JP6202838B2 - Melting bag - Google Patents

Melting bag Download PDF

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JP6202838B2
JP6202838B2 JP2013051039A JP2013051039A JP6202838B2 JP 6202838 B2 JP6202838 B2 JP 6202838B2 JP 2013051039 A JP2013051039 A JP 2013051039A JP 2013051039 A JP2013051039 A JP 2013051039A JP 6202838 B2 JP6202838 B2 JP 6202838B2
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bag
melting
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melt adhesive
hot melt
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JP2014177284A (en
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筑紫 憲門
憲門 筑紫
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Sekisui Film Co Ltd
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Description

本発明は、ホットメルト接着剤を包装する溶融袋に関する。   The present invention relates to a melting bag for packaging a hot melt adhesive.

従来、ホットメルト接着剤を包装する袋として、袋を剥がすことなくそのままホットメルト接着剤を溶かす高温容器に投入できる、いわゆる溶融袋が用いられている。   Conventionally, as a bag for packaging a hot-melt adhesive, a so-called melting bag that can be put into a high-temperature container that melts the hot-melt adhesive without removing the bag has been used.

溶融袋に求められる要件としては、溶融操作温度よりも低い温度で溶融すること、短時間で均一溶融すること、及び袋を落としても破袋しにくいことが挙げられる。   Requirements required for the melting bag include melting at a temperature lower than the melting operation temperature, uniform melting in a short time, and difficulty in breaking the bag even if the bag is dropped.

例えば、特許文献1には、密度が0.898〜0.920g/cmのメタロセン系直鎖状エチレン重合体(A)と、密度が0.905〜0.925g/cmであって直鎖状エチレン重合体(A)より高い密度の直鎖状エチレン重合体(B)とを含む樹脂組成物からなるフィルムからなる溶融袋が開示されている。 For example, Patent Document 1, metallocene linear ethylene polymer having a density of 0.898~0.920g / cm 2 and (A), density a 0.905~0.925g / cm 2 straight A melting bag made of a film made of a resin composition containing a linear ethylene polymer (B) having a higher density than the chain ethylene polymer (A) is disclosed.

特許第3685775号Japanese Patent No. 3658775

しかしながら、上記特許文献1に記載の溶融袋は、150℃付近の低温では完全には溶融せず、溶融残渣が残る、という問題点を有している。   However, the melting bag described in Patent Document 1 has a problem that it does not melt completely at a low temperature around 150 ° C. and a molten residue remains.

本発明は、低温(例、150℃付近)でほとんど又は全く残渣が残らないように融解でき、長期間保管にした状態でもブロッキングがおこらず、かつ被包装物を入れた状態で落とされても破袋しにくい溶融袋を提供することを課題とする。   The present invention can be melted so that little or no residue remains at a low temperature (eg, around 150 ° C.), does not block even when stored for a long period of time, and can be dropped with a packaged item in it. It is an object of the present invention to provide a molten bag that is difficult to break.

本発明者らは、鋭意検討の結果、
融点110℃以下、密度0.915〜0.922、メルトフローレート15〜35の低密度ポリエチレン樹脂からなる溶融袋
によって、前記課題が解決出来ることを見出し、本発明を完成するに至った。
As a result of intensive studies, the present inventors have
The present inventors have found that the above problems can be solved by a melting bag made of a low-density polyethylene resin having a melting point of 110 ° C. or less, a density of 0.915 to 0.922, and a melt flow rate of 15 to 35, and has completed the present invention.

本発明は、次の態様を含む。
項1. 融点110℃以下、密度0.915〜0.922、メルトフローレート15〜35の低密度ポリエチレン樹脂からなる溶融袋。
項2. ホットメルト接着剤の包装用である、項1に記載の溶融袋。
項3. 項1に記載の溶融袋、及び当該溶融袋で包装されたホットメルト接着剤からなる包装ホットメルト接着剤。
The present invention includes the following aspects.
Item 1. A melting bag made of a low density polyethylene resin having a melting point of 110 ° C. or less, a density of 0.915 to 0.922, and a melt flow rate of 15 to 35.
Item 2. Item 2. The molten bag according to Item 1, which is used for packaging hot melt adhesive.
Item 3. Item 10. A packaging hot melt adhesive comprising the melt bag according to Item 1 and a hot melt adhesive packaged in the melt bag.

