JP6182692B2 - Control system for transfer robot with electrostatic chuck - Google Patents

Control system for transfer robot with electrostatic chuck Download PDF

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JP6182692B2
JP6182692B2 JP2017521682A JP2017521682A JP6182692B2 JP 6182692 B2 JP6182692 B2 JP 6182692B2 JP 2017521682 A JP2017521682 A JP 2017521682A JP 2017521682 A JP2017521682 A JP 2017521682A JP 6182692 B2 JP6182692 B2 JP 6182692B2
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control means
electrostatic chuck
robot
electrode
transfer robot
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JPWO2016194336A1 (en
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傑之 鈴木
傑之 鈴木
大輔 川久保
大輔 川久保
展史 南
展史 南
和博 武者
和博 武者
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Ulvac Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1612—Programme controls characterised by the hand, wrist, grip control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/90—Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Orthopedic Medicine & Surgery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Description

本発明は、静電チャック付き搬送ロボットの制御システムに関する。 The present invention relates to a control system for a transfer robot with an electrostatic chuck.

従来から、シリコンウエハやガラス基板等のワークに対して所定の処理を実施する真空処理装置ＶＭとして、図１に示すように、搬送ロボットＴｒを配置した中央の搬送室Ａを囲うようにして、ロードロック室Ｂと複数の処理室Ｃ１〜Ｃ３とをゲートバルブＧｖを介して配置し、ロードロック室Ｂに投入したワークＷを搬送ロボットＴｒによりいずれかの処理室Ｃ１〜Ｃ３に搬送し、所定の処理を実施するように構成したもの（所謂、クラスタツール）が知られている。搬送ロボットＴｒとしては、例えば、同心に配置される２本の回転軸と、各回転軸に連結されて回転軸の回転角に応じて旋回及び伸縮するロボットアームとを備え、ロボットアームの先端にワークを載置した状態で支持するロボットハンドを設けたものが用いられる。   Conventionally, as shown in FIG. 1, as a vacuum processing apparatus VM for performing a predetermined process on a workpiece such as a silicon wafer or a glass substrate, a central transfer chamber A in which a transfer robot Tr is arranged is surrounded. The load lock chamber B and the plurality of processing chambers C1 to C3 are arranged via the gate valve Gv, and the workpiece W introduced into the load lock chamber B is transferred to any of the processing chambers C1 to C3 by the transfer robot Tr, A configuration (so-called cluster tool) configured to perform the above-described processing is known. The transfer robot Tr includes, for example, two rotation shafts arranged concentrically and a robot arm that is connected to each rotation shaft and rotates and expands and contracts according to the rotation angle of the rotation shaft. What provided the robot hand which supports in the state which mounted the workpiece | work is used.

このような搬送ロボットの中には、ロボットハンドに正負の電極を設けて所謂双極型の静電チャックを有するものがある（例えば、特許文献１参照）。これにより、ワークを静電吸着することで、搬送途中でロボットハンドからワークが脱離したり、位置ずれしたりしないようにできる。また、真空中で可動する搬送ロボットのロボットハンドに設けた電極に対する給電方法としては、非接触式のものが例えば特許文献２で知られている。このものは、キャパシタと、交流電源部を有して静電チャックの両電極への給電をオンオフ制御（ワークの静電吸着または解除）する静電チャック制御手段とを備える。キャパシタは、対向配置される一対の電極間で機械的に分離され、一方の電極は、回転軸の周囲に固定配置すると共に静電チャック制御手段からの出力が接続され、静電チャックの電極に接続される他方の電極は、電極間距離を一定に維持しながら相対移動するように搬送ロボットの回転軸に取り付けられると共に交流電源部の負荷に接続される。   Among such transfer robots, there is a robot having positive and negative electrodes on a robot hand and a so-called bipolar electrostatic chuck (see, for example, Patent Document 1). Thus, by electrostatically attracting the workpiece, it is possible to prevent the workpiece from being detached or displaced from the robot hand during the conveyance. Further, as a power feeding method for an electrode provided on a robot hand of a transfer robot that is movable in a vacuum, a non-contact type is known, for example, in Patent Document 2. This device includes a capacitor and an electrostatic chuck control unit that has an AC power supply unit and performs on / off control (electrostatic chucking or release of the workpiece) of power feeding to both electrodes of the electrostatic chuck. The capacitor is mechanically separated between a pair of electrodes arranged opposite to each other, and one of the electrodes is fixedly arranged around the rotating shaft and an output from the electrostatic chuck control means is connected to the electrode of the electrostatic chuck. The other electrode to be connected is attached to the rotating shaft of the transfer robot and is connected to the load of the AC power supply unit so as to move relative to each other while maintaining the distance between the electrodes constant.

