JP6210679B2 - 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム - Google Patents

半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム Download PDF

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Publication number
JP6210679B2
JP6210679B2 JP2012271703A JP2012271703A JP6210679B2 JP 6210679 B2 JP6210679 B2 JP 6210679B2 JP 2012271703 A JP2012271703 A JP 2012271703A JP 2012271703 A JP2012271703 A JP 2012271703A JP 6210679 B2 JP6210679 B2 JP 6210679B2
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support member
ultrasonic
semiconductor device
connection structure
device connection
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JP2012271703A
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English (en)
Japanese (ja)
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JP2014116904A (ja
JP2014116904A5 (https=
Inventor
淳也 山田
淳也 山田
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Olympus Corp
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Olympus Corp
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Priority to JP2012271703A priority Critical patent/JP6210679B2/ja
Priority to CN201380064710.4A priority patent/CN104838671A/zh
Priority to PCT/JP2013/082506 priority patent/WO2014091970A1/ja
Priority to EP13861652.9A priority patent/EP2934024A4/en
Publication of JP2014116904A publication Critical patent/JP2014116904A/ja
Priority to US14/738,334 priority patent/US9997449B2/en
Publication of JP2014116904A5 publication Critical patent/JP2014116904A5/ja
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/445—Details of catheter construction
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Gynecology & Obstetrics (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Endoscopes (AREA)
  • Geometry (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Transducers For Ultrasonic Waves (AREA)
JP2012271703A 2012-12-12 2012-12-12 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム Active JP6210679B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012271703A JP6210679B2 (ja) 2012-12-12 2012-12-12 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム
CN201380064710.4A CN104838671A (zh) 2012-12-12 2013-12-03 半导体器件连接构造、超声波模块以及搭载有超声波模块的超声波内视镜系统
PCT/JP2013/082506 WO2014091970A1 (ja) 2012-12-12 2013-12-03 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム
EP13861652.9A EP2934024A4 (en) 2012-12-12 2013-12-03 CONNECTING STRUCTURE FOR A SEMICONDUCTOR COMPONENT, ULTRASOUND MODULE AND ULTRASONIC DOCKING SYSTEM WITH THE BUILT-IN ULTRASOUND MODULE
US14/738,334 US9997449B2 (en) 2012-12-12 2015-06-12 Semiconductor device connection structure, ultrasonic module, and ultrasonic endoscope system having ultrasonic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012271703A JP6210679B2 (ja) 2012-12-12 2012-12-12 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム

Publications (3)

Publication Number Publication Date
JP2014116904A JP2014116904A (ja) 2014-06-26
JP2014116904A5 JP2014116904A5 (https=) 2016-02-04
JP6210679B2 true JP6210679B2 (ja) 2017-10-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012271703A Active JP6210679B2 (ja) 2012-12-12 2012-12-12 半導体装置接続構造、超音波モジュールおよび超音波モジュールを搭載した超音波内視鏡システム

Country Status (5)

Country Link
US (1) US9997449B2 (https=)
EP (1) EP2934024A4 (https=)
JP (1) JP6210679B2 (https=)
CN (1) CN104838671A (https=)
WO (1) WO2014091970A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107708576B (zh) * 2015-06-23 2021-07-13 奥林巴斯株式会社 超声波振子和超声波探头
JP6908325B2 (ja) * 2015-11-25 2021-07-21 フジフィルム ソノサイト インコーポレイテッド 高周波超音波トランスデューサアレイを含む医療機器
WO2017199857A1 (ja) * 2016-05-20 2017-11-23 オリンパス株式会社 超音波振動子モジュールおよび超音波内視鏡
JP6815502B2 (ja) * 2017-06-21 2021-01-20 アルプスアルパイン株式会社 回転コネクタ
WO2022208807A1 (ja) * 2021-03-31 2022-10-06 オリンパス株式会社 超音波振動子アレイ、内視鏡および超音波振動子アレイの製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385255A (en) * 1979-11-02 1983-05-24 Yokogawa Electric Works, Ltd. Linear array ultrasonic transducer
CA2139151A1 (en) * 1994-01-14 1995-07-15 Amin M. Hanafy Two-dimensional acoustic array and method for the manufacture thereof
JP3628048B2 (ja) * 1994-09-08 2005-03-09 株式会社日立メディコ 超音波探触子
US5810009A (en) * 1994-09-27 1998-09-22 Kabushiki Kaisha Toshiba Ultrasonic probe, ultrasonic probe device having the ultrasonic probe, and method of manufacturing the ultrasonic probe
JPH10201759A (ja) * 1997-01-21 1998-08-04 Olympus Optical Co Ltd 超音波プローブ
NL1014175C2 (nl) * 2000-01-25 2001-07-26 Oldelft B V Ultrageluid probe.
JP4100965B2 (ja) 2001-06-13 2008-06-11 キヤノン株式会社 半導体装置の製造方法
US6788620B2 (en) * 2002-05-15 2004-09-07 Matsushita Electric Industrial Co Ltd Acoustic matching member, ultrasound transducer, ultrasonic flowmeter and method for manufacturing the same
US6994674B2 (en) * 2002-06-27 2006-02-07 Siemens Medical Solutions Usa, Inc. Multi-dimensional transducer arrays and method of manufacture
JP2004363746A (ja) * 2003-06-03 2004-12-24 Fuji Photo Film Co Ltd 超音波用探触子及びその製造方法
US20050225210A1 (en) * 2004-04-01 2005-10-13 Siemens Medical Solutions Usa, Inc. Z-axis electrical connection and methods for ultrasound transducers
US20070187844A1 (en) * 2006-02-10 2007-08-16 Wintec Industries, Inc. Electronic assembly with detachable components
US7449821B2 (en) * 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP2007068918A (ja) * 2005-09-09 2007-03-22 Fujifilm Corp 超音波プローブ、および超音波診断装置
JP4669449B2 (ja) * 2006-07-18 2011-04-13 アロカ株式会社 超音波探触子及びその製造方法
JP2009188802A (ja) 2008-02-07 2009-08-20 Olympus Corp 撮像モジュール
JP2010022931A (ja) * 2008-07-18 2010-02-04 Fujifilm Corp 接着剤はみ出し防止構造を有する超音波探触子
JP5355452B2 (ja) * 2010-03-02 2013-11-27 富士フイルム株式会社 超音波診断装置
JP5611645B2 (ja) * 2010-04-13 2014-10-22 株式会社東芝 超音波トランスデューサおよび超音波プローブ
JP6205704B2 (ja) * 2012-10-25 2017-10-04 セイコーエプソン株式会社 超音波測定装置、ヘッドユニット、プローブ及び診断装置
WO2015141800A1 (ja) * 2014-03-20 2015-09-24 オリンパス株式会社 ケーブル接続構造および内視鏡装置

Also Published As

Publication number Publication date
EP2934024A1 (en) 2015-10-21
US20150279764A1 (en) 2015-10-01
WO2014091970A1 (ja) 2014-06-19
US9997449B2 (en) 2018-06-12
CN104838671A (zh) 2015-08-12
EP2934024A4 (en) 2016-08-03
JP2014116904A (ja) 2014-06-26

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