JP2002313897A - Substrate holding device and exposure device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make duct interruption effect sufficient and to realize speedy switching in a substrate holding device where a substrate is sucked and held by negative pressure and is transported to a stage by a transport mechanism. SOLUTION: A wafer chuck 3 of the substrate holding device sucks and holds a wafer 2 as the substrate by negative pressure and is transported to the stage 4 by a transport mechanism 50. The chuck 3 is provided with a stage side duct 33a which sucks and holds the wafer 2 based on negative pressure and a negative pressure control signal which are supplied from the stage 4, and sucks the wafer 2 on the stage 4, when the wafer 2 is held on the stage 4. The chuck sucks and holds the wafer 2 based on negative pressure and the negative pressure control signal which are supplied from the transport mechanism 50, when the wafer is transported by the transport mechanism 50. The chuck sucks the wafer 2 on the stage 4 and with a transport mechanism side duct 33b for sucking the wafer 2 by the hand 51 of the transport mechanism 50.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate transfer system for transferring a substrate such as a wafer in an exposure apparatus. In addition, the present invention relates to a substrate holding apparatus for holding a substrate such as a wafer by vacuum suction, an exposure apparatus using the same, and a device manufacturing method.

[0002]

2. Description of the Related Art FIG. 5 is a schematic view of an exposure apparatus and a wafer supply apparatus disclosed in Japanese Patent Application Laid-Open No. 2000-82737. 1 is an off-axis alignment optical system, 2
Denotes a wafer which is a substrate to be exposed, 13 denotes a wafer chuck on which the wafer 2 is mounted and holds the wafer 2 by vacuum suction, and 14A denotes a position where the wafer chuck 13 is mounted and the position of the wafer is measured by a laser interferometer (not shown). 2 is an alignment stage for positioning. Wafer supply unit 2
Reference numerals 1 and 22 perform pre-alignment of the wafer 2 by the alignment optical system 1 and the alignment stage 14A. Reference numeral 5 denotes a projection optical system for projecting the image of the reticle 6 onto the wafer 2, reference numeral 7 denotes a TTL (Through The Lens) alignment optical system, reference numeral 8 denotes an illumination optical system, and reference numeral 14B denotes a position of the wafer chuck 13 on which the wafer 2 is mounted. It is a wafer stage. Reference numeral 11 denotes a semiconductor exposure apparatus, which is a central processing unit 9
Are connected online with the wafer supply units 21 and 22 via the. Reference numeral 30 denotes a vacuum device, which performs vacuum suction for holding a wafer by the hose 10 connected to the alignment stage 14A and the wafer stage 14B. With the above configuration, the wafer chuck 13 holding the wafer 2 pre-aligned by the wafer supply units 21 and 22 is transferred to the wafer stage 14B of the exposure apparatus 11 by the hand mechanism 50. Since the wafer 2 conveyed to the exposure device 11 is pre-aligned by the wafer supply units 21 and 22 in advance, the position of the wafer chuck 13 with respect to the reticle 6 in the exposure device 11 is measured by the TTL, so that the central processing unit 9, each shot position can be calculated, and the alignment time can be shortened.

FIG. 6 shows a conventional example of a wafer chuck. In the figure, a wafer chuck 13 on which a wafer 2 is mounted is provided.
Are held by suction on the alignment stage 14A or the wafer stage 14B. A stage-side vacuum conduit 133a is provided on the chuck surface for vacuum-sucking the wafer 2,
The hand-side vacuum pipe 133b communicates with the hand. Each vacuum line 133a, 133b is connected to a respective ball 1
34a, 134b and soft springs 135a, 13
5b.

[0004] In FIG.
4B, a pipe 42 is formed as a wafer suction air pipe system independently of a chuck suction air pipe system (not shown), and the pipe 42 is connected to the hose 10 connected to the above-described vacuum device. And the vacuum line 133a on the stage side of the wafer chuck 13 are communicated with each other. When the vacuum device 30 supplies a negative pressure to the wafer chuck 13 via the wafer suction air piping system in the wafer chuck support stage 14, the balls 134b provided in the hand-side vacuum pipe 133b
A pressure difference is generated between the left and right sides, and the ball 134b is pressed against the narrowed portion, so that the hand-side vacuum pipe 133b
Is in a state where the flow is interrupted. As a result, a flow of air is generated as indicated by the arrow in the figure, whereby a reduced pressure state sufficient to adsorb the wafer 2 on the chuck surface is maintained.

