TWI771753B - Wafer box detection device and wafer box detection method - Google Patents

Abstract

The invention provides a wafer box detection device, which is suitable for detecting a box body, wherein a plurality of objects to be detected are arranged in the box body, and the wafer box detection device includes a base, an image sensing unit, a rotating mechanism and a control unit. The pedestal is suitable for carrying the box body; the image sensing unit is used to detect the objects to be tested and capture a first image and a second image; the rotating mechanism is arranged between the pedestal and the image sensing unit; the control unit is electrically It is sexually connected to the rotating mechanism and the image sensing unit, and the control unit includes an output unit. In addition, the present invention also provides a wafer cassette inspection method for inspecting the cassette body through the above-mentioned wafer cassette inspection device.

Description

Wafer box detection device and wafer box detection method

The present invention provides a wafer box detection device and a wafer box detection method, and particularly relates to a wafer box detection device capable of detecting the configuration information of an object to be tested in a box body through two images captured in two different directions, And a wafer box detection method using the above-mentioned wafer box detection device to realize the automation of the detection process.

A wafer is an electronic component that is highly utilized in the semiconductor industry. Generally speaking, wafer cassettes equipped with wafers can be roughly divided into two categories: front opening unified pod (FOUP) and front opening shipping box (FOSB). The two types of wafer cassettes are usually made of transparent materials such as acrylic, and during the transportation process, the wafer cassettes will be put into a special bag for packaging the wafer cassettes to avoid contamination caused by the mixing of external impurities during transportation. wafer.

However, before or after packaging, it is necessary to confirm whether the wafers assembled in the wafer cassette are missing, overlapping or skewed, and these confirmation steps are mostly performed manually, which is not only time-consuming, but also And only by visual inspection from a single angle, it is more difficult for the staff to find the bad configuration on the blind spot of the vision, which in turn causes the delay of the inspection process, the reduction of inspection yield and the consumption of manpower.

The inventor then exhausted his mind and researched carefully, and further developed a wafer box inspection device that can detect the configuration information of the object to be tested in the box body through two images captured in two different directions, and use the above wafer box inspection device. A wafer cassette inspection method that automates the inspection process, in order to achieve the effect of accelerating the inspection process, improving the inspection yield and saving manpower.

The invention provides a wafer box detection device, which is suitable for detecting a box body, wherein a plurality of objects to be detected are arranged in the box body, and the wafer box detection device includes a base, an image sensing unit, a rotating mechanism and a control unit. The pedestal is suitable for carrying the box body; the image sensing unit is used to detect the objects to be tested and capture a first image and a second image; the rotating mechanism is arranged between the pedestal and the image sensing unit; the control unit is electrically The control unit is connected to the rotating mechanism and the image sensing unit, and the control unit includes an output unit, wherein the control unit receives the first image and the second image, performs an image recognition program on the first image and the second image, and transmits the image through the output unit. A configuration information of the objects to be tested is output.

In one embodiment, the wafer cassette inspection apparatus further includes a light-emitting unit, and the light-emitting unit is used for providing a light source when the image sensing unit captures the first image and the second image.

In one embodiment, the above-mentioned image sensing unit includes a plurality of image sensors, and these image sensors are arranged along the arrangement direction of the objects to be tested.

In one embodiment, the box body includes a first corner and a second corner, and the first image and the second image are captured by the image sensing unit through the first corner and the second corner, respectively. Two images.

On the other hand, the present invention also provides a wafer cassette detection method, which is suitable for detecting a cassette body through the above-mentioned wafer cassette detection device, and the wafer cassette detection method includes: arranging the cassette body on a pedestal, and image sensing The unit captures a first image including the object to be tested, the control unit drives the rotating mechanism to make the box body and the image sensing unit rotate relative to each other at an angle; the image sensing unit captures a second image including the object to be tested; control The unit receives the first image and the second image, and executes an image recognition program on the first image and the second image, and the control unit outputs a configuration information of the objects to be tested through the output unit.

