JP4637250B2 - Local heating device - Google Patents

Description

  The present invention relates to a local heating device for forming a film by heating and drying a liquid or a thermosetting member locally formed on a substrate.

  A technique for forming a film by applying a liquid or a thermosetting member on a substrate and drying it has been conventionally used in many production apparatuses. Among them, a patterning technique that has been attracting attention in recent years is a patterning technique for forming a film by applying a required amount of liquid to an arbitrary location on a substrate and drying it. Such a technique includes a technique using a dispenser or an ink jet. Such a technique has been attracting attention as a technique that can be used in a vacuum removal process instead of a pattern generation method using a vacuum process by conventional photolithography.

  For example, as a production apparatus using an inkjet patterning technique, inks of red (R), green (G), and blue (B) colors are landed in RGB pixel areas formed on a glass substrate. There is an apparatus that fills each pixel to form a color filter (CF) panel. In this case, the ink buried in the pixel region is dried by heating the entire substrate with an oven or the like to form a film.

  Such patterning technology is widely used not only as a full-surface printing technology, but also as a technology for repairing defective parts such as color mixing, mixing of foreign substances, or adhesion, and development of such a repairing apparatus is also progressing. It is out. As such a repair technique, for example, in a CF panel, in the case of a defective pixel in which ink color mixture occurs or a defective pixel mixed with impurities, the ink layer film in the defective area is removed and ink is applied again to the removed portion. Then, there is a technique for re-forming pixels by heating and drying.

  As a method for heating and drying the liquid application part, there is a conventional document that discloses a method of heating and drying the entire substrate with an oven, a hot plate, or the like. When heating the entire substrate, a dedicated large-scale heating device and a transfer robot with excellent heat resistance are required, and a place and time for cooling the heated substrate to proceed to the next process are also required. There was a problem that the rise and tact time became long.

  In particular, when there are few places to be heated and dried, it is advantageous to produce locally and heat-dry only the liquid application part because the manufacturing cost and tact are more advantageous when locally heated and dried.

  In FIG. 2, as a technique for locally heating and drying only the liquid application part, the substrate support member 5 supports the substrate 1 at a certain height, and then the hot air heater 2 only locally heats the liquid application part. The structure sectional drawing of the local heating apparatus with the exhaust pipe 9 which takes unnecessary thermal exhaust is shown. The substrate on the transport roller 8 is slightly lifted and supported by the substrate support member 5, and is heated from the lower surface of the substrate by the hot air heater 2 disposed inside the substrate support member. The height of the substrate support member at the start of heating is set in advance, and the distance between the supported substrate and the hot air heater is managed to be constant.

  The substrate support member is in direct contact with the substrate, and when the substrate is heated with a hot air heater, the adjacent substrate support member is also affected by heat and the temperature rises. For this reason, the board | substrate support member is manufactured with the resin material with high heat resistance so that a board | substrate may not be damaged.

  However, when the temperature of the substrate support member rises, since it is a resin material, its strength decreases, and the possibility of deformation due to a load during substrate support increases. In order to suppress the temperature rise of the substrate support member, it is effective to increase the distance from the hot air heater. In the case of a ring-shaped substrate support member, increasing the ring shape is a very effective method for suppressing the temperature rise of the substrate support member. In addition, since the load for supporting the substrate can be dispersedly supported in a large area, concentrated load on the substrate can be prevented, and the possibility of occurrence of problems such as substrate cracking can be reduced.

JP 2004-160296 A

  When heat treatment is performed on the edge portion of the substrate with a structure in which the heating means is arranged at the center position of the substrate support member that keeps the substrate height constant, the heating means center position is placed at the substrate processing position in order to keep the substrate heating conditions optimal. There is a need to. However, when the support position of the substrate support member is separated from the center position of the heating means to avoid the influence of heat, a part of the substrate support member protrudes from the substrate and supports the substrate. In addition, a substrate alignment mechanism or the like is disposed around the substrate end portion, and the substrate support member and the substrate edge portion vicinity member such as the substrate alignment mechanism physically interfere with each other and come into contact with each other. In order not to contact the two, it is necessary to arrange the substrate support member largely inward from the substrate edge portion so that it does not protrude from the substrate region, and therefore, it is impossible to heat the substrate edge portion with a hot air heater. There is.