ここで、図１に示す真空処理装置ＶＭでは、通常、真空ポンプ、搬送室Ａと、ロードロック室Ｂ及び各処理室Ｃ１〜Ｃ３とを夫々仕切るゲートバルブＧｖや各処理室Ｃ１〜Ｃ３内での処理を実施する部品などの各構成要素の作動を統括制御する、シーケンサー、マイコンやメモリー等の公知の制御機器を備える統括制御手段Ｍｃが設けられ、搬送ロボットＴｒの作動を制御する、公知の制御機器を備えるロボット制御手段Ｒｃが別途設けられている。ロボット制御手段Ｒｃは、統括制御手段Ｍｃに通信自在に接続されてこの統括制御手段からの制御信号に応じて搬送ロボットの作動を制御することが一般である。   Here, in the vacuum processing apparatus VM shown in FIG. 1, the vacuum pump, the transfer chamber A, the load lock chamber B, and the processing chambers C <b> 1 to C <b> 3, respectively, are usually provided in the processing chambers C <b> 1 to C <b> 3. There is provided a general control means Mc including a known control device such as a sequencer, a microcomputer, a memory, etc., which controls the operation of each component such as a part that performs the above processing, and controls the operation of the transport robot Tr. A robot control means Rc having a control device is separately provided. In general, the robot control means Rc is communicably connected to the overall control means Mc and controls the operation of the transfer robot in accordance with a control signal from the overall control means.

ところで、搬送ロボットのロボットハンドに静電チャックを設ける場合、静電チャック制御手段もまた、統括制御手段Ｍｃに通信自在に接続し、統括制御手段Ｍｃからの制御信号に応じて静電吸着または解除を制御することが考えられる。然し、静電チャックによるワークの静電吸着または解除と搬送ロボットの動作とが連動しているため、上記制御では、統括制御手段と、ロボット制御手段と静電チャックとの一方の通信を待って、その他方と統括制御手段との通信が行われることとなり、ロボットアームの旋回、伸縮や、静電チャックの静電吸着、解除のための応答時間が長くなるという不具合が生じる。しかも、搬送ロボットを備えた既存の処理装置に静電チャックを後付けしようとすると、統括制御手段自体の動作プログラムに大幅な変更を加える必要が生じるという問題を招来する。   By the way, when an electrostatic chuck is provided in the robot hand of the transfer robot, the electrostatic chuck control means is also connected to the overall control means Mc so as to be communicable, and electrostatic adsorption or release is performed according to a control signal from the overall control means Mc. It is conceivable to control. However, since the electrostatic chucking or release of the workpiece by the electrostatic chuck and the operation of the transfer robot are linked, the above control waits for communication between the overall control means, the robot control means, and the electrostatic chuck. As a result, communication between the other side and the overall control means is performed, and there arises a problem that the response time for turning and expansion / contraction of the robot arm and electrostatic chucking / release of the electrostatic chuck becomes long. Moreover, if an electrostatic chuck is to be retrofitted to an existing processing apparatus equipped with a transfer robot, a problem arises that it is necessary to make a significant change to the operation program of the overall control means itself.

特開平６−６３８８５号公報JP-A-6-63885 再表２０１２／０７７２９６号公報No. 2012/077296

本発明は、以上の点に鑑み、搬送ロボットに静電チャックを設ける場合でも、応答性よく静電チャックを動作させることができる静電チャック付き搬送ロボットの制御システムを提供することをその課題とするものである。   In view of the above, it is an object of the present invention to provide a control system for a transport robot with an electrostatic chuck that can operate the electrostatic chuck with high responsiveness even when the transport robot is provided with an electrostatic chuck. To do.

上記課題を解決するために、ワークに対して所定の処理を実施する複数の処理室を有する処理装置にて、処理室間でワークを静電吸着して搬送する本発明の静電チャック付き搬送ロボットの制御システムは、処理装置の作動を統括制御する統括制御手段に通信自在に接続され、統括制御手段からの制御信号に応じて搬送ロボットの作動を制御するロボット制御手段と、静電チャックに対するワークの静電吸着または解除を制御する静電チャック制御手段とを備え、静電チャック制御手段は、統括制御手段とロボット制御手段との通信内容を監視し、この監視する通信内容を基に静電チャックの静電チャックに対するワークの静電吸着または解除を制御するように構成されることを特徴とする。   In order to solve the above-described problems, the conveyance with an electrostatic chuck according to the present invention in which a workpiece is electrostatically adsorbed and conveyed between processing chambers in a processing apparatus having a plurality of processing chambers for performing predetermined processing on the workpiece. The robot control system is communicatively connected to an overall control means for overall control of the operation of the processing apparatus, and controls the operation of the transfer robot in response to a control signal from the overall control means. Electrostatic chuck control means for controlling electrostatic attraction or release of the workpiece, and the electrostatic chuck control means monitors communication contents between the overall control means and the robot control means, and statically based on the monitored communication contents. The electrostatic chuck is configured to control electrostatic attraction or release of the workpiece with respect to the electrostatic chuck.

