JP6213801B2 - 積層体、成形品、導電性パターン、電子回路及び電磁波シールド - Google Patents
積層体、成形品、導電性パターン、電子回路及び電磁波シールド Download PDFInfo
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- JP6213801B2 JP6213801B2 JP2017524968A JP2017524968A JP6213801B2 JP 6213801 B2 JP6213801 B2 JP 6213801B2 JP 2017524968 A JP2017524968 A JP 2017524968A JP 2017524968 A JP2017524968 A JP 2017524968A JP 6213801 B2 JP6213801 B2 JP 6213801B2
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- metal
- layer
- resin
- polyphenylene sulfide
- acid
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
- C08J2381/04—Polysulfides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
- C08J2433/14—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2475/04—Polyurethanes
- C08J2475/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2491/00—Characterised by the use of oils, fats or waxes; Derivatives thereof
- C08J2491/06—Waxes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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Description
(1)N−メチルピロリドン、ジメチルアセトアミド等のアミド系溶剤やスルホラン等のスルホン系溶媒中で硫化ナトリウムとp−ジクロロベンゼンとを反応させる方法。
(2)p−ジクロロベンゼンを硫黄と炭酸ソーダの存在下で重合させる方法。
(3)極性溶媒とp−ジクロロベンゼンとの混合溶媒に、硫化ナトリウムを滴下するか、水硫化ナトリウムと水酸化ナトリウムとの混合物を滴下するか、又は、硫化水素と水酸化ナトリウムとの混合物を滴下して重合させる方法。
(4)p−クロロチオフェノールの自己縮合による方法。
温度計、窒素ガス導入管、攪拌器を備えた窒素置換された容器中で、ポリエステルポリオール(1,4−シクロヘキサンジメタノールとネオペンチルグリコールとアジピン酸とを反応させて得られたポリエステルポリオール)100質量部、2,2―ジメチロールプロピオン酸17.6質量部、1,4−シクロヘキサンジメタノール21.7質量部及びジシクロヘキシルメタン−4,4’−ジイソシアネート106.2質量部を、メチルエチルケトン178質量部の混合溶剤中で反応させることによって、末端にイソシアネート基を有するウレタンプレポリマー溶液を得た。
還流冷却器、温度計、撹拌機を備えた反応フラスコに、37質量%ホルムアルデヒドと7質量%メタノールを含むホルマリン600質量部に、水200質量部及びメタノール350質量部を加えた。次いで、この水溶液に25質量%水酸化ナトリウム水溶液を加え、pH10に調整した後、メラミン310質量部を加え、液温を85℃まで上げ、メチロール化反応を1時間行った。
温度計、窒素ガス導入管、攪拌器を備え、窒素置換された反応容器に、2,2−ジメチロールプロピオン酸9.2質量部、ポリメチレンポリフェニルポリイソシアネート(東ソー株式会社製「ミリオネートMR−200」)57.4質量部及びメチルエチルケトン233質量部を仕込み、70℃で6時間反応させ、イソシアネート化合物を得た。次いで、反応容器内にブロック化剤としてフェノール26.4質量部を供給し、70℃で6時間反応させた。その後、40℃まで冷却し、ブロックイソシアネートの溶液を得た。
エチレングリコール45質量部及びイオン交換水55質量部の混合溶媒に、分散剤としてポリエチレンイミンにポリオキシエチレンが付加した化合物を用いて平均粒径30nmの銀粒子を分散させることによって、ナノサイズの金属粉及び分散剤を含有する流動体を調製した。次いで、得られた流動体に、イオン交換水及び界面活性剤を加えて粘度を10mPa・sに調整することによって、インクジェット印刷用導電性インクである流動体(1)を調製した。
リニア型ポリフェニレンスルフィド(ASTM D1238−86によるMFR:600g/10分)100質量部、チョップドガラス繊維(旭ファイバーグラス株式会社製「FT562」、繊維状無機充填剤)54.5質量部、グリシジルメタクリレート変性エチレン−アクリル酸メチル共重合エラストマー(住友化学株式会社製「ボンドファースト7L」)0.5質量部及びモンタン酸複合エステルワックス(クラリアントジャパン株式会社製「リコルブWE40」)0.8質量部を均一に混合した後、35mmφの2軸押出機を用いて290〜330℃で溶融混錬し、ポリフェニレンスルフィド樹脂組成物を得た。得られたポリフェニレンスルフィド樹脂組成物を射出成形機で成形することにより、50mm×105mm×2mmのサイズの支持体(A−1)を得た。