  In addition, the substrate heated locally by the hot air heater expands and warps the substrate. When the heated substrate is greatly warped, the distance between the substrate and the hot air heater is changed, and the processing temperature of the substrate cannot be controlled uniformly. Therefore, there is a problem in that stable heating conditions cannot be maintained and the quality of the thermosetting member after heating cannot be improved.

  The present invention has been made in view of the above problems, and enables heating of a substrate edge portion to be heated, maintains a stable heating condition against warping of the substrate, and is a thermosetting member after heating. An object of the present invention is to provide a local heating device that can improve the quality of the material.

  The present invention includes a substrate support member that supports the substrate in the vicinity of the heat treatment region from below and supports the substrate, and a heating unit that heats the substrate to be heated by spraying hot air from above the substrate. For each substrate processing coordinate area, set the relative positional relationship between the coordinates for injecting hot air from the heating means and the coordinates of the substrate support member, and control the position of the coordinates of the heating means and the coordinates of the substrate support member independently. To do.

  According to this local heating device, when the substrate edge portion is heated by the heating means, the position of the heating means and the coordinates of the substrate support member are independently controlled to control the center position of the heating means and the substrate support. By shifting the center position of the member, setting the substrate support member at a position where it does not physically interfere with the peripheral member of the substrate, and setting the heating means at the edge portion of the substrate for heat treatment, Allows heat treatment.

  Furthermore, it is preferable that the coordinates of the heating means can be arranged outside the support region of the substrate support member that supports the substrate.

  By disposing the heating means outside the support region of the substrate support member, the influence of heat on the substrate support member due to the heat treatment can be suppressed, and deterioration due to heating can be prevented.

  Further, the height of the heating means is controlled by using the difference amount between the height of the substrate upper surface position on the substrate support member and the height of the substrate upper surface position at the heating position by the heating means as a height correction amount of the ejection position of the heating means. It is preferable.

  By controlling the height of the heating means using the difference in height due to substrate deflection as a correction amount, the distance between the ejection position of the heating means and the upper surface position of the substrate can be kept constant, and the heating conditions are stabilized. This makes it possible to improve the quality of the substrate after heating.

  Furthermore, it is preferable to set the height of the substrate support member so that the warping direction due to the heat treatment of the substrate is a constant direction.

  By setting the height of the substrate support member at the start of the heat treatment, the substrate is warped, and the distance between the ejection position of the heating means and the substrate upper surface position is made constant by making the warpage direction by the heat treatment constant. It is possible to improve the quality of the substrate after heating by stabilizing the heating conditions.

  According to the local heating device of the present invention, the position of the heating means and the coordinates of the substrate support member are independently controlled, so that it is possible to perform the heating process at the substrate edge proximity position that is the heating target. . Further, since the distance between the upper surface position of the substrate and the heating means can be kept constant, the heating conditions of the substrate can be managed more strictly, and the quality of the substrate after heating can be improved. .

It is a block diagram which shows the heat processing operation | movement of this invention. It is sectional drawing which shows the structure of the local heating apparatus in a prior art. It is a top view which shows the apparatus structure of this invention. It is sectional drawing which shows the apparatus structure of this invention. It is a figure which shows the state of the board | substrate on a conveyance roller. It is a figure which shows the state by which the board | substrate was supported by the board | substrate support member. It is a figure which shows interference of a board | substrate support member and an alignment mechanism. It is a figure which shows the state which divided | segmented the board | substrate into the several area | region. It is a figure which shows the recipe 1 for every area | region divided | segmented into the several area | region. It is a figure which shows the position shift of the hot air heater and board | substrate support member in this invention. It is a figure which shows the recipe 2 for every area | region divided | segmented into the several area | region. It is a figure which shows the relative positional relationship of a hot air heater and a board | substrate support member. It is a figure which shows the deflection | deviation of the board | substrate edge part at the time of making a board | substrate support member position the same. It is a figure which shows the deflection | deviation of the board | substrate edge part when the space | interval of a board | substrate support member and a heating means is made constant. It is a figure which shows the height relationship of the ejection position of a board | substrate and a heating means. It is a figure which shows the curvature by the heating of a board | substrate. It is a figure which shows the curvature direction of a board | substrate. It is a figure which shows the curvature of the board | substrate on a board | substrate support member. It is a figure which shows the curvature of the board | substrate on a board | substrate support member.