本発明の溶融袋は、低温(例、150℃付近)でほとんど又は全く残渣が残らないように融解でき、長期間保管にした状態でもブロッキングがおこらず、かつ被包装物を入れた状態で落とされても破袋しにくい。   The molten bag of the present invention can be melted so that little or no residue remains at a low temperature (eg, around 150 ° C.), does not block even when stored for a long period of time, and drops in a state where a packaged item is placed. Even if it is done, it is hard to break the bag.

本発明の溶融袋は、融点110℃以下、密度0.915〜0.922、メルトフローレート15〜35の低密度ポリエチレン樹脂からなることを特徴とする。   The melting bag of the present invention is characterized by comprising a low-density polyethylene resin having a melting point of 110 ° C. or less, a density of 0.915 to 0.922, and a melt flow rate of 15 to 35.

本発明用いられる低密度ポリエチレン樹脂における低密度ポリエチレンとは、エチレンに高圧下、ラジカル重合触媒で重合させて製造されたポリエチレンいう。   The low density polyethylene in the low density polyethylene resin used in the present invention refers to polyethylene produced by polymerizing ethylene with a radical polymerization catalyst under high pressure.

本発明で使用される低密度ポリエチレン樹脂の融点は、110℃以下に限定される。融点が110℃よりも高いと、低温(例、150℃付近)融解時で溶融袋が充分に溶融しないためである。   The melting point of the low density polyethylene resin used in the present invention is limited to 110 ° C. or less. This is because when the melting point is higher than 110 ° C., the melting bag is not sufficiently melted at low temperature (eg, around 150 ° C.).

融点は、JIS K7121の融解温度である。   The melting point is the melting temperature of JIS K7121.

本発明で使用される低密度ポリエチレン樹脂の密度は、0.915〜0.922g/cmの範囲内に限定される。密度が、0.915g/cmよりも低いと、袋同士がブロッキングし、これを剥がそうとする際に袋が破れてしまうことがあり、一方、密度が0.922g/cmよりも高いと樹脂の融点も高くなり、溶融時に溶け残り(残渣)が出ることがある。より好ましい上限は、0.920g/cmであり、より望ましい下限は0.917g/cmである。 The density of the low density polyethylene resin used in the present invention is limited to the range of 0.915 to 0.922 g / cm 3 . When the density is lower than 0.915 g / cm 3 , the bags may block each other, and the bag may be broken when trying to peel off, while the density is higher than 0.922 g / cm 3. The melting point of the resin also increases, and unmelted (residue) may be produced during melting. A more preferable upper limit is 0.920 g / cm 3 , and a more desirable lower limit is 0.917 g / cm 3 .

密度は、JIS K6760の方法により求められる。   The density is determined by the method of JIS K6760.

本発明で使用するメルトフローレート(MFR)は、15〜35に限定される。MFRが、15よりも低いと、溶融時に残渣が出てしまい、MFRが35よりも高いと製造された袋の強度が低下するおそれがあるためである。より好ましい上限は25であり、より好ましい下限は20である。   The melt flow rate (MFR) used in the present invention is limited to 15-35. This is because if the MFR is lower than 15, a residue is produced at the time of melting, and if the MFR is higher than 35, the strength of the manufactured bag may be reduced. A more preferred upper limit is 25, and a more preferred lower limit is 20.

MFRは、ASTM D1238に基づき190℃の温度、2.16kg荷重下の条件により求められる。   The MFR is determined based on ASTM D1238 under conditions of a temperature of 190 ° C. and a load of 2.16 kg.

本発明で使用される低密度ポリエチレン樹脂は、商業的に入手可能である。本発明で使用される低密度ポリエチレン樹脂の市販品としては、例えば、日本ポリエチレン社製の商品名「ノバテックLJ802」、旭化成ケミカルズ社製の商品名「サンテックM6520」、東ソー社製の商品名「ペトロセン202」などが挙げられる。   The low density polyethylene resin used in the present invention is commercially available. Commercially available products of the low density polyethylene resin used in the present invention include, for example, a trade name “Novatech LJ802” manufactured by Nippon Polyethylene Co., Ltd., a trade name “Suntech M6520” manufactured by Asahi Kasei Chemicals Corporation, and a trade name “Petrocene” manufactured by Tosoh Corporation. 202 "and the like.

