JP6138746B2 - Connector connection board, connector connection board structure, cable with connector plug, method for manufacturing connector connection board - Google Patents

Description

  The present invention relates to a connector connection board for connecting a connector terminal and a cable lead, a connector connection board structure, a cable with a connector plug, and a method for manufacturing the connector connection board.

  Conventionally, a cable with a connector for connecting electric devices is well known and used in various situations.

  For example, in Patent Document 1, in view of the fact that personal computers (hereinafter referred to as PCs) and their peripheral devices are used not only in offices but also in factories, PCs and peripheral device D-sub connectors are used. We propose a waterproof structure for cables with connectors.

JP 2007-227040 A

  By the way, there are various types of connection methods between the cable and the connector board, and an example thereof will be described with reference to FIG. FIG. 14 is a diagram illustrating an example of a configuration (connection method) of a conventional cable with a connector plug. For example, as shown in FIG. 14, the connector plug 100 is configured by housing a connector portion 102 in a housing 101. The connector portion 102 is configured by plug terminals 105 a to 105 e being integrally formed in the forming portion 104 and a substrate 106 being attached to the top surface of the forming portion 104.

  The lead wires 107a to 107e are soldered in a state of being wound around connection pins of plug terminals 105a to 105e provided so as to protrude from the substrate 106.

  However, in such a connection method, since the electric wires are soldered to the connection pins protruding from the connector board, it is necessary to provide a space for accommodating the periphery of the connection pins in the housing 101, and it is difficult to reduce the size of the connector. It was. Furthermore, a high processing technique is required for such a wire connection process by soldering, and the productivity is low.

  The present invention has been made to solve the above-described problems. A connector connection board, a connector connection board structure, a cable with a connector plug, and a method for manufacturing a connector connection board that can be easily connected and reduce the connector size. The purpose is to provide.

  In order to achieve the above object, the invention according to claim 1 is a connector connection board for connecting a connector terminal and a lead wire of a cable, and is provided on a first surface on the lead wire side of the board. And a receiving hole for receiving a lead wire in the land and electrically connected to the land on the first surface, and the second surface on the first surface and the connector terminal side of the substrate. A via hole that communicates between the surfaces and electrically connects the first surface and the second surface; and an electrode pad that is electrically connected to the via hole on the second surface and is connected to the connector terminal; And a second connection composed of lands, receiving holes, via holes, and electrode pads; and a second connection composed of lands, receiving holes, via holes, and electrode pads. Are arranged, and the first connection portion row and the second connection portion row are juxtaposed, and each via hole of the first connection portion row and the second connection portion row includes the first connection portion row and the second connection portion row. It is arrange | positioned between connection part rows.

  If comprised in this way, the structure which inserts and solders a lead wire in a receiving hole is obtained. In addition, since the electrode pad on the second surface is electrically connected to the land on the first surface via the via hole, heat when soldering the lead wire in the land is not directly transmitted to the electrode pad. Furthermore, in each of the first connection portion row and the second connection portion row, the wiring between the via holes is more compact than when the via hole is provided outside the region composed of the first connection portion row and the second connection portion row. It becomes.

  According to a second aspect of the present invention, in the configuration of the first aspect of the present invention, the via hole is provided in a positional relationship so as to overlap the electrode pad when viewed from the connector terminal side.

  If comprised in this way, when reflow soldering a connector terminal to an electrode pad, solder will flow into a via hole, and it will become easy to fill up a hole.

  According to a third aspect of the present invention, in the configuration of the first or second aspect of the present invention, at least the side wall of the receiving hole is plated with a conductive material.

  If comprised in this way, conduction | electrical_connection with a lead wire and a land can be ensured also via the solder also in the side wall of a receiving hole.

  A fourth aspect of the present invention includes the connector connection board according to any one of the first to third aspects, wherein the connector terminal is encapsulated in a synthetic resin with a part thereof exposed, and a part of the exposed part of the connector terminal Is provided with a connector terminal member that is reflow soldered to the electrode pad, and a sealing layer formed by sealing a waterproof sealing material in a gap between the connector terminal member and the connector connection board.