  Hereinafter, a local heating device according to an embodiment of the present invention based on the present invention will be described with reference to the drawings.

  3 and 4 show the configuration of the local heating device. An alignment roller 61 for positioning and fixing the substrate 1 and an air cylinder 62 for driving the alignment roller 61 are installed in the substrate transport frame 7 to constitute the alignment mechanism 6. When the air cylinder 62 is operated, the four corners of the substrate 1 are positioned and fixed by the alignment rollers 61. The substrate 1 is arranged on a large number of conveyance rollers 8 (not shown), and can be reciprocated in the Y-axis direction by a conveyance mechanism (not shown).

  Above the substrate 1, a heating means 2 and a cooling nozzle 3 are fixed to a unit holding member 4. As the heating means 2, a hot air heater that injects hot air may be used. The unit holding member 4 is movable in an X direction and a vertical Z direction perpendicular to the substrate transport direction (Y) by an X and Z stage (not shown). The distance between the position of the substrate 1 and the tip of the heating means 2 such as a hot air heater during the heat treatment is controlled in advance so as to have an optimum gap size for substrate heating.

  The glass substrate used has a size exceeding 3 m on one side, but its thickness is very thin, about 0.7 mm. As described above, the substrate 1 moves so as to slide on the transport roller 8, but it does not become a flat plate at all. FIG. 5A is a cross-sectional view showing a state in which the substrate 1 is supported by the transport roller 8, and FIG. 5B is a cross-section showing a state in which the substrate 1 is supported by the transport roller 8 in a biased manner. FIG. As shown in FIG. 5 (a), the substrate is deflected by its own weight between the adjacent conveyance rollers 8, and the substrate height varies. Further, it is difficult to match the height of the upper surface of the transport roller 8 without variation, which is one of the causes of variations in the height of the substrate on the transport roller 8. As shown in FIG. 5 (b), when the periphery of the substrate is heated by a hot air heater as the heating means 2, the substrate 1 is supported in a cantilevered state by a transfer roller 8. Therefore, a large deflection may occur due to the weight of the substrate 1 in the cantilevered state.

  In a local heating device using a hot air heater, if the distance between the hot air heater and the substrate 1 varies, the substrate temperature during the heat treatment varies depending on the distance and does not become constant. In order to keep the thermosetting member applied to the substrate 1 in high quality after the heat treatment, it is necessary to heat the thermosetting member to a preset optimum substrate temperature range, and it is necessary to suppress the variation in the heating temperature. .

  For this reason, as shown in FIG. 6, a substrate support member 5 is disposed below the substrate 1, and the substrate support member 5 here has a donut shape and contacts the substrate in a ring shape. The substrate support member 5 is mounted on an X and Z stage (not shown), and is movable in the X direction perpendicular to the substrate transport direction and in the vertical Z direction. The hot air heater above the substrate 1 is also movable in the X direction perpendicular to the substrate transport Y direction, but the center position of the substrate support member 5 and the hot air heater center position can be substantially coincided with each other when viewed in the apparatus XY plane. The Y direction position is set. Here, a state in which the substrate support member 5 is disposed slightly above the upper surface of the transport roller 8 is shown. Even if the substrate 1 on the conveyance roller 8 is bent by arranging the substrate support member 5 above the upper surface of the conveyance roller 8 and lifting the substrate 1 by a small amount, the substrate height at the center portion of the substrate support member is almost equal. The height is defined to be constant, and the distance between the substrate 1 and the hot air heater can be kept constant.

  By the way, the thermosetting member may be applied to almost the entire surface of the substrate 1 except for a very small part of the outermost periphery of the substrate. When the vicinity of the center of the substrate 1 is heat-treated, the substrate 1, the substrate support member 5 and the hot air heater shown in FIG. 6 are arranged, and the substrate 1 at the center position of the substrate support member 5 is heat-treated. Here, there are no other components such as the alignment roller 61 around the substrate support member 5, and stable heat treatment is possible.

