JP6176948B2 - Copper foil with carrier, method for producing copper foil with carrier, method for producing printed circuit board, method for producing copper-clad laminate, and method for producing printed wiring board - Google Patents

Description

  The present invention relates to a copper foil with a carrier, a method for producing a copper foil with a carrier, a printed wiring board, a printed circuit board, a copper clad laminate, and a method for producing a printed wiring board, and in particular, a printed wiring board for fine patterns. The present invention relates to a carrier-attached copper foil, a method for producing a carrier-attached copper foil, a printed wiring board, a printed circuit board, a copper-clad laminate, and a method for producing a printed wiring board.

  Printed wiring boards have made great progress over the last half century and are now used in almost all electronic devices. In recent years, with the increasing needs for miniaturization and higher performance of electronic devices, higher density mounting of components and higher frequency of signals have progressed, and conductor patterns have become finer (fine pitch) and higher frequency than printed circuit boards. In particular, when an IC chip is mounted on a printed wiring board, a fine pitch of L (line) / S (space) = 20 μm / 20 μm or less is required.

  A printed wiring board is first manufactured as a copper clad laminate in which an insulating substrate mainly composed of a copper foil and a glass epoxy substrate, BT resin, polyimide film or the like is bonded. Bonding is performed by laminating an insulating substrate and a copper foil and applying heat and pressure (laminating method), or by applying a varnish that is a precursor of an insulating substrate material to a surface having a coating layer of copper foil, A heating / curing method (casting method) is used.

  Along with the fine pitch, the thickness of the copper foil used for the copper clad laminate is also 9 μm, and further, 5 μm or less. However, when the foil thickness is 9 μm or less, the handleability when forming a copper clad laminate by the above-described lamination method or casting method is extremely deteriorated. Therefore, a copper foil with a carrier has appeared, in which a thick metal foil is used as a carrier, and an ultrathin copper layer is formed on the metal foil via a release layer. A common method of using a copper foil with a carrier is to bond the surface of an ultrathin copper layer to an insulating substrate, thermocompression bond, and then peel the carrier through a peeling layer.

  Conventionally, a diffusion prevention layer, a release layer, and an electrolytic copper plating are formed in this order on the surface of the carrier foil, and a Cr or Cr hydrated oxide layer is used as the release layer, and Ni, Co, Fe, Cr, Patent Document 1 discloses a method for maintaining good peelability after hot pressing by using a single element or alloy of Mo, Ta, Cu, Al, and P.

  Alternatively, it is known that the release layer is formed of Cr, Ni, Co, Fe, Mo, Ti, W, P, alloys thereof, or hydrates thereof. Furthermore, it is described in Patent Documents 2 and 3 that it is effective to provide Ni, Fe or an alloy layer thereof on the base of the release layer in order to stabilize the peelability in a high temperature use environment such as a hot press. Has been.

JP 2006-022406 A JP 2010-006071 A JP 2007-007937 A

  In copper foil with carrier, the ultrathin copper foil must not be easily peeled off from the carrier before the lamination process on the insulating substrate, while the carrier from the ultrathin copper foil is easily peeled off after the lamination process on the insulation substrate. It is necessary to peel off. In addition, after peeling the carrier from the ultra-thin copper foil after lamination, a circuit is formed on the ultra-thin copper foil by a semi-additive method, so that organic substances and metal and metal oxides that are difficult to etch are maintained in order to maintain good etching properties. It is necessary to reduce the amount of metal hydrated oxide present.

  Regarding Patent Document 1, the peelability after hot pressing is good, but the state of the ultrathin copper foil surface is not mentioned.

  Further, in the same patent document, it is described that the order of the diffusion prevention layer and the release layer may be either, but the examples described are all in the order of carrier foil, release layer, diffusion prevention layer, electrolytic copper plating, At the time of peeling, the peeling layer / diffusion prevention layer interface may peel off. If it becomes so, a diffusion prevention layer will remain on the surface of electrolytic copper plating (ultra-thin copper layer), and it will lead to the etching failure at the time of forming a circuit.

  In Patent Documents 2 and 3, there is no description that can be considered that the properties such as the peel strength between the carrier and the ultrathin copper foil are sufficiently examined, and there is still room for improvement.

  Then, this invention makes it a subject to provide the copper foil with a carrier with the favorable etching property of ultra-thin copper foil.

  In order to achieve the above-mentioned object, the present inventor has conducted earnest research. As a result, the carrier-attached copper foil is heat-bonded to the substrate under predetermined conditions, and the carrier is peeled off. It has been found that by controlling the variation in the internal distribution, it is possible to obtain a good etching property in which the in-plane variation is suppressed for the ultrathin copper layer.

The present invention has been completed based on the above knowledge, and in one aspect, a carrier-attached copper foil comprising a carrier, an intermediate layer laminated on the carrier, and an ultrathin copper layer laminated on the intermediate layer The intermediate layer contains Ni, and the ultra-thin copper layer is thermocompression bonded to the insulating substrate in the atmosphere under the conditions of pressure: 20 kgf / cm ² , 220 ° C. × 2 hours, in accordance with JIS C 6471. When the carrier is peeled off, the intermediate layer side surface of the ultrathin copper layer when the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is measured 10 points at intervals of 20 mm in the width direction and the longitudinal direction. The average value of the adhesion amount of Ni: A is 400 μg / dm ² or less, the standard deviation of the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is σ, and the variation coefficient of the Ni adhesion amount is X = Assuming that σ × 100 / A, X satisfies 30.0% or less. A copper foil with A.

In one embodiment, the copper foil with a carrier according to the present invention is obtained by thermocompression bonding an insulating substrate to the ultrathin copper layer under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours in JIS C 6471. When the carrier is peeled off in accordance with the intermediate layer of the ultrathin copper layer when the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction. Average value of adhesion amount of Ni on side surface: A is 3 to 300 μg / dm ² .

In another embodiment of the copper foil with a carrier according to the present invention, an insulating substrate is thermocompression bonded to the ultrathin copper layer under the conditions of pressure: 20 kgf / cm ² , 220 ° C. × 2 hours in JIS C. When the carrier is peeled off in accordance with 6471, the average value when the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction: A is 3 ˜250 μg / dm ² .

In yet another embodiment of the copper foil with a carrier according to the present invention, an insulating substrate is thermocompression bonded to the ultrathin copper layer under the conditions of pressure: 20 kgf / cm ² , 220 ° C. × 2 hours in JIS. When the carrier was peeled off in accordance with C 6471, the average value when the Ni adhesion amount on the intermediate layer side surface of the ultrathin copper layer was measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction: A 3 to 200 μg / dm ² .

In yet another embodiment of the copper foil with a carrier according to the present invention, an insulating substrate is thermocompression bonded to the ultrathin copper layer under the conditions of pressure: 20 kgf / cm ² , 220 ° C. × 2 hours in JIS. When the carrier was peeled off in accordance with C 6471, the average value when the Ni adhesion amount on the intermediate layer side surface of the ultrathin copper layer was measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction: A 5 to 100 μg / dm ² .

In yet another embodiment of the copper foil with a carrier according to the present invention, an insulating substrate is thermocompression bonded to the ultrathin copper layer under the conditions of pressure: 20 kgf / cm ² , 220 ° C. × 2 hours in JIS. When the carrier was peeled off in accordance with C 6471, the average value when the adhesion amount of Ni on the surface on the intermediate layer side of the ultrathin copper layer was measured 10 points at intervals of 20 mm in the width direction and the longitudinal direction was defined as A. When the standard deviation is σ and the variation coefficient of the Ni adhesion amount is X = σ × 100 / A, X satisfies 1.0 to 25.0%.

Another aspect of the present invention is a copper foil with a carrier comprising a carrier, an intermediate layer laminated on the carrier, and an ultrathin copper layer laminated on the intermediate layer, the intermediate layer being Ni When the carrier is peeled off in accordance with JIS C 6471, the insulating substrate is thermocompression bonded to the ultrathin copper layer under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours in the atmosphere. The average value when the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction is A, the standard deviation is σ, and the variation coefficient of the Ni adhesion amount is When X = σ × 100 / A, the carrier-attached copper foil satisfies X of 17.0% or less.

In another aspect of the present invention, a carrier-attached copper foil comprising a carrier, an intermediate layer laminated on the carrier, and an ultrathin copper layer laminated on the intermediate layer, the intermediate layer comprising: When Ni was included and the carrier was peeled off in accordance with JIS C 6471, the amount of Ni deposited on the intermediate layer side surface of the ultrathin copper layer was measured 10 points at intervals of 20 mm in the width direction and the longitudinal direction. Average value: When A ′ is 400 μg / dm ² or less, the standard deviation is σ ′, and the variation coefficient of Ni adhesion amount is X ′ = σ ′ × 100 / A ′, X ′ satisfies 20.0% or less. Copper foil with carrier.

In yet another embodiment of the copper foil with a carrier according to the present invention, when the carrier is peeled in accordance with JIS C 6471, the amount of Ni deposited on the intermediate layer side surface of the ultrathin copper layer is determined in the width direction and Average value when 10 points are measured at intervals of 20 mm in the longitudinal direction: A ′ is 400 μg / dm ² or less, the standard deviation is σ ′, and the variation coefficient of Ni adhesion amount is X ′ = σ ′ × 100 / A Assuming that “X” satisfies 20.0% or less.

  In yet another embodiment of the copper foil with a carrier according to the present invention, when the carrier is peeled in accordance with JIS C 6471, the amount of Ni deposited on the intermediate layer side surface of the ultrathin copper layer is determined in the width direction and Assuming that the average value when measuring 10 points at intervals of 20 mm in the longitudinal direction is A ′, the standard deviation is σ ′, and the variation coefficient of the Ni adhesion amount is X ′ = σ ′ × 100 / A ′, X ′ is Satisfies 1.0 to 15.0%.