本発明によれば、静電チャック制御手段が、統括制御手段とロボット制御手段との通信内容を監視し、この監視する通信内容を基に、即ち、例えば統括制御手段とロボット制御手段との間で特定の制御信号が出力されたときに、静電チャックに対するワークの静電吸着または解除を行うため、統括制御手段と、ロボット制御手段と静電チャック制御手段との一方の通信を待って、その他方と統括制御手段との通信を行うものと比較してその応答時間を短くすることができる。その上、統括制御手段自体の動作プログラムを大幅に変更する必要がなく、搬送ロボットを備えた既存の処理装置に静電チャックを後付けしようとする場合に有利となる。   According to the present invention, the electrostatic chuck control means monitors the communication contents between the overall control means and the robot control means, and based on the monitored communication contents, for example, between the overall control means and the robot control means. When a specific control signal is output in order to perform electrostatic attraction or release of the workpiece with respect to the electrostatic chuck, waiting for one communication between the overall control means, the robot control means and the electrostatic chuck control means, The response time can be shortened as compared with the communication between the other side and the overall control means. In addition, it is not necessary to significantly change the operation program of the overall control means itself, which is advantageous when an electrostatic chuck is to be retrofitted to an existing processing apparatus equipped with a transfer robot.

なお、本発明においては、前記静電チャック制御手段は、対向配置される一対の電極間で機械的に分離され、一方の電極と他方の電極との電極間距離を一定に維持しながら相対移動するように他方の電極が搬送ロボットの可動部分に設けられるキャパシタと、一方の電極に接続される給電回路ユニットと、他方の電極と静電チャックの吸着用電極との間に接続される受電回路ユニットとを有して静電チャックの吸着用電極に対して非接触式の給電するものであり、給電回路ユニットの作動を制御する給電回路制御部で、統括制御手段とロボット制御手段との通信内容を監視する構成を採用することができる。   In the present invention, the electrostatic chuck control means is mechanically separated between a pair of electrodes arranged opposite to each other, and relatively moved while maintaining a constant distance between one electrode and the other electrode. The other electrode is provided on the movable part of the transfer robot, the power supply circuit unit connected to one electrode, and the power receiving circuit connected between the other electrode and the chucking electrode of the electrostatic chuck A power supply circuit control unit that controls the operation of the power supply circuit unit, and communicates between the overall control means and the robot control means. A configuration for monitoring contents can be adopted.

搬送ロボットを備える真空処理装置の構成を模式的に示す図。The figure which shows typically the structure of a vacuum processing apparatus provided with a conveyance robot. 搬送ロボットの構成を示す斜視図。The perspective view which shows the structure of a conveyance robot. 制御システムの回路構成を示す模式図。The schematic diagram which shows the circuit structure of a control system.

以下、搬送ロボットＴｒをそのロボットハンドに静電チャックを備えるものとし、また、ワークをシリコンウエハ（以下、「ウエハＷ」という）とし、この搬送ロボットＴｒが図１に示す真空処理装置ＶＭの搬送室Ａに設けられている場合を例に本発明の実施形態の静電チャック付き搬送ロボットの制御システムＲＳを説明する。なお、搬送ロボットＴｒのロボット制御手段Ｒｃの構成や動作制御及び、統括制御手段Ｍｃとの通信等については公知のものが利用できるため、これ以上の詳細な説明は省略する。   Hereinafter, the transfer robot Tr is provided with an electrostatic chuck in its robot hand, and the workpiece is a silicon wafer (hereinafter referred to as “wafer W”). The transfer robot Tr transfers the vacuum processing apparatus VM shown in FIG. The control system RS of the transfer robot with an electrostatic chuck according to the embodiment of the present invention will be described taking the case of being provided in the chamber A as an example. In addition, since a well-known thing can be utilized about the structure of the robot control means Rc of the conveyance robot Tr, operation control, communication with the general control means Mc, etc., the detailed description beyond this is abbreviate | omitted.

図２及び図３を参照して、静電チャック付き搬送ロボットの制御システムＲＳは、真空処理装置ＶＭの作動を統括制御する統括制御手段Ｍｃに通信自在に接続され、統括制御手段Ｍｃと相互通信しながら搬送ロボットＴｒの作動を制御するロボット制御手段Ｒｃと、静電チャックの両電極への給電をオンオフ制御（ワークの静電吸着または解除）する静電チャック制御手段Ｃｃとを備える。   2 and 3, the control system RS of the transfer robot with the electrostatic chuck is communicably connected to the overall control means Mc for overall control of the operation of the vacuum processing apparatus VM, and communicates with the overall control means Mc. The robot control means Rc for controlling the operation of the transfer robot Tr and the electrostatic chuck control means Cc for on / off control (electrostatic chucking or release of the workpiece) of power supply to both electrodes of the electrostatic chuck are provided.

搬送ロボットＴｒとしては所謂フログレッグ式のものであり、同心状に配置され、図外の駆動源により夫々回転駆動される２本の回転軸１ａ，１ｂと、この回転軸１ａ，１ｂに夫々連結され、先端にロボットハンド２を有するロボットアーム３とで構成される。ロボットハンド２には、静電チャックを構成する吸着用電極４ａ，４ｂが夫々設けられている。特に図示して説明しないが、回転軸１ａ，１ｂに直動モータやエアーシリンダ等の昇降手段が付設され、ロードロック室Ｂや各処理室Ｃ１〜Ｃ３にてウエハＷを受取りまたは受渡しする際に、回転軸１ａ，１ｂ、ひいては、ロボットハンド２を鉛直方向に昇降できるようにしている。   The transfer robot Tr is a so-called frog-leg type, is concentrically arranged, and is connected to two rotary shafts 1a and 1b that are respectively driven to rotate by a drive source (not shown), and the rotary shafts 1a and 1b, respectively. And a robot arm 3 having a robot hand 2 at the tip. The robot hand 2 is provided with suction electrodes 4a and 4b constituting an electrostatic chuck. Although not specifically illustrated and described, when the rotary shafts 1a and 1b are provided with elevating means such as a linear motor or an air cylinder, when the wafer W is received or delivered in the load lock chamber B or each of the processing chambers C1 to C3. The rotary shafts 1a and 1b and by extension the robot hand 2 can be moved up and down in the vertical direction.