  By the way, if the shape of the substrate support member 5 is small, the substrate support member 5 is also heated by the hot air heater during the heat treatment, and the temperature rises. Since the substrate support member 5 is in contact with the substrate 1, the substrate support member 5 is formed of a resin material so as not to damage the substrate 1. A heat-resistant resin material is selected, but if the heating amount is large due to the load when the substrate 1 is supported, the possibility of thermal deformation increases. For this reason, the shape of the substrate support member 5 having a size that allows an allowable temperature increase has been selected by prior examination.

  On the other hand, FIG. 7 shows the positional relationship between the heating means 2 such as a hot air heater and the substrate support member 5 when the substrate edge portion is heat-treated. The center positions of the substrate support member 5 and the hot air heater which is the heating means 2 are in agreement. The substrate support member 5 protrudes greatly outside the outer peripheral portion of the substrate and physically interferes with the alignment roller 61 for positioning and fixing the substrate. Further, the hot air heater heats the substrate 1 in the vicinity of the alignment roller 61, and the hot air after heating the substrate heats the alignment roller 61. Since the alignment roller 61 is also in contact with the substrate end surface, the alignment roller 61 is formed of a resin material so as not to damage the substrate end surface. If the temperature becomes high during substrate alignment, the possibility of thermal deformation increases.

  As described above, in the case of the local heating device using the substrate support member 5 and the hot air heater, problems such as physical interference between the members and abnormal heating of the components occur during the heat treatment of the substrate edge portion and the outer peripheral portion.

  FIG. 8 shows a state in which the substrate 1 is divided into a plurality of regions. Here, the substrate is divided into five regions of P2 to P5 at the edge portion of the substrate and P1 which is other than that. Each substrate processing coordinate area has a processing recipe in which the relative positional relationship between the hot air heater center coordinates and the substrate support member 5 center coordinates is set.

  FIG. 9 shows a relative positional relationship (recipe 1) between the substrate processing coordinate area, the hot air heater center coordinate, and the substrate support member 5 center coordinate in FIG.

  The hot air heater center coordinate Xh is normally Xh = X0 because it is necessary to heat the thermosetting member application position X0 on the substrate at the hot air heater center.

  As for the substrate support member 5 center coordinates Xp, Xp = Xh (= X0) is set in the substrate region P1, Xp = A (a constant value) is set in the substrate regions P2 and P4, and in the substrate regions P3 and P5, Xp = B (constant value) is set. That is, in the substrate region P1, the heating process is performed with the hot air heater and the center of the substrate support member 5 being aligned. In the other substrate regions P2 to P5, the center position of the substrate support member 5 is set to, for example, a position A or B where the substrate support member does not protrude from the substrate region so as not to physically interfere with the substrate peripheral member. In the P2 to P5 substrate region, the hot air heater center position is arranged away from the substrate support member 5 center position.

  FIG. 10 is a cross-sectional view showing the positional relationship between the substrate support member 5 and the hot air heater as the heating means 2 in the region P2. The substrate support member 5 is fixed at a position Xp = A that does not protrude from the substrate region, and the hot air heater is position-controlled at the heat treatment position (Xh = X0).

  A plurality of relative positional relationships are set by combining position control (P1 area) where the hot air heater center coordinates and the substrate support member 5 center coordinates are simply matched with position control where both coordinates are independent (P2 to P5 areas). The at least one kind of processing recipe is provided, and the coordinate position of the hot air heater and the substrate support member 5 is controlled and heat-treated according to this processing recipe, thereby preventing contact between the substrate support member 5 and the substrate edge portion peripheral member. The substrate edge portion can be heat-treated.

  On the other hand, the fact that the center position of the heating means 2 such as a hot air heater is shifted from the center position of the substrate support member 5 means that the substrate support member 5 itself is heated when the hot air heater approaches the substrate support member 5. The substrate support member 5 is formed of a resin material having high heat resistance so as not to damage the substrate 1 when coming into contact with the substrate 1, but the distance between the hot air heater and the substrate support member 5 is reduced to support the substrate. If the temperature rise of the member 5 is large, the substrate support member 5 is thermally deformed, which may adversely affect the substrate support.

  Therefore, a configuration of a local heating device in which a hot air heater is arranged outside the region where the substrate support member 5 supports the substrate 1 is adopted.

