TWM623500U - Wafer notch position judgment device - Google Patents

Abstract

The present invention relates to a device for judging the position of a wafer gap. The main structure includes a wafer driving element, one side of the wafer driving element is provided with a photographing element, one side of the photographing element is provided with a backlight element and a processing host, The processing host is provided with a gap judging module and a position judging module. In this way, the wafer driving element can be used to drive the wafer to move under the photographic element, so that the photographic element cooperates with the backlight element to perform a segmented photographing action to continuously photograph the wafer to generate a plurality of segmented pictures . Then, the segmented pictures are sent to the gap judgment module and the position judgment module to determine whether the wafer has a gap and the position of the gap, so as to achieve a fast and accurate detection action.

Description

Wafer notch position judgment device

The present invention provides a device for judging the position of a wafer gap, especially a device for judging the position of a wafer gap with a relatively accurate detection method.

According to the press, wafers are a very important part of the semiconductor crystal industry. They are mainly circular thin slices, so they are also called wafers. It can be used as a carrier substrate in the integrated circuit process, and in the manufacture of solar cells, and the wafers can also be divided into many types according to the material and size. For example, materials can be divided into silicon wafers, gallium nitride wafers, and silicon carbide wafers, etc., and sizes can be classified by diameter, such as 3 inches, 4 inches, or 5 inches.

Since wafers are quite sophisticated products, the overall integrity requirements are also very high, so the requirements for testing equipment will also be relatively improved. Generally, the method used to inspect the wafer is to use the method of photographing and optical measurement to carry out the inspection.

However, if you need to measure a larger wafer, you may not be able to photograph the entire wafer completely. If you want to directly photograph the entire wafer, it may produce blurred pixels. The problem is that it is necessary to install photographic equipment with higher photographic functions for shooting, which leads to an increase in cost.

Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the applicant of the present invention and the relevant manufacturers engaged in this industry are eager to research and improve.

Therefore, in view of the above-mentioned deficiencies, the applicant of this new model collects relevant information, evaluates and considers from various parties, and uses years of experience accumulated in this industry, through continuous trials and revisions, to design such a more accurate quantity. The patentee of a new type patent for a device for judging the position of a wafer gap in a measuring method and a method thereof.

The main purpose of the new model is to accurately measure the position of the gap by taking multiple sets of segmented pictures and cooperating with the gap judging module and the position judging module.

In order to achieve the above-mentioned purpose, the main structure of the present invention includes: a wafer driving element, a photographing element arranged at one side of the wafer driving element, a backlight element arranged at one side of the photographing element, and a photographing element arranged at one side of the photographing element. A processing host connected to the photographing element at one side of the element, a gap judging module set in the processing host, and a position judging module set in the processing host and connected with the gap judging module.

With the above structure, the user can use the wafer driving element to drive a wafer to continuously move in one direction at the photographing position of the photographing element, thereby allowing the photographing element to use the light source provided by the backlight element to continuously shoot in segments. wafers to generate complex segmented images.

The captured segmented pictures will be sent to the gap judgment module in the processing host for judging actions, thereby judging whether some of the wafers in each segmented picture have gaps, if no gaps are found, it will be End the action and access the relevant data. If a gap is detected in some wafers in the segmented image, the segmented image will be sent to the position judgment module for research and judgment, thereby judging that the gap is in the wafer. absolute position on the wafer. In this way, the above-mentioned segmented method can be used to inspect the wafers quickly and accurately, so as to improve the accuracy of inspection and reduce the cost of equipment.

With the above-mentioned technology, it is possible to break through the troublesome problem of detecting wafers with larger size, so as to achieve the practical progress of the above-mentioned advantages.

1: Wafer drive components

2: Photographic components

3: Backlight components

4: Handle the host

5: Gap judgment module

6: Location judgment module

61: Angle judgment component

62: Center line judgment element

63: Length judgment element

64: Position judgment element

7: Wafer carrier

T: Tangent angle

C: center line

W: horizontal length

A, A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11: Segmented pictures

The first figure is a three-dimensional perspective view of the preferred embodiment of the new type.