  In still another embodiment of the copper foil with a carrier according to the present invention, the intermediate layer is made of any one layer of nickel or an alloy containing nickel on the carrier, chromium, a chromium alloy, and an oxide of chromium. A layer including any one or more of them is formed by stacking in this order.

  In still another embodiment of the carrier-attached copper foil according to the present invention, the layer containing at least one of chromium, a chromium alloy, and a chromium oxide includes a chromate treatment layer.

  In another embodiment of the copper foil with a carrier according to the present invention, the intermediate layer contains zinc.

  In still another embodiment of the carrier-attached copper foil according to the present invention, the intermediate layer is any one layer of nickel, nickel-zinc alloy, nickel-phosphorus alloy, nickel-cobalt alloy on the carrier, And any one of a zinc chromate treatment layer, a pure chromate treatment layer, and a chromium plating layer is laminated in this order.

In yet another embodiment of the copper foil with a carrier according to the present invention, the intermediate layer is formed by laminating a nickel layer or a nickel-zinc alloy layer and a zinc chromate treatment layer in this order on the carrier. Or a nickel-zinc alloy layer, and a pure chromate treatment layer or a zinc chromate treatment layer are laminated in this order, and the adhesion amount of nickel in the intermediate layer is 100 to 40000 μg / dm ^2. The adhesion amount of chromium is 5 to 100 μg / dm ² , and the adhesion amount of zinc is 1 to 70 μg / dm ² .

In another embodiment of the copper foil with a carrier according to the present invention, the intermediate layer includes a nickel layer or an alloy layer containing nickel on the carrier, and at least a nitrogen-containing organic compound, a sulfur-containing organic compound, and a carboxylic acid. The organic layer containing any of the above is laminated in the order, and the adhesion amount of nickel in the intermediate layer is 100 to 40000 μg / dm ² .

In another embodiment of the copper foil with a carrier according to the present invention, the intermediate layer includes an organic layer containing at least one of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid on the carrier, and nickel. A layer or an alloy layer containing nickel is laminated in this order, and the adhesion amount of nickel in the intermediate layer is 100 to 40000 μg / dm ² .

  In another embodiment of the copper foil with a carrier according to the present invention, the intermediate layer contains an organic substance in a thickness of 25 nm or more and 80 nm or less.

In still another embodiment of the copper foil with a carrier according to the present invention, the intermediate layer includes at least one of a nickel layer or an alloy layer containing nickel and molybdenum, cobalt, and a molybdenum cobalt alloy on the carrier. It is constructed by stacking in the order of the layers to include,
The adhesion amount of nickel in the intermediate layer is 100 to 40000 μg / dm ² , and when molybdenum is included, the adhesion amount of molybdenum is 10 to 1000 μg / dm ² , and when cobalt is included, the adhesion amount of cobalt is 10 ˜1000 μg / dm ² .

  In still another embodiment of the copper foil with a carrier according to the present invention, the carrier is formed of an electrolytic copper foil or a rolled copper foil.

  In yet another embodiment, the copper foil with a carrier according to the present invention has a roughening treatment layer on the surface of the ultrathin copper layer.

  In still another embodiment of the copper foil with a carrier according to the present invention, the roughening layer is any one selected from the group consisting of copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium, and zinc. Or a layer made of an alloy containing one or more of them.

  In still another embodiment, the carrier-attached copper foil according to the present invention is selected from the group consisting of a heat-resistant layer, a rust-proof layer, a chromate treatment layer, and a silane coupling treatment layer on the surface of the roughening treatment layer. Has more than seed layers.

  In still another embodiment, the carrier-attached copper foil according to the present invention is selected from the group consisting of a heat-resistant layer, a rust-proof layer, a chromate treatment layer, and a silane coupling treatment layer on the surface of the ultrathin copper layer. Has more than seed layers.

  In another aspect of the present invention, after forming any one layer of nickel or an alloy containing nickel on a carrier, a layer containing any one or more of chromium, a chromium alloy, or an oxide of chromium is formed. An intermediate in which zinc is contained in at least one layer of nickel or an alloy containing nickel, or a layer containing any one or more of chromium, a chromium alloy, or an oxide of chromium It is a manufacturing method of copper foil with a carrier including the process of forming a layer, and the process of forming an ultra-thin copper layer by electrolytic plating on the said intermediate | middle layer.

  In one embodiment of the method for manufacturing a copper foil with a carrier according to the present invention, after forming a plating layer containing nickel and zinc on a carrier, an intermediate layer is formed by forming a plating layer containing chromium or a chromate treatment layer. And a step of forming an ultrathin copper layer by electrolytic plating on the intermediate layer.

  In another embodiment of the method for producing a copper foil with a carrier according to the present invention, after forming a plating layer containing nickel on a carrier, a plating layer containing chromium and zinc or a zinc chromate treatment layer is formed. Forming an intermediate layer; and forming an ultrathin copper layer on the intermediate layer by electrolytic plating.

  In yet another embodiment of the method for producing a copper foil with a carrier according to the present invention, a plating layer containing nickel and zinc is formed on a carrier, and then a plating layer containing zinc and zinc or a zinc chromate treatment layer is formed. Thus, the method includes a step of forming an intermediate layer and a step of forming an ultrathin copper layer on the intermediate layer by electrolytic plating.

  In yet another embodiment of the method for producing a copper foil with a carrier according to the present invention, after forming a nickel plating layer on the carrier, an intermediate layer is formed by forming a zinc chromate treatment layer with electrolytic chromate. Alternatively, after forming a nickel-zinc alloy plating layer, a step of forming an intermediate layer by forming a pure chromate treatment layer or a zinc chromate treatment layer by electrolytic chromate, and an ultrathin copper layer by electrolytic plating on the intermediate layer Forming the step.

  In yet another embodiment of the method for producing a copper foil with a carrier according to the present invention, after forming a nickel plating layer or an alloy plating layer containing nickel on the carrier, at least a nitrogen-containing organic compound, a sulfur-containing organic compound, and After forming an organic material layer having a thickness of 25 nm to 80 nm containing any of carboxylic acids, or forming an organic material layer of thickness 25 nm to 80 nm containing at least one of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid, The method includes a step of forming an intermediate layer by forming a nickel plating layer or an alloy plating layer containing nickel, and a step of forming an ultrathin copper layer by electrolytic plating on the intermediate layer.

  In yet another embodiment of the method for producing a copper foil with a carrier according to the present invention, a nickel plating layer or an alloy plating layer containing nickel is formed on the carrier, and then any one of molybdenum, cobalt, and a molybdenum cobalt alloy. The method includes a step of forming an intermediate layer by forming a layer containing seeds or more, and a step of forming an ultrathin copper layer by electrolytic plating on the intermediate layer.

  In still another embodiment of the method for producing a copper foil with a carrier according to the present invention, in the step of forming the intermediate layer, the carrier conveyance speed is 30 m / min or less.

  In still another embodiment, the method for producing a copper foil with a carrier according to the present invention further includes a step of forming a roughened layer on the ultrathin copper layer.

  In still another aspect, the present invention is a printed wiring board manufactured using the carrier-attached copper foil of the present invention.

  In still another aspect, the present invention is a printed circuit board manufactured using the carrier-attached copper foil of the present invention.

  In yet another aspect, the present invention is a copper clad laminate produced using the carrier-attached copper foil of the present invention.

  In yet another aspect of the present invention, the step of preparing the copper foil with carrier and the insulating substrate of the present invention, the step of laminating the copper foil with carrier and the insulating substrate, the copper foil with carrier and the insulating substrate, After the lamination, a copper-clad laminate is formed through a step of peeling the carrier of the copper foil with carrier, and then the circuit is formed by any of the semi-additive method, the subtractive method, the partial additive method, or the modified semi-additive method. It is a manufacturing method of a printed wiring board including the process of forming.

  ADVANTAGE OF THE INVENTION According to this invention, the copper foil with a carrier with the favorable etching property of an ultra-thin copper layer can be provided.

It is the schematic of the cross section of the width direction of the circuit pattern in an Example, and the outline of the calculation method of the etching factor (EF) using this schematic diagram.

<Copper foil with carrier>
The copper foil with a carrier of the present invention comprises a carrier, an intermediate layer containing Ni laminated on the carrier, and an ultrathin copper layer laminated on the intermediate layer. How to use the copper foil with carrier itself is well known to those skilled in the art. For example, the surface of the ultra-thin copper layer is made of paper base phenol resin, paper base epoxy resin, synthetic fiber cloth base epoxy resin, glass cloth / paper composite Ultra-thin bonded to an insulating substrate, bonded to an insulating substrate such as a base epoxy resin, glass cloth / glass nonwoven fabric composite epoxy resin and glass cloth base epoxy resin, polyester film, polyimide film, etc. A copper layer is etched into the intended conductor pattern, and finally a printed wiring board, a printed circuit board, a copper clad laminate, or the like can be produced.

After the copper foil with carrier is bonded to the substrate by thermocompression bonding and the ultrathin copper layer is peeled off from the copper foil with carrier, if the amount of Ni remaining on the ultrathin copper layer is large, the etching property of the ultrathin copper layer Becomes defective. For this reason, the copper foil with a carrier of the present invention is obtained by thermocompression bonding an insulating substrate to an ultrathin copper layer under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours in accordance with JIS C 6471. When the carrier was peeled off, the amount of Ni deposited on the intermediate layer side surface of the ultrathin copper layer was measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction. adhesion amount of the average value: a are controlled to be 400 [mu] g / dm ² or less, more preferably is controlled so that 3~300μg / dm ^2, so as to be 3~250μg / dm ² More preferably, it is controlled to be 3 to 200 μg / dm ² , more preferably 5 to 100 μg / dm ^2, and 6 to 80 μg / dm ² More preferably it is controlled to, more preferably is controlled so that 8~60μg / dm ^2, and more preferably is controlled so that 10-50 / dm ^2.