  FIG. 11 shows the relative positional relationship (recipe 2) between the substrate processing coordinates, the hot air heater center coordinates, and the substrate support member 5 center coordinates in the region section of FIG.

  The hot air heater center coordinate Xh is normally Xh = X0 because it is necessary to heat the thermosetting member application position X0 on the substrate at the hot air heater center.

  As for the substrate support member 5 center coordinates Xp, Xp = Xh (= X0) is set in the substrate region P1, Xp = Xh−α is set in the substrate regions P2 and P4, and Xp = Xh in the substrate regions P3 and P5. Xh + α is set. That is, in the substrate region P1, the heating process is performed with the hot air heater and the center of the substrate support member 5 being aligned. In the other substrate regions P2 to P5, the center position of the substrate support member 5 is set to be offset relative to the center position of the hot air heater by α or −α.

  12A shows a plan view for explaining the positional relationship between the heating means 2 such as a hot air heater and the substrate support member 5 when the P2 region is heat-treated, and FIG. 12B shows a side view. The substrate 1 is lifted upward by a predetermined amount from the substrate position on the transport roller 8 by the substrate support member 5. The substrate 1 upper hot air heater center position Xh is positioned so as to coincide with the thermosetting member application position X0. On the other hand, the substrate support member 5 center position Xp is arranged at a position −α from the hot air heater center position. Here, the center of the hot air heater is disposed outside the substrate support member 5. The magnitude of the offset value α is set according to conditions such that the hot air heater does not heat the substrate support member 5 to a temperature higher than the heat resistant temperature, and the substrate support member 5 is not physically contacted even when it is closest to the alignment roller 61. .

  By adopting a configuration in which the heating means 2 such as a hot air heater is arranged outside the region where the substrate support member 5 supports the substrate 1, the hot air heater and the substrate support member can be used even when the substrate edge portion is heated. Since the distance to 5 can be sufficiently maintained, a large temperature rise of the substrate support member 5 can be suppressed. Further, since the substrate support member 5 is disposed inside the substrate region, it is possible to prevent the contact with the peripheral member of the substrate edge portion.

  When the substrate 1 is lifted by the ring-shaped substrate support member 5, the height of the lower surface of the substrate 1 at the center of the substrate support member 5 is substantially the same as the height of the upper surface (substrate receiving surface) of the substrate support member 5. When the substrate support member 5 supports the substrate 1 at a position shifted by α from the center position of the hot air heater, the substrate support member 5 cantilevered the substrate, and the substrate height may vary slightly due to the influence of warpage or deflection of the substrate 1. There is sex. However, as compared with the case where the substrate support member 5 is not used, the variation in the distance between the hot air heater and the substrate 1 is much smaller. As a result, the heating temperature of the substrate 1 can be brought close to the set temperature, and it is possible to improve the quality of the thermosetting member after heating.

  Thus, the local heating apparatus having the substrate support member 5 has a processing recipe in which a plurality of relative positional relationships between the substrate processing coordinate area, the hot air heater center coordinates, and the substrate support member 5 center coordinates are set. By controlling the coordinate positions of the heater and the substrate support member 5, the entire surface of the substrate can be heated by the hot air heater while the substrate 1 is supported by the substrate support member 5.

  In this embodiment, the substrate is divided into five processing regions, but each region is divided into various division numbers and shapes depending on factors such as the configuration of the substrate alignment mechanism 6 and the shape of the substrate support member 5. Is also possible. In this embodiment, the offset value between the hot air heater as the heating means 2 and the substrate support member 5 is set to a certain set value α. However, a plurality of offsets are set depending on the interference region between the substrate support member 5 and other members. It can also be a set value. Further, it is possible to set a plurality of hot air heater center positions corresponding to the heat treatment using a plurality of hot air heaters.