In one embodiment, the above-mentioned image recognition process includes: dividing the inside of the box in the first image and the second image into a plurality of intervals, and according to the image grayscale value distribution and a standard grayscale value distribution in these intervals Compare and judge the configuration information of the object to be tested.

In one embodiment, the above-mentioned image sensing unit includes a plurality of image sensors, the image sensors are arranged along the arrangement direction of the object to be tested, and the image sensors capture part of the intervals respectively .

In one embodiment, the above-mentioned configuration information includes a normal information, an overlap information, a vacancy information and a skew information of the objects to be tested.

In one embodiment, the above-mentioned wafer cassette inspection device further includes a light-emitting unit, and the wafer cassette inspection method further includes: the light-emitting unit provides a light source when the image sensing unit captures the first image and the second image.

In one embodiment, the box body includes a first corner portion and a second corner portion, and disposing the box body on the pedestal includes: aligning the first corner portion with the image sensing unit; and the aforementioned The control unit driving the rotation mechanism to rotate the box body and the image sensing unit relative to each other by an angle includes: making the second corner align with the image sensing unit.

Thereby, the wafer cassette inspection device of the present invention can rotate the cassette body and the image sensing unit relative to each other through the rotating mechanism, and respectively capture the first image and the second image through the image sensing unit, and then the control unit checks The first image and the second image execute an image recognition procedure to obtain configuration information of the object to be tested. On the other hand, the wafer cassette inspection method of the present invention can obtain the configuration information of the object to be tested through the above-mentioned wafer cassette inspection device, thereby achieving the effects of speeding up the inspection process, improving the inspection yield and saving manpower.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

1: Wafer cassette inspection device

100: Pedestal

200: Image Sensing Unit

210: The first image sensor

220: Second Image Sensor

230: Third Image Sensor

300: Rotary Mechanism

400: Control Unit

500: Light unit

2, 2': box body

22: The first corner

24: Second corner

3, 3': object to be tested

A-A, A'-A': Section

S01~S06: Steps

T: Thickness

X, Y: direction

FIG. 1 is a schematic perspective view of an embodiment of a wafer cassette inspection device of the present invention.

FIG. 2 is a flow chart of the steps of an embodiment of the wafer cassette inspection method of the present invention.

FIG. 3 is a schematic top view of the box body in FIG. 1 .

FIG. 4 is a schematic cross-sectional view of the box body carrying the normally configured object to be tested along the section A-A in FIG. 3 .

FIG. 5 is a schematic cross-sectional view of the box body carrying the object to be tested with poor configuration along the section A-A in FIG. 3 .

FIG. 6 is a schematic diagram of the object to be tested in a normal configuration in the first image or the second image.

FIG. 7 is a schematic diagram of the object to be tested in the overlapping arrangement in the first image or the second image.

FIG. 8 is a schematic diagram of the object to be tested with a skewed arrangement in the first image or the second image.

The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings. It is worth mentioning that the directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only for referring to the directions of the attached drawings. Accordingly, the directional terms used are intended to illustrate, but not to limit the invention. In addition, in each of the following embodiments, the same or similar elements will be given the same or similar reference numerals.

Please refer to FIG. 1 and FIG. 2 , wherein FIG. 1 is a three-dimensional schematic diagram of an embodiment of a wafer cassette inspection apparatus of the present invention, and FIG. 2 is a flow chart of steps of an embodiment of a wafer cassette inspection method of the present invention. The wafer cassette inspection device 1 of this embodiment is suitable for inspecting a cassette body 2 , wherein the cassette body 2 is, for example, a wafer cassette, and the wafer cassette inspection device 1 includes a stand 100 and an image sensing unit 200 , a rotating mechanism 300 and a control unit 400, wherein the rotating mechanism 300 is disposed between the pedestal 100 and the image sensing unit 200, The control unit 400 is, for example, a computer and is electrically connected to the image sensing unit 200 and the rotation mechanism 300 , and the control unit 400 includes an output unit (not shown), wherein the output unit is, for example, a display screen.