Also, when the carrier-attached copper foil is bonded to the substrate by thermocompression bonding and the ultrathin copper layer is peeled off from the carrier-attached copper foil, the variation in the in-plane distribution of the Ni adhesion amount on the peeled surface of the ultrathin copper layer is large. In addition, the variation in the in-plane distribution of the etching property increases, and the etching property of the ultrathin copper layer becomes poor. For this reason, the copper foil with a carrier of the present invention is obtained by thermocompression bonding an insulating substrate to an ultrathin copper layer under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours in accordance with JIS C 6471. When the carrier was peeled off, the average value when the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer was measured 10 points at intervals of 20 mm in the width direction and the longitudinal direction was defined as A, and the standard deviation was defined as σ. The coefficient of variation of the Ni adhesion amount at the time: X = σ × 100 / A is used as an index of variation in the in-plane distribution of the Ni adhesion amount on the surface of the intermediate layer of the ultrathin copper layer, and by controlling this, the etching property The in-plane distribution is controlled within a certain range, thereby improving the etching property of the ultrathin copper layer. In the present invention, the variation coefficient of the Ni adhesion amount: X is controlled to satisfy 30.0% or less, and X is preferably controlled to satisfy 1.0 to 25.0%, It is more preferably controlled to satisfy 1.0 to 22%, more preferably controlled to satisfy 1.5 to 20%, and controlled to satisfy 2.0 to 18%. More preferably, it is more preferably controlled to satisfy 17% or less. The coefficient of variation of Ni adhesion amount: X can be controlled by keeping the current density of Ni plating at the time of forming the intermediate layer low and controlling the adhesion amount at the conveyance speed. It is also effective to keep the parallelism between the carrier and the anode when forming the intermediate layer uniform.

It is also possible to control the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer when the ultrathin copper layer is peeled off from the copper foil with carrier without performing thermocompression bonding with the insulating substrate. It is preferable for improving the etching property. From such a point of view, the copper foil with a carrier according to the present invention can reduce the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer in the width direction and the longitudinal direction when the carrier is peeled in accordance with JIS C 6471. Average value when measuring 10 points at intervals of 20 mm: A ′ is more preferably controlled to be 400 μg / dm ² or less, and it is controlled to be 1 to 350 μg / dm ^2. more preferably, more preferably are controlled such that the 2~300μg / dm ^2, and more preferably is controlled so that 5~100μg / dm ^2.

In addition, it is also possible to suppress the variation in the in-plane distribution of the Ni adhesion amount on the peeling surface of the ultra-thin copper layer when the ultra-thin copper layer is peeled off from the carrier-attached copper foil without thermocompression bonding with the insulating substrate. It preferred in order the internal distribution of variation in suppression. For this reason, the copper foil with a carrier of the present invention has an average value when the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction as A ′, When the standard deviation is σ ′ and the variation coefficient of the Ni adhesion amount is X ′ = σ ′ × 100 / A ′, X ′ is preferably controlled so as to satisfy 20.0% or less. More preferably, it is controlled to satisfy ˜15.0%, more preferably controlled to satisfy 1.0 to 14%, and controlled to satisfy 1.5 to 13%. More preferably, it is more preferably controlled to satisfy 1.5 to 12%.

<Career>
Carriers that can be used in the present invention are typically metal foils or resin films, such as copper foil, copper alloy foil, nickel foil, nickel alloy foil, iron foil, iron alloy foil, stainless steel foil, aluminum foil, aluminum. It is provided in the form of alloy foil, insulating resin film, polyimide film, LCD film.
Carriers that can be used in the present invention are typically provided in the form of rolled copper foil or electrolytic copper foil. In general, the electrolytic copper foil is produced by electrolytic deposition of copper from a copper sulfate plating bath onto a drum of titanium or stainless steel, and the rolled copper foil is produced by repeating plastic working and heat treatment with a rolling roll. Examples of copper foil materials include high-purity copper such as tough pitch copper (JIS H3100 alloy number C1100) and oxygen-free copper (JIS H3100 alloy number C1020 or JIS H3510 alloy number C1011), for example, Sn-containing copper, Ag-containing copper, Cr A copper alloy such as a copper alloy added with Zr or Mg, or a Corson copper alloy added with Ni, Si or the like can also be used. In addition, when the term “copper foil” is used alone in this specification, a copper alloy foil is also included.

  The thickness of the carrier that can be used in the present invention is not particularly limited, but may be appropriately adjusted to a thickness suitable for serving as a carrier, for example, 12 μm or more. However, if it is too thick, the production cost becomes high, so generally it is preferably 35 μm or less. Accordingly, the thickness of the carrier is typically 12-70 μm, more typically 18-35 μm.

<Intermediate layer>
An intermediate layer containing Ni is provided on one side or both sides of the carrier. The intermediate layer is formed by laminating any one layer of nickel or an alloy containing nickel on the carrier and a layer containing any one or more of chromium, a chromium alloy, and an oxide of chromium in this order. It is preferable. In addition, it is preferable that zinc is contained in any one layer of nickel or an alloy containing nickel and / or a layer containing any one or more of chromium, a chromium alloy, and an oxide of chromium. Here, the alloy containing nickel includes nickel and one or more elements selected from the group consisting of cobalt, iron, chromium, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. An alloy. The alloy containing nickel is an alloy made of nickel and one or more elements selected from the group consisting of cobalt, iron, chromium, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. It is preferable that The alloy containing nickel may be an alloy composed of three or more elements. The chromium alloy is an alloy composed of chromium and one or more elements selected from the group consisting of cobalt, iron, nickel, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. Say. The chromium alloy may be an alloy composed of three or more elements. Further, the layer containing any one or more of chromium, a chromium alloy, and a chromium oxide may be a chromate treatment layer. Here, the chromate-treated layer refers to a layer treated with a liquid containing chromic anhydride, chromic acid, dichromic acid, chromate or dichromate. Chromate treatment layer is any element such as cobalt, iron, nickel, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic and titanium (metal, alloy, oxide, nitride, sulfide, etc.) May be included). Specific examples of the chromate treatment layer include a pure chromate treatment layer and a zinc chromate treatment layer. In the present invention, a chromate treatment layer treated with an anhydrous chromic acid or potassium dichromate aqueous solution is referred to as a pure chromate treatment layer. In the present invention, a chromate treatment layer treated with a treatment liquid containing chromic anhydride or potassium dichromate and zinc is referred to as a zinc chromate treatment layer.
In addition, the intermediate layer is any one of nickel, nickel-zinc alloy, nickel-phosphorus alloy, nickel-cobalt alloy, zinc chromate treatment layer, pure chromate treatment layer, and chromium plating layer on the carrier. It is preferable that one kind of layer is laminated in this order, and the intermediate layer is constituted by laminating a nickel layer or a nickel-zinc alloy layer and a zinc chromate treatment layer in this order on the carrier. It is more preferable that the nickel-zinc alloy layer and the pure chromate-treated layer or the zinc chromate-treated layer are laminated in this order. Since the adhesive force between nickel and copper is higher than the adhesive force between chromium and copper, when the ultrathin copper layer is peeled off, it peels at the interface between the ultrathin copper layer and the chromate treatment layer. Further, the nickel of the intermediate layer is expected to have a barrier effect that prevents the copper component from diffusing from the carrier into the ultrathin copper layer. Further, it is preferable to form a chromate treatment layer on the intermediate layer instead of chrome plating. Since chromium plating forms a dense chromium oxide layer on the surface, when an ultrathin copper foil is formed by electroplating, the electrical resistance increases and pinholes are likely to occur. The surface on which the chromate treatment layer is formed has a chromium oxide layer that is less dense than chrome plating, so resistance to formation of ultrathin copper foil by electroplating is less likely to reduce pinholes. it can. Here, by forming a zinc chromate treatment layer as the chromate treatment layer, the resistance when forming an ultrathin copper foil by electroplating is lower than that of a normal chromate treatment layer, thereby suppressing the generation of pinholes more be able to.
When using electrolytic copper foil as a carrier, it is preferable to provide an intermediate layer on the shiny surface from the viewpoint of reducing pinholes.

  Among the intermediate layers, the chromate treatment layer is thinly present at the interface of the ultrathin copper layer, while the ultrathin copper layer does not peel off from the carrier before the laminating process on the insulating substrate, while after the laminating process on the insulating substrate It is preferable for obtaining the property that the ultrathin copper layer can be peeled from the carrier. If a chromate treatment layer is present at the boundary between the carrier and the ultrathin copper layer without providing a nickel layer or an alloy layer containing nickel (for example, a nickel-zinc alloy layer), the peelability is hardly improved and the chromate treatment layer If the nickel layer or nickel-containing alloy layer (for example, nickel-zinc alloy layer) and the ultrathin copper layer are directly laminated, the nickel amount in the nickel layer or nickel-containing alloy layer (for example, nickel-zinc alloy layer) Accordingly, the peel strength is too strong or too weak to obtain an appropriate peel strength.

  In addition, if the chromate treatment layer is present at the boundary between the carrier and the nickel layer or an alloy layer containing nickel (for example, a nickel-zinc alloy layer), the intermediate layer is also peeled off along with the peeling of the ultrathin copper layer. And the intermediate layer is undesirably peeled off. Such a situation may occur not only when the chromate treatment layer is provided at the interface with the carrier, but also when the amount of chromium is excessive even if the chromate treatment layer is provided at the interface with the ultrathin copper layer. This is because copper and nickel are likely to be in solid solution, so if they are in contact with each other, the adhesive force increases due to mutual diffusion and is difficult to peel off, while chromium and copper are less likely to dissolve and cause mutual diffusion. It is considered that the adhesion between the chromium and copper interface is weak and easy to peel off. Further, when the nickel amount in the intermediate layer is insufficient, there is only a very small amount of chromium between the carrier and the ultrathin copper layer, so that they are in close contact with each other and are difficult to peel off.