静電チャック制御手段Ｃｃは、対向配置される一対の電極間で機械的に分離された、径方向外側に位置する回転軸１ｂの外表面に一体に設けられる一方の電極５ａと、電極間距離を一定に維持しながら相対移動するように、回転軸１ｂに外挿した金属製の筒状部材からなる他方の電極５ｂとで構成されるキャパシタ（所謂エアーギャップ式のもの）５と、電極５ｂに配線６ａを介して接続される給電回路ユニット７と、一方の電極５ａと吸着用電極４ａ，４ｂとの間に配線６ｂを介して接続される受電回路ユニット８とを備える。両電極５ａ，５ｂの表面積や両電極５ａ，５ｂ相互間の距離は、用途に応じて、キャパシタ５に加わる電圧がパッシェンの法則で制限される放電電圧以下であるように適宜選択され、また、両電極５ａ，５ｂの対向する面積は同一である必要はない。   The electrostatic chuck control means Cc is formed by mechanically separating a pair of electrodes arranged opposite to each other, and one electrode 5a integrally provided on the outer surface of the rotary shaft 1b positioned on the radially outer side, and the distance between the electrodes The capacitor (so-called air gap type) 5 composed of the other electrode 5b made of a metal cylindrical member extrapolated to the rotary shaft 1b so as to move relative to the electrode 5b, and the electrode 5b And a power receiving circuit unit 8 connected between the one electrode 5a and the adsorption electrodes 4a and 4b via the wiring 6b. The surface areas of the electrodes 5a and 5b and the distance between the electrodes 5a and 5b are appropriately selected according to the application so that the voltage applied to the capacitor 5 is equal to or lower than the discharge voltage limited by Paschen's law. The opposing areas of both electrodes 5a, 5b need not be the same.

給電回路ユニット７は、キャパシタ５を含む共振回路の共振周波数で発振する自励発振器７１と、振幅変調を加える変調器７２と、これらの作動を統括制御する、マイコンやメモリー等を備えた公知の給電回路制御部７３とを備える。自励発振器７１及び変調器７２として、例えば公知の構造を有するオシレーターを用いることができ、その駆動周波数が１００ｋＨｚ〜数十ＭＨｚのものであり、高周波帯域の駆動周波数を含むものである。受電回路ユニット８は、例えばロボットアーム３の下面に取り付けられた金属製の筺体８ａ内に収納され、吸着用電極４ａ，４ｂに並列に設けた抵抗８１と、キャパシタ５を通してこの抵抗８１の両端に供給された搬送波を整流する整流回路８２と、これらの作動を制御する、マイコンやメモリー等を備えた公知の受電回路制御部８３とを備える。   The power feeding circuit unit 7 is a known self-excited oscillator 71 that oscillates at the resonance frequency of the resonance circuit including the capacitor 5, a modulator 72 that applies amplitude modulation, and a microcomputer, a memory, and the like that collectively control these operations. And a power feeding circuit control unit 73. As the self-excited oscillator 71 and the modulator 72, for example, an oscillator having a known structure can be used. The drive frequency is 100 kHz to several tens of MHz, and includes a drive frequency in a high frequency band. The power receiving circuit unit 8 is housed in, for example, a metal housing 8 a attached to the lower surface of the robot arm 3, a resistor 81 provided in parallel with the attracting electrodes 4 a and 4 b, and both ends of the resistor 81 through the capacitor 5. A rectifier circuit 82 that rectifies the supplied carrier wave and a known power receiving circuit control unit 83 including a microcomputer, a memory, and the like that control the operation thereof are provided.

給電回路制御部７３により自励発振器７１から所定周波数の電力供給用の搬送波が出力されると、変調器７２にて振幅変調がかけられ、キャパシタ５を通して、抵抗８１の両端に変調された搬送波が供給される。そして、この搬送波が整流回路８２で整流され、吸着用電極４ａに、ウエハＷの静電吸着に必要な（正）高電圧が印加されてウエハＷがロボットハンド２に静電吸着される。この場合、特に図示して説明しないが、倍電圧整流方式などで昇圧するようにしてもよい。他方で、給電回路制御部７３により自励発振器７１から電力供給用の搬送波の出力が停止されると、吸着用電極４ａへの電圧印加が停止されてロボットハンド２でのウエハＷの吸着が解除される。なお、給電回路制御部７３と受電回路制御部８３は、例えば無線通信できるようにしている。また、一方の吸着用電極４ｂは、ロボットハンド２にアース接地され、また、抵抗８１は、筺体８ａにアース接地されている。   When a power supply carrier wave having a predetermined frequency is output from the self-excited oscillator 71 by the power feeding circuit control unit 73, amplitude modulation is applied by the modulator 72, and the carrier wave modulated to both ends of the resistor 81 through the capacitor 5. Supplied. Then, this carrier wave is rectified by the rectifier circuit 82, and a (positive) high voltage necessary for electrostatic chucking of the wafer W is applied to the chucking electrode 4 a so that the wafer W is electrostatically chucked to the robot hand 2. In this case, although not specifically illustrated and described, the voltage may be boosted by a voltage doubler rectification method or the like. On the other hand, when the power supply circuit control unit 73 stops the output of the carrier wave for supplying power from the self-excited oscillator 71, the voltage application to the suction electrode 4a is stopped, and the suction of the wafer W by the robot hand 2 is released. Is done. In addition, the power feeding circuit control unit 73 and the power receiving circuit control unit 83 are configured to perform wireless communication, for example. One suction electrode 4b is grounded to the robot hand 2, and the resistor 81 is grounded to the housing 8a.