支持体に用いるポリフェニレンスルフィド樹脂組成物を表1に示した組成にして、支持体(A−2)〜(A−5)を得て、プライマー樹脂層用樹脂組成物(X−1)をプライマー樹脂層用樹脂組成物(X−2)に変更した以外は、実施例1と同様の方法によって、支持体(A)、プライマー樹脂層(X)、金属層(B)及び金属めっき層(C)を順次積層した積層体(2)〜(5)を得た。
支持体に用いるポリフェニレンスルフィド樹脂組成物を表1に示した組成にして、支持体(A−5)を得て、プライマー樹脂層用樹脂組成物(X−1)をプライマー樹脂層用樹脂組成物(X−3)に変更した以外は、実施例1と同様の方法によって、支持体(A)、プライマー樹脂層(X)、金属層(B)及び金属めっき層(C)を順次積層した積層体(5)を得た。
実施例3で得られた支持体(A−3)を用いて、プライマー樹脂層用樹脂組成物(X−1)を用いずに、支持体(A−3)上に直接銀層を形成した以外は、実施例1と同様の方法によって、支持体(A)、前記金属層(B)及び金属めっき層(C)を順次積層した積層体(6)を得た。
支持体に用いるポリフェニレンスルフィド樹脂組成物を表1に示した組成にして、支持体(A−6)を得て、プライマー樹脂層用樹脂組成物(X−1)をプライマー樹脂層用樹脂組成物(X−2)に変更した以外は、実施例1と同様の方法によって、支持体(A)、プライマー樹脂層(X)、金属層(B)、金属めっき層(C)を順次積層した積層体(R1)を得た。
支持体に用いるポリフェニレンスルフィド樹脂組成物を表1に示した組成にして、支持体(A−7)を得て、プライマー樹脂層用樹脂組成物(X−1)を用いずに、支持体(A−3)上に直接銀層を形成した以外は、実施例1と同様の方法によって、支持体(A)、前記金属層(B)及び金属めっき層(C)を順次積層した積層体(R2)を得た。
上記で得られた各積層体について、株式会社島津製作所製「オートグラフAGS−X 500N」を用いてピール強度を測定した。なお、測定に用いるリード幅は5mm、そのピールの角度は90°とした。また、ピール強度は、金属めっき層の厚さが厚くなるほど高い値を示す傾向にあるが、本発明でのピール強度の測定は、金属めっき層の厚さ15μmにおける測定値を基準として実施した。
上記で得られた各積層体について、それぞれ150℃に設定した乾燥機内に168時間保管して加熱した。加熱後、上記と同様の方法でピール強度を測定した。
上記で測定した加熱前後のピール強度値を用いて、加熱前後での保持率を算出し、下記の基準にしたがって耐熱性を評価した。
A:保持率が80%以上である。
B:保持率が70%以上80%未満である。
C:保持率が50%以上70%未満である。
D:保持率が50%未満である。
Claims (9)
- ポリフェニレンスルフィド(a1)及びエラストマー(a2)を含有するポリフェニレンスルフィド樹脂組成物からなる支持体(A)の上に、プライマー樹脂層(X)、金属層(B)及び金属めっき層(C)が順次積層された積層体であって、前記ポリフェニレンスルフィド樹脂組成物中のエラストマー(a2)の含有量が、前記ポリフェニレンスルフィド(a1)100質量部に対して、0.3〜90質量部の範囲であり、前記プライマー樹脂層(X)を構成する樹脂が、ウレタン樹脂をシェルとしN−アルキロール(メタ)アクリルアミドを含む単量体を重合したビニル樹脂をコアとするコア・シェル型複合樹脂、メラミン樹脂及びフェノールブロックイソシアネートからなる群から選ばれる1以上の樹脂であることを特徴とする積層体。
- 前記エラストマーが、オレフィン共重合体系エラストマーである請求項1記載の積層体。
- 前記金属層(B)を構成する金属が、パラジウム、ニッケル、クロム及び銀からなる群から選ばれる少なくとも1種である請求項1又は2記載の積層体。
- 前記金属層(B)の付着量が、1〜30,000mg/m2の範囲である請求項1〜3のいずれか1項記載の積層体。
- 前記金属めっき層(C)が、電解めっき法、無電解めっき法又はこれらの組み合わせにより形成されたものである請求項1〜4のいずれか1項記載の積層体。
- 請求項1〜5のいずれか1項記載の積層体からなることを特徴とする成形品。
- 請求項1〜5のいずれか1項記載の積層体からなることを特徴とする導電性パターン。
- 請求項7記載の導電性パターンを有することを特徴とする電子回路。
- 請求項1〜5のいずれか1項記載の積層体からなることを特徴とする電磁波シールド。
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JP2015128836 | 2015-06-26 | ||
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PCT/JP2016/068661 WO2016208672A1 (ja) | 2015-06-26 | 2016-06-23 | 積層体、成形品、導電性パターン、電子回路及び電磁波シールド |
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JP6859799B2 (ja) * | 2017-03-29 | 2021-04-14 | 三菱マテリアル株式会社 | ペースト状銀粉組成物、接合体の製造方法および銀膜の製造方法 |
WO2019013038A1 (ja) * | 2017-07-10 | 2019-01-17 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
WO2019013039A1 (ja) * | 2017-07-10 | 2019-01-17 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