On the other hand, when the wafer is transferred by the hand mechanism 50, the flow of the stage side vacuum conduit 133a is cut off. As a result, the wafer 2
Is maintained at a reduced pressure sufficient to convey. In FIG. 6, reference numeral 38 denotes a stage support surface, 39 denotes a hand support surface, 40 denotes a hand support flange, and 41 denotes a chuck support surface.

[0006]

With respect to the above conventional example,
There are the following issues. -Unless a sufficient differential pressure is generated in the ball, the effect of blocking the pipeline cannot be obtained.・ Adjustment of the spring is difficult, and quick switching cannot be supported.

SUMMARY OF THE INVENTION In view of these problems to be improved, it is an object of the present invention to provide a substrate holding device that has a sufficient line blocking effect and enables quick switching.

[0008]

According to the present invention, there is provided a substrate holding apparatus for sucking and holding a substrate by a negative pressure and transferring the substrate to a stage by a transfer mechanism.
A first holding mechanism that sucks and holds the substrate based on a negative pressure and a negative pressure control signal supplied from the stage when the substrate is held on the stage; and And a second holding mechanism that sucks and holds the substrate based on the negative pressure and the negative pressure control signal supplied from the transport mechanism.

It is preferable that the first holding mechanism include a stage side pipe for sucking the substrate by the first holding mechanism and a transport mechanism side pipe for sucking the substrate by the second holding mechanism. When the substrate is being sucked by the holding mechanism, the pipeline on the transfer mechanism side is almost closed, and when the substrate is being sucked by the second holding mechanism, the pipeline on the stage side is almost closed. It is preferable that the opening and closing of the stage side pipe and the transport mechanism side pipe can be controlled based on the negative pressure control signal, and the negative pressure control signal is an air pressure signal and an electric signal. Any of them may be used.

The present invention is also directed to a substrate holding apparatus which sucks and holds a substrate by a negative pressure and transfers the substrate to a stage by a transfer mechanism. A first holding mechanism for sucking and holding the substrate based on the negative pressure control signal, and sucking the substrate based on the negative pressure and the negative pressure control signal supplied from the transfer mechanism when the substrate is being transferred by the transfer mechanism. And a second holding mechanism for holding, and a control mechanism capable of arbitrarily controlling the supply of the respective negative pressures. At least one of a pressure gauge and a thermometer provided on at least one of the stage and the transfer mechanism can measure at least one of the pressure measurement of the negative pressure and the temperature in the vicinity of holding the substrate. preferable.

According to the present invention, there is provided an exposure apparatus having a substrate stage for detachably holding any of the above substrate holding devices, and transferring an original pattern to a substrate positioned by the substrate stage. Good. The substrate stage can hold the substrate holding device by suction under a negative pressure, has an alignment stage that detachably holds the substrate holding device, and the substrate holding device held by the alignment stage. The relative position to the substrate may be detected, and the detection of the relative position between the substrate holding device and the substrate performed when the substrate is held by the alignment stage is preferably performed by off-axis global alignment. The alignment stage includes:
It is desirable that the substrate holding device be suction-held by a negative pressure, and that the transport mechanism transports the substrate holding device from the alignment stage to the substrate stage, and that the substrate held by the substrate stage be exposed to light. When performing positioning, the through-the-lens (TT
L) The alignment is preferably performed.

Further, the present invention provides a step of installing a manufacturing apparatus group for various processes including any one of the above exposure apparatuses in a semiconductor manufacturing factory, and manufacturing a semiconductor device by a plurality of processes using the manufacturing apparatus group. The method is also applicable to a semiconductor device manufacturing method having steps. Connecting the group of manufacturing apparatuses via a local area network, and performing data communication of information on at least one of the group of manufacturing apparatuses between the local area network and an external network outside the semiconductor manufacturing plant. Preferably, a database provided by a vendor or a user of the exposure apparatus is accessed via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing factory different from the semiconductor manufacturing factory It is preferable to perform production management by performing data communication with the external network via the external network.

According to the present invention, there is provided a manufacturing apparatus group for various processes including any of the above exposure apparatuses, a local area network connecting the manufacturing apparatus group, and an external network outside the factory being accessed from the local area network. A semiconductor manufacturing factory having a gateway for enabling the data communication of information on at least one of the manufacturing apparatus groups, wherein a vendor or a user of the exposure apparatus is provided outside the semiconductor manufacturing factory. Providing a maintenance database connected to a network, allowing access to the maintenance database from within the semiconductor manufacturing plant via the external network, and storing maintenance information stored in the maintenance database in the external network Transmitting to the semiconductor manufacturing factory side via It may be a maintenance method for an optical device.