本発明で用いられる低密度ポリエチレン樹脂は、その特性が著しく損なわれない範囲内において、光安定剤、紫外線吸収剤などの添加剤を含有していてもよい。   The low density polyethylene resin used in the present invention may contain additives such as a light stabilizer and an ultraviolet absorber as long as the characteristics are not significantly impaired.

本発明の溶融袋は、前記低密度ポリエチレン樹脂から形成されるポリエチレンフィルムからなる。
当該ポリエチレンフィルムの厚さについては、特に限定はなく、袋に充填する製品の量に応じて、適宜選択することができるが、通常は、約10〜約500μmの範囲内である。
The molten bag of the present invention is made of a polyethylene film formed from the low density polyethylene resin.
The thickness of the polyethylene film is not particularly limited and can be appropriately selected according to the amount of the product filled in the bag, but is usually in the range of about 10 to about 500 μm.

本発明の溶融袋は、低密度ポリエチレン樹脂から、常法によってポリエチレンフィルムを成形する工程、及び当該ポリエチレンフィルムを常法によって製袋する工程を含む製造方法によって製造できる。
本発明の溶融袋の形態は、特に限定されず、例えば、四方シール袋、三方シール袋、二方シール袋、ガセット包装袋、又はピロー包装袋等であることができる。
本発明の溶融袋の大きさは、例えば、縦20〜50cm×横10〜40cmの範囲内である。
The molten bag of the present invention can be produced from a low density polyethylene resin by a production method including a step of forming a polyethylene film by a conventional method and a step of forming the polyethylene film by a conventional method.
The form of the molten bag of the present invention is not particularly limited, and can be, for example, a four-side sealed bag, a three-side sealed bag, a two-side sealed bag, a gusset packaging bag, or a pillow packaging bag.
The size of the molten bag of the present invention is, for example, in the range of 20 to 50 cm in length and 10 to 40 cm in width.

本発明の溶融袋で包装される対象は、好ましくはホットメルト接着剤である。なかでも合成ゴム、及びタッキファイヤを含有するホットメルト接着剤が好ましい。
本発明の溶融袋は、このようなホットメルト接着剤と良好な相溶性を有する。
The object to be packaged in the melt bag of the present invention is preferably a hot melt adhesive. Of these, a hot-melt adhesive containing a synthetic rubber and tackifier is preferable.
The molten bag of the present invention has good compatibility with such a hot melt adhesive.

本発明は、低温(例、150℃付近)でほとんど又は全く残渣が残らないように融解でき、長期間保管にした状態でもブロッキングがおこらず、かつ被包装物を入れた状態で落とされても破袋しにくい。   The present invention can be melted so that little or no residue remains at a low temperature (eg, around 150 ° C.), does not block even when stored for a long period of time, and can be dropped with a packaged item in it. Hard to break.

本発明の包装ホットメルト接着剤は、本発明の溶融袋及び当該溶融袋で包装されたホットメルト接着剤からなる。
本発明の包装ホットメルト接着剤は、例えば、本発明の溶融袋の開口部からホットメルト接着剤を入れ、当該開口部をシールすることによって製造される。
本発明の包装ホットメルト接着剤は、ホットメルト接着剤を本発明の溶融袋から取り出すことなく、本発明の包装ホットメルト接着剤を丸ごと溶融させることにより、接着剤として使用できる。
The packaging hot melt adhesive of the present invention comprises the melting bag of the present invention and the hot melt adhesive packaged in the melting bag.
The packaging hot melt adhesive of the present invention is produced, for example, by inserting the hot melt adhesive from the opening of the melt bag of the present invention and sealing the opening.
The packaging hot melt adhesive of the present invention can be used as an adhesive by melting the entire packaging hot melt adhesive of the present invention without removing the hot melt adhesive from the melting bag of the present invention.

以下、本発明を実施例により説明するが、本発明は、これらの実施例に限定されるものではない。   EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to these Examples.