The second figure is a photographing schematic diagram of the new preferred embodiment.

The third figure is a schematic diagram of a segmented picture of the preferred embodiment of the new model.

The fourth figure is a schematic diagram (1) of the judgment of this new preferred embodiment.

Fig. 5 is a schematic diagram (2) of the judgment of this new preferred embodiment.

The sixth figure is a schematic diagram (3) of the judgment of the preferred embodiment of the new model.

In order to achieve the above purpose and effect, the technical means and structure adopted by the present invention are described in detail with reference to the preferred embodiment of the present invention and its features and functions are as follows, so as to be fully understood.

Please refer to the first figure, which is a three-dimensional perspective view of a preferred embodiment of the new model. It can be clearly seen from the figure that the new model includes:

A wafer driving element 1, the wafer driving element 1 in this embodiment takes a robotic arm that can drive the wafer to move as an example;

a photographing element 2 disposed at one side of the wafer driving element 1;

A backlight element 3 disposed at one side of the photographing element 2, the backlight element 3 of this embodiment is an example of an LED backlight plate that can emit a stable light source;

a processing host 4 disposed at one side of the photographing element 2 and connected to the photographing element 2;

A gap judging module 5 disposed in the processing host 4, the gap judging module 5 in the present embodiment takes the processor module disposed in the processing host 4 as an example;

A position judging module 6 disposed in the processing host 4 and connected with the information of the gap judging module 5. The position judging module 6 in this embodiment takes the processor module set in the processing host 4 as an example, and the gap judging The module 5 has an angle judging element 61 , a centerline judging element 62 disposed at one side of the angle judging element 61 , a length judging element 63 disposed at one side of the centerline judging element 62 , and a a position judging element 64 that is informationally connected to the angle judging element 61, the centerline judging element 62, and the length judging element 63; and

A wafer carrier 7 is provided at one side of the wafer carrying element 1 .

Through the above description, the structure of the present technology can be understood, and according to the corresponding cooperation of the structure, the advantages of fast and accurate measurement effect can be achieved, and the detailed explanation will be described below.

Please also refer to the first to sixth figures, which are the three-dimensional perspective views to the judgment schematic diagram (3) of the preferred embodiment of the new model. The user can use the wafer driving element 1 to take out the wafers in the wafer carrier 7, and drive the wafers to the lower side of the photographing element 2 for shooting, while the wafer driving element 1 will drive the wafers The wafer moves in a fixed direction, so that the photographic element 2 cooperates with the light source provided by the backlight element 3 to continuously perform a segmented shooting action, so that the edge shape of the wafer can be more completely displayed through the light source provided by the backlight element 3, That is, as shown in the third figure, a complex number of segmented pictures A (in this embodiment, the segmented pictures are taken A1 to A11 are used as examples), and when the segmented picture A is taken, overlapping parts will be photographed, for example, the lower half of the segmented picture A1 and the upper half of the segmented picture A2 will overlap each other. The overlapping effects ensure that the entire wafer is captured completely.

Then, the segmented pictures A are sent to the gap judgment module 5 to detect the partial wafers captured in the segmented pictures A (partial pictures of the wafers captured in the segmented pictures A) Whether there is a notch or not, the detection method of this embodiment takes as an example whether the wafer has a notch or not by means of binarization.

And if the gap determination module 5 determines that some of the wafers in each segmented picture A have no gap, it will directly end the overall detection operation, and access the relevant data. If a gap is detected, it will The segmented picture A with the gap is sent to the gap determination module 5 to calculate where the absolute position of the gap is on the wafer. In this embodiment, the gap is captured in the segmented picture A2 and the segmented picture A3 As an example.

The calculation method of this embodiment can be matched with those shown in the fourth to sixth figures, and the calculation of the gap in the segmented picture A2 will be used as an example. The tangent angle T of the notch in the embodiment is positive 60 degrees, and then the centerline judging element 62 is used to determine the position of the centerline C of some wafers to determine whether the notch is located on the left side or the right side (in this embodiment, it is located on the left side). (as an example), and then the horizontal length W of the notch position on the wafer is judged and read through the length judgment element 63, and finally the tangent angle T, the position of the center line C, and the horizontal length W are transmitted to the position judgment element 64 for integration. The action of judging can determine where the absolute position of the gap is and perform the action of recording and accessing.