According to the present invention, in any one of the above-described exposure apparatuses, the apparatus further includes a display, a network interface, and a computer that executes network software. It may be characterized in that it is possible to do so. The network software is connected to an external network of a factory where the exposure apparatus is installed, and provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the exposure apparatus on the display. It is preferable to be able to obtain information from the database via.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS <First Embodiment> FIG. 1 is a view schematically showing an exposure apparatus and a wafer transfer apparatus according to the present invention. In FIG. 1, reference numeral 1 denotes an off-axis alignment optical system, 2 denotes a wafer as a substrate to be exposed,
Is a wafer chuck that constitutes a substrate holding device that holds the wafer 2 and holds the wafer 2 by vacuum suction. 4A is a wafer chuck that mounts a wafer chuck 3 and is position-measured by a laser interferometer (not shown). This is an alignment stage for positioning the chuck 3.

Reference numerals 21 and 22 denote wafer supply units (or wafer supply units) which pre-align the wafer 2 with the alignment optical system 1 and the alignment stage 4A, and detect the relative position of the wafer 2 with respect to the wafer chuck 3. Here, as the relative position between the wafer chuck 3 and the wafer 2, the relative position of each chip on the wafer 2 with respect to the alignment mark of the wafer 2 is detected.

Reference numeral 4B denotes a wafer stage on which the wafer chuck 3 is mounted and whose position is measured by a laser interference system (not shown) to position the wafer 2 and the wafer chuck 3. 5 is a projection optical system for projecting an image of a reticle 6 as an original onto the wafer 2, 7 is a TTL alignment optical system, 8
Is an illumination optical system. 11 is a wafer supply unit 21 and 2
2 is an exposure unit (or exposure apparatus) connected online. Reference numeral 9 denotes a central processing unit that controls operations of the wafer supply units 21 and 22 and the exposure unit 11. Exposure unit 11
Then, the reticle 6 is irradiated with exposure light by the illumination optical system 8, and this irradiation light is reduced and projected on the wafer 2 by the projection optical system 5. The wafer stage 4B includes the wafer chuck 3
The wafer 2 held thereon is sequentially positioned so as to be exposed for each chip. A hand mechanism 50 transports the wafer 2 together with the wafer chuck 3. Reference numeral 10 denotes a hose that supplies a negative pressure generated by the vacuum device 30 to the alignment stage 4A, the wafer stage 4B, and the hand mechanism 50. Reference numeral 20 denotes a control signal line, which is connected to the alignment stage 4A, the wafer stage 4B, and the hand mechanism 50 similarly to the hose 10. This control signal line operates based on a command from the central processing unit 9. Details will be described later.

The operation of each component when the wafer 2 is transferred from the wafer supply units 21 and 22 to the exposure unit 11 with the above configuration will be described.

First, the wafer 2 is supplied to the wafer supply units 21 and
Vacuum suction is performed by the wafer chuck 3 mounted on the second alignment stage 4A, and the wafer is held on the wafer chuck surface. In this state, the alignment stage 4A is positioned, the relative position between the wafer chuck 3 and the wafer 2 is detected by off-axis global alignment, and pre-alignment of the wafer 2 is performed. A method of holding the wafer 2 and the wafer chuck 3 in the wafer supply units 21 and 22 will be described later.

After the completion of the pre-alignment of the wafer 2, the wafer chuck 3 holding the wafer 2 is transferred to the wafer stage 4 B of the exposure unit 11 by the transfer hand mechanism 50.
The transfer hand mechanism 50 includes the wafer 2 and the wafer chuck 3.
The wafer chuck 3 is transferred while being held by vacuum suction so as not to drop. The details of this transport operation will be described later.

The wafer stage 4B holds the wafer chuck 3 and the wafer 2 transported by the transport hand mechanism 50, holds the wafer chuck 3 by vacuum suction, and positions the wafer 2 by driving the wafer stage 4B. . A method for holding the wafer chuck 3 of the wafer stage 4B will be described later. The wafer stage 4B
Step movement to a predetermined shot position is repeated for each chip, and a reticle pattern is exposed on the wafer 2.

When performing exposure, the TTL alignment optical system 7 performs TTL alignment between the reticle 6 and the wafer 2 using a projection optical system for each shot. TTL
The alignment can correct this error even if the distance between the alignment mark of the wafer 2 and each chip or the distance between the chips changes, so that the alignment between the reticle 6 and the wafer 2 can be performed with high accuracy. Can be. Generally TT
In the L alignment, since alignment is performed for each shot, it takes a long alignment time and the throughput is reduced.
Since the relative positions of each shot of the wafer 2 with respect to the wafer chuck 3 are detected in advance in the central processing unit 9 by measuring the position of the wafer chuck 3 with respect to the reticle 6 on the wafer stage 4B by the TTL. Each shot position can be calculated,
High-precision and high-speed alignment can be performed.