  FIG. 1 shows an example of a block diagram of a heat treatment operation including opening and closing of the substrate cooling nozzle shown in FIG. A processing recipe is selected according to conditions such as the apparatus configuration and the number of substrate processing divisions (S1). The heat treatment coordinates X0 and Y0 on which the thermosetting member is applied to the substrate are input (S2), and the treatment area including the coordinates is selected (S3). Refer to the table set in the selected processing area (S4). According to the table, the hot air heater, the substrate support member 5, and the substrate movement / position control (S5). The hot air heater is lowered to the substrate heating position, and the substrate 1 is supported by the substrate support member 5. When the hot air heater is always ON, substrate heating is started (S6). A heat treatment for ensuring sufficient curing of the thermosetting member (S7). After the heating, the hot air heater and the substrate support member 5 are retracted (S8). The cooling nozzle valve is opened and substrate cooling is started (S9). Cooling to substrate temperature discharge set temperature (S10). The cooling nozzle valve is closed and the substrate cooling is completed (S11). It is determined whether there is another heat treatment point on the same substrate 1 (S12). If it is necessary to heat-treat other points (Yes), the process returns to the processing area determination (S3) to continue the additional processing. If not necessary (No), the hot air heater and the substrate support member 5 are brought to the home position. The movement (S13) and the substrate 1 are dispensed (S14).

  Here, the description has been made on the condition that the hot air is constantly ejected from the hot air heater, but the power supply of the hot air heater may be controlled to be turned on / off every time the substrate 1 is overheated.

  In the configuration of FIG. 12, the heating means 2 such as a hot air heater is disposed outside the region where the substrate support member 5 supports the substrate 1. In FIG. 12B, the substrate 1 is cantilevered by the substrate support member 5. It is supported. In order to suppress the temperature rise of the substrate support member 5 due to the influence of hot air from the hot air heater, it is necessary to make the distance α between the hot air heater center position and the substrate support member 5 as large as possible. However, on the other hand, the cantilever amount of the substrate 1 increases, and the substrate lower surface height at the center position of the hot air heater also bends lower than the upper surface of the substrate support member 5 due to the weight of the substrate 1. If the deflection amount of the substrate at the position to be heated is large, the distance between the hot air heater and the substrate 1 becomes large, and the heating temperature of the thermosetting member on the substrate 1 is lowered.

  Therefore, a correction table is created in which the difference between the substrate height on the substrate support member 5 at the substrate coordinates to be heat-treated and the substrate height at the substrate 1 coordinate position is the height correction amount ΔZ of the hot air heater.

  13 (a), 13 (b), and 13 (c) are examples of controlling the substrate support member 5 position to be the same and the hot air heater position to move in the heat treatment of the substrate edge portion. . The distance between the hot air heater and the substrate support member 5 is α1, α2, and the difference in height between the substrate 1 on the substrate support member 5 and the substrate 1 at the coordinate position to be heated is the deflection correction amounts ΔZ1, ΔZ2.

  14 (a), 14 (b), and 14 (c) are examples of controlling the distance between the substrate support member 5 and the hot air heater to move at a constant position in the heat treatment of the substrate edge portion. It is. The distance between the hot air heater and the substrate support member 5 is a constant value α3, and the difference in height between the substrate 1 on the substrate support member 5 and the substrate 1 at the coordinate position to be heated is the deflection correction amount ΔZ3. When the change amount of the hot air heater center coordinate Xh is small, the deflection correction amount does not change greatly if the distance from the substrate support member 5 is a constant value.

  FIG. 15 shows the positional relationship between the substrate 1 and the hot air heater as the heating means 2. FIG. 15A shows a standby state in which the hot air heater 1 is held at a place where it escapes larger than the substrate surface. When the substrate 1 is moved in the Y direction or when the hot air heater is moved at high speed in the X direction, the hot air heater is largely escaped from the substrate 1 in order to avoid interference between the substrate 1 and the hot air heater. In addition, since the hot air heater takes time from the start of energization until the temperature is raised to a predetermined temperature, if energization of the hot air heater is started after the substrate to be heat-treated is carried in, it takes time until the heating starts. The tact time is greatly increased. For this reason, it is effective to reduce the tact time by always energizing the hot air heater. Even when it is not desired to heat the parts other than the substrate heating unit unnecessarily by the hot air heater that is always energized, it is effective to release the hot air heater largely.

  FIG. 15B shows a state where the hot air heater heats the substrate. The distance m between the substrate 1 and the hot air heater is set in advance so as to be an optimum heating condition. Assuming that the amount of descent from the standby position of the hot air heater to the processing position is M, considering the substrate deflection correction amount ΔZ described above, the hot air heater only needs to be lowered from the standby position by M + ΔZ.