ところで、上述したように搬送ロボットＴｒを構成した場合、各電極４ａ，４ｂへの給電のオンオフによるウエハＷの静電吸着または解除は、搬送ロボットＴｒの動作と連動して行われる。この場合、静電チャック制御手段Ｃｃを統括制御手段Ｍｃに通信自在に接続し、統括制御手段Ｍｃからの制御信号に応じて静電吸着または解除を制御することが考えられるが、これでは、統括制御手段Ｍｃと、ロボット制御手段Ｒｃと静電チャック制御手段Ｃｃとの一方の通信を待って、その他方と統括制御手段Ｍｃとの通信が行われることとなるので、応答時間が短くできるように構成することが望まれる。   When the transfer robot Tr is configured as described above, electrostatic chucking or release of the wafer W by turning on / off the power supply to the electrodes 4a and 4b is performed in conjunction with the operation of the transfer robot Tr. In this case, it is conceivable that the electrostatic chuck control means Cc is communicably connected to the overall control means Mc and the electrostatic adsorption or release is controlled in accordance with a control signal from the overall control means Mc. Since communication between the control means Mc, one of the robot control means Rc and the electrostatic chuck control means Cc is performed and communication between the other means and the overall control means Mc is performed, the response time can be shortened. It is desirable to configure.

本実施形態では、静電チャック制御手段Ｃｃが、統括制御手段Ｍｃとロボット制御手段Ｒｃとの通信内容を監視し、この監視する通信内容を基に静電チャックによるウエハＷの静電吸着または解除を制御するように構成した。即ち、例えば、統括制御手段Ｍｃとロボット制御手段Ｒｃとが給電回路ユニット７の給電回路制御部７３を経由して相互通信するように構成され、給電回路制御部７３が、統括制御手段Ｍｃとロボット制御手段Ｒｃとの通信内容を常時監視するように構成されている。そして、統括制御手段Ｍｃとロボット制御手段Ｒｃとの間で特定の制御信号が出力されたとき、給電回路制御部７３により自励発振器７１から所定周波数の電力供給用の搬送波が出力され、吸着用電極４ａに、ウエハＷの静電吸着に必要な（正）高電圧が印加されてウエハＷがロボットハンド２に静電吸着される。   In the present embodiment, the electrostatic chuck control means Cc monitors the communication content between the overall control means Mc and the robot control means Rc, and electrostatic chucking or release of the wafer W by the electrostatic chuck based on the monitored communication content. Configured to control. That is, for example, the overall control unit Mc and the robot control unit Rc are configured to communicate with each other via the power supply circuit control unit 73 of the power supply circuit unit 7, and the power supply circuit control unit 73 is configured to communicate with the robot control unit Mc and the robot. The communication contents with the control means Rc are constantly monitored. When a specific control signal is output between the overall control unit Mc and the robot control unit Rc, a power supply carrier wave having a predetermined frequency is output from the self-excited oscillator 71 by the power supply circuit control unit 73, and is used for adsorption. A (positive) high voltage necessary for electrostatic attraction of the wafer W is applied to the electrode 4a, and the wafer W is electrostatically attracted to the robot hand 2.

このような制御信号としては、例えば、ロードロック室Ｂと処理室Ｃ１との間でウエハＷを搬送する場合を例に説明すると、ロードロック室Ｂに存在するウエハＷを受取る場合、先ず、統括制御手段Ｍｃは、ロードロック室Ｂと処理室Ｃ１との間のゲートバルブＧｖを開けた後、ロボット制御手段Ｒｃに対して、回転軸１ａ，１ｂを駆動してロボットハンド２の先端がロードロック室Ｂを指向する位置に旋回する制御信号を出力する。ロボットアーム３の旋回が終了すると、ロボット制御手段Ｒｃは、統括制御手段Ｍｃに対して旋回終了の制御信号を出力する。   As such a control signal, for example, a case where the wafer W is transported between the load lock chamber B and the processing chamber C1 will be described as an example. After opening the gate valve Gv between the load lock chamber B and the processing chamber C1, the control means Mc drives the rotary shafts 1a and 1b to the robot control means Rc so that the tip of the robot hand 2 is load-locked. A control signal for turning to a position directed to the room B is output. When the turning of the robot arm 3 is completed, the robot control means Rc outputs a turning completion control signal to the overall control means Mc.