Intermediate nickel layer or nickel-containing alloy layer (eg nickel-zinc alloy layer) is formed by wet plating such as electroplating, electroless plating and immersion plating, or dry plating such as sputtering, CVD and PDV can do. Electroplating is preferable from the viewpoint of cost. When the carrier is a resin film, the intermediate layer can be formed by dry plating such as CVD and PDV or wet plating such as electroless plating and immersion plating.
In addition, the chromate treatment layer can be formed with, for example, electrolytic chromate or immersion chromate, but the chromium concentration can be increased, and the peel strength of the ultra-thin copper layer from the carrier is improved. Preferably formed.
Further, the amount of adhered 100~40000μg / dm ² of nickel in the intermediate layer, the adhesion amount of chromium 5~100μg / dm ^2, the amount of deposition of zinc is preferably 1~70μg / dm ^2. As described above, in the copper foil with carrier of the present invention, the amount of Ni on the surface of the ultrathin copper layer after the ultrathin copper layer is peeled from the copper foil with carrier is controlled. In order to control the amount of Ni on the surface of the ultra-thin copper layer, the intermediate layer is made of a metal species (Cr, Zn) that suppresses the diffusion of Ni to the ultra-thin copper layer side while reducing the amount of Ni deposited on the intermediate layer. Is preferably included. From this point of view, Ni content of the intermediate layer is preferably from 100~40000μg / dm ^2, more preferably not less 200 [mu] g / dm ² or more 20000μg / dm ² or less, 500 [mu] g / dm ² or more 10000 / further preferably at dm ² or less, more preferably at 700 [mu] g / dm ² or more 5000 [mu] g / dm ² or less, and even more preferably 700 [mu] g / dm ² or more 3000Myug / dm ² or less. Further, Cr is preferably contained 5~100μg / dm ^2, more preferably not less 8 [mu] g / dm ² or more 50 [mu] g / dm ² or less, more preferably at 10 [mu] g / dm ² or more 40 [mu] g / dm ² or less, More preferably, it is 12 μg / dm ² or more and 30 μg / dm ² or less. Zn is preferably contained 1~70μg / dm ^2, more preferably not less 3 [mu] g / dm ² or more 30 [mu] g / dm ² or less, and even more preferably 5 [mu] g / dm ² or more 20 [mu] g / dm ² or less.
Further, when the carrier transport speed (line speed) at the time of forming the intermediate layer is lowered and / or the current density in the plating process is lowered, any one layer of nickel or an alloy containing nickel, and chromium or chromium alloy The density of the layer containing one or more chromium oxides tends to increase. When the density of any one layer of nickel or an alloy containing nickel and the layer containing any one or more of chromium, a chromium alloy, and an oxide of chromium increases, any one of nickel or an alloy containing nickel This makes it difficult for nickel in this layer to diffuse, and the amount of Ni on the surface of the ultrathin copper layer after peeling can be controlled.

The intermediate layer of the carrier-attached copper foil of the present invention is laminated in the order of a nickel layer or an alloy layer containing nickel and an organic material layer containing at least one of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid on the carrier. The adhesion amount of nickel in the intermediate layer may be 100 to 40,000 μg / dm ² . The alloy containing nickel is an alloy composed of nickel and one or more elements selected from the group consisting of cobalt, iron, chromium, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. I mean. The alloy containing nickel may be an alloy composed of three or more elements. The alloy containing nickel may contain an element other than the elements described above. The intermediate layer of the copper foil with a carrier according to the present invention includes an organic layer containing at least one of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid on the carrier, and a nickel layer or an alloy layer containing nickel. The adhesion amount of nickel in the intermediate layer may be 5 to 40000 μg / dm ² . The alloy containing nickel is an alloy composed of nickel and one or more elements selected from the group consisting of cobalt, iron, chromium, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. I mean. The alloy containing nickel may be an alloy composed of three or more elements. The alloy containing nickel may contain an element other than the elements described above. As described above, in the copper foil with carrier of the present invention, the amount of Ni on the surface of the ultrathin copper layer after the ultrathin copper layer is peeled from the copper foil with carrier is controlled. In order to control the amount of Ni on the surface of the ultrathin copper layer, a nitrogen-containing organic compound, a sulfur-containing organic compound that suppresses the diffusion of Ni to the ultrathin copper layer side while reducing the Ni adhesion amount of the intermediate layer and It is preferable that the intermediate layer includes an organic material layer containing any of carboxylic acids. From this point of view, Ni content of the intermediate layer is preferably from 5~40000μg / dm ^2, more preferably not less 100 [mu] g / dm ² or more 10000 / dm ² or less, 300 [mu] g / dm ² or more 5000 [mu] g / more preferably at dm ² or less, and even more preferably 500 [mu] g / dm ² or more 3000Myug / dm ² or less. Moreover, BTA (benzotriazole), MBT (mercaptobenzothiazole), etc. are mentioned as an organic substance containing either the said nitrogen containing organic compound, sulfur containing organic compound, and carboxylic acid.

Moreover, as an organic substance which an intermediate | middle layer contains, it is preferable to use what consists of 1 type (s) or 2 or more types selected from a nitrogen containing organic compound, a sulfur containing organic compound, and carboxylic acid. Among the nitrogen-containing organic compound, the sulfur-containing organic compound, and the carboxylic acid, the nitrogen-containing organic compound includes a nitrogen-containing organic compound having a substituent. Specific nitrogen-containing organic compounds include 1,2,3-benzotriazole, carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, 1H-1 which are triazole compounds having a substituent. 2,4-triazole, 3-amino-1H-1,2,4-triazole and the like are preferably used.
For the sulfur-containing organic compound, it is preferable to use mercaptobenzothiazole, 2-mercaptobenzothiazole sodium, thiocyanuric acid, 2-benzimidazolethiol, and the like.
As the carboxylic acid, it is particularly preferable to use a monocarboxylic acid, and it is particularly preferable to use oleic acid, linoleic acid, linolenic acid, or the like.
The organic material is preferably contained in a thickness of 25 nm to 80 nm, more preferably 30 nm to 70 nm. The intermediate layer may contain a plurality of types (one or more) of the aforementioned organic substances.
In addition, the thickness of organic substance can be measured as follows.

<Thickness of organic material in the intermediate layer>
After peeling off the ultrathin copper layer of the carrier-attached copper foil from the carrier, the surface of the exposed ultrathin copper layer on the intermediate layer side and the exposed surface of the intermediate layer side of the carrier are subjected to XPS measurement to create a depth profile. The depth at which the carbon concentration first becomes 3 at% or less from the surface on the intermediate layer side of the ultrathin copper layer is defined as A (nm), and the carbon concentration is initially 3 at% or less from the surface on the intermediate layer side of the carrier. The resulting depth can be defined as B (nm), and the sum of A and B can be defined as the thickness (nm) of the organic substance in the intermediate layer.
XPS operating conditions are shown below.
・ Device: XPS measuring device (ULVAC-PHI, Model 5600MC)
・ Achieving vacuum: 3.8 × 10 ⁻⁷ Pa
X-ray: Monochromatic AlKα or non-monochromatic MgKα, X-ray output 300 W, detection area 800 μmφ, angle between sample and detector 45 °
Ion beam: ion species Ar ⁺ , acceleration voltage 3 kV, sweep area 3 mm × 3 mm, sputtering rate 2.8 nm / min (in terms of SiO ₂ )