Incidentally, in the present invention, the exposure apparatus includes the above-described exposure unit 11, but the wafer supply units 21 and
2. The vacuum device 30 may or may not be included. Neither case changes the essence of the invention.

FIG. 2 shows a detailed structure of the wafer chuck 3 which is a feature of the present invention. In FIG. 1, a wafer chuck 3 as a substrate holding device has a chuck surface composed of a convex portion 31 that is a portion that comes into contact with the wafer 2 for vacuum-sucking the wafer 2 and a concave portion 32 that is a depressurized portion. . The projection 31 is finished to an extremely high flatness. Further, in the recess 32, a stage-side vacuum pipe line 33 a for suction by a first holding mechanism that sucks and holds the wafer 2 based on a negative pressure supplied from the stage 4 and a negative pressure control signal, and a transfer mechanism 50. A vacuum line 33b for hand-side vacuum for suction by a second holding mechanism that sucks and holds the wafer 2 based on the supplied negative pressure and a negative pressure control signal is in communication with the hand-held vacuum line 33b.

Each of the vacuum lines 33a, 33b is provided with a respective pressurizing line 34a, 34b, which is individually opened and closed and serves as a control mechanism for arbitrarily controlling the supply of negative pressure. The valve portions 36a and 36b, the valve rotation support portions 37a and 37b, and the pressurized pipelines 34a and 34
4b, there are valve opening pressing portions 35a and 35b slidable within 4b. When the pressurized pipelines 34a and 34b are open, the valve portions 36a and 36b are closed.
The wafer chuck 3 has a stage supporting surface 38 parallel to the convex portion 31 serving as a chuck surface, and a hand supporting flange 4.
0, and a hand support surface 39.

FIG. 3 shows the operation principle of the wafer chuck 3 described above. FIG. 3A shows a state where the wafer chuck 3 is mounted on an alignment stage 4A or a wafer stage 4B which is a wafer chuck supporting stage, and FIG. This shows a state where it is mounted on the mechanism 50. In FIG. 3A, the wafer chuck 3 has a stage support surface 38 of the wafer chuck 3 and a chuck support surface 41 on the wafer chuck support stage 4 (4A or 4B).
Is held by vacuum suction. The air piping system for chucking the chuck is not shown.

The wafer chuck support stage 4 is provided with a pipe 42 as a wafer suction air pipe system independently of the chuck suction air pipe system. Hose 10 connected to
And the stage side vacuum pipe 33a of the wafer chuck 3 are communicated with each other. Further, a wafer suction control pipe 43 is formed, and this pipe 43 connects the control signal line 20 and the pressurized pipe 35a. When the wafer chuck 3 is mounted on the alignment stage 4A or the wafer stage 4B, high-pressure air is supplied to the pressurized pipeline 34a based on a command from the central processing unit 9, and the control signal line 20 is supplied.
Is supplied via Then, the valve portion 36a is pressed by the pressing portion 35a, rotates around the support portions 37a and 37b, and the valve is opened. In this state, when the vacuum device 30 supplies a negative pressure to the wafer chuck 3 via the wafer suction air piping system in the wafer chuck support stage 4, the flow in the hand-side vacuum pipe 33b remains shut off. 3A, a flow of air is generated as shown by an arrow in FIG. 3A, whereby a reduced pressure state sufficient to suck the wafer 2 in the concave portion 32 of the chuck surface is maintained.

FIG. 3B shows a state where the wafer chuck 3 is mounted and transported by the hand mechanism 50. In the figure, the wafer chuck 3 is gripped so that the hand support surface 39 of the wafer chuck 3 is sandwiched by the hand 51 of the hand mechanism 50. The hand 51 has a contact portion 52 and is in close contact with the hand support surface 39 of the wafer chuck 3. In the hand 51, there is a wafer suction air piping system 53, which communicates with the hand-side vacuum pipe line 33b in the wafer chuck 3. The wafer suction air piping system 53 in the hand 51 is connected to the vacuum device 30 by the hose 10.

