JP6163351B2 - Position detection apparatus and position detection method - Google Patents

Description

  The present invention relates to a position detection device and a position detection method for detecting the position of an object to be inspected.

2. Description of the Related Art Conventionally, a position detection device that detects the position of a semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) (inspected object) in a semiconductor manufacturing process is known (for example, Patent Document 1).
A position detection device described in Patent Document 1 includes a positioning table that supports a wafer, temperature adjusting means provided inside the positioning table, and an infrared camera that photographs a circuit pattern (modeled object) formed on the surface of the wafer. The temperature difference due to the difference in thermal conductivity is photographed with an infrared camera by heating the wafer, and the position of the wafer is detected.

JP 2007-305627 A

  However, in the conventional position detection apparatus as described in Patent Document 1, since the entire object to be inspected is heated, for example, the thermal conductivity of the wafer main body and the shaped object formed on the surface of the wafer main body is almost equal. If there is no difference, the entire object will reach the same temperature in an instant. For this reason, the time in which the temperature difference appears between the region where the modeled object is formed and the other region is extremely short, and instantaneous imaging data (discrimination data) capable of recognizing the region where the modeled object is formed and the other region, That is, the position of the adherend must be detected based on a small amount of information. For example, if there is an abnormality or erroneous imaging in the imaging data, there is a possibility that different positioning will be performed. There is a disadvantage that the reliability is lowered.

  The objective of this invention is providing the position detection apparatus and position detection method which can improve the reliability of the positioning accuracy of a to-be-inspected object.

  The position detection apparatus of the present invention includes a support means having a support surface for supporting an object to be inspected on which a predetermined shaped object is formed on at least one surface of a substrate, and a temperature change capable of heating or cooling the object to be inspected. And a discrimination means capable of discriminating between the area where the shaped object of the object to be inspected is formed and another area when the temperature of the object to be inspected is changed by the temperature changing means, and a result of the discrimination by the discrimination means Recognizing means for recognizing the position of the object to be inspected based on the temperature change means, the temperature change means for heating or cooling the object to be inspected, and moving the temperature change source along the support surface The structure which is provided with the moving means to be adopted is employ | adopted.

  In this case, in the position detection device of the present invention, it is preferable that the temperature change source includes a heating unit that can heat the object to be inspected and a cooling unit that can cool the object to be inspected.

  On the other hand, the position detection method of the present invention includes a step of supporting an object to be inspected having a predetermined shaped object formed on at least one surface of a base material on a support surface, and moving the temperature changing means along the support surface. However, the step of heating or cooling the object to be inspected by the temperature changing means, and the region where the shaped object of the object to be inspected is formed and other areas at the time of temperature change of the object to be inspected by the temperature changing means And a step of recognizing the position of the object to be inspected based on the result of the determination are employed.

  According to the position detection device and the position detection method as described above, since the temperature change means can heat or cool the object to be inspected while moving the temperature change source, the entire object to be inspected reaches the same temperature in an instant. For example, even if there is almost no difference in thermal conductivity between the region where the shaped object of the object to be inspected is formed and other regions, the region that reaches the same temperature in an instant Can be partial. As a result, even if the time during which the temperature difference appears between the region where the modeled object is formed and the other region is extremely short, a plurality of instantaneous determination data capable of recognizing the region where the modeled object is formed and the other region are obtained. For example, the position of the object to be inspected can be detected by performing predetermined data processing and control such as connecting or verifying the plurality of discrimination data by the recognition means. In this way, based on a large amount of discriminant data, for example, even if one or a small number of discriminant data has abnormalities or misclassifications, statistics can be corrected using a large number of other discriminating data or verified. Thus, the reliability of positioning accuracy can be improved.

  At this time, if the variable temperature source is provided with a heating unit and a cooling unit, for example, the determination data obtained when heating the inspection object and the determination data obtained when cooling the inspection object are superimposed. By verifying the discrimination result during heating with the discrimination result during cooling, or verifying the discrimination result during cooling with the discrimination result during heating, the reliability of the discrimination data can be further improved. . In addition, if the object to be inspected is handled easily by quickly returning the object to be inspected, or if a heat-sensitive adhesive sheet is affixed to the object to be inspected, adhesive residue due to overheating of the sheet Or prevent problems.