The method for using the organic substance contained in the intermediate layer will be described below with reference to the method for forming the intermediate layer on the carrier foil. The intermediate layer is formed on the carrier by dissolving the above-mentioned organic substance in a solvent and immersing the carrier in the solvent, or showering, spraying method, dropping method and electrodeposition method on the surface on which the intermediate layer is to be formed. Etc., and there is no need to adopt a particularly limited method. At this time, the concentration of the organic agent in the solvent is preferably in the range of a concentration of 0.01 g / L to 30 g / L and a liquid temperature of 20 to 60 ° C. in all the organic substances described above. The concentration of the organic substance is not particularly limited, and there is no problem even if the concentration is originally high or low. In addition, the organic substance thickness of an intermediate | middle layer tends to become large, so that the density | concentration of organic substance is high, and the contact time of the carrier to the solvent which dissolved the organic substance mentioned above is long. And when the organic substance thickness of an intermediate | middle layer is thick, it exists in the tendency for the effect of organic substance to suppress the spreading | diffusion to the ultra-thin copper layer side of Ni to become large.
In addition, if the carrier transport speed (line speed) during the formation of the intermediate layer is slowed and / or the current density in the plating process is lowered, the density of the nickel layer or the alloy layer containing nickel and the density of organic matter tend to increase. is there. When the density of the nickel layer or the alloy layer containing nickel and the density of the organic matter increase, the nickel in the nickel layer or the alloy layer containing nickel becomes difficult to diffuse, and the carrier after the ultrathin copper layer is peeled off from the copper foil with carrier The amount of Ni deposited on the release surface can be controlled.
In addition, the intermediate layer is preferably configured by stacking nickel and molybdenum or cobalt or a molybdenum-cobalt alloy in this order on a carrier. Since the adhesion force between nickel and copper is higher than the adhesion force between molybdenum or cobalt and copper, when peeling the ultrathin copper layer, the interface between the ultrathin copper layer and molybdenum or cobalt or molybdenum-cobalt alloy It will come off. Further, the nickel of the intermediate layer is expected to have a barrier effect that prevents the copper component from diffusing from the carrier into the ultrathin copper layer.
The aforementioned nickel may be an alloy containing nickel. Here, the alloy containing nickel is nickel and one or more elements selected from the group consisting of cobalt, iron, chromium, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. Refers to the alloy containing. The alloy containing nickel is an alloy composed of nickel and one or more elements selected from the group consisting of cobalt, iron, chromium, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. There may be. The molybdenum described above may be an alloy containing molybdenum. Here, the alloy containing molybdenum includes molybdenum and one or more elements selected from the group consisting of cobalt, iron, chromium, nickel, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. Refers to the alloy containing. The alloy containing molybdenum is an alloy composed of molybdenum and one or more elements selected from the group consisting of cobalt, iron, chromium, nickel, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. There may be. The cobalt described above may be an alloy containing cobalt. Here, the alloy containing cobalt includes cobalt and one or more elements selected from the group consisting of molybdenum, iron, chromium, nickel, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. Refers to the alloy containing. The alloy containing cobalt is an alloy composed of cobalt and one or more elements selected from the group consisting of molybdenum, iron, chromium, nickel, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium. It may be.
Molybdenum-cobalt alloy is an element other than molybdenum and cobalt (for example, one or more elements selected from the group consisting of nickel, iron, chromium, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic, and titanium). May be included.
When using electrolytic copper foil as a carrier, it is preferable to provide an intermediate layer on the shiny surface from the viewpoint of reducing pinholes.
Among the intermediate layers, the molybdenum or cobalt or molybdenum-cobalt alloy layer is thinly present at the interface of the ultrathin copper layer, while the ultrathin copper layer does not peel off from the carrier before the lamination process to the insulating substrate, while the insulating substrate It is preferable for obtaining the property that the ultrathin copper layer can be peeled off from the carrier after the lamination step. If a molybdenum or cobalt or molybdenum-cobalt alloy layer is present at the boundary between the carrier and the ultrathin copper layer without providing a nickel layer, the peelability may be hardly improved, and the molybdenum or cobalt or molybdenum-cobalt alloy layer When the nickel layer and the ultrathin copper layer are directly laminated, the peel strength may be too strong or too weak depending on the amount of nickel in the nickel layer, and an appropriate peel strength may not be obtained.
In addition, if the molybdenum or cobalt or molybdenum-cobalt alloy layer is present at the boundary between the carrier and the nickel layer, the intermediate layer may be additionally peeled off when the ultrathin copper layer is peeled off, that is, between the carrier and the intermediate layer. May cause undesirable peeling. Such a situation is not only when a molybdenum or cobalt or molybdenum-cobalt alloy layer is provided at the interface with the carrier, but also when a molybdenum or cobalt or molybdenum-cobalt alloy layer is provided at the interface with the ultrathin copper layer. This can occur if the amount of molybdenum or cobalt is too high. This is because copper and nickel are likely to be in solid solution, so if they are in contact with each other, the adhesive force increases due to mutual diffusion and it is difficult to peel off, while molybdenum or cobalt and copper are less likely to dissolve and mutual diffusion. This is considered to be because the adhesive force is weak at the interface between the molybdenum or cobalt or molybdenum-cobalt alloy layer and copper and is easily peeled off. Further, when the amount of nickel in the intermediate layer is insufficient, since only a small amount of molybdenum or cobalt is present between the carrier and the ultrathin copper layer, they may be in close contact and difficult to peel off.
The intermediate layer nickel and cobalt or molybdenum-cobalt alloy can be formed by wet plating such as electroplating, electroless plating and immersion plating, or dry plating such as sputtering, CVD and PDV. Molybdenum can be formed only by dry plating such as CVD and PDV. Electroplating is preferable from the viewpoint of cost.
In the intermediate layer, the adhesion amount of nickel is 5~40000μg / dm ^2, the adhesion amount of molybdenum is 10~1000μg / dm ^2, the adhesion amount of the cobalt is 10~1000μg / dm ^2. As described above, in the copper foil with carrier of the present invention, the amount of Ni on the surface of the ultrathin copper layer after the ultrathin copper layer is peeled from the copper foil with carrier is controlled. In order to control the amount of Ni on the surface of the ultrathin copper layer, the intermediate layer is made of a metal species (Co, Mo) that suppresses the diffusion of Ni to the ultrathin copper layer side while reducing the amount of Ni deposited on the intermediate layer. Is preferably included. From this viewpoint, the amount of nickel deposited is preferably to 5~40000μg / dm ^2, preferably to 100~30000μg / dm ^2, more preferably to 300~15000μg / dm ^2, 300~10000μg / Dm ² is more preferable. If included molybdenum in the intermediate layer, a molybdenum deposition amount is preferably set to 10~1000μg / dm ^2, the molybdenum deposition amount is preferably set to 20~600μg / dm ^2, and 30~400μg / dm ² More preferably. If included cobalt in the intermediate layer, the cobalt coating weight is preferably set to 10~1000μg / dm ^2, cobalt deposition amount is preferably set to 20~600μg / dm ^2, and 30~400μg / dm ² More preferably.
When the intermediate layer contains both molybdenum and cobalt, the total adhesion amount of molybdenum and cobalt is preferably 10 to 1000 μg / dm ^2, and the total adhesion amount of molybdenum and cobalt is 20 to 600 μg. / Dm ² is preferable, and 30 to 400 μg / dm ² is more preferable.
As described above, the intermediate layer is plated for providing a molybdenum, cobalt, or molybdenum-cobalt alloy layer when nickel and molybdenum, cobalt, or a molybdenum-cobalt alloy are stacked in this order on a carrier. When the current density in the treatment is lowered and the carrier conveyance speed (line speed) is lowered, the density of the molybdenum, cobalt, or molybdenum-cobalt alloy layer tends to increase. When the density of the layer containing molybdenum and / or cobalt increases, nickel in the nickel layer becomes difficult to diffuse, and the amount of Ni on the surface of the ultrathin copper layer after peeling can be controlled.

<Strike plating>
An ultrathin copper layer is provided on the intermediate layer. Before that, strike plating with a copper-phosphorus alloy may be performed in order to reduce pinholes in the ultrathin copper layer. Examples of the strike plating include a copper pyrophosphate plating solution.

<Ultrathin copper layer>
An ultrathin copper layer is provided on the intermediate layer. The ultra-thin copper layer can be formed by electroplating using an electrolytic bath such as copper sulfate, copper pyrophosphate, copper sulfamate, copper cyanide, etc., and is used in general electrolytic copper foil with high current density. Since a copper foil can be formed, a copper sulfate bath is preferable. The thickness of the ultrathin copper layer is not particularly limited, but is generally thinner than the carrier, for example, 12 μm or less. It is typically 0.5-12 μm, more typically 2-5 μm.

<Roughening treatment>
A roughening treatment layer may be provided on the surface of the ultrathin copper layer by performing a roughening treatment, for example, in order to improve adhesion to the insulating substrate. The roughening treatment can be performed, for example, by forming roughened particles with copper or a copper alloy. The roughening process may be fine. The roughening treatment layer is a layer made of any single element selected from the group consisting of copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium and zinc, or an alloy containing one or more of them. Also good. Moreover, after forming the roughened particles with copper or a copper alloy, a roughening treatment can be performed in which secondary particles or tertiary particles are further formed of nickel, cobalt, copper, zinc alone or an alloy. Thereafter, a heat-resistant layer or a rust-preventing layer may be formed of nickel, cobalt, copper, zinc alone or an alloy, and the surface thereof may be further subjected to a treatment such as a chromate treatment or a silane coupling treatment. Alternatively, a heat-resistant layer or a rust-preventing layer may be formed from nickel, cobalt, copper, zinc alone or an alloy without roughening, and the surface may be subjected to a treatment such as chromate treatment or silane coupling treatment. Good. That is, one or more layers selected from the group consisting of a heat-resistant layer, a rust-preventing layer, a chromate treatment layer, and a silane coupling treatment layer may be formed on the surface of the roughening treatment layer. One or more layers selected from the group consisting of a heat-resistant layer, a rust prevention layer, a chromate treatment layer, and a silane coupling treatment layer may be formed on the surface. In addition, the above-mentioned heat-resistant layer, rust prevention layer, chromate treatment layer, and silane coupling treatment layer may each be formed of a plurality of layers (for example, 2 layers or more, 3 layers or more, etc.).

<Printed wiring boards, printed circuit boards, and copper-clad laminates>
A copper clad laminate can be prepared by attaching a copper foil with a carrier to the insulating resin plate from the ultrathin copper layer side, thermocompression bonding, and peeling the carrier. Thereafter, a copper circuit of a printed wiring board or a printed circuit board can be formed by etching the ultrathin copper layer portion. The insulating resin plate used here is not particularly limited as long as it has characteristics applicable to a printed wiring board or a printed circuit board. For example, a paper base phenolic resin, a paper base epoxy resin for rigid PWB, Use synthetic fiber cloth base epoxy resin, glass cloth / paper composite base epoxy resin, glass cloth / glass non-woven composite base epoxy resin, glass cloth base epoxy resin, etc., polyester film or polyimide film etc. for FPC Can be used. The printed wiring board, printed circuit board, and copper-clad laminate produced in this manner can be mounted on various electronic components that require high-density mounting of the mounted components.

<Method for manufacturing printed wiring board>
In one embodiment of a method for producing a printed wiring board according to the present invention, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention, a step of laminating the copper foil with a carrier and an insulating substrate, the carrier After laminating the attached copper foil and the insulating substrate so that the ultrathin copper layer side faces the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the copper foil with carrier, and then a semi-additive method, The method includes a step of forming a circuit by any one of the modified semi-additive method, the partly additive method, and the subtractive method. It is also possible for the insulating substrate to contain an inner layer circuit.

  In the present invention, the semi-additive method refers to a method in which a thin electroless plating is performed on an insulating substrate or a copper foil seed layer, a pattern is formed, and then a conductive pattern is formed using electroplating and etching.