Further, the hand 51 is provided with a wafer suction control pipeline 54, which communicates the control signal line 20 with the pressurized pipeline 34b.
When the wafer chuck 3 is brought into close contact with the hand 51, high-pressure air is supplied to the pressurized pipeline 34 b via the control signal line 20 based on a command from the central processing unit 9. Then
The valve portion 36b is pressed by the pressing portion 35b, and the valve is opened. In this state, when the vacuum device 30 supplies a negative pressure to the wafer chuck 3 via the suction air piping system 53, the flow in the stage-side vacuum pipe line 33a is cut off as shown by the arrow. A flow of air is generated, so that a reduced pressure state sufficient to suck the wafer 2 in the concave portion 32 of the chuck surface is maintained.

In the above-described configuration, the wafer chuck 3 is sandwiched by the hand supporting surface 39 provided on the side surface of the wafer chuck 3. However, the present invention is not limited to this. Hand 51
It may be mounted on top. In addition, the wafer suction air pipe system 53 applies a negative pressure from the hand-side vacuum pipe port provided on the side surface of the wafer chuck 3, but is not limited to this, and the hand-side vacuum pipe port is hand-supported. It may be provided on the flange side for use.

In the past, the alignment stage 4
A, the case where the wafer chuck 4 is mounted on only one of the wafer stage 4B and the hand mechanism 50 has been described.
When the wafer chuck 3 is mounted on the hand mechanism 50 and transferred to the stage 4, the wafer chuck 3 is held by both the hand mechanism 50 and the chuck support stage 4. At this time, both the control signal lines to the stage 4 and the hand mechanism 50 may be made valid. If vacuum pressure gauges are provided in the pipelines of the wafer suction air piping systems 42 and 53 in the stage 4 and the hand mechanism 50, respectively, the wafer chuck 3 sucks and holds the wafer 2 in a sufficiently reduced pressure state. Can be monitored.

In the present embodiment, the wafer and the wafer chuck whose relative positions have been measured in advance in the wafer supply unit are transported to the exposure unit, and the alignment of the wafer is performed in the exposure unit. Therefore, the alignment time in the exposure unit is reduced. be able to. This is particularly effective when performing TTL alignment in an exposure unit, which alone takes an alignment time.

In this embodiment, it is necessary to transfer the wafer chuck holding the wafer to the wafer stage of the exposure unit so that the relative positions of the wafer and the wafer chuck measured in the wafer supply unit do not shift. Traditionally,
It has been difficult to increase the degree of vacuum due to the inability to obtain a pipeline blocking effect, or to increase the responsiveness of pipeline blocking. However, in the present embodiment, a negative pressure can be instantaneously applied to the wafer chuck via the stage or the hand mechanism, and the hose does not have to be dragged during the transfer, so that the degree of freedom in designing the apparatus is increased, and the hose can be used. Since there is no entanglement, troubles such as falling of the wafer are reduced. In addition, it has become possible to keep the high-speed performance of the apparatus without impairing it.

<Second Embodiment> As described above, the present invention is not limited to the first embodiment as long as the valve can be switched by a signal line different from the negative pressure line. In the second embodiment, for example, by incorporating a general solenoid valve,
Even if an electric signal is given as the control signal line 20 shown in FIG. 4A to switch between the stage-side vacuum pipe 33a and the hand-side vacuum pipe 33b, there is no functional problem.

Although the solenoid valve generates heat, it should be handled with care, but it is possible to substantially eliminate the influence of heat generation by shortening the heat generation time. By incorporating a solenoid valve, the substrate chuck itself can be easily manufactured. In FIG. 4, the same elements as those in FIG. 3 are denoted by the same reference numerals, and the description thereof will not be repeated.

<Third Embodiment> In the first embodiment, a method has been described in which a vacuum line can be reliably controlled in order to reliably hold a vacuum during transfer, alignment, and exposure of a substrate. . However, on the other hand, in order to maintain high accuracy, it is necessary to manage the temperature state in each state, and therefore, as shown in FIGS. 4A and 4B, the alignment stage 4A, the wafer stage 4B It is possible to provide the temperature sensors 60A and 60B on the hand mechanism 50 and further provide the temperature sensor 60h on the hand mechanism 50. Needless to say, these temperature sensors are desirably arranged near the chuck.

<Embodiment of Semiconductor Production System>
Semiconductor device (IC or LS) using the apparatus according to the present invention
An example of a production system of a semiconductor chip such as I, a liquid crystal panel, a CCD, a thin-film magnetic head, a micromachine, etc.) will be described. In this system, maintenance services such as troubleshooting and periodic maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software are performed using a computer network outside the manufacturing factory.