  The coordinate position to be heat-treated is different for each substrate, and is not a fixed coordinate. For this reason, the substrate deflection correction amount varies depending on the combination of conditions such as the protrusion amount of the substrate 1 cantilevered by the substrate support member 5, the distance between the substrate support member 5 and the hot air heater, and the heat treatment coordinates.

  For this reason, it is difficult to create a correction table that covers all the conditions in advance. Usually, the hot air heater center position (= heat treatment position) is divided into several regions, for example, k1 ≦ Xh ≦ k2. Is operated as ΔZ = ΔZk12.

  In this way, a correction table is created in which the difference between the substrate height on the substrate support member 5 at the substrate coordinates to be heat-treated and the substrate height at the substrate 1 coordinate position is the height correction amount ΔZ of the hot air heater. By controlling the distance between the substrate 1 and the hot air heater according to the correction table, the distance between the substrate 1 at the heat treatment position and the hot air heater can be kept almost constant at any position on the substrate 1. As a result, the substrate heating temperature can be managed to a target set value, and the quality of the thermosetting member after heating can be improved.

  In order to bake and dry the thermosetting resin applied on the substrate 1, the substrate 1 is heated by a hot air heater as the heating means 2, but only the periphery of the thermosetting resin is heated. Depending on the heater conditions such as the shape of the hot air heater and the amount of discharged hot air, the temperature of the substrate 1 at a portion separated by about 100 mm hardly increases. Although the temperature of the board | substrate 1 changes with the kind of thermosetting resin, and a heating process, it may become 300 degreeC or more high temperature. Although the thermal expansion amount of the heated portion is large, the thermal expansion amount of the peripheral region where the temperature rise is small is small. For this reason, only the heating region having a large thermal expansion amount warps in a bowl shape. FIG. 16A shows the state of substrate expansion before and after heating. Here, it is assumed that the substrate 1 is supported so as to be freely deformable.

  When the substrate surface is heated by the hot air heater, the substrate surface temperature on the hot air heater side is higher than the surface temperature on the opposite side. The warpage due to the thermal expansion of the substrate 1 due to heating is that if the substrate 1 before heating is not warped, the substrate 1 on the hot air heater side having a high heating temperature has a large elongation. Warp in shape.

  On the other hand, when the substrate 1 before heating is warped in advance, it does not always warp the hot air heater side convex shape. The warping direction may be warped in the convex shape on the hot air heater side shown in FIG. 16A, or may be warped in the convex shape on the opposite side to the hot air heater shown in FIG. It is the warping direction of the substrate 1 at the start of heating and the method of fixing and supporting the substrate 1 that has the greatest influence on the warping direction. Here, it is assumed that the substrate 1 is supported so as to hardly affect the warping direction during heating.

  FIG. 17A shows a state where the substrate 1 is slightly warped at the hot air heater side (upper side) convex shape at the start of heating. When the substrate 1 is heated from above the substrate 1 with a hot air heater, the heated substrate 1 warps greatly in a convex shape on the hot air heater side as shown in FIG. The phenomenon of warping the hot air heater side convex shape is the same as when there is no warp at the start of heating.

  FIG. 17C shows a state in which the substrate 1 is slightly warped at the opposite side (lower side) of the hot air heater at the start of heating. When the substrate 1 is heated from above the substrate 1 with a hot air heater, the heated substrate 1 is greatly warped in a convex shape opposite to the hot air heater (lower side) as shown in FIG. The warp direction of the substrate 1 by heating is opposite to the case where the substrate 1 before heating has no warp and the case where the substrate 1 slightly warps in the convex shape on the hot air heater side (upper side).

  That is, the state of warping of the substrate 1 before heating greatly affects the direction of warping after heating. Usually, the substrate 1 itself has a greater or lesser warp, and a new warp is generated depending on how the substrate 1 is supported.