Therefore, in one embodiment of a method for producing a printed wiring board according to the present invention using a semi-additive method, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Removing all of the ultrathin copper layer exposed by peeling the carrier by a method such as etching or plasma using a corrosive solution such as acid,
Providing a through hole or / and a blind via in the resin exposed by removing the ultrathin copper layer by etching;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the resin and the through hole or / and the blind via;
Providing a plating resist on the electroless plating layer;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using a semi-additive method, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Removing all of the ultrathin copper layer exposed by peeling the carrier by a method such as etching or plasma using a corrosive solution such as acid,
Providing an electroless plating layer on the surface of the resin exposed by removing the ultrathin copper layer by etching;
Providing a plating resist on the electroless plating layer;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer and the ultrathin copper layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

  In the present invention, the modified semi-additive method is a method in which a metal foil is laminated on an insulating layer, a non-circuit forming portion is protected by a plating resist, and the copper is thickened in the circuit forming portion by electrolytic plating, and then the resist is removed. Then, a method of forming a circuit on the insulating layer by removing the metal foil other than the circuit forming portion by (flash) etching is indicated.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using the modified semi-additive method, the step of preparing the copper foil with carrier and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Providing a plating resist on the surface of the ultrathin copper layer exposed by peeling the carrier,
Forming a circuit by electrolytic plating after providing the plating resist;
Removing the plating resist;
Removing the ultra-thin copper layer exposed by removing the plating resist by flash etching;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using the modified semi-additive method, the step of preparing the carrier-attached copper foil and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Providing a plating resist on the exposed ultrathin copper layer by peeling off the carrier;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer and the ultrathin copper layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

  In the present invention, the partial additive method means that a catalyst circuit is formed on a substrate provided with a conductor layer, and if necessary, a substrate provided with holes for through holes or via holes, and etched to form a conductor circuit. Then, after providing a solder resist or a plating resist as necessary, it refers to a method of manufacturing a printed wiring board by thickening through holes, via holes, etc. on the conductor circuit by electroless plating.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using a partly additive method, a step of preparing the copper foil with carrier and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Applying catalyst nuclei to the region containing the through-holes and / or blind vias;
Providing an etching resist on the surface of the ultrathin copper layer exposed by peeling the carrier,
Exposing the etching resist to form a circuit pattern;
Removing the ultrathin copper layer and the catalyst nucleus by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
A step of providing a solder resist or a plating resist on the surface of the insulating substrate exposed by removing the ultrathin copper layer and the catalyst core by a method such as etching or plasma using a corrosive solution such as an acid;
Providing an electroless plating layer in a region where the solder resist or plating resist is not provided,
including.

  In the present invention, the subtractive method refers to a method of forming a conductor pattern by selectively removing unnecessary portions of a copper foil on a copper clad laminate by etching or the like.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using a subtractive method, a step of preparing the carrier-attached copper foil and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Providing an electroplating layer on the surface of the electroless plating layer;
A step of providing an etching resist on the surface of the electrolytic plating layer or / and the ultrathin copper layer;
Exposing the etching resist to form a circuit pattern;
Removing the ultrathin copper layer and the electroless plating layer and the electrolytic plating layer by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using a subtractive method, a step of preparing the carrier-attached copper foil and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the copper foil with carrier and the insulating substrate, the step of peeling the carrier of the copper foil with carrier,
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Forming a mask on the surface of the electroless plating layer;
Providing an electroplating layer on the surface of the electroless plating layer on which no mask is formed;
A step of providing an etching resist on the surface of the electrolytic plating layer or / and the ultrathin copper layer;
Exposing the etching resist to form a circuit pattern;
Removing the ultra-thin copper layer and the electroless plating layer by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
including.

  The process of providing a through hole or / and a blind via and the subsequent desmear process may not be performed.

  EXAMPLES The present invention will be described in more detail below with reference to examples of the present invention, but the present invention is not limited to these examples.

1. Manufacture of copper foil with carrier As a carrier, long electrolytic copper foil (JTC made by JX Nippon Mining & Metals Co., Ltd.) and rolled copper foil (Tough pitch copper foil JIS H3100 alloy number C1100 made by JX Nippon Mining & Metals Co., Ltd.) And an intermediate layer was formed on the surface. The formation of the intermediate layer was performed according to the processing order described in the item “Method for forming intermediate layer” in Table 1. That is, for example, what is described as “Ni / zinc chromate” indicates that “Ni” was first processed and then “Zinc chromate” was processed. In the “intermediate layer” item, “Ni” means that pure nickel plating was performed, and “Ni—Zn” means that nickel zinc alloy plating was performed. “Sputtered Ni” means that Ni plating was formed by sputtering, and “Pure chromate” means that pure chromate treatment was performed. , “BTA treatment” means that a surface treatment using benzotriazole was performed. Each processing condition is shown below. In addition, when increasing the adhesion amount of Ni, Zn, Cr, Mo, and Co, set the current density higher and / or set the plating time longer, and / or in the plating solution The concentration of each element was increased. Further, when reducing the amount of adhesion of Ni, Zn, Cr, Mo, and Co, the current density should be set low and / or the plating time should be set short and / or in the plating solution The concentration of each element was reduced. The balance of the liquid composition such as a plating solution is water.

"Ni": Nickel plating (Liquid composition) Nickel sulfate: 270-280 g / L, Nickel chloride: 35-45 g / L, Nickel acetate: 10-20 g / L, Trisodium citrate: 15-25 g / L, luster Agents: Saccharin, butynediol, etc. Sodium dodecyl sulfate: 55-75 ppm
(PH) 4-6
(Liquid temperature) 55-65 degreeC
(Current density) 1-25 A / dm ²
(Energization time) 1 to 20 seconds

- "Ni-Zn": in the formation conditions of the nickel-zinc alloy plating the nickel plating, was added in the form of zinc of zinc sulfate (ZnSO ₄₎ in the nickel plating solution, zinc concentration: 0.05-5 g / L range In this way, a nickel zinc alloy plating was formed.

"Ni-Co": nickel cobalt alloy plating In the above nickel plating formation conditions, cobalt in the form of cobalt sulfate was added to the nickel plating solution, and the cobalt concentration was adjusted in the range of 0.1 to 10 g / L. Nickel cobalt alloy plating was formed.

"Ni-W": Nickel tungsten alloy plating In the above nickel plating formation conditions, add tungsten in the form of sodium tungstate to the nickel plating solution, and adjust the tungsten concentration in the range of 0.1 to 10 g / L. Nickel tungsten alloy plating was formed.

"Ni-Mo": Nickel molybdenum alloy plating In the above nickel plating formation conditions, molybdenum in the form of sodium molybdate is added to the nickel plating solution, and the molybdenum concentration is adjusted in the range of 0.1 to 10 g / L. Nickel molybdenum alloy plating was formed.

-"Ni-Sn": Nickel tin alloy plating In the above nickel plating formation conditions, tin in the form of sodium stannate is added to the nickel plating solution, and the tin concentration is adjusted in the range of 0.1 to 10 g / L. Nickel tin alloy plating was formed.

- "Cr": chromium plating (liquid _{composition) CrO 3: 200~400g / L,} H 2 SO 4: 1.5~4g / L
(PH) 1-4
(Liquid temperature) 45-60 ° C
(Current density) 10-40 A / dm ²
(Energization time) 1 to 20 seconds

"Pure chromate": Pure chromate treatment (Liquid composition) Potassium dichromate: 1-10 g / L, Zinc: 0 g / L
(PH) 2-4, 7-10
(Liquid temperature) 40-60 ° C
(Current density) 0.1-2.6 A / dm ²
(Coulomb amount) 0.5 to 90 As / dm ²
(Energization time) 1 to 30 seconds

-"Zinc chromate": Zinc chromate treatment In the above electrolytic pure chromate treatment conditions, zinc in the form of zinc sulfate (ZnSO ₄ ) is added to the solution, and the zinc concentration is adjusted in the range of 0.05 to 5 g / L. Zinc chromate treatment was performed.

-BTA treatment: Surface treatment using benzotriazole (Liquid composition) Benzotriazole: 0.1 to 20 g / L
(PH) 2-5
(Liquid temperature) 20-40 ° C
(Immersion time) 5-30s

MBT treatment: surface treatment using mercaptobenzothiazole (Liquid composition) 2-mercaptobenzothiazole sodium: 0.1 to 20 g / L
(PH) 7-10
(Liquid temperature) 40-60 ° C
(Voltage) 1-5V
(Energization time) 1 to 30 seconds

"Sputtering Ni": Ni plating by sputtering Ni: A nickel layer was formed using a sputtering target having a composition of 99 mass%.
Target: Ni: 99 mass%
Equipment: Sputtering equipment manufactured by ULVAC, Inc. Output: DC50W
Argon pressure: 0.2 Pa

-"Sputtering Cr": Cr plating by sputtering Cr: A chromium layer was formed using a sputtering target having a composition of 99 mass%.
Target: Cr: 99 mass%
Equipment: Sputtering equipment manufactured by ULVAC, Inc. Output: DC50W
Argon pressure: 0.2 Pa

"Mo-Co": Molybdenum cobalt alloy plating (Liquid composition) Cobalt sulfate: 10-200 g / L, Sodium molybdate: 5-200 g / L, Sodium citrate: 2-240 g / L
(PH) 2-5
(Liquid temperature) 10-70 ° C
(Current density) 0.5 to 10 A / dm ²
(Energization time) 1 to 20 seconds

  When forming the intermediate layer, the Ni adhesion amount variation coefficient: X and X ′ are controlled by keeping the Ni plating current density low, controlling the adhesion amount by the conveyance speed, and adjusting the parallelism between the carrier and the anode. It was done by keeping it uniform.