The side view which shows the position detection apparatus which concerns on one Embodiment of this invention. The top view for demonstrating the temperature distribution of a to-be-inspected object.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
Note that the X axis, the Y axis, and the Z axis in this specification are orthogonal to each other, the X axis and the Y axis are axes in a horizontal plane, and the Z axis is an axis that is orthogonal to the horizontal plane. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ “Left” is the arrow direction of the X axis, “Right” is the opposite direction, “Front” is the arrow direction of the Y axis, and “Back” is the opposite direction.

  In FIG. 1, the position detection apparatus 1 has a support surface 25 that supports a test object WK in which a plurality of electronic circuits EC as a predetermined shaped object are formed on at least one surface of a wafer WF as a base material. Means 2, temperature changing means 3 capable of heating or cooling the object to be inspected WK, and the region where the electronic circuit EC of the object to be inspected WK is formed when the temperature changing means 3 changes the temperature of the object to be inspected WK. Discriminating means 5 capable of discriminating the street line SL as the area of the disc, recognition means 6 for recognizing the position of the inspected object WK based on the discrimination result of the discriminating means 5, and in-plane of the support surface 25, that is, the Z axis Rotating means 8 for rotating the supporting means 2 around, and biaxial moving means 9 for moving the supporting means 2 in a biaxial direction in the plane along the support surface 25, that is, the X-axis direction and the Y-axis direction. In the inspected object WK, a plurality of electronic circuits EC are arranged at predetermined intervals, thereby forming street lines SL between adjacent electronic circuits EC and forming the electronic circuits EC. An adhesive sheet AS is affixed to the surface.

  The support means 2 includes a hollow box-shaped table 21 having a support surface 25, a side surface portion 23, and a bottom surface portion 24. The support surface 25 communicates with decompression means (not shown) such as a decompression pump and a vacuum ejector.

  The temperature changing means 3 supports the heating means 31 by a heating means 31 as a temperature changing source for heating the object to be inspected WK, a cooling means 32 as a temperature changing source for cooling the object to be inspected WK, and a first slider 33. In addition, the cooling means 32 is supported by the second slider 34, and the heating means 31 and the cooling means 32 are driving devices that move along the support surface 25, and are provided with a linear motor 35 as a moving means. Is housed inside. The heating means 31 can be exemplified by an infrared irradiation device, a coil heater, a heat pump (heat radiation side) and the like, and the cooling means 32 can be exemplified by a blower, a Peltier element, a heat pump (heat absorption side) and the like.

  The discriminating means 5 is constituted by an infrared camera, a thermography or the like, and is installed above the support surface 25.

  The recognition unit 6 includes a personal computer, a sequencer, and the like, and is provided so as to be able to control the entire operation of the position detection apparatus 1 as well as the determination unit 5.

  The rotating means 8 rotatably supports the table 21 with an output shaft 82 of a rotating motor 81 as a driving device supported by the biaxial moving means 9.

  The biaxial moving means 9 is a linear motor 92 as a driving device capable of moving the slider 91 supporting the rotation motor 81 in the Y-axis direction, and a drive capable of moving the slider 93 supporting the linear motor 92 in the X-axis direction. It has a linear motor 94 as a device.

A procedure for detecting the position of the inspected object WK in the position detection apparatus 1 will be described.
First, when the inspection object WK having the adhesive sheet AS is placed on the support surface 25 by a conveying means (not shown) or manually, the supporting means 2 drives a decompression means (not shown) to hold the inspection object WK by suction. Next, the temperature changing means 3 drives the heating means 31 and the linear motor 35, moves the heating means 31 to the left from the position indicated by the solid line in FIG. 1, and heats the object WK at two points in FIG. Move to the position indicated by the chain line. At this time, the discriminating means 5 takes images (continuous shot images) as a plurality of discriminating data capturing temperature differences due to differences in thermal conductivity. Further, after a predetermined time has elapsed since the heating means 31 moved, the temperature changing means 3 drives the cooling means 32 and the linear motor 35 to move the cooling means 32 to the left from the position shown by the solid line in FIG. The specimen WK is moved to a position indicated by a two-dot chain line in FIG. 1 while being cooled. Also at this time, the discriminating means 5 takes a plurality of images (continuous shot images) capturing the temperature difference due to the difference in thermal conductivity.