  By the way, when the substrate is heated by the hot air heater, the heating temperature of the substrate 1 varies greatly depending on the distance between the substrate 1 and the hot air heater. Assuming that the substrate heating temperature when the distance between the substrate 1 and the hot air heater is H is T, when the substrate 1 is warped in the convex shape on the hot air heater side due to heating, the distance between the two is reduced by the warp size ΔH1 and H−ΔH1. Therefore, the substrate surface temperature rises to T + ΔT1. On the other hand, when the substrate 1 warps in the shape opposite to the hot air heater side due to heating, the distance between the two increases by the warp size ΔH2 and becomes H + ΔH2, so that the substrate surface temperature falls to T−ΔT2. Thus, the substrate temperature varies between T + ΔT1 and T−ΔT2 depending on the direction of warping during heating, and the heating conditions are not constant. Therefore, quality improvement of the thermosetting member after a heating cannot be achieved.

  FIG. 18 shows a state in which the substrate 1 at the start of heating is supported so that the substrate 1 at the time of heating warps the convex shape on the hot air heater side when heated by the hot air heater from above the substrate 1. The substrate 1 is placed on the transport roller 8. Since the substrate mounting surface height of the substrate support member 5 is set slightly above the transport roller 8 substrate mounting surface, the substrate 1 supported by the substrate support member 5 is slightly upwardly convex. Warped. When the substrate 1 in this state is heated from above by a hot air heater, the hot air heater side is greatly warped.

  FIG. 19 shows a state in which the substrate mounting surface height of the substrate support member 5 before heating is set below the transport roller 8 substrate mounting surface. Although the substrate 1 is supported by the ring-shaped substrate support member 5, the central portion of the substrate support member 5 facing the hot air heater is slightly warped in a downward convex shape. When the substrate 1 in this state is heated from above by a hot air heater, it is greatly warped in a convex shape opposite to the hot air heater (lower side).

  Even when the substrate 1 is supported using the same substrate support member 5, the warping direction of the substrate 1 is affected by conditions such as the distance between the conveyance rollers 8 of the heat treatment unit, the size of the substrate support member 5, and the substrate support height. Receive. For this reason, when the warp of the substrate 1 at the time of heating is aligned in a certain direction, it is confirmed in advance whether all the warpage of the substrate 1 supported by the substrate support member 5 is in a certain direction within the necessary substrate region. There is a need.

  In this way, by heating the substrate at the substrate coordinate position to be heat-treated by the hot air heater from above the substrate 1, the substrate support member 5 height is set so that the substrate support member 5 always warps upward. At this time, the distance between the substrate 1 and the hot air heater can be set to H-ΔH1, and the substrate surface temperature can be set to T + ΔT1. As a result, the heating conditions are stabilized, and the quality of the thermosetting member after heating can be improved.

  In the present embodiment, the substrate 1 at the time of heating is warped in a convex shape on the hot air heater side (upper side). This is because heating of the substrate 1 without warping is the same as the warping direction, which is natural as a warping phenomenon of the substrate 1. However, if necessary, it is also possible to set the substrate support height so as to warp the downward convex shape by heating as described above.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of limited interpretation. Therefore, the technical scope of the present invention should not be interpreted only by the above-described embodiments, but is defined based on the description of the claims. Moreover, the meaning equivalent to the range of a claim and all the changes within a claim are included.

1 Substrate 2 Heating means (hot air heater)
DESCRIPTION OF SYMBOLS 3 Cooling nozzle 4 Unit holding member 5 Substrate support member 6 Alignment mechanism 61 Alignment roller 62 Air cylinder 7 Substrate conveyance frame 8 Conveyance roller 9 Exhaust pipe

Claims (4)

An apparatus for locally heating a substrate,
A substrate support member for supporting the substrate in the vicinity of the heat treatment region of the substrate from below,
Heating means for injecting hot air from above the substrate and heating the local position to be heated of the substrate;
Coordinates for injecting hot air from the heating means for each substrate processing coordinate area,
Set a relative positional relationship with the coordinates of the substrate support member,
A local heating apparatus, wherein the coordinates of the heating means and the coordinates of the substrate support member are independently controlled.   The local heating apparatus according to claim 1, wherein the coordinates of the heating unit can be arranged outside a support region of the substrate support member that supports the substrate. A height of a substrate upper surface position on the substrate support member;
The difference between the height of the substrate upper surface position at the heating position by the heating means,
The local heating apparatus according to claim 2, wherein the height of the heating unit is controlled as a height correction amount of the ejection position of the heating unit.   The local heating apparatus according to claim 1, wherein a warping direction of the substrate by heat treatment is set to a constant direction by setting a height of the substrate support member.