If comprised in this way, the structure by which the space between the connector terminal member and the connector connection board | substrate was waterproof-sealed will be obtained.
The invention according to claim 5 is a connector connection board structure including a connector connection board for connecting the connector terminal and the lead wire of the cable, and the connector connection board is formed on the first surface of the board on the lead wire side. A land to be provided, a receiving hole for receiving a lead wire in the land, and being electrically connected to the land on the first surface, and a connector terminal side of the first surface and the substrate A via hole that communicates between the second surfaces and electrically connects the first surface and the second surface, and is electrically connected to the via hole on the second surface, and is connected to the connector terminal. And a connector terminal that is encapsulated in a synthetic resin with a portion of the connector terminal exposed, and a part of the exposed portion of the connector terminal is reflow soldered to the electrode pad. And wood, sealing material having a gap waterproof between the connector terminal member and the connector substrate are those comprising a sealing layer made sealed.
If comprised in this way, the structure which inserts and solders a lead wire in a receiving hole is obtained. In addition, since the electrode pad on the second surface is electrically connected to the land on the first surface via the via hole, heat when soldering the lead wire in the land is not directly transmitted to the electrode pad. Furthermore, a structure in which the space between the connector terminal member and the connector connection substrate is sealed waterproof is obtained.

  Invention of Claim 6 is a cable with a connector plug, Comprising: The housing which has waterproofness, The connector connection board structure of Claim 4 or Claim 5, and a housing, A connector connection board structure is provided in a housing. Connector housing portion to be accommodated, waterproof packing attached to a gap between the housing and the connector terminal member, a cable insertion hole provided in the housing, and inserted into the cable insertion hole, leading to the land of the connector connection board structure The cable is provided with a cable to which each of the wires is soldered and a plug terminal formed by an exposed tip portion of the connector terminal.

  If comprised in this way, it will be provided with the connector connection board | substrate structure which has a waterproof structure, and also it will become a structure where a waterproof packing prevents that a liquid penetrate | invades from between a housing and a connector terminal member also in connector plug itself.

  The invention according to claim 7 is a method of manufacturing a connector connection board structure, wherein a through hole is formed to communicate one side and the other side of a laminated board in which a conductive material is bonded to both sides of a base material. In addition, a step of drilling a receiving hole on one side of the laminate, a step of forming a via hole by conducting conductive connection processing between layers for the through hole, and removing an unnecessary portion from one side of the laminate, Form a land connected to the via hole in the periphery of the receiving hole and remove an unnecessary part from the other side of the laminated board to form an electrode pad connected to the via hole, and a synthesis with a part exposed Preparing a connector terminal member having a connector terminal encapsulated in resin, reflow soldering a part of the exposed portion of the connector terminal of the connector terminal member to the electrode pad; A sealing material having a waterproof property is sealed in a gap between the terminal member and a part of the exposed portion of the connector terminal of the connector terminal member and the substrate on which the reflow soldered electrode pad is formed. Forming a stop layer.

  The connector connection board structure obtained by such a manufacturing method has a structure in which a lead wire is inserted into a receiving hole and soldered. In addition, since the electrode pad on the second surface is electrically connected to the land on the first surface via the via hole, the heat when soldering the lead wire in the land is not directly transmitted to the electrode pad. Furthermore, a structure in which the space between the connector terminal member and the connector connection substrate is sealed waterproof is obtained.

  As described above, according to the first aspect of the present invention, since a structure in which the lead wire is inserted into the receiving hole and soldered is obtained, the soldering operation is facilitated and the connecting portion of the lead wire can be made compact. Also, since the heat when soldering the lead wire in the land is not directly transferred to the electrode pad, when the connector terminal is soldered to the electrode pad, the solder melts and the connector terminal peels off from the electrode pad. Can be suppressed. Furthermore, since the wiring between the via holes is made compact, it is advantageous in designing the wiring between the via holes.

  In addition to the effects of the invention described in claim 1, the invention described in claim 2 improves the waterproofness because when soldering the connector terminal to the electrode pad by reflow soldering, the solder flows into the via hole and the hole is easily filled. .

  According to the third aspect of the invention, in addition to the effect of the first or second aspect of the invention, since the conduction between the lead wire and the land can be ensured through the solder also on the side wall of the receiving hole, The reliability of attachment becomes high.