  Here, since the street line SL portion in the inspected object WK heated by the heating means 31 has a higher thermal conductivity than the electronic circuit EC portion, the electronic circuit EC portion as shown by the black line in FIG. The temperature rises faster than the moment (the black portion in FIG. 2 is the high temperature portion). For this reason, since the discrimination | determination means 5 can image the heat ray (infrared rays) emitted from the street line SL so as to be distinguished from the electronic circuit EC portion, the street line SL can be discriminated reliably. . Thereafter, the electronic circuit EC portion having a lower thermal conductivity than the street line SL portion also becomes high temperature (instantaneously) with time, and it becomes difficult to discriminate the street line SL by the discriminating means 5 (cannot be discriminated in some cases). In this way, even if the time during which the temperature difference appears between the region where the electronic circuit EC is formed and the street line SL is extremely short, the region where the same temperature is reached in an instant is made partial. A plurality of instantaneous images capable of recognizing the area where the circuit EC is formed and the street line SL can be obtained. Next, after the predetermined time has elapsed, the cooling means 32 moves while cooling the object to be inspected WK, so that the street line SL portion, which has a higher thermal conductivity than the electronic circuit EC portion, is indicated by a white line in FIG. Then, the temperature becomes lower than the electronic circuit EC part for a moment (the white part in FIG. 2 is the part that has become low temperature (room temperature)). For this reason, the determination means 5 can obtain a plurality of instantaneous images capable of recognizing the area where the electronic circuit EC is formed and the street line SL in the same manner as described above.

  The plurality of images picked up by the determining means 5 are sent to the recognizing means 6, and the recognizing means 6 recognizes the positions of the electronic circuit EC and the street line SL. Here, for example, even if one or a small number of images have an abnormality or erroneous imaging, the accuracy of positioning accuracy can be improved by taking statistics with a large number of other images and correcting them by verifying them. Can be improved. In addition, the image obtained when heating the object to be inspected WK and the image obtained when cooling the object to be inspected WK are overlapped, or the determination result when heated by the heating means 31 is displayed when the cooling means 32 is cooled. The reliability of the images can be further improved by verifying with the determination result of the above, or verifying the determination result at the time of cooling by the cooling unit 32 with the determination result at the time of heating by the heating unit 31.

  When the position of the inspected object WK can be recognized as described above, the rotating means 8 and the biaxial moving means 9 drive the rotating motor 81 and the linear motors 92 and 94 based on the recognition result of the recognizing means 6, and The inspection body WK is positioned at a predetermined position. In the case of the present embodiment, the biaxial moving means 9 drives the linear motors 92 and 94 to place the center of the object to be inspected WK at a predetermined position (for example, the center position LN), and the rotating means 8 causes the rotating motor 81 to move. Driven, the street lines SL orthogonal to each other are arranged so as to be parallel to the X axis and the Y axis.

  According to the present embodiment as described above, since the temperature change means 3 can heat or cool the inspection object WK while moving the heating means 31 and the cooling means 32, the entire inspection object WK is instantaneously formed. Since the same temperature is not reached and the position of the inspected object WK can be recognized from a plurality of images, the reliability of the positioning accuracy can be improved.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, the modeled object of the object to be inspected is not limited to a mold, a pattern, a pattern, a character, a symbol, or the like.
Furthermore, the temperature changing means 3 may have a configuration in which only one of the heating means 31 and the cooling means 32 is provided. Moreover, when both of them are provided, the cooling means 32 may be moved first, and then the heating means 31 may be moved. Thus, when the cooling means 32 is moved first, the cooling means 32 may cool the object to be inspected WK below room temperature. Furthermore, when both of them are provided, the position of the object to be inspected may be recognized using only one of them. Further, the heating means 31 and the cooling means 32 may be supported by one slider of the linear motor. Furthermore, the temperature changing means 3 may move the heating means 31 and / or the cooling means 32 one or more times. The more the heating means 31 and the cooling means 32 are moved, the more images of the discrimination means 5 are. The reliability of positioning accuracy can be improved. In addition, after the temperature changing means 3 moves the heating means 31 and the cooling means 32 a predetermined number of times and the discrimination means 5 takes an image, the rotating means 8 rotates the table 21 by a predetermined angle, and / or the biaxial moving means 9 After moving the table 21 by a predetermined amount, the temperature changing means 3 may again move the heating means 31 and the cooling means 32 a predetermined number of times, and the discrimination means 5 may take an image. By doing so, the electronic circuit EC part and the street line SL part can be imaged from different angles and positions. For example, the recognition means 6 could not be recognized from the image due to light reflection or shading. The image can be picked up again by clarifying the portion, and the reliability of the positioning accuracy can be further improved.