表1の組成からなる厚さ30μmのキャストフィルムを作成した。フィルムの成形は、リップクリアランスが3mmのTダイフィルム成形機(75mm径押出機)を用い、成形条件は樹脂温度180℃、引取速度35m/分とした。得られたフィルムを縦ピロー包装機(川島製作所)で製袋(シール温度:縦方向 115℃、横方向 90℃)して溶融袋を得た。
また、溶融袋にホットメルト接着剤を充填し、上部をシールして、ホットメルト接着剤を封入した溶融袋を得た。
溶融袋の、溶融性、耐ブロッキング性、及び破袋強度を下記の要領で測定し、その結果を表1に示した。
尚、実施例、又は比較例に用いた樹脂及びその物性、並びに実施例、又は比較例において得られたフィルムの物性測定方法は以下のとおりである。
A cast film having a composition of Table 1 and having a thickness of 30 μm was prepared. For forming the film, a T-die film forming machine (75 mm diameter extruder) with a lip clearance of 3 mm was used. The forming conditions were a resin temperature of 180 ° C. and a take-up speed of 35 m / min. The obtained film was formed into a bag (seal temperature: 115 ° C. in the vertical direction, 90 ° C. in the horizontal direction) with a vertical pillow packaging machine (Kawashima Seisakusho) to obtain a molten bag.
Moreover, the melt bag was filled with a hot melt adhesive, the upper part was sealed, and a melt bag enclosing the hot melt adhesive was obtained.
The meltability, blocking resistance, and bag breaking strength of the melt bag were measured in the following manner, and the results are shown in Table 1.
In addition, the resin used for an Example or a comparative example, its physical property, and the physical-property measuring method of the film obtained in the Example or the comparative example are as follows.

1.原料の組成と物性
樹脂1:低密度ポリエチレン樹脂(日本ポリエチレン社製 商品名「ノバテックLJ802」、融点106℃、密度0.918、MFR22)
樹脂2:低密度ポリエチレン樹脂(ダウケミカル社製 商品名「DNDJ−0405」融点105℃、密度0.915、MFR25)
樹脂3:低密度ポリエチレン樹脂(旭化成ケミカルズ社製 商品名「サンテックM6520.4」、融点107℃、密度0.919、MFR17)
樹脂4:低密度ポリエチレン樹脂(東ソー社製 商品名「ペトロセン208」、融点111℃、密度0.924、MFR23)
樹脂5:低密度ポリエチレン樹脂(旭化成ケミカルズ社製 商品名「サンテックL6810」、融点107℃、密度0.918、MFR11)
樹脂6:低密度ポリエチレン樹脂(日本ポリエチレン社製 商品名「ノバテックLJ902」、融点102℃、密度0.915、MFR45)
樹脂7:低密度ポリエチレン樹脂(日本ポリエチレン社製 商品名「ノバテックLJ8041」、融点123℃、密度0.918、MFR23)
樹脂8:低密度ポリエチレン樹脂(ダウケミカル社製 商品名「DNDV−0405R」、融点105℃、密度0.914、MFR32)
1. Composition of raw materials and physical properties resin 1: Low density polyethylene resin (trade name “Novatech LJ802” manufactured by Nippon Polyethylene Co., Ltd., melting point 106 ° C., density 0.918, MFR22)
Resin 2: Low density polyethylene resin (trade name “DNDJ-0405” manufactured by Dow Chemical Co., Ltd., melting point 105 ° C., density 0.915, MFR25)
Resin 3: Low density polyethylene resin (trade name “Suntech M6520.4” manufactured by Asahi Kasei Chemicals Corporation, melting point 107 ° C., density 0.919, MFR17)
Resin 4: Low density polyethylene resin (trade name “Petrocene 208” manufactured by Tosoh Corporation, melting point 111 ° C., density 0.924, MFR23)
Resin 5: Low-density polyethylene resin (trade name “Suntech L6810” manufactured by Asahi Kasei Chemicals Corporation, melting point 107 ° C., density 0.918, MFR11)
Resin 6: Low-density polyethylene resin (trade name “Novatech LJ902” manufactured by Nippon Polyethylene Co., Ltd., melting point: 102 ° C., density: 0.915, MFR45)
Resin 7: Low-density polyethylene resin (trade name “Novatech LJ8041” manufactured by Nippon Polyethylene Co., Ltd., melting point: 123 ° C., density: 0.918, MFR23)
Resin 8: Low-density polyethylene resin (trade name “DNDV-0405R” manufactured by Dow Chemical Co., Ltd., melting point 105 ° C., density 0.914, MFR32)

