedline Technologies, Inc. Conveyor system with lifting mechanism
US6056190A (en) 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US5886494A (en) 1997-02-06 1999-03-23 Camelot Systems, Inc. Positioning system
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US5903125A (en) 1997-02-06 1999-05-11 Speedline Technologies, Inc. Positioning system
US5918648A (en) 1997-02-21 1999-07-06 Speedline Techologies, Inc. Method and apparatus for measuring volume
US6093251A (en) 1997-02-21 2000-07-25 Speedline Technologies, Inc. Apparatus for measuring the height of a substrate in a dispensing system
US6085943A (en) 1997-06-30 2000-07-11 Speedline Technologies, Inc. Controllable liquid dispensing device
US5957343A (en) 1997-06-30 1999-09-28 Speedline Technologies, Inc. Controllable liquid dispensing device
US6119895A (en) 1997-10-10 2000-09-19 Speedline Technologies, Inc. Method and apparatus for dispensing materials in a vacuum
US6007631A (en) 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
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US6214117B1 (en) 1998-03-02 2001-04-10 Speedline Technologies, Inc. Dispensing system and method
US6866881B2 (en) 1999-02-19 2005-03-15 Speedline Technologies, Inc. Dispensing system and method
US6216917B1 (en) 1999-07-13 2001-04-17 Speedline Technologies, Inc. Dispensing system and method
US6541063B1 (en) 1999-11-04 2003-04-01 Speedline Technologies, Inc. Calibration of a dispensing system
US6514569B1 (en) 2000-01-14 2003-02-04 Kenneth Crouch Variable volume positive displacement dispensing system and method
US6644238B2 (en) 2000-01-28 2003-11-11 Speedline Technologies, Inc. Conveyorized vacuum injection system
US6444035B1 (en) 2000-01-28 2002-09-03 Speedline Technologies, Inc. Conveyorized vacuum injection system
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US6775879B2 (en) 2001-10-10 2004-08-17 Speedline Technologies, Inc. Needle cleaning system
US6932280B2 (en) 2003-05-02 2005-08-23 Speedline Technologies, Inc. Adjustable needle foot for dispensing system
US20050001869A1 (en) * 2003-05-23 2005-01-06 Nordson Corporation Viscous material noncontact jetting system
US7404861B2 (en) 2004-04-23 2008-07-29 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
KR101256424B1 (ko) * 2004-08-23 2013-04-19 이시이 효키 가부시키가이샤 잉크젯 프린터의 토출량 제어 방법, 잉크 액적 확산 검사방법, 및 배향 막 형성 방법
US20060193969A1 (en) 2005-02-25 2006-08-31 Speedline Technologies, Inc. Method and apparatus for streaming a viscous material on a substrate
US7980197B2 (en) 2006-11-03 2011-07-19 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
US7923056B2 (en) 2007-06-01 2011-04-12 Illinois Tool Works Inc. Method and apparatus for dispensing material on a substrate
US7833572B2 (en) 2007-06-01 2010-11-16 Illinois Tool Works, Inc. Method and apparatus for dispensing a viscous material on a substrate
US8136705B2 (en) 2009-04-09 2012-03-20 Illinois Tool Works Inc. Magnetic drive for dispensing apparatus
US8714716B2 (en) 2010-08-25 2014-05-06 Illinois Tool Works Inc. Pulsed air-actuated micro-droplet on demand ink jet
US8733244B2 (en) * 2010-12-08 2014-05-27 Illinois Tool Works, Inc. Methods for depositing viscous material on a substrate with a combination stencil printer and dispenser
JP5779353B2 (ja) * 2011-01-19 2015-09-16 武蔵エンジニアリング株式会社 液体材料の塗布方法、塗布装置およびプログラム
US8616042B2 (en) * 2011-03-25 2013-12-31 Illinois Tool Works Inc. Method and apparatus for calibrating dispensed deposits
US20130136850A1 (en) 2011-11-29 2013-05-30 Illinois Tool Works Inc. Method for depositing materials on a substrate
US20130133574A1 (en) 2011-11-29 2013-05-30 Illinois Tool Works Inc. Material deposition system for depositing materials on a substrate

Also Published As

Publication number Publication date
PH12015501236B1 (en) 2015-08-17
US9057642B2 (en) 2015-06-16
CN104938044A (zh) 2015-09-23
SG11201504304PA (en) 2015-06-29
US20140150518A1 (en) 2014-06-05
JP2016502672A (ja) 2016-01-28
EP2926637A1 (en) 2015-10-07
MY183877A (en) 2021-03-17
PH12015501236A1 (en) 2015-08-17
KR20150092235A (ko) 2015-08-12
KR102195227B1 (ko) 2020-12-24
EP2926637B1 (en) 2017-04-12
WO2014088746A1 (en) 2014-06-12
CN104938044B (zh) 2018-06-01

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