  Further, a rotating motor as a driving device is used as the moving means, and the center of the heating means or the cooling means having a length equal to or larger than the width of the object to be inspected WK is supported by the output shaft of the rotating motor. It is good also as a structure which rotates a cooling means 180 degrees or more. Further, when using a rotating motor as a driving device as the moving means, the end of the heating means or the cooling means having a length about half the width of the inspected object WK is supported by the output shaft of the rotating motor, These heating means and cooling means may be configured to rotate 360 ° or more.

Further, the heating unit 31 and the cooling unit 32 may be arranged above the support unit 2, and the determination unit 5 may be housed in the table 21 to heat and cool the object to be inspected WK from above.
Further, the determination data of the determination means may be a moving image or a still image, or may be image data or electronic (electrical) data without being imaged.

  In addition, the inspection object WK may be placed with the adhesive sheet AS on the upper side in the configuration of the embodiment. Further, the object to be inspected WK may be one in which the adhesive sheet AS is affixed on both front and back surfaces, or may be one in which the adhesive sheet AS is not affixed on both front and back surfaces.

  Further, the material, type, shape, and the like of the adhesive sheet AS and the inspected object WK in the present invention are not particularly limited. For example, as the adhesive sheet AS, a heat-sensitive adhesive or a pressure-sensitive adhesive may be employed. Examples of the object to be inspected WK include foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, information recording substrates such as circuit boards and optical disks, glass plates, steel plates, ceramics, wood plates, or resin plates. Any form of member or article can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes, etc. in shape can be affixed to any inspection object as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, if the support means has a support surface that supports an object to be inspected on which at least one surface is formed with a predetermined modeled object, the support means is within the range in light of the common general technical knowledge at the time of filing. There is no limitation (the description of other means is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 Position detection apparatus 2 Support means 3 Temperature change means 5 Discrimination means 6 Recognition means 25 Support surface 31 Heating means (temperature change source)
32 Cooling means (temperature change source)
35 Linear motor (moving means)
41 Reverse temperature source EC Electronic circuit (molded article)
WF Wafer (base material)
WK Inspected object

Claims (3)

A support means having a support surface for supporting an object to be inspected on which a predetermined shaped article is formed on at least one surface of the substrate;
Temperature changing means capable of heating or cooling the object to be inspected;
When the temperature of the object to be inspected is changed by the temperature changing means, the determining means capable of determining the area where the shaped object of the object to be inspected is formed and other areas;
Recognizing means for recognizing the position of the object to be inspected based on the determination result of the determining means,
The position detecting device includes a temperature changing source for heating or cooling the object to be inspected and a moving means for moving the temperature changing source along the support surface.   The position detection apparatus according to claim 1, wherein the temperature change source includes a heating unit that can heat the object to be inspected and a cooling unit that can cool the object to be inspected. A step of supporting a test object on which a predetermined shaped object is formed on at least one surface of the substrate with a support surface;
Heating or cooling the object to be inspected with the temperature changing means while moving the temperature changing means along the support surface;
When changing the temperature of the object to be inspected by the temperature changing means, the step of discriminating between the area where the shaped object of the object to be inspected is formed and another area;
And a step of recognizing the position of the object to be inspected based on the determination result.