FIG. 7 shows the whole system cut out from a certain angle. In the figure, reference numeral 101 denotes a business establishment of a vendor (apparatus supply maker) that provides a semiconductor device manufacturing apparatus. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film formation equipment,
It is assumed that flattening equipment and the like and post-processing equipment (assembly equipment, inspection equipment, etc.) are used. In the business office 101, a host management system 10 for providing a maintenance database of manufacturing equipment
8. It has a plurality of operation terminal computers 110 and a local area network (LAN) 109 connecting these to construct an intranet or the like. Host management system 1
Reference numeral 08 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the business office, and a security function for restricting external access.

On the other hand, reference numerals 102 to 104 denote manufacturing factories of a semiconductor manufacturer as users of the manufacturing apparatus. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 connecting them to construct an intranet or the like, and a host as a monitoring apparatus for monitoring the operation status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
Host management system 107 provided in the storage system 02 to 104
Has a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, access to the host management system 108 on the vendor 101 side from the LAN 111 of each factory via the Internet 105 is possible, and access is allowed only to limited users by the security function of the host management system 108. In particular,
Via the Internet 105, status information indicating the operation status of each manufacturing apparatus 106 (for example, the symptom of the manufacturing apparatus in which a trouble has occurred) is notified from the factory side to the vendor side, and response information corresponding to the notification (for example, (Information indicating how to cope with a trouble, software and data for coping), and maintenance information such as the latest software and help information can be received from the vendor. For data communication between each of the factories 102 to 104 and the vendor 101 and data communication with the LAN 111 in each of the factories, a communication protocol (T
CP / IP) is used. Instead of using the Internet as an external network outside the factory, a dedicated line network (such as ISDN) that can be accessed by a third party and has high security can be used. In addition, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit access to the database from a plurality of factories of the user.

FIG. 8 is a conceptual diagram showing the whole system of the present embodiment cut out from an angle different from that of FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. The data of the manufacturing apparatus was communicated. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors is connected to a management system of each of the plurality of manufacturing equipments via an external network outside the factory, and maintenance information of each manufacturing equipment is stored. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing line for performing various processes, for example, an exposure apparatus 202, a resist processing apparatus 203;
A film forming apparatus 204 is introduced. Although only one manufacturing factory 201 is illustrated in FIG. 8, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by LAN 206 to form an intranet,
The operation management of the production line is performed by the host management system 205.

On the other hand, each business establishment of a vendor (apparatus maker) such as an exposure apparatus maker 210, a resist processing apparatus maker 220, and a film forming apparatus maker 230 has a host management system 21 for remote maintenance of the supplied equipment.
1, 211, and 231 which include a maintenance database and an external network gateway as described above. A host management system 205 for managing each device in the user's manufacturing plant, and a vendor management system 2 for each device
11, 221, and 231 are connected by the Internet or the dedicated line network which is the external network 200. In this system, if a trouble occurs in any of a series of manufacturing equipment on the manufacturing line,
Although the operation of the production line is paused, quick response is possible by receiving remote maintenance via the Internet 200 from the vendor of the troubled device, and the suspension of the production line can be minimized. .

Each of the manufacturing apparatuses installed in the semiconductor manufacturing factory has a display, a network interface, and a computer that executes network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 9 on a display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 401, the serial number 402, and the trouble subject 40.
3. Information such as date of occurrence 404, degree of urgency 405, symptom 406, coping method 407, progress 408, etc. is input to input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the resulting appropriate maintenance information is returned from the maintenance database and presented on the display. The user interface provided by the web browser further includes hyperlink functions 410 to 4 as shown in the figure.
12 enables the operator to access more detailed information on each item, extract the latest version of software used for manufacturing equipment from the software library provided by the vendor, and provide an operation guide (help Information). Here, the maintenance information provided by the maintenance database includes the information on the present invention described above, and the software library also provides the latest software for realizing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG. 10 shows a flow of the whole semiconductor device manufacturing process.
In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. Step 3
In (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and assembly such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). Process. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Further, information for production management and apparatus maintenance is also communicated between the pre-process factory and the post-process factory via the Internet or a dedicated line network.

FIG. 11 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In 5 (resist processing), a photosensitive agent is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Can be improved in productivity.

[0045]

According to the present invention, it is possible to reliably apply a negative pressure to the substrate holding device via the stage or the hand mechanism, and it is not necessary to pull the hose during the transfer.
Since the degree of freedom in designing the device is increased and the hose is not entangled, troubles such as dropping of the substrate are reduced. Further, switching of vacuum can be performed instantaneously, and high-speed operation of the apparatus can be maintained.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing the entirety of an exposure unit and a wafer supply device according to an embodiment of the present invention.

FIG. 2 is a sectional view of a wafer chuck as a substrate holding device according to the first embodiment of the present invention.

