JP6191214B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP6191214B2
JP6191214B2 JP2013088479A JP2013088479A JP6191214B2 JP 6191214 B2 JP6191214 B2 JP 6191214B2 JP 2013088479 A JP2013088479 A JP 2013088479A JP 2013088479 A JP2013088479 A JP 2013088479A JP 6191214 B2 JP6191214 B2 JP 6191214B2
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JP
Japan
Prior art keywords
light emitting
lead
light
emitting device
emitting element
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JP2013088479A
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English (en)
Japanese (ja)
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JP2014212248A (ja
JP2014212248A5 (https=
Inventor
宏明 宇川
宏明 宇川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013088479A priority Critical patent/JP6191214B2/ja
Publication of JP2014212248A publication Critical patent/JP2014212248A/ja
Publication of JP2014212248A5 publication Critical patent/JP2014212248A5/ja
Application granted granted Critical
Publication of JP6191214B2 publication Critical patent/JP6191214B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2013088479A 2013-04-19 2013-04-19 発光装置 Active JP6191214B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013088479A JP6191214B2 (ja) 2013-04-19 2013-04-19 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013088479A JP6191214B2 (ja) 2013-04-19 2013-04-19 発光装置

Publications (3)

Publication Number Publication Date
JP2014212248A JP2014212248A (ja) 2014-11-13
JP2014212248A5 JP2014212248A5 (https=) 2016-05-12
JP6191214B2 true JP6191214B2 (ja) 2017-09-06

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ID=51931776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013088479A Active JP6191214B2 (ja) 2013-04-19 2013-04-19 発光装置

Country Status (1)

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JP (1) JP6191214B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6337859B2 (ja) * 2015-09-08 2018-06-06 日亜化学工業株式会社 発光装置
JP6521119B2 (ja) * 2018-02-19 2019-05-29 日亜化学工業株式会社 発光装置
US11769862B2 (en) 2020-03-26 2023-09-26 Nichia Corporation Light emitting device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5691681B2 (ja) * 2010-03-15 2015-04-01 日亜化学工業株式会社 発光装置
JP2012004476A (ja) * 2010-06-21 2012-01-05 Toshiba Corp 発光装置

Also Published As

Publication number Publication date
JP2014212248A (ja) 2014-11-13

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