JP6163161B2 - コア/シェル構造を有するナノワイヤを備えた光電子デバイス - Google Patents
コア/シェル構造を有するナノワイヤを備えた光電子デバイス Download PDFInfo
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
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- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
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- H—ELECTRICITY
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- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
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- H—ELECTRICITY
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- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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Description
Claims (9)
- 基板(11)の上に形成された、コア/シェル型構造を有するナノワイヤ(1、7)の形態である複数の発光手段を含む光電子デバイスであって、
前記ナノワイヤが活性領域(12、72)を含み、前記活性領域が、異なる発光波長に関連づけられているとともに前記活性領域のうちの少なくとも2つの異なる領域(120、121;720、721、722)の中に割り当てられた少なくとも2つの種類の量子井戸を含み、
前記ナノワイヤ(1、7)における前記活性領域(12、72)の第1の領域(120、720)が、前記ナノワイヤのコア(10、70)を少なくとも部分的に囲んでいるとともに半径方向の量子井戸を備える、略垂直な周辺部分であり、
前記活性領域の第2の領域(121、721)が、前記ナノワイヤにおける前記コアの端部に位置しているとともに軸方向の量子井戸を備える、略水平な上側部分であり、
前記デバイスが、前記基板上の第1の電気接触領域(15)と、前記複数の発光手段の上の第2の電気接触領域(16、51;17、81)とをさらに含み、
前記複数の発光手段が少なくとも2つのグループに従って割り当てられ、電気接触が、互いに異なる電気接触パターンを用いて前記少なくとも2つのグループのそれぞれを覆うように、連続的な導電層によって、前記活性領域における少なくとも異なる領域において、前記少なくとも2つのグループのそれぞれに対して行われるように前記第2の電気接触領域が配置され、
また、多波長光の放出を得るように電源が制御される、光電子デバイス。 - 前記活性領域(72)が、前記第1の領域と前記第2の領域との間に位置している第3の領域(722)を含む、請求項1に記載の光電子デバイス。
- 前記第2の電気接触領域が、前記ナノワイヤにおける前記活性領域のうちの前記第1の領域の少なくとも一部にわたって延びている、請求項1または2に記載の光電子デバイス。
- 電気的に並列に接続された複数の部分(40〜48)を含み、該複数の部分の内部において前記発光手段が並列に接続され、前記第2の電気接触領域における電気接触が、2つの隣接する部分に対して、前記活性領域と異なる領域においてもたらされている、請求項1から3のいずれか一項に記載の光電子デバイス。
- 前記発光手段における前記活性領域が2つの異なる領域を含み、第2のグループの発光手段(3)が、前記基板と反対側の上側面(330)を除いて電気絶縁用材料(34)によって囲まれ、前記第2の電気接触領域が、前記第2のグループの発光手段を完全に囲むとともに、第1のグループの発光手段(2)の周辺部の上に設けられて、前記活性領域における前記第1の領域に相当する高さhにわたって前記発光手段(2)と直接接触し、それによって、これらの発光手段(2)の上側部分が露出している、請求項1から4のいずれか一項に記載の光電子デバイス。
- 前記発光手段が、第3の領域を有する活性領域を含み、第3のグループの発光手段(7b)が、前記高さhにわたって電気絶縁用材料によって囲まれ、前記第2の電気接触領域が、hより大きい高さh1にわたって前記第3のグループの発光手段(7b)の周辺部の上に設けられ、それによって、前記発光手段の上側部分が部分的に露出している、請求項5に記載の光電子デバイス。
- 前記発光手段の少なくとも一部に対して、前記活性領域の少なくとも2つの領域において電気接触がもたらされるように前記第2の電気接触領域が配置されている、請求項1から6のいずれか一項に記載の光電子デバイス。
- 前記発光手段が、少なくとも2つの電気的に独立したグループ(60、61)の中に割り当てられており、前記少なくとも2つのグループごとに、前記活性領域における異なる領域に電力供給されるように電源が制御される、請求項7に記載の光電子デバイス。
- 前記ナノワイヤにおける前記活性領域が、好ましくはInGaN/GaNで形成されている、請求項1から8のいずれか一項に記載の光電子デバイス。
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Application Number | Priority Date | Filing Date | Title |
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FR1103670A FR2983639B1 (fr) | 2011-12-01 | 2011-12-01 | Dispositif optoelectronique comprenant des nanofils de structure coeur/coquille |
FR1103670 | 2011-12-01 | ||
PCT/IB2012/056866 WO2013080174A1 (fr) | 2011-12-01 | 2012-11-30 | Dispositif optoélectronique comprenant des nanofils de structure cœur/coquille |
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JP2014533897A JP2014533897A (ja) | 2014-12-15 |
JP6163161B2 true JP6163161B2 (ja) | 2017-07-12 |
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EP (1) | EP2786414B1 (ja) |
JP (1) | JP6163161B2 (ja) |
CN (1) | CN103959469B (ja) |
FR (1) | FR2983639B1 (ja) |
WO (1) | WO2013080174A1 (ja) |
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EP2973752A4 (en) * | 2013-03-15 | 2016-11-09 | Glo Ab | DIELECTRIC FILM WITH HIGH BREAKING INDEX TO INCREASE EXTRACTION EFFICIENCY OF NANODRAHT LEADS |
FR3011380B1 (fr) * | 2013-09-30 | 2017-01-13 | Aledia | Dispositif optoelectronique a diodes electroluminescentes |