For example, from the data of this embodiment, it can be seen that the corresponding horizontal lengths W have two positions as shown in the sixth figure, which means that the possible positions of the gaps are at the end points of the upper and lower horizontal lengths W, and the matching is because the tangent angle T is Positive value, so it can be judged that the gap should be located at the upper left and lower right (because only the tangent angle T of the upper left and lower right will be positive, while the upper right and lower left will be negative), and finally through the center In the way of interpreting line C, it can be judged that the gap should be located on the left side of the center line C, so it can be inferred that the absolute position of the gap is at the upper left absolute position in the sixth figure.

In this way, the user can use the above direction to take the wafer segmented into multiple sets of segmented pictures A, so as to detect whether there are gaps in the segmented pictures A, and when there is a gap, it can be quite accurate. The position of the gap can be judged to facilitate the user to perform the detection action quickly. In addition, since segmented imaging inspection is possible, the same wafer can be used regardless of the inspection size of the wafer. It is not necessary to purchase and install imaging elements 2 of different sizes according to the size of the wafer, so that the cost during inspection can be greatly reduced.

In addition, when the continuous shooting technology is generally used to detect whether there is an abnormal situation, an encoder will be set in the shooting machine to trigger the image capture action. segment image A, thereby reducing the movement error when shooting each segmented image A, so that the captured segmented image A can be completely connected and pieced together to form a wafer, so as to know the position of the gap. In this case, it can be seen from the above content that the absolute position of the gap on the wafer can be calculated directly by using the segmented picture A with the gap. It is completely different from the detection technology of general continuous shooting. It does not need to install an additional encoder (encoder) to trigger the image acquisition. Therefore, the manufacturing cost can also be greatly reduced, and the convenience of use can be improved at the same time. .

To sum up, the device for judging the position of the wafer gap of the present invention can indeed achieve its effect and purpose when it is used. Therefore, the present invention is a new model with excellent practicability. I hope that the review committee will approve this new model as soon as possible to protect the applicant's hard work. If the review committee has any doubts, please do not hesitate to send a letter for instructions, and the applicant will do our best to cooperate.

1: Wafer drive components

2: Photographic components

3: Backlight components

4: Handle the host

5: Gap judgment module

6: Location judgment module

61: Angle judgment component

62: Center line judgment element

63: Length judgment element

64: Position judgment element

7: Wafer carrier

Claims (5)

A device for judging the position of a wafer gap, which mainly includes: a wafer driving element, the wafer driving element drives the wafer to move; a photographing element, the photographing element is arranged at one side of the wafer driving element for continuously photographing the wafers driven by the wafer driving element in a segmented manner, so as to generate a plurality of segmented pictures; a backlight element provided at one side of the photographic element for providing the photographic element with the required light source; a processing host, which is arranged at one side of the photographing element for receiving the segmented pictures captured by the photographing element; a gap judging module, the gap judging module is arranged in the processing host for judging whether some of the wafers on the segmented image have gaps; and A position judging module, the position judging module is arranged in the processing host and is connected with the gap judging module for receiving each of the segmented pictures with gaps. The device for judging the position of the wafer notch as described in the first claim, wherein the position judging module has an angle judging element, a centerline judging element disposed on one side of the angle judging element, and a A length judging element at one side of the centerline judging element, and a position judging element connected to the angle judging element, the centerline judging element, and the length judging element information. The device for judging the position of a wafer gap as described in claim 1, wherein the gap judging module judges whether a part of the wafer on each of the segmented images has a gap through binarization. The device for judging the position of the wafer gap according to the first item of the scope of application, wherein a wafer carrier is disposed on one side of the wafer driving element. The device for judging the position of the wafer notch according to the first item of the scope of the application, wherein some of the wafers on the segmented pictures are for combining into a complete wafer.

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