3A and 3B are explanatory cross-sectional views when a negative pressure is supplied to the wafer chuck shown in FIG. 2, wherein FIG. 3A shows a state where the wafer chuck is mounted on a stage, and FIG. This shows a state of being mounted and transported by the hand mechanism.

FIG. 4 is a cross-sectional view of a wafer chuck according to a second embodiment and a third embodiment of the present invention, wherein (a) shows a state where the wafer chuck is mounted on a stage,
(B) shows a state where the wafer chuck is mounted and transported by the hand mechanism.

FIG. 5 is an overall schematic view of a conventional exposure apparatus and wafer supply apparatus.

FIG. 6 is a cross-sectional view of a conventional exposure unit and a wafer chuck.

FIG. 7 is a conceptual view of a semiconductor device production system using the apparatus according to the present invention as viewed from a certain angle.

FIG. 8 is a conceptual diagram of a semiconductor device production system using the apparatus according to the present invention as viewed from another angle.

FIG. 9 is a specific example of a user interface.

FIG. 10 is a diagram illustrating a flow of a device manufacturing process.

FIG. 11 is a diagram illustrating a wafer process.

[Explanation of symbols]

1: alignment optical system, 2: wafer (substrate), 3: wafer chuck, 4: stage, 4A: alignment stage, 4B: wafer stage, 5: projection optical system, 6: reticle (original), 7: TTL alignment optics System, 8:
Illumination optical system, 9: central processing unit, 10: hose, 11:
Exposure unit or exposure apparatus, 13: wafer chuck, 14:
Stage, 14A: Alignment stage, 14B: Wafer stage, 20: Control signal line, 21, 22: Wafer supply unit, 30: Vacuum device, 31: Convex portion, 32: Concavity, 33a: Vacuum pipeline on stage side, 33b : Hand side vacuum line, 34 (34a, 34b): pressurized line, 35
(35a, 35b): valve opening pressing portion, 36 (36
a, 36b): Valve portion, 37 (37a, 37b): Valve rotation support portion, 38: Stage support surface, 39: Hand support surface, 40: Hand support flange, 42: Wafer suction air piping system, 43: Control pipeline, 50: Hand mechanism, 51: Hand, 52: Close contact portion, 53: Wafer suction air piping system, 54: Control pipeline, 60: Temperature sensor, 1
01: Vendor business, 102, 103, 104: Manufacturing plant, 105: Internet, 106: Manufacturing equipment, 1
07: factory host management system, 108: vendor host management system, 109: vendor local area network (LAN), 110: operation terminal computer, 111: factory local area network (L)
AN), 200: external network, 201: manufacturing apparatus user's manufacturing factory, 202: exposure apparatus, 203: resist processing apparatus, 204: film formation processing apparatus, 205: factory host management system, 206: factory local area network (LAN), 210: exposure apparatus maker, 21
1: a host management system for an office of an exposure apparatus maker;
Reference numeral 20: resist processing apparatus maker, 221: host management system of a business site of the resist processing apparatus maker, 230: film forming apparatus maker, 231: host management system of a business site of the film forming apparatus maker, 401: model of manufacturing apparatus, 402 : Serial number, 403: trouble subject, 404: date of occurrence, 405: urgency, 406: symptom, 407: remedy, 408: progress, 410, 411, 412: hyperlink function.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/027 H01L 21/30 503C 502J 520A F term (Reference) 3C100 AA62 BB02 CC02 CC03 CC04 EE06 5F031 CA02 FA01 FA07 FA12 GA15 GA24 GA35 HA14 HA50 HA53 HA60 JA01 JA02 JA06 JA10 JA14 JA22 JA32 JA38 JA46 JA47 KA05 LA15 MA27 PA06 5F046 CC08 CC10 CC13 CD01 CD04 CD06 DA07 DA26 DA27 FC08

Claims (21)