Please refer to FIG. 3 and FIG. 4 , wherein FIG. 3 is a schematic top view of the box body in FIG. 1 , and FIG. 4 is a cross-sectional view of the box body carrying the normally configured DUT along the section A-A in FIG. 3 . In detail, the pedestal 100 of this embodiment is suitable for carrying the box body 2 , and the rotating mechanism 300 is a rotating cylinder, which can drive the pedestal 100 to freely translate or rotate. On the other hand, a plurality of objects to be tested 3 are arranged in the box body 2 , wherein the objects to be tested 3 are, for example, wafers. In order to prevent the object to be tested 3 from being improperly arranged inside the box body 2 , the wafer cassette inspection apparatus 1 of the present embodiment captures the image of the object to be tested 3 in the box body 2 through the image sensing unit 200 , and The captured image is sent to the control unit 400 for image recognition, and then the configuration information of the object to be tested 3 is obtained through the output unit.

The following will describe how the cassette detection method of the present embodiment detects the cassette body 2 on which the object to be tested 3 is arranged through the wafer cassette detection device 1 . First, the worker arranges the box body 2 on the pedestal 100 by manual or robotic extraction (step S01 ). In this embodiment, the box body 2 is made of a transparent material such as acrylic, so the image sensing unit 200 can directly capture the image of the object to be tested 3 inside the box body 2 , but the present invention does not add to this. Restriction, in other possible embodiments, the box body 2 can also be made of a colored material or a material that is impenetrable to general visible light, and the image sensing unit 200 is correspondingly configured with special wavelength light that can penetrate the box body 2 ( such as X-ray) for image capture.

Since the wafer cassette is usually equipped with extractor elements for robotic arm extraction above and in front of the wafer cassette, in order to prevent the above-mentioned elements from obscuring the identification features in the image during image capture, preferably, the rear of the cassette body 2 includes a first The corner portion 22, and when the box body 2 is arranged on the pedestal 100, the configured staff or the robotic arm can perform azimuth correction on the box body 2, so that the first corner portion 22 of the box body 2 is positioned on the image sensing unit. 200, at this time, the image sensing unit 200 captures a first image including the object to be tested 3 (step S02), in other words In other words, the first image is an image captured by the image sensing unit 200 through the first corner 22 . With such a configuration, not only can the features in the first image be prevented from being blocked, but also the configuration of the object 3 to be tested along the direction of the two sides adjacent to the first corner 22 can be detected at the same time, so that less The number of image captures to obtain enough image recognition information.

In order to obtain high-quality images and good comparison results, preferably, the wafer cassette inspection device 1 further includes a light-emitting unit 500, wherein the light-emitting unit 500 is, for example, a light-emitting panel, and the light-emitting unit 500 is used for the image sensing unit 200 provides a light source when capturing the first image. Of course, if the environment where the pod inspection apparatus 1 is located is a well-lit place (eg, outdoors), the pod inspection apparatus 1 may not be equipped with the light-emitting unit 500, and only capture images through external light.

After that, the control unit 400 drives the rotation mechanism 300 to rotate the box body 2 and the image sensing unit 200 by an angle relative to each other (step S03 ). The relative rotation is performed by rotating the box body 2, and the rotation angle is, for example, 90 degrees, but in other possible embodiments, the rotating mechanism 300 can also be arranged on the image sensing unit 200, and the box body 2 is fixed. The image sensing unit 200 revolves around the box body 2 for relative rotation, and even one of the box body 2 or the image sensing unit 200 can slide for a certain distance to generate a relative angle difference, which is not limited in the present invention. Preferably, the box body 2 further includes a second corner portion 24, and the control unit 400 drives the rotating mechanism 300 to make the second corner portion 24 of the box body 2 align with the image sensing unit 200. At this time, the image sensing unit 200 captures a second image including the object to be tested 3 (step S04 ). In other words, the first image is an image captured by the image sensing unit 200 through the second corner 24 . With such a configuration, the features in the second image can be prevented from being blocked, and the configuration of the object to be tested 3 independent of the direction of the two sides adjacent to the first corner 22 can be detected at the same time. Similarly, the above-mentioned light-emitting unit 500 can also provide a light source when the image sensing unit 200 captures the second image, so as to improve the quality and contrast of the second image.