次に、統括制御手段Ｍｃは、ロボット制御手段Ｒｃに対して、回転軸１ａ，１ｂを更に駆動してロボットハンド２がロードロック室Ｂの所定位置に移動するようにロボットアーム３が伸びる制御信号を出力する。ロボットアーム３の伸びが終了すると、ロボット制御手段Ｒｃは、統括制御手段Ｍｃに対して伸び終了の制御信号を出力する。そして、統括制御手段Ｍｃは、回転軸１ａ，１ｂに付設した昇降手段を介してロボットハンド２を上昇する制御信号を出力する。ロボットハンド２の上昇が終了すると、ロボット制御手段Ｒｃは、統括制御手段Ｍｃに対して上昇終了の制御信号を出力する。このとき、ロボット制御手段Ｒｃの統括制御手段Ｍｃに対する制御信号を監視している給電回路制御部７３は、上昇終了という特定の制御信号を基に、自励発振器７１から所定周波数の電力供給用の搬送波を出力し、吸着用電極４ａに、ウエハＷの静電吸着に必要な（正）高電圧が印加する。これにより、ウエハＷがロボットハンド２に吸着保持される。   Next, the overall control means Mc controls the robot control means Rc to further drive the rotary shafts 1a and 1b so that the robot arm 3 extends so that the robot hand 2 moves to a predetermined position in the load lock chamber B. Is output. When the extension of the robot arm 3 is completed, the robot control means Rc outputs a control signal indicating the end of extension to the overall control means Mc. Then, the overall control means Mc outputs a control signal for raising the robot hand 2 via the raising / lowering means attached to the rotary shafts 1a and 1b. When the raising of the robot hand 2 is finished, the robot control means Rc outputs a raising end control signal to the overall control means Mc. At this time, the power feeding circuit control unit 73 that monitors the control signal for the overall control unit Mc of the robot control unit Rc is for supplying power of a predetermined frequency from the self-excited oscillator 71 based on the specific control signal of the end of the rise. A carrier wave is output, and a (positive) high voltage necessary for electrostatic chucking of the wafer W is applied to the chucking electrode 4a. Thereby, the wafer W is attracted and held by the robot hand 2.

次に、ロードロック室Ｂに存在するウエハＷを受取った後、処理室Ｃ１に受け渡す場合には、上記と同様に通信して、ロボットハンド２の先端が処理室Ｃ１を指向する位置に旋回し、ロボットアーム３を伸ばす。そして、統括制御手段Ｍｃは、昇降手段を介してロボットハンド２が下降を開始する制御信号を出力する。このとき、給電回路制御部７３は、下降開始という特定の制御信号を基に、給電回路制御部７３により自励発振器７１から電力供給用の搬送波の出力が停止されると、吸着用電極４ａへの電圧印加が停止されてロボットハンド２でのウエハＷの吸着が解除される。   Next, when the wafer W present in the load lock chamber B is received and then transferred to the processing chamber C1, communication is performed in the same manner as described above, and the tip of the robot hand 2 turns to a position directed to the processing chamber C1. Then, the robot arm 3 is extended. Then, the overall control means Mc outputs a control signal for starting the descent of the robot hand 2 via the elevating means. At this time, when the power supply circuit control unit 73 stops the output of the carrier wave for power supply from the self-excited oscillator 71 based on the specific control signal of the start of lowering, the power supply circuit control unit 73 supplies the suction electrode 4a. Is stopped, and the suction of the wafer W by the robot hand 2 is released.

以上の実施形態によれば、静電チャック制御手段Ｃｃが、統括制御手段Ｍｃとロボット制御手段Ｒｃとの通信内容を監視し、この監視する通信内容を基に、即ち、例えば統括制御手段Ｍｃとロボット制御手段Ｒｃとの間で特定の制御信号が出力されたときに、ロボットハンド２でのウエハＷの静電吸着または解除を行うため、統括制御手段Ｍｃと、ロボット制御手段Ｒｃと静電チャック制御手段Ｃｃとの一方の通信を待って、その他方と統括制御手段Ｍｃとの通信を行うものと比較してその応答時間を短くすることができる。その上、統括制御手段Ｍｃ自体の動作プログラムを変更する必要がなく、搬送ロボットＴｒを備えた既存の処理装置に静電チャックを後付けしようとする場合に有利となる。   According to the above embodiment, the electrostatic chuck control means Cc monitors the communication contents between the overall control means Mc and the robot control means Rc, and based on the monitored communication contents, for example, the overall control means Mc When a specific control signal is output to the robot control means Rc, the overall control means Mc, the robot control means Rc, and the electrostatic chuck are used to electrostatically attract or release the wafer W by the robot hand 2. Waiting for one communication with the control means Cc, the response time can be shortened compared to the communication with the other means and the general control means Mc. In addition, there is no need to change the operation program of the overall control unit Mc itself, which is advantageous when an electrostatic chuck is to be retrofitted to an existing processing apparatus including the transfer robot Tr.