[Claims] 1. A substrate holding apparatus for holding a substrate by suction under a negative pressure and transferring the substrate to a stage by a transfer mechanism, wherein a negative pressure supplied from the stage and a negative pressure control when the substrate is held on the stage. A first holding mechanism for sucking and holding the substrate based on a signal, and a second holding mechanism for sucking and holding the substrate based on the negative pressure and negative pressure control signals supplied from the transfer mechanism when the substrate is being transferred by the transfer mechanism. A substrate holding device comprising: a holding mechanism. 2. The apparatus according to claim 1, further comprising: a stage-side conduit for adsorbing the substrate by the first holding mechanism, and a transfer mechanism-side conduit for adsorbing the substrate by the second holding mechanism. The substrate holding device according to claim 1. 3. When the substrate is being sucked by the first holding mechanism, the transfer mechanism side pipe is substantially closed, and when the substrate is being sucked by the second holding mechanism. The substrate holding device according to claim 1, wherein the stage-side conduit is substantially closed. 4. The substrate holding apparatus according to claim 2, wherein opening and closing of the stage side pipeline and the transfer mechanism side pipeline are controlled based on the negative pressure control signal. 5. The system according to claim 1, wherein the negative pressure control signal is one of a pneumatic signal and an electric signal.
The substrate holding device according to any one of the above. 6. A substrate holding apparatus for holding a substrate by suction under a negative pressure and transferring the substrate to a stage by a transfer mechanism, wherein the negative pressure and the negative pressure supplied from the stage are controlled when the substrate is held on the stage. A first holding mechanism for sucking and holding the substrate based on a signal, and a second holding mechanism for sucking and holding the substrate based on the negative pressure and negative pressure control signals supplied from the transfer mechanism when the substrate is being transferred by the transfer mechanism. A substrate holding device comprising: a holding mechanism; and a control mechanism capable of arbitrarily controlling the supply of each negative pressure. 7. A pressure gauge of at least one of a pressure gauge and a thermometer provided on at least one of the stage and the transfer mechanism to measure at least one of the pressure of the negative pressure and the temperature in the vicinity of holding the substrate. The substrate holding device according to claim 1, wherein measurement is possible. 8. A substrate stage for detachably holding the substrate holding device according to claim 1, wherein an original pattern is transferred onto a substrate positioned by the substrate stage. Exposure apparatus. 9. The exposure apparatus according to claim 8, wherein the substrate stage suction-holds the substrate holding device by negative pressure. 10. An apparatus according to claim 8, further comprising an alignment stage for detachably holding said substrate holding device, and detecting a relative position between said substrate holding device held by said alignment stage and said substrate. Or the exposure apparatus according to 9. 11. The exposure according to claim 10, wherein the detection of the relative position between the substrate holding device and the substrate performed while the substrate is held on the alignment stage is performed by off-axis global alignment. apparatus. 12. The exposure apparatus according to claim 10, wherein the alignment stage suction-holds the substrate holding device by negative pressure. 13. The exposure apparatus according to claim 10, wherein the transfer mechanism transfers the substrate holding device from the alignment stage to the substrate stage. 14. The exposure apparatus according to claim 1, wherein the exposure is performed on the substrate held by the substrate stage.
14. The exposure apparatus according to claim 13, wherein the exposure is performed by TL) alignment. 15. A step of installing a manufacturing apparatus group for various processes including the exposure apparatus according to claim 8 in a semiconductor manufacturing factory, and a semiconductor device by a plurality of processes using the manufacturing apparatus group. Manufacturing a semiconductor device. 16. A step of connecting the manufacturing equipment group by a local area network, and data communication between at least one of the manufacturing equipment group between the local area network and an external network outside the semiconductor manufacturing factory. 16. The method according to claim 15, further comprising the step of: 17. A semiconductor manufacturing factory different from the semiconductor manufacturing factory by accessing a database provided by a vendor or a user of the exposure apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication. 17. The production management is performed by performing data communication between the system and the external network via the external network.
3. The method for manufacturing a semiconductor device according to item 1. 18. A manufacturing apparatus group for various processes including the exposure apparatus according to claim 8, a local area network connecting the manufacturing apparatus group, and an external device outside the factory from the local area network. A semiconductor manufacturing plant, comprising: a gateway enabling access to a network; and capable of performing data communication of information on at least one of the manufacturing apparatus groups. 19. The semiconductor device according to claim 8, which is installed in a semiconductor manufacturing plant.
The maintenance method for an exposure apparatus according to any one of to 14, wherein a vendor or a user of the exposure apparatus provides a maintenance database connected to an external network of the semiconductor manufacturing plant; and A step of permitting access to the maintenance database via the external network, and a step of transmitting maintenance information stored in the maintenance database to a semiconductor manufacturing factory via the external network. How to maintain the exposure equipment. 20. The exposure apparatus according to claim 8, further comprising a display, a network interface, and a computer that executes network software, and stores maintenance information of the exposure apparatus via a computer network. An exposure apparatus characterized in that data communication can be performed by using the same. 21. The network software,
Provided on the display is a user interface for accessing a maintenance database provided by a vendor or a user of the exposure apparatus connected to an external network of a factory where the exposure apparatus is installed, and from the database via the external network. 21. The exposure apparatus according to claim 20, wherein information can be obtained.