It is worth mentioning that, in order to more precisely identify the object to be tested 3 in the box body 2 , the image sensing unit 200 of this embodiment includes a first image sensor 210 and a second image sensor 220 and a third image sensor 230, wherein the first image sensor 210, the second image sensor 220 and the third image sensor 230 are, for example, charge-coupled device (CCD) cameras, And these image sensors are arranged along the arrangement direction of the objects to be tested 3 . Through such a configuration, in the subsequent image recognition process, each image sensor can capture images of the object 3 under test in different regions, so that the resolution of the features of a single image is further improved.

After the image sensing unit 200 captures the first image and the second image, the first image and the second image will be sent to the control unit 400 , and the control unit 400 receives the first image and the second image, and responds to the first image and the second image. The image and the second image execute an image recognition procedure (step S05). Please refer to FIG. 4 and FIG. 5 at the same time, wherein FIG. 5 is a schematic cross-sectional view of the box body carrying the poorly configured DUT along the section A-A in FIG. 3 . Specifically, as shown in FIG. 5 , the image recognition program divides the inside of the box 2 in the first image and the second image into a plurality of sections, for example, 25 layers in this embodiment, and according to these sections The gray-scale value distribution of the image is compared with a standard gray-scale value distribution to determine the configuration information of the objects to be tested, and the above-mentioned image sensor respectively captures some of these intervals. In this embodiment, the first image sensor 210 detects the first to eighth layers, the second image sensor 220 detects the ninth to seventeenth layers, and the third image sensor 230 detects the eighteenth to the Take 25 floors as an example.

Please refer to FIGS. 6 to 8 , wherein FIG. 6 is a schematic diagram of the DUT in the first image or the second image in the normal configuration, and FIG. 7 is the DUT in the first image or the second image in the overlapping configuration. and FIG. 8 is a schematic diagram of the object to be tested with a skewed arrangement in the first image or the second image. In detail, the configuration information of the object to be tested 3 detected by the wafer cassette inspection apparatus 1 of this embodiment includes a normal information, an overlap information, a vacancy information and a skew information of the object to be tested 3, and the control unit 400 will According to the image grayscale value distribution of the normally configured object to be tested 3, an X-Y direction coordinate system and a threshold of thickness T are established. If the object to be tested 3 in the box body 2 has two overlapping objects as shown in FIG. 7 In the same layer, the distribution thickness of the image grayscale value of the object to be tested 3 at this time will exceed the thickness T of the object to be tested 3 in the normal configuration. Therefore, the control unit 400 can know through image recognition that the object to be tested 3 in this layer has a thickness T. The overlapping situation occurs, and an overlapping information is output; similarly, if the control unit 400 does not detect any grayscale value distribution of the object to be tested 3 in the specific area layer of the first image and the second image, it can determine the layer The situation where the object to be tested 3 is missing occurs, and a vacancy information is output; similarly, if the object to be tested 3 in the box body 2 is skewed as shown in FIG. The distribution direction will deviate from the standard X-Y coordinate system, so the control unit 400 can know that the object 3 under test in the layer is skewed through image recognition, and output skew information.

After the above-mentioned image recognition program is executed, the control unit 400 will output the configuration information of the objects 3 under test through the output unit (step S06 ). Specifically, when the configuration of the object to be tested 3 in the box body 2 is as shown in FIG. 5 , the control unit 400 will output information such as the following table through the output unit:

The first position is the position where the first corners 22 of the box body 2 are positioned on the image sensing unit 200 , and the second position is the position where the second corners 24 of the box body 2 are positioned at the image sensing unit 200 . By outputting the above configuration information from the control unit, the detection process can be effectively automated to save manpower, and the user can quickly know that the DUT 3 on the third layer is overlapped and the DUT 3 on the fifth layer is missing. In addition, the object under test 3 on the eighth layer is skewed, so that the configuration information of the object under test 3 in the box body 2 can be quickly obtained, so that the effect of speeding up the process and improving the inspection yield can be achieved.