以上、本発明の実施形態について説明したが、本発明は上記のものに限定されるものではない。上記実施形態では、所謂双極型のものを例に説明したが、これに限定されるものではなく、単極型のものにも本発明は適用でき、また、静電チャックへの給電方法は上記のものに限定されるものではない。また、統括制御手段Ｍｃとロボット制御手段Ｒｃとの通信を監視できるのであれば、静電チャック制御手段Ｃｃの統括制御手段Ｍｃやロボット制御手段Ｒｃへの接続方法は上記に限定されるものではない。   As mentioned above, although embodiment of this invention was described, this invention is not limited to said thing. In the above embodiment, a so-called bipolar type has been described as an example. However, the present invention is not limited to this, and the present invention can also be applied to a single-pole type. It is not limited to those. Further, the method of connecting the electrostatic chuck control means Cc to the overall control means Mc and the robot control means Rc is not limited to the above as long as the communication between the overall control means Mc and the robot control means Rc can be monitored. .

また、上記実施形態では、静電チャック制御手段Ｃｃが監視する通信内容を基に静電チャックによるワークの静電吸着または解除を制御する場合の例として、統括制御手段Ｍｃとロボット制御手段Ｒｃとの間で、ロボットアームの伸縮や昇降など搬送ロボットＴｒの動作に起因した特定の制御信号が出力されたときに制御するものを挙げたが、これに限定されるものではなく、搬送ロボットＴｒがワークを搬送するときの統括制御手段Ｍｃとロボット制御手段Ｒｃとの間で出力される制御信号から適宜選択することができる。例えば、搬送ロボットＴｒがそのロボットハンド２に設置されるワークの存在を検知する機能を持ち、ロボット制御手段Ｒｃから統括制御手段Ｍｃに対してウエハの存在を検知した信号を出力する機能を持っているような場合には、そのときの統括制御手段Ｍｃとロボット制御手段Ｒｃとの通信を基に静電チャック制御手段Ｃｃが静電チャックによるワークの静電吸着を制御することができ、静電チャックでワークを静電吸着している状態で、ロボットアーム３の伸び動作に起因した特定の制御信号が出力されたときに静電吸着の解除を制御することができる。   In the above embodiment, as an example of controlling electrostatic attraction or release of the workpiece by the electrostatic chuck based on the communication content monitored by the electrostatic chuck control unit Cc, the overall control unit Mc and the robot control unit Rc The control is performed when a specific control signal resulting from the operation of the transfer robot Tr such as expansion / contraction or raising / lowering of the robot arm is output. However, the present invention is not limited to this. An appropriate selection can be made from control signals output between the overall control means Mc and the robot control means Rc when the workpiece is conveyed. For example, the transfer robot Tr has a function of detecting the presence of a workpiece installed in the robot hand 2 and has a function of outputting a signal for detecting the presence of a wafer from the robot control means Rc to the general control means Mc. In such a case, the electrostatic chuck control means Cc can control the electrostatic chucking of the work by the electrostatic chuck based on the communication between the overall control means Mc and the robot control means Rc at that time. When a specific control signal resulting from the extension operation of the robot arm 3 is output in a state where the workpiece is electrostatically adsorbed by the chuck, the release of the electrostatic adsorption can be controlled.

他方で、上述したロードロック室Ｂと処理室Ｃ１との間でウエハＷを搬送する場合の例では、給電回路制御部７３が、上昇終了などの特定の制御信号を基に吸着用電極４ａにウエハＷの静電吸着に必要な（正）高電圧を印加したり、高電圧の印加を停止したりしているが、ロボット制御手段Ｒｃは、統括制御手段Ｍｃからロボットアーム３の伸びや縮みを出力を受けた時点でその動作完了までに要する時間が判っていることから、上昇終了などの特定の制御信号を待たずに、タイマーなどを用いた上記時点からのタイミング処理で、給電回路制御部７３により吸着用電極４ａにウエハＷの静電吸着に必要な（正）高電圧を印加したり、電圧印加を停止したりすることもできる。   On the other hand, in the example in the case where the wafer W is transferred between the load lock chamber B and the processing chamber C1 described above, the power feeding circuit control unit 73 applies the adsorption electrode 4a to the adsorption electrode 4a based on a specific control signal such as the end of ascent. Although the (positive) high voltage necessary for electrostatic attraction of the wafer W is applied or the application of the high voltage is stopped, the robot control means Rc extends or contracts the robot arm 3 from the overall control means Mc. Since the time required to complete the operation is known when the output is received, the power supply circuit is controlled by timing processing from the above point using a timer, etc. without waiting for a specific control signal such as the end of the rise. The unit 73 can apply a (positive) high voltage necessary for the electrostatic chucking of the wafer W to the chucking electrode 4a, or can stop the voltage application.