WO2020003879A1 (ja) * | 2018-06-26 | 2020-01-02 | Dic株式会社 | 金属パターンを有する成形体の製造方法 |
TWI819048B (zh) * | 2018-08-23 | 2023-10-21 | 日商Dic股份有限公司 | 積層體、成形品、導電性圖案及電子電路 |
CN114450157A (zh) * | 2019-10-10 | 2022-05-06 | Dic株式会社 | 层叠体、成形品、印刷配线板和电磁波屏蔽体 |
KR20220101661A (ko) * | 2019-11-26 | 2022-07-19 | 디아이씨 가부시끼가이샤 | 폴리아릴렌설파이드 수지 조성물, 성형품, 적층체 및 그들의 제조 방법 |
CN113301714A (zh) * | 2021-05-25 | 2021-08-24 | 安徽鑫泰电子科技有限公司 | 一种适用于铜浆印制的电路板基板及其制作方法 |
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JPH05320506A (ja) * | 1992-05-26 | 1993-12-03 | Dainippon Ink & Chem Inc | ランプリフレクタ |
US5484648A (en) * | 1993-08-11 | 1996-01-16 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector and method for the preparation thereof |
WO2007001036A1 (ja) * | 2005-06-28 | 2007-01-04 | Dainippon Ink And Chemicals, Inc. | ポリフェニレンスルフィド樹脂構造体 |
JP5400664B2 (ja) * | 2010-03-01 | 2014-01-29 | 古河電気工業株式会社 | フィルム状成形体及び積層体 |
JP5645455B2 (ja) * | 2010-04-22 | 2014-12-24 | 三菱樹脂株式会社 | 積層ポリエステルフィルム |
JP6074832B2 (ja) * | 2011-04-20 | 2017-02-08 | 学校法人立教学院 | ポリフェニレンエーテルを含む樹脂組成物およびその製造方法 |
WO2013147050A1 (ja) * | 2012-03-30 | 2013-10-03 | Dic株式会社 | 積層体、導電性パターン、電気回路及び積層体の製造方法 |
JP6241175B2 (ja) * | 2013-09-27 | 2017-12-06 | 東レ株式会社 | ポリフェニレンスルフィド樹脂組成物からなる成形品と金属箔を接合した複合成形品および複合成形品の製造方法 |
US11274223B2 (en) * | 2013-11-22 | 2022-03-15 | C3 Nano, Inc. | Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches |
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2016
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- 2016-06-23 KR KR1020187001692A patent/KR20180022813A/ko not_active Application Discontinuation
- 2016-06-23 EP EP16814441.8A patent/EP3315302B1/en active Active
- 2016-06-23 CN CN201680037194.XA patent/CN107708997A/zh active Pending
- 2016-06-23 JP JP2017524968A patent/JP6213801B2/ja active Active
- 2016-06-23 WO PCT/JP2016/068661 patent/WO2016208672A1/ja active Application Filing
- 2016-06-24 TW TW105119846A patent/TW201707973A/zh unknown
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JPWO2017154879A1 (ja) * | 2016-03-11 | 2018-07-05 | Dic株式会社 | 積層体の製造方法 |
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WO2016208672A1 (ja) | 2016-12-29 |
CN107708997A (zh) | 2018-02-16 |
EP3315302B1 (en) | 2022-02-23 |
EP3315302A4 (en) | 2018-06-20 |
TW201707973A (zh) | 2017-03-01 |
KR20180022813A (ko) | 2018-03-06 |
EP3315302A1 (en) | 2018-05-02 |
US20180162106A1 (en) | 2018-06-14 |
JPWO2016208672A1 (ja) | 2017-10-05 |
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