US11398579B2 (en) | 2013-09-30 | 2022-07-26 | Commissariat à l'énergie atomique et aux énergies alternatives | Method for producing optoelectronic devices comprising light-emitting diodes |
FR3011383B1 (fr) * | 2013-09-30 | 2017-05-26 | Commissariat Energie Atomique | Procede de fabrication de dispositifs optoelectroniques a diodes electroluminescentes |
FR3016081B1 (fr) * | 2013-12-27 | 2017-03-24 | Aledia | Dispositif optoelectronique a diodes electroluminescentes a courant de fuite reduit |
FR3019938B1 (fr) * | 2014-04-09 | 2017-09-01 | Commissariat Energie Atomique | Dispositif optoelectronique a diodes electroluminescentes a diagramme d'emission ameliore |
CN107004727A (zh) | 2014-11-07 | 2017-08-01 | 索尔伏打电流公司 | 密堆积胶体晶体膜的壳赋能(shell‑enabled)垂直对准和精密组装 |
FR3041074B1 (fr) * | 2015-09-14 | 2020-01-17 | Valeo Vision | Module d'eclairage pour vehicule automobile |
EP3453050B1 (en) * | 2016-05-04 | 2022-06-15 | Nanosys, Inc. | Light emitting device containing different color leds and method of making an array of such light emitting devices |
EP3260414A1 (en) | 2016-06-21 | 2017-12-27 | Sol Voltaics AB | Method for transferring nanowires from a fluid to a substrate surface |
JP7007547B2 (ja) * | 2017-04-11 | 2022-01-24 | 日亜化学工業株式会社 | 発光素子の製造方法 |
DE102017130760A1 (de) * | 2017-12-20 | 2019-06-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches halbleiterbauteil und verfahren zur herstellung von optoelektronischen halbleiterbauteilen |
CN108394857A (zh) * | 2018-02-02 | 2018-08-14 | 上海理工大学 | 一种核壳GaN纳米线阵列的制备方法 |
CN110190162A (zh) * | 2019-06-04 | 2019-08-30 | 深圳扑浪创新科技有限公司 | 一种led芯片的外延结构及其制备方法 |
JP7520305B2 (ja) | 2020-08-31 | 2024-07-23 | 株式会社小糸製作所 | 半導体発光素子および半導体発光素子の製造方法 |
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JP3906654B2 (ja) * | 2000-07-18 | 2007-04-18 | ソニー株式会社 | 半導体発光素子及び半導体発光装置 |
JP4595198B2 (ja) * | 2000-12-15 | 2010-12-08 | ソニー株式会社 | 半導体発光素子及び半導体発光素子の製造方法 |
KR100593438B1 (ko) | 2004-02-09 | 2006-06-28 | 학교법인 포항공과대학교 | 나노 형광체/나노소재 이종접합구조체 및 그 제조방법 |
KR100553317B1 (ko) | 2004-04-23 | 2006-02-20 | 한국과학기술연구원 | 실리콘 나노선을 이용한 실리콘 광소자 및 이의 제조방법 |
US7045375B1 (en) | 2005-01-14 | 2006-05-16 | Au Optronics Corporation | White light emitting device and method of making same |
CA2643439C (en) | 2006-03-10 | 2015-09-08 | Stc.Unm | Pulsed growth of gan nanowires and applications in group iii nitride semiconductor substrate materials and devices |
FR2922685B1 (fr) | 2007-10-22 | 2011-02-25 | Commissariat Energie Atomique | Dispositif optoelectronique a base de nanofils et procedes correspondants |
JP4979810B2 (ja) * | 2008-03-05 | 2012-07-18 | パナソニック株式会社 | 発光素子 |
JP5227224B2 (ja) | 2008-03-14 | 2013-07-03 | パナソニック株式会社 | 化合物半導体発光素子およびそれを用いる照明装置ならびに化合物半導体発光素子の製造方法 |
WO2010023921A1 (ja) * | 2008-09-01 | 2010-03-04 | 学校法人上智学院 | 半導体光素子アレイおよびその製造方法 |
RU2469435C1 (ru) * | 2008-10-17 | 2012-12-10 | Нэшнл Юниверсити Корпорейшн Хоккайдо Юниверсити | Массив полупроводниковых светоизлучающих элементов и способ его изготовления |
US7829445B2 (en) | 2008-10-24 | 2010-11-09 | Samsung Electronics Co., Ltd. | Method of manufacturing a flash memory device |
SE533531C2 (sv) * | 2008-12-19 | 2010-10-19 | Glo Ab | Nanostrukturerad anordning |
DE102010012711A1 (de) * | 2010-03-25 | 2011-09-29 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterbauelements |
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JP2014533897A (ja) | 2014-12-15 |
FR2983639A1 (fr) | 2013-06-07 |
CN103959469A (zh) | 2014-07-30 |
WO2013080174A1 (fr) | 2013-06-06 |
EP2786414A1 (fr) | 2014-10-08 |
CN103959469B (zh) | 2017-06-06 |
FR2983639B1 (fr) | 2014-07-18 |
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