After forming the intermediate layer, an ultrathin copper layer having a thickness of 1 to 10 μm was formed on the intermediate layer by electroplating under the following conditions to produce a copper foil with a carrier.
-Ultrathin copper layer Copper concentration: 30-120 g / L
H ₂ SO ₄ concentration: 20 to 120 g / L
Electrolyte temperature: 20-80 ° C
Current density: 10 to 100 A / dm ²

2. Evaluation of copper foil with carrier The copper foil with carrier obtained as described above was evaluated by the following methods.
<Metal adhesion amount of intermediate layer>
The amount of nickel deposited was measured by ICP emission analysis after dissolving the sample in nitric acid with a concentration of 20% by mass. The amount of zinc, chromium, molybdenum and cobalt deposited was dissolved in hydrochloric acid with a concentration of 7% by mass and the atomic absorption method was used. It was measured by performing quantitative analysis. The nickel, zinc, chromium, molybdenum and cobalt adhesion amounts were measured as follows. First, after peeling the ultrathin copper layer from the carrier-attached copper foil, only the vicinity of the surface on the intermediate layer side of the ultrathin copper layer is dissolved (for example, only 0.5 μm thickness from the surface is dissolved), The amount of adhesion on the surface on the intermediate layer side is measured. In addition, after peeling off the ultrathin copper layer, only the vicinity of the surface on the intermediate layer side of the carrier is dissolved (for example, only 0.5 μm thickness from the surface is dissolved), and the amount of adhesion on the surface of the carrier on the intermediate layer side is measured. . And the value which totaled the adhesion amount of the surface by the side of the intermediate | middle layer of an ultra-thin copper layer and the adhesion amount of the surface by the side of the intermediate | middle layer of a carrier was made into the metal adhesion amount of an intermediate | middle layer.

<Coefficient of variation of Ni adhesion amount>
A 250 mm × 250 mm square copper foil with a carrier was used for the analysis of the Ni adhesion amount on the ultrathin copper layer side. Copper foil with carrier, ultrathin copper layer side on a substrate of BT resin (triazine-bismaleimide resin, manufactured by Mitsubishi Gas Chemical Co., Ltd.) in air, pressure: 20 kgf / cm ² , 220 ° C. × 2 hours And bonded by thermocompression. Thereafter, the ultrathin copper layer was peeled off from the carrier in accordance with JIS C 6471 (Method A), and the ultrathin copper layer / BT resin laminate was cut into a 20 mm × 20 mm square size. Subsequently, the average value when the adhesion amount of Ni on the peeling surface of the ultrathin copper layer was dissolved in nitric acid having a concentration of 20% by mass and measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction by ICP emission analysis. A was taken as A, the standard deviation was taken as σ, and the coefficient of variation of the Ni adhesion amount: X = σ × 100 / A was determined. Similarly, for the ultrathin copper layer of the carrier-attached copper foil before being bonded to the resin substrate, the Ni adhesion amount variation coefficient: X ′ = σ ′ × 100 / A ′ was measured.

<Peel strength>
Heat the copper foil with a carrier to the BT resin (triazine-bismaleimide resin, manufactured by Mitsubishi Gas Chemical Co., Ltd.) in the atmosphere under pressure of 20 kgf / cm ² and 220 ° C. × 2 hours. Crimped and pasted. Subsequently, the carrier side was pulled with a load cell, and the peel strength was measured according to the 90 ° peel method (JIS C 6471 8.1). Also, the peel strength was measured in the same manner for each sample before thermocompression bonding with the resin.

<Etching property>
A copper foil with a carrier was attached to a polyimide substrate and heat-pressed at 220 ° C. for 2 hours, and then the ultrathin copper layer was peeled off from the carrier. Subsequently, after applying a photosensitive resist to the surface of the ultra-thin copper layer on the polyimide substrate, 50 L / S = 5 μm / 5 μm wide circuits are printed by an exposure process to remove unnecessary portions of the copper layer. The etching process was performed under the following spray etching conditions.
(Spray etching conditions)
Etching solution: Ferric chloride aqueous solution (Baume degree: 40 degrees)
Liquid temperature: 60 ° C
Spray pressure: 2.0 MPa
Etching was continued, the time until the circuit top width reached 4 μm was measured, and the circuit bottom width (the length of the base X) and the etching factor at that time were evaluated. The etching factor is the distance of the length of sagging from the intersection of the vertical line from the upper surface of the copper foil and the resin substrate, assuming that the circuit is etched vertically when sagging at the end (when sagging occurs) Is a ratio of a to the thickness b of the copper foil: b / a, and the larger the value, the larger the inclination angle, and the etching residue does not remain and the sagging is small. It means to become. FIG. 1 shows a schematic diagram of a cross section in the width direction of a circuit pattern and an outline of a method for calculating an etching factor using the schematic diagram. This X was measured by SEM observation from above the circuit, and the etching factor (EF = b / a) was calculated. In addition, it calculated by a = (X (μm) −4 (μm)) / 2. The etching factor is obtained by measuring 12 points in the circuit and taking an average value. Thereby, the quality of etching property can be determined easily. Also, by calculating the standard deviation of the 12 etching factors, it is possible to determine whether the linearity of the circuit formed by etching is good or bad.
In the present invention, an etching factor of 5 or more is etching property: ◯, 2.5 or more and less than 5 is etching property: Δ, less than 2.5 or calculation is impossible or circuit formation is impossible. -. Moreover, it can be said that the smaller the standard deviation of the etching factor, the better the linearity of the circuit. When the standard deviation of the etching factor was less than 0.5, the linearity was evaluated as ◯, when 0.5 to less than 1.0 was determined as the linearity: Δ, and 1.0 or more was determined as the linearity: x. Moreover, the etching property was similarly measured about each sample before thermocompression bonding with the said resin.

<Thickness of organic material in the intermediate layer>
For each sample before thermocompression bonding with resin, after peeling the ultrathin copper layer of the carrier-attached copper foil from the carrier, the exposed surface of the intermediate layer side of the exposed ultrathin copper layer and the exposed surface of the intermediate layer side of the carrier Is measured by XPS, and a depth profile is created. The depth at which the carbon concentration first becomes 3 at% or less from the surface on the intermediate layer side of the ultrathin copper layer is defined as A (nm), and the carbon concentration is initially 3 at% or less from the surface on the intermediate layer side of the carrier. The resulting depth was defined as B (nm), and the sum of A and B was defined as the thickness (nm) of the organic substance in the intermediate layer. The larger the value of x, the deeper (farther) the measurement position of the metal atomic concentration is from the surface. Note that the measurement interval of the atomic concentration of the metal in the depth direction (x: unit nm) is preferably 0.18 to 0.30 nm (in terms of SiO ₂ ). In the present invention, the atomic concentration of the metal in the depth direction was measured at intervals of 0.28 nm (SiO ₂ conversion) (measured every 0.1 minutes by sputtering time).
XPS operating conditions are shown below.
・ Device: XPS measuring device (ULVAC-PHI, Model 5600MC)
・ Achieving vacuum: 3.8 × 10 ⁻⁷ Pa
X-ray: Monochromatic AlKα or non-monochromatic MgKα, X-ray output 300 W, detection area 800 μmφ, angle between sample and detector 45 °
Ion beam: ion species Ar ⁺ , acceleration voltage 3 kV, sweep area 3 mm × 3 mm, sputtering rate 2.8 nm / min (in terms of SiO ₂ )
As described above, as a result of measuring the organic material thickness of the intermediate layer, the organic material thickness of the intermediate layer of Example 6 is 39 nm, the organic material thickness of the intermediate layer of Example 7 is 40 nm, the organic material thickness of the intermediate layer of Example 14 is 30 nm, The organic layer thickness of the intermediate layer of Example 17 was 35 nm, the organic layer thickness of the intermediate layer of Comparative Example 11 was 16 nm, and the organic layer thickness of the intermediate layer of Comparative Example 12 was 11 nm.
The results are shown in Tables 1 and 2.

In each of Examples 1 to 18, the average value A of the Ni adhesion amount transferred to the surface of the ultrathin copper layer is 400 μg / dm ² or less, and the coefficient of variation of the Ni adhesion amount after bonding the substrates: X = Since σ × 100 / A was 30.0% or less, good etching properties were exhibited before and after thermocompression bonding.
Since Comparative Examples 1 and 2 did not have an intermediate layer, they could not be peeled before and after substrate bonding. In Comparative Examples 3 and 4, since Ni was not present in the intermediate layer, it could not be peeled before and after substrate bonding. In Comparative Example 5, since Cr was not present in the intermediate layer, it could not be peeled after the substrates were bonded together. Comparative Examples 6 and 8 could not be peeled after pressing because the amount of Cr deposited in the intermediate layer was small. Comparative Example 9 could not be peeled off after pressing because the amount of Zn deposited on the intermediate layer was large. In Comparative Example 14, since the average value A of the amount of Ni deposited on the surface of the ultrathin copper layer was large, etching could not be performed before and after substrate bonding. In Comparative Example 15, since the average value A of the amount of Ni transferred to the surface of the ultrathin copper layer was large, etching could not be performed after the substrates were bonded together.