更に、統括制御手段Ｍｃが、例えば搬送ロボットＴｒによりワークの搬送を開始しようとするときに、静電チャック制御手段Ｃｃにより静電チャックの吸着用電極に給電し、この状態でウエハＷを受け取るように制御することができる。他方で、消費電力や静電チャックの残留電荷の増加等を考慮して、搬送ロボットＴｒによるウエハの搬送中にウエハに、所定以上の加速度が加わるようなときにだけ静電チャックの吸着用電極に給電するように構成してもよい。このような場合、特定の制御信号が出力された時点からのタイミング処理で給電回路制御部７３により吸着用電極４ａにウエハＷの静電吸着に必要な（正）高電圧を印加したり、電圧印加を停止したりすればよい。   Further, when the overall control unit Mc is about to start the transfer of the workpiece by the transfer robot Tr, for example, the electrostatic chuck control unit Cc supplies power to the chucking electrode of the electrostatic chuck and receives the wafer W in this state. Can be controlled. On the other hand, in consideration of power consumption, increase in residual charge of the electrostatic chuck, etc., the chucking electrode of the electrostatic chuck is only applied when a predetermined acceleration or more is applied to the wafer during transfer of the wafer by the transfer robot Tr. You may comprise so that it may electrically feed. In such a case, the feeding circuit controller 73 applies a (positive) high voltage necessary for electrostatic chucking of the wafer W to the chucking electrode 4a by timing processing from the time when a specific control signal is output, The application may be stopped.

また、上記実施形態では、吸着用電極４ａにウエハＷの静電吸着に必要な（正）高電圧を印加したり、電圧印加を停止したりするものを例に説明しているが、これに限定されるものではなく、例えば、吸着用電極４ａに静電吸着されているウエハＷを脱離する際に、吸着用電極４ａに逆電位を印加したり、接地したりする制御回路が設けられているような場合にも本発明を適用してそのような制御回路の動作を制御することができる。   In the above-described embodiment, the case where the (positive) high voltage necessary for electrostatic chucking of the wafer W is applied to the chucking electrode 4a or the voltage application is stopped is described as an example. For example, when the wafer W electrostatically attracted to the suction electrode 4a is detached, a control circuit for applying a reverse potential to the suction electrode 4a or grounding is provided. Even in such a case, the operation of such a control circuit can be controlled by applying the present invention.

ＶＭ…真空処理装置（処理装置）、Ｔｒ…搬送ロボット、Ｍｃ…統括制御制御手段、Ｃｃ…静電チャック制御手段、Ｒｃ…搬送ロボット制御手段、２…ロボットハンド、４ａ，４ｂ…吸着用電極、５…キャパシタ、７…給電回路ユニット、７３…給電回路制御部（静電チャック制御手段）。   VM ... Vacuum processing device (processing device), Tr ... Transport robot, Mc ... Overall control control means, Cc ... Electrostatic chuck control means, Rc ... Transport robot control means, 2 ... Robot hand, 4a, 4b ... Suction electrode, 5... Capacitor, 7... Power feeding circuit unit, 73... Power feeding circuit control unit (electrostatic chuck control means).

Claims (2)

ワークに対して所定の処理を実施する複数の処理室を有する処理装置にて、処理室間でワークを静電吸着して搬送する静電チャック付き搬送ロボットの制御システムにおいて、
処理装置の作動を統括制御する統括制御手段に通信自在に接続され、統括制御手段からの制御信号に応じて搬送ロボットの作動を制御するロボット制御手段と、静電チャックに対するワークの静電吸着または解除を制御する静電チャック制御手段とを備え、
静電チャック制御手段は、統括制御手段とロボット制御手段との通信内容を監視し、この監視する通信内容を基に静電チャックによるワークの静電吸着または解除を制御するように構成されることを特徴とする静電チャック付き搬送ロボットの制御システム。In a control system for a transfer robot with an electrostatic chuck that transfers a workpiece by electrostatically attracting the workpiece between the processing chambers in a processing apparatus having a plurality of processing chambers for performing predetermined processing on the workpiece.
A robot control unit that is communicably connected to an overall control unit that performs overall control of the operation of the processing apparatus and controls the operation of the transfer robot according to a control signal from the overall control unit; An electrostatic chuck control means for controlling release,
The electrostatic chuck control means is configured to monitor communication contents between the overall control means and the robot control means, and control electrostatic attraction or release of the workpiece by the electrostatic chuck based on the monitored communication contents. Control system for transfer robot with electrostatic chuck. 前記静電チャック制御手段は、対向配置される一対の電極間で機械的に分離され、一方の電極と他方の電極との電極間距離を一定に維持しながら相対移動するように他方の電極が搬送ロボットの可動部分に設けられるキャパシタと、一方の電極に接続される給電回路ユニットと、他方の電極と静電チャックの吸着用電極との間に接続される受電回路ユニットとを有して静電チャックの吸着用電極に対して非接触式の給電するものであり、給電回路ユニットの作動を制御する給電回路制御部で、統括制御手段とロボット制御手段との通信内容を監視するように構成されることを特徴とする請求項１記載の静電チャック付き搬送ロボットの制御システム。   The electrostatic chuck control means is mechanically separated between a pair of electrodes arranged opposite to each other, and the other electrode is moved relative to each other while maintaining a constant distance between the one electrode and the other electrode. It has a capacitor provided in the movable part of the transfer robot, a power supply circuit unit connected to one electrode, and a power receiving circuit unit connected between the other electrode and the chucking electrode of the electrostatic chuck. A non-contact type power supply to the chucking electrode of the electric chuck. The power supply circuit control unit that controls the operation of the power supply circuit unit is configured to monitor the communication contents between the overall control means and the robot control means. The control system for a transfer robot with an electrostatic chuck according to claim 1.
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