2.評価方法
〔溶融性〕
150℃に加熱したシリコーンオイル中に10cm×10cmの面積の厚さ30μmの溶融袋を投入し、40分後の溶融袋の状態を、以下の基準で評価した。
○(優):溶け残りが全くない又は溶け残ったフィルム片が小さい(面積4cm未満)
△(良):溶け残ったフィルム片がやや大きい(面積4cm以上9cm未満)
×(不良):溶け残ったフィルム片が大きい(面積9cm以上)
2. Evaluation method (meltability)
A molten bag having a thickness of 10 cm × 10 cm and a thickness of 30 μm was put into silicone oil heated to 150 ° C., and the state of the molten bag after 40 minutes was evaluated according to the following criteria.
○ (excellent): no undissolved residue or undissolved film piece is small (area less than 4 cm 2 )
Δ (good): The film piece that remained undissolved is slightly large (area 4 cm 2 or more and less than 9 cm 2 ).
X (Bad): Large undissolved film piece (area 9 cm 2 or more)

〔耐ブロッキング性〕
溶融袋を2枚重ね合わせ、重ね合わせたフィルム上に荷重10kgの錘をフィルムを完全に覆うように載せ、50℃のオーブン中に3日間放置した。オーブン中から重ね合わせた溶融袋を取り出して剥がす際のブロッキングの程度を、以下の基準で評価した。
○(優):重ね合わせた溶融袋はブロッキングしておらず、容易に剥がすことができた
△(良):重ね合わせた溶融袋は少しブロッキングしていたが、剥がすのに困難はなかった
×(不良):重ね合わせた溶融袋はブロッキングしており、剥がすのが困難であった
[Blocking resistance]
Two melt bags were superposed and a weight of 10 kg was placed on the superposed film so as to completely cover the film, and left in an oven at 50 ° C. for 3 days. The degree of blocking when taking out and peeling the superposed molten bags from the oven was evaluated according to the following criteria.
○ (excellent): The superposed molten bag was not blocked and could be easily peeled off. Δ (good): The superposed molten bag was slightly blocked, but there was no difficulty in peeling off. (Bad): Stacked molten bags were blocking and difficult to peel off

〔破袋強度〕
重さ2kgのホットメルト接着剤を封入した溶融袋(縦35cm×横25cm)を高さ1mから落下させて破れた回数を測定し、以下の基準で評価した。なお、溶融袋のシールはヒートシールによって行った。
○(優):10回の試験で袋が破れた回数が0〜1回
△(良):10回の試験で袋が破れた回数が2〜5回
×(不良):10回の試験で袋が破れた回数が5〜10回
[Stripped bag strength]
The number of times a molten bag (35 cm long × 25 cm wide) encapsulating a 2 kg hot melt adhesive was dropped from a height of 1 m was measured and evaluated according to the following criteria. The melting bag was sealed by heat sealing.
○ (excellent): The number of times that the bag was torn in 10 tests was 0 to 1 Δ (good): the number of times that the bag was torn in 10 tests was 2 to 5 times × (defect): 10 times in the test Number of times the bag was torn 5 to 10 times

Claims (2)

融点110℃以下、密度0.915〜0.922、ASTM D1238に基づき190℃の温度、2.16kg荷重下の条件により測定したメルトフローレート15〜35の低密度ポリエチレン樹脂からなり、
合成ゴム、及びタッキファイヤを含有するホットメルト接着剤の包装用である、
溶融袋。
Mp 110 ° C. or less, a density from 0.915 to 0.922, a temperature of 190 ° C. Based on ASTM D1238, Ri Do from low-density polyethylene resin has a melt flow rate from 15 to 35 as measured by the conditions under 2.16kg load,
For packaging hot melt adhesive containing synthetic rubber and tackifier,
Melting bag.
請求項1に記載の溶融袋、及び当該溶融袋で包装され、合成ゴム、及びタッキファイヤを含有するホットメルト接着剤からなる包装ホットメルト接着剤。 A hot melt adhesive packaged with the melt bag according to claim 1 and comprising a hot melt adhesive packaged in the melt bag and containing synthetic rubber and tackifier .
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