JP6154713B2 - 脆性材料基板のブレイク方法並びにブレイク装置 - Google Patents

脆性材料基板のブレイク方法並びにブレイク装置 Download PDF

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Publication number
JP6154713B2
JP6154713B2 JP2013203709A JP2013203709A JP6154713B2 JP 6154713 B2 JP6154713 B2 JP 6154713B2 JP 2013203709 A JP2013203709 A JP 2013203709A JP 2013203709 A JP2013203709 A JP 2013203709A JP 6154713 B2 JP6154713 B2 JP 6154713B2
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JP
Japan
Prior art keywords
brittle material
substrate
material substrate
convex portion
scribe line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013203709A
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English (en)
Japanese (ja)
Other versions
JP2015066831A (ja
Inventor
佑磨 岩坪
佑磨 岩坪
村上　健二
健二 村上
武田　真和
真和 武田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2013203709A priority Critical patent/JP6154713B2/ja
Priority to TW103114169A priority patent/TWI619588B/zh
Priority to KR1020140061302A priority patent/KR102172680B1/ko
Priority to CN201410364678.8A priority patent/CN104511973B/zh
Publication of JP2015066831A publication Critical patent/JP2015066831A/ja
Application granted granted Critical
Publication of JP6154713B2 publication Critical patent/JP6154713B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP2013203709A 2013-09-30 2013-09-30 脆性材料基板のブレイク方法並びにブレイク装置 Expired - Fee Related JP6154713B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013203709A JP6154713B2 (ja) 2013-09-30 2013-09-30 脆性材料基板のブレイク方法並びにブレイク装置
TW103114169A TWI619588B (zh) 2013-09-30 2014-04-18 脆性材料基板之裂斷方法及裂斷裝置
KR1020140061302A KR102172680B1 (ko) 2013-09-30 2014-05-22 취성 재료 기판의 브레이크 방법 그리고 브레이크 장치
CN201410364678.8A CN104511973B (zh) 2013-09-30 2014-07-28 脆性材料基板的裂断方法及裂断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013203709A JP6154713B2 (ja) 2013-09-30 2013-09-30 脆性材料基板のブレイク方法並びにブレイク装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015252334A Division JP6072215B2 (ja) 2015-12-24 2015-12-24 脆性材料基板用のブレイクバー

Publications (2)

Publication Number Publication Date
JP2015066831A JP2015066831A (ja) 2015-04-13
JP6154713B2 true JP6154713B2 (ja) 2017-06-28

Family

ID=52788133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013203709A Expired - Fee Related JP6154713B2 (ja) 2013-09-30 2013-09-30 脆性材料基板のブレイク方法並びにブレイク装置

Country Status (4)

Country Link
JP (1) JP6154713B2 (zh)
KR (1) KR102172680B1 (zh)
CN (1) CN104511973B (zh)
TW (1) TWI619588B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106514884A (zh) * 2015-09-09 2017-03-22 三星钻石工业股份有限公司 用于脆性衬底的切割方法及切割设备
TWI632040B (zh) * 2017-07-10 2018-08-11 煜峰投資顧問有限公司 脆性材料基板裂片裝置及使用該裝置之裂片方法
JP6967276B2 (ja) * 2017-12-28 2021-11-17 三星ダイヤモンド工業株式会社 ブレーク装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121906U (zh) * 1986-01-24 1987-08-03
JPH01210295A (ja) * 1988-02-19 1989-08-23 Ngk Insulators Ltd 脆性材の切断方法及び切断装置
WO2003002471A1 (fr) * 2001-06-28 2003-01-09 Mitsuboshi Diamond Industrial Co., Ltd Dispositif et procede permettant de decouper un substrat realise dans une matiere fragile
JP4169565B2 (ja) * 2002-10-11 2008-10-22 三星ダイヤモンド工業株式会社 脆性材料基板のブレーク方法及びその装置並びに加工装置
JP2004216729A (ja) * 2003-01-15 2004-08-05 Seishin Shoji Kk 分割溝付き基板の分割装置
WO2009128314A1 (ja) * 2008-04-14 2009-10-22 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
JP2010159187A (ja) * 2009-01-09 2010-07-22 Epson Imaging Devices Corp 基板ブレイク方法、基板ブレイク装置及びブレイクバー
JP5167161B2 (ja) * 2009-01-30 2013-03-21 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
JP2010229005A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の分断方法
JP5216040B2 (ja) * 2010-03-31 2013-06-19 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法
JP5187421B2 (ja) * 2010-11-30 2013-04-24 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法
JP2012193080A (ja) * 2011-03-17 2012-10-11 Seiko Epson Corp ブレーク方法、及びブレーク装置
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
TWI488824B (zh) * 2011-12-05 2015-06-21 Mitsuboshi Diamond Ind Co Ltd The method and scribing device of glass substrate
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法

Also Published As

Publication number Publication date
TWI619588B (zh) 2018-04-01
KR102172680B1 (ko) 2020-11-02
TW201511907A (zh) 2015-04-01
CN104511973A (zh) 2015-04-15
CN104511973B (zh) 2017-09-22
JP2015066831A (ja) 2015-04-13
KR20150037481A (ko) 2015-04-08

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