JP6159726B2 - 被覆された製品、電着浴、及び関連するシステム - Google Patents

被覆された製品、電着浴、及び関連するシステム Download PDF

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Publication number
JP6159726B2
JP6159726B2 JP2014530869A JP2014530869A JP6159726B2 JP 6159726 B2 JP6159726 B2 JP 6159726B2 JP 2014530869 A JP2014530869 A JP 2014530869A JP 2014530869 A JP2014530869 A JP 2014530869A JP 6159726 B2 JP6159726 B2 JP 6159726B2
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JP
Japan
Prior art keywords
coating
silver
layer
bath
tungsten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014530869A
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English (en)
Japanese (ja)
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JP2014526615A5 (enExample
JP2014526615A (ja
Inventor
ナジラ・ダドヴァン
ジョン・ドゥルソ
ジョナサン・シー・トレンクル
アラン・シー・ルンド
ジョン・キャハレン
クリストファー・エイ・シュー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xtalic Corp
Original Assignee
Xtalic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/232,261 external-priority patent/US20120118755A1/en
Priority claimed from US13/232,291 external-priority patent/US20120121925A1/en
Application filed by Xtalic Corp filed Critical Xtalic Corp
Publication of JP2014526615A publication Critical patent/JP2014526615A/ja
Publication of JP2014526615A5 publication Critical patent/JP2014526615A5/ja
Application granted granted Critical
Publication of JP6159726B2 publication Critical patent/JP6159726B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2014530869A 2011-09-14 2012-09-14 被覆された製品、電着浴、及び関連するシステム Active JP6159726B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US13/232,261 2011-09-14
US13/232,261 US20120118755A1 (en) 2010-03-12 2011-09-14 Coated articles, electrodeposition baths, and related systems
US13/232,291 2011-09-14
US13/232,291 US20120121925A1 (en) 2010-03-12 2011-09-14 Coated articles, electrodeposition baths, and related systems
PCT/US2012/055495 WO2013040400A1 (en) 2011-09-14 2012-09-14 Coated articles, electrodeposition baths, and related systems

Publications (3)

Publication Number Publication Date
JP2014526615A JP2014526615A (ja) 2014-10-06
JP2014526615A5 JP2014526615A5 (enExample) 2017-03-23
JP6159726B2 true JP6159726B2 (ja) 2017-07-05

Family

ID=47883783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014530869A Active JP6159726B2 (ja) 2011-09-14 2012-09-14 被覆された製品、電着浴、及び関連するシステム

Country Status (4)

Country Link
EP (1) EP2755819B1 (enExample)
JP (1) JP6159726B2 (enExample)
CN (2) CN104080606B (enExample)
WO (1) WO2013040400A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6159726B2 (ja) * 2011-09-14 2017-07-05 エクスタリック コーポレイションＸｔａｌｉｃ Ｃｏｒｐｏｒａｔｉｏｎ 被覆された製品、電着浴、及び関連するシステム
JP2015014019A (ja) * 2013-07-03 2015-01-22 パナソニック株式会社 電気接点の表面処理方法、電気接点部材、コネクタ並びに接点処理剤
EP3417089B1 (en) * 2016-02-16 2023-12-13 Xtalic Corporation Articles including a multi-layer coating and methods
CN106521284A (zh) * 2016-11-24 2017-03-22 苏州华意铭铄激光科技有限公司 一种高性能电气设备用复合电阻应变材料
KR101913568B1 (ko) * 2017-04-26 2018-10-31 재단법인대구경북과학기술원 귀금속 나노입자가 도금된 다공성 수지침 및 이의 제조방법
JP7770766B2 (ja) * 2020-02-25 2025-11-17 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

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US3762882A (en) * 1971-06-23 1973-10-02 Di Coat Corp Wear resistant diamond coating and method of application
GB1418108A (en) * 1972-09-12 1975-12-17 Siemens Ag Preparation of a catalytic material
SU1035655A1 (ru) * 1980-12-12 1983-08-15 Предприятие П/Я А-1955 Электрохимический управл емый резистор
JPS61248314A (ja) * 1985-04-24 1986-11-05 松下電工株式会社 接点材料の製法
US5225253A (en) * 1992-04-17 1993-07-06 General Motors Corporation Method of forming silver/molybdenum surface coating material
US5525206A (en) * 1995-02-01 1996-06-11 Enthone-Omi, Inc. Brightening additive for tungsten alloy electroplate
JPH10302866A (ja) * 1997-04-28 1998-11-13 Harness Sogo Gijutsu Kenkyusho:Kk 嵌合型接続端子
JP2003183882A (ja) * 2001-12-11 2003-07-03 Kobe Steel Ltd 錫めっき付き電子材料
SG121757A1 (en) * 2003-02-11 2006-05-26 Agency Science Tech & Res Thin film magnetic recording media
JP2005062624A (ja) * 2003-08-18 2005-03-10 Seiko Epson Corp 反射膜及びその製造方法、カラーフィルタ及びその製造方法並びに電気光学装置用基板、電気光学装置及び電子機器
US7320832B2 (en) * 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate
JP4176081B2 (ja) * 2005-01-19 2008-11-05 日本航空電子工業株式会社 コンタクトの製造方法
WO2006100917A1 (ja) * 2005-03-22 2006-09-28 Tanaka Kikinzoku Kogyo K.K. 発光素子用のリフレクター及びその製造方法、並びに該リフレクターを備える発光デバイス
US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
JP5144302B2 (ja) * 2007-02-20 2013-02-13 株式会社神戸製鋼所 反射膜積層体
US9005420B2 (en) * 2007-12-20 2015-04-14 Integran Technologies Inc. Variable property electrodepositing of metallic structures
CN102272356A (zh) * 2008-11-07 2011-12-07 克斯塔里克公司 电沉积液、系统及方法
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
JP5719179B2 (ja) * 2010-01-25 2015-05-13 株式会社神戸製鋼所 反射膜積層体
CN102947473B (zh) * 2010-03-12 2016-07-20 克斯塔里克公司 具有涂层的物件及涂布方法
US9694562B2 (en) * 2010-03-12 2017-07-04 Xtalic Corporation Coated articles and methods
JP6159726B2 (ja) * 2011-09-14 2017-07-05 エクスタリック コーポレイションＸｔａｌｉｃ Ｃｏｒｐｏｒａｔｉｏｎ 被覆された製品、電着浴、及び関連するシステム

Also Published As

Publication number Publication date
CN106947986B (zh) 2019-07-19
CN106947986A (zh) 2017-07-14
CN104080606B (zh) 2016-12-07
CN104080606A (zh) 2014-10-01
EP2755819A4 (en) 2015-04-15
WO2013040400A1 (en) 2013-03-21
JP2014526615A (ja) 2014-10-06
EP2755819A1 (en) 2014-07-23
EP2755819B1 (en) 2016-09-14

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