Claims (35)

A carrier-attached copper foil comprising a carrier, an intermediate layer laminated on the carrier, and an ultrathin copper layer laminated on the intermediate layer,
The ultra-thin copper layer is thinner than the carrier,
The intermediate layer includes Ni;
An insulating substrate is thermocompression-bonded to the ultrathin copper layer in the atmosphere under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours, and the carrier is removed from the ultrathin copper layer in accordance with Method A of JIS C 6471. When you peel
The average value of the amount of Ni deposited on the intermediate layer side surface of the ultrathin copper layer when the amount of Ni deposited on the intermediate layer side surface of the ultrathin copper layer was measured 10 points at intervals of 20 mm in the width direction and the longitudinal direction. : When A is 400 μg / dm ² or less, the standard deviation of the Ni adhesion amount on the intermediate layer side surface of the ultrathin copper layer is σ, and the variation coefficient of the Ni adhesion amount is X = σ × 100 / A, A copper foil with a carrier satisfying X of 30.0% or less. An insulating substrate is thermocompression-bonded to the ultrathin copper layer in the atmosphere under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours, and the carrier is removed from the ultrathin copper layer in accordance with Method A of JIS C 6471. When the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction, the Ni content on the intermediate layer side surface of the ultrathin copper layer is measured. ^{2. The} copper foil with a carrier according to claim 1, wherein an average value of the adhesion amount: A is 3 to 300 μg / dm ² . An insulating substrate is thermocompression-bonded to the ultrathin copper layer in the atmosphere under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours, and the carrier is removed from the ultrathin copper layer in accordance with Method A of JIS C 6471. The average value when A was measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction: A was 3 to 250 μg / dm ² The copper foil with a carrier according to claim 2. An insulating substrate is thermocompression-bonded to the ultrathin copper layer in the atmosphere under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours, and the carrier is removed from the ultrathin copper layer in accordance with Method A of JIS C 6471. When the amount of Ni deposited on the intermediate layer side surface of the ultrathin copper layer was measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction: A was 3 to 200 μg / dm ² The copper foil with a carrier according to claim 3. An insulating substrate is thermocompression-bonded to the ultrathin copper layer in the atmosphere under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours, and the carrier is removed from the ultrathin copper layer in accordance with Method A of JIS C 6471. When the amount of adhesion of Ni on the intermediate layer side surface of the ultrathin copper layer was measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction: A is 5 to 100 μg / dm ² The copper foil with a carrier according to claim 4. An insulating substrate is thermocompression-bonded to the ultrathin copper layer in the atmosphere under the conditions of pressure: 20 kgf / cm ² and 220 ° C. × 2 hours, and the carrier is removed from the ultrathin copper layer in accordance with Method A of JIS C 6471. , The average value when the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction is A, the standard deviation is σ, and Ni The copper foil with a carrier according to any one of claims 1 to 5, wherein X satisfies 1.0 to 25.0% when a coefficient of variation of the adhesion amount is X = σ × 100 / A. When the carrier is peeled from the ultrathin copper layer in accordance with JIS C 6471 method A ,
The average value when the adhesion amount of Ni on the intermediate layer side surface of the ultrathin copper layer is measured at 10 points at intervals of 20 mm in the width direction and the longitudinal direction: A ′ is 400 μg / dm ² or less, and the standard deviation is σ The copper foil with a carrier according to any one of claims 1 to 6 , wherein X ′ satisfies 20.0% or less, assuming that the coefficient of variation of the Ni adhesion amount is X ′ = σ ′ × 100 / A ′. When the carrier was peeled from the ultrathin copper layer in accordance with JIS C 6471 method A , the amount of Ni deposited on the intermediate layer side surface of the ultrathin copper layer was 10 points at intervals of 20 mm in the width direction and the longitudinal direction. When the average value when measured one by one is A ′, the standard deviation is σ ′, and the variation coefficient of the Ni adhesion amount is X ′ = σ ′ × 100 / A ′, X ′ is 1.0 to 15.0%. The copper foil with a carrier of Claim 7 which satisfy | fills. The copper foil with a carrier according to any one of claims 1 to 8 , wherein the carrier is formed of an electrolytic copper foil or a rolled copper foil. Copper foil with carrier according to any one of claims 1 to 9 having a roughened layer on the ultra-thin copper layer surface. The roughening treatment layer is a layer made of any single element selected from the group consisting of copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium, and zinc, or an alloy containing at least one kind. Item 11. A copper foil with a carrier according to Item 10 . The copper with a carrier according to claim 10 or 11 , comprising at least one layer selected from the group consisting of a heat-resistant layer, a rust-preventing layer, a chromate-treated layer, and a silane coupling-treated layer on the surface of the roughened layer. Foil. On the surface of the ultra-thin copper layer, heat-resistant layer, the anticorrosive layer, according to any one of claims 1 to 9, having at least one layer selected from the group consisting of chromate treatment layer and a silane coupling treatment layer Copper foil with carrier. The intermediate layer is configured by laminating any one layer of nickel or an alloy containing nickel on the carrier and a layer containing any one or more of chromium, a chromium alloy, and an oxide of chromium in this order. The copper foil with a carrier according to any one of claims 1 to 13 . The copper foil with a carrier according to claim 14 , wherein the layer containing any one or more of chromium, a chromium alloy, and a chromium oxide includes a chromate treatment layer. The said intermediate | middle layer is copper foil with a carrier in any one of Claims 1-15 containing zinc. The intermediate layer is any one of nickel, nickel-zinc alloy, nickel-phosphorus alloy, nickel-cobalt alloy, zinc chromate treatment layer, pure chromate treatment layer, and chromium plating layer on the carrier. The copper foil with a carrier according to any one of claims 1 to 16 , wherein one kind of layer is laminated in this order. The intermediate layer is on the carrier,
A nickel layer or a nickel-zinc alloy layer and a zinc chromate treatment layer are laminated in this order, or
A nickel-zinc alloy layer and a pure chromate treatment layer or a zinc chromate treatment layer are laminated in this order.
In any of the amount of adhered 100~40000μg / dm ² of nickel in the intermediate layer, the amount of adhered 5~100μg / dm ² chromium, claims 1-17 adhesion amount of the zinc is 1~70μg / dm ² The copper foil with a carrier of description. The intermediate layer is formed by laminating a nickel layer or an alloy layer containing nickel on the carrier, and an organic material layer containing at least one of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid. ,
The copper foil with a carrier according to any one of claims 1 to 18 , wherein an adhesion amount of nickel in the intermediate layer is 100 to 40000 µg / dm ² . The intermediate layer is formed by laminating an organic layer containing at least one of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid, and a nickel layer or an alloy layer containing nickel on the carrier. ,
Copper foil with carrier according to any one of claims 1 to 19 attached amount of nickel is 100~40000μg / dm ² in the intermediate layer. The copper foil with a carrier according to claim 19 or 20 , wherein the intermediate layer contains an organic substance in a thickness of 25 nm to 80 nm. The intermediate layer is formed by laminating a nickel layer or an alloy layer containing nickel on the carrier and a layer containing any one or more of molybdenum, cobalt, and a molybdenum cobalt alloy in this order.
The adhesion amount of nickel in the intermediate layer is 100 to 40000 μg / dm ² , and when molybdenum is included, the adhesion amount of molybdenum is 10 to 1000 μg / dm ² , and when cobalt is included, the adhesion amount of cobalt is 10 ~1000μg / dm ² copper foil with carrier according to any one of claims 1 to 21. On the carrier, after forming any one layer of nickel or an alloy containing nickel, forming a layer containing any one or more of chromium, a chromium alloy or an oxide of chromium, and at least the nickel or nickel A step of forming an intermediate layer containing zinc in any one layer of an alloy containing or any one of chromium, a chromium alloy, or a layer containing an oxide of chromium, and the intermediate method for producing a copper foil with carrier according to any one of claims 1 to 18, and forming a very thin copper layer by electrolytic plating on the layer. After forming a plating layer containing nickel and zinc on the carrier, forming an intermediate layer by forming a plating layer containing chromium or a chromate treatment layer, and an ultrathin copper layer by electrolytic plating on the intermediate layer method for producing a copper foil with carrier according to any one of claims 1 to 18 including the step of forming a. After forming a plating layer containing nickel on the carrier, a step of forming an intermediate layer by forming a plating layer containing chromium and zinc or a zinc chromate treatment layer, and ultrathin copper by electrolytic plating on the intermediate layer method for producing a copper foil with carrier according to any one of claims 1 to 18 including the step of forming the layer. After forming a plating layer containing nickel and zinc on the carrier, forming a plating layer containing chromium and zinc or a zinc chromate treatment layer, and forming an intermediate layer on the intermediate layer by electrolytic plating method for producing a copper foil with carrier according to any one of claims 1 to 18, and forming a thin copper layer. After forming a nickel plating layer on the carrier, an intermediate layer is formed by forming a zinc chromate treatment layer by electrolytic chromate, or after forming a nickel-zinc alloy plating layer, a pure chromate treatment layer by electrolytic chromate forming an intermediate layer or by forming a zinc chromate treatment layer, with a carrier according to any one of claims 1 to 18 including the step of forming the intermediate layer ultra-thin copper layer by electrolytic plating on A method for producing copper foil. On the carrier, after forming a nickel plating layer or an alloy plating layer containing nickel, an organic material layer having a thickness of 25 nm to 80 nm containing at least one of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid is formed, or After forming an organic substance layer having a thickness of 25 nm to 80 nm containing at least one of a nitrogen-containing organic compound, a sulfur-containing organic compound and a carboxylic acid, an intermediate layer is formed by forming a nickel plating layer or an alloy plating layer containing nickel. The manufacturing method of the copper foil with a carrier in any one of Claims 1-13 and 19-21 including the process and the process of forming an ultra-thin copper layer by electrolytic plating on the said intermediate | middle layer. Forming an intermediate layer by forming a layer containing any one or more of molybdenum, cobalt, and a molybdenum cobalt alloy after forming a nickel plating layer or an alloy plating layer containing nickel on the carrier; The manufacturing method of the copper foil with a carrier in any one of Claims 1-13 and 22 including the process of forming an ultra-thin copper layer on a layer by electrolytic plating. 30. The method for producing a copper foil with a carrier according to any one of claims 23 to 29 , wherein in the step of forming the intermediate layer, a conveyance speed of the carrier is 30 m / min or less. Method for producing a copper foil with carrier according to any one of claims 23-30, further comprising the step of forming a roughened layer on the ultra-thin copper layer. Method for manufacturing a printed wiring board using the copper foil with carrier according to any one of claims 1 to 22. Method for manufacturing a printed circuit board using the copper foil with carrier according to any one of claims 1 to 22. Method for producing a copper-clad laminate using a copper foil with carrier according to any one of claims 1 to 22. A step of preparing the carrier-attached copper foil according to any one of claims 1 to 22 and an insulating substrate,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the carrier-attached copper foil and the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the carrier-attached copper foil,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method.