The present invention has been disclosed above with preferred embodiments, but those skilled in the art should understand that the above embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. It should be noted that all the changes and substitutions equivalent to the above-mentioned embodiments should be considered to be included in the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.

1: Wafer cassette inspection device

100: Pedestal

200: Image Sensing Unit

210: The first image sensor

220: Second Image Sensor

230: Third Image Sensor

300: Rotary Mechanism

400: Control Unit

500: Light unit

2: Box

Claims (10)

A wafer box detection device is suitable for detecting a box body, the box body is equipped with a plurality of objects to be tested, and the wafer box detection device includes: a seat, suitable for carrying the box body; an image sensor a measuring unit for detecting the plurality of objects to be measured and capturing a first image and a second image; a rotating mechanism disposed between the pedestal and the image sensing unit; a control unit electrically is connected to the image sensing unit and the rotating mechanism, and the control unit includes an output unit; wherein, the control unit drives the rotating mechanism to make the box body and the image sensing unit rotate at an angle relative to each other, and receives the For the first image and the second image, an image recognition program is executed on the first image and the second image, and a configuration information of the plurality of objects to be tested is outputted through the output unit. The wafer cassette inspection device according to claim 1, further comprising a light-emitting unit, and the light-emitting unit is used for providing a light source when the image sensing unit captures the first image and the second image. The wafer cassette inspection device according to claim 1, wherein the image sensing unit includes a plurality of image sensors, and the plurality of image sensors are arranged along the arrangement direction of the plurality of objects to be tested. The wafer cassette inspection device as claimed in claim 1, wherein the cassette body includes a first corner portion and a second corner portion, and the first image and the second image are respectively transmitted by the image sensing unit through the first corner. Two images captured from a corner and the second corner. A wafer cassette detection method is suitable for detecting a cassette body through a wafer cassette detection device, the wafer cassette detection device includes a base, an image sensing unit, a rotation mechanism and a control unit, wherein the rotation mechanism Disposed between the pedestal and the image sensing unit, the control unit is electrically connected to the image sensing unit and the rotating mechanism and includes an output unit, and a plurality of objects to be tested are disposed in the box, the crystal The round box detection method includes: disposing the box body on the pedestal; the image sensing unit capturing a first image including the plurality of objects to be tested; the control unit driving the rotating mechanism to make the box body and The image sensing units are rotated relative to each other at an angle; the image sensing unit captures a second image including the plurality of objects to be tested; the control unit receives the first image and the second image, and sends the first image to the first image The image and the second image execute an image recognition program; and the control unit outputs a configuration information of the plurality of objects to be tested through the output unit. The wafer cassette inspection method according to claim 5, wherein the image recognition program comprises: dividing the inside of the cassette body in the first image and the second image into a plurality of sections; The image grayscale value distribution is compared with a standard grayscale value distribution to determine the configuration information of the plurality of objects to be tested. The wafer cassette inspection method according to claim 6, wherein the image sensing unit comprises a plurality of image sensors, and the plurality of image sensors are arranged along the rows of the plurality of objects to be tested The plurality of image sensors are arranged in the row direction, and the plurality of image sensors respectively capture part of the plurality of intervals. The wafer cassette inspection method according to claim 5, wherein the configuration information includes a normal information, an overlap information, a vacancy information and a skew information of the plurality of objects to be tested. The wafer cassette inspection method according to claim 5, wherein the wafer cassette inspection device further includes a light-emitting unit, and the wafer cassette inspection method further includes: the light-emitting unit captures the first image in the image sensing unit The image and the second image provide a light source. The wafer cassette inspection method as claimed in claim 5, wherein the cassette body includes a first corner portion and a second corner portion, and disposing the cassette body on the pedestal comprises: making the first corner portion meet the is located in the image sensing unit; and the control unit drives the rotating mechanism to rotate the box body and the image sensing unit relative to each other by an angle including: making the second corner face the image sensing unit.

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