In addition to the effect of the invention according to any one of claims 1 to 3, the invention according to claim 4 provides a structure in which the connector terminal member and the connector connection board are sealed with a waterproof seal. Good waterproofness can be obtained between the member and the connector connection board.
According to the fifth aspect of the present invention, since a structure in which the lead wire is inserted into the receiving hole and soldered is obtained, the soldering operation becomes easy and the connecting portion of the lead wire can be made compact. Also, since the heat when soldering the lead wire in the land is not directly transferred to the electrode pad, when the connector terminal is soldered to the electrode pad, the solder melts and the connector terminal peels off from the electrode pad. Can be suppressed. In addition, since a waterproof sealed structure is obtained between the connector terminal member and the connector connection board, a good waterproof property can be obtained between the connector terminal member and the connector connection board.

  The invention described in claim 6 includes a connector connection board structure having a waterproof structure in addition to the effects of the invention described in claim 4 or 5, and the waterproof packing is also provided in the connector plug itself. Since the structure prevents the liquid from entering between the members, a cable with a connector plug with improved waterproofness can be obtained.

  According to the seventh aspect of the present invention, the connector connecting board structure can obtain a structure in which the lead wire is inserted into the receiving hole and soldered, so that the soldering operation is facilitated and the lead wire connecting portion is made compact. it can. In addition, since the electrode pad on the second surface is electrically connected to the land on the first surface via the via hole, the heat when soldering the lead wire in the land is not directly transmitted to the electrode pad. When the connector terminal is soldered to the electrode pad, it can be suppressed that the solder melts and the connector terminal is peeled off from the electrode pad. In addition, since a waterproof sealed structure is obtained between the connector terminal member and the connector connection board, a good waterproof property can be obtained between the connector terminal member and the connector connection board.

It is the fragmentary sectional view which showed the external appearance in the front view of the cable with a connector plug by 1st Embodiment of this invention. It is a fragmentary sectional view in the II-II line of FIG. It is a front view which shows the external appearance of the connector connection board structure shown in FIG. It is a right view which shows the external appearance of the connection board structure shown in FIG. It is a front view which shows the structure of the connector connection board | substrate shown in FIG. It is a top view which shows the structure of the connector connection board | substrate shown in FIG. It is a bottom view which shows the structure of the connector connection board | substrate shown in FIG. It is typical sectional drawing of the VIII-VIII line shown in FIG. FIG. 9 is a process diagram illustrating a part of the manufacturing process of the connector connection board illustrated in FIG. 8. FIG. 10 is a process diagram illustrating a continuation of the manufacturing process illustrated in FIG. 9. It is process drawing which shows a part of manufacturing process of the connector terminal member shown in FIG. FIG. 12 is a process diagram illustrating a continuation of the manufacturing process illustrated in FIG. 11. It is process drawing which shows the process of soldering the lead wire of a cable to the receiving hole of a connector connection board | substrate. It is sectional drawing which shows the structure of the conventional cable with a connector plug.

  FIG. 1 is a partial cross-sectional view showing an external appearance of a cable with a connector plug according to the first embodiment of the present invention in a front view, and FIG. 2 is a partial cross-sectional view taken along the line II-II in FIG.

  Referring to these drawings, a cable 1 with a connector plug includes a plug terminal 31 having a shape that can be inserted into a receiving terminal 22 provided in the receptacle 2, a waterproof housing 11, and set screws 12a and 12b. Are provided with screw insertion holes 13a and 13b.

  The housing 11 is provided with a connector housing portion 16 for housing the connector connection board structure 30.

  The connector connection board structure 30 includes a connector terminal member 34 provided on the receptacle 2 side and a connector connection board 40 attached to the top surface of the connector terminal member 34. A lead wire 18 of a cable (not shown) inserted from the cable insertion hole 14 is attached to the top surface of the connector connection board 40, while a plug terminal 31 is provided on the bottom surface of the connector terminal member 34. The detailed configuration of the connector terminal member 34 and the connector connection board 40 will be described later.

  The connector terminal member 34 and the connector connection board 40 are set to have a dimensional relationship such that a gap is formed between the housing 11 and the connector terminal member 34 when the connector connection board structure 30 is housed in the connector housing portion 16. ing. In this gap, the waterproof packing 15 is attached so as to surround the connector terminal member 34. Further, when the waterproof packing 15 is attached, the lower surface of the connector connection board 40 and a part of the top surface of the waterproof packing 15 abut.

  The waterproof packing 15 is made of a member such as rubber. Protrusions 15a and 15b are provided above and below the inner peripheral wall, respectively, and protrusions 15c and 15d are provided above and below the outer peripheral wall, respectively. By providing such protrusions 15 a to 15 d on the waterproof packing 15, sealing of the gap formed between the housing 11 and the connector terminal member 34 becomes more reliable, and waterproofness is improved.

  Further, when the plug terminal 31 of the cable with connector 1 is inserted into the receiving terminal 22 of the receptacle 2, when the receptacle 2 and the cable with connector 1 are connected, the screw insertion holes 13 a and 13 b respectively Set screws 12a and 12b are inserted and screwed into set nuts 21a and 21b provided in the receptacle 2. Thereby, the connection state of the receptacle 2 and the cable 1 with a connector is fixed.

  In the receptacle 2, the main body substrate solder portion 23 is connected to the electronic device side accommodated in the housing 24 by soldering.

  3 is a front view showing the appearance of the connector connection board structure shown in FIG. 1, and FIG. 4 is a right side view showing the appearance of the connection board structure shown in FIG.

  With reference to these drawings, the connector connection board structure 30 includes a connector terminal member 34 having plug terminals 31a to 31j on the bottom surface, and a connector connection board 40 attached to the top surface of the connector terminal member 34. . Hereinafter, when it is not necessary to distinguish each of the plug terminals 31a to 31j, they are simply referred to as a plug terminal 31.

  The connector terminal member 34 is configured by being encapsulated in a synthetic resin with the connector terminal 35 partially exposed on the top surface side and the bottom surface side of the connector terminal member 34. The exposed portion 36 on the top surface side of the connector terminal 35 is reflow soldered to the electrode pad 41 provided on the connector connection substrate 40. On the other hand, the tip of the exposed portion on the bottom side of the connector terminal 35 becomes a plug terminal 31.

  Further, a sealing layer 33 is provided in a gap between the connector terminal member 34 and the connector connection substrate 40 by sealing a waterproof sealing material. As the sealing material, for example, a synthetic resin such as an epoxy resin can be employed.

  If comprised in this way, the structure by which the exposed part 36 and the electrode pad 41 were waterproof-sealed between the connector terminal member 34 and the connector connection board | substrate 40 is obtained. For this reason, in the connector terminal member 34, the good waterproofness which can suppress that water penetrate | invades from the clearance gap between the connector terminal 35 and the synthetic resin which has enclosed this, and reaches the connector connection board | substrate 40 side is acquired. .

  The connector connection board 40 includes lands 42 provided on the first surface on the lead wire side, and electrode pads 41 provided on the second surface on the connector terminal side for connection with the exposed portions 36 of the connector terminals 35.

  3 and 4, the connector terminal member 34 includes a first row composed of connector terminals 35a to 35e and a second row composed of connector terminals 35f to 35j. That is, the connector terminal member 34 is provided with a total of 10 connector terminals in 2 rows × 5.

  In these drawings, the reference numerals are omitted for the sake of drawing. In the connector connection board 40, the electrode pads 41 and the lands 42 correspond to the 10 connector terminals of the connector terminal member 34. Ten each are provided. The detailed configuration of the connector connection board 40 will be described later.

  5 is a front view showing the structure of the connector connection board shown in FIG. 3, FIG. 6 is a plan view showing the structure of the connector connection board shown in FIG. 3, and FIG. 7 is shown in FIG. FIG. 8 is a schematic cross-sectional view of the VIII-VIII line shown in FIG. 5.

  Referring to these drawings, connector connection board 40 is provided so as to reach the middle of connector connection board 40 at lands 42a to 42j provided on first surface (top surface) 48 and lands 42a to 42j (see FIG. 8), receiving holes 43a to 43j for receiving the lead wires, and the first surface 48 are electrically connected to the lands 42a to 42j, and the first surface 48 and the connector terminal side of the connector connection board 40 on the connector terminal side. Via holes 44a to 44j that communicate between the two surfaces (bottom surface) 49 (see FIG. 8) and electrically connect the first surface 48 and the second surface 49, and via holes 44a to 44j on the second surface 49 The electrode pads 41a to 41j that are electrically connected and are connected to the connector terminals 35f to 35j are aligned with the connector terminal member 34 at the time of attachment. Comprising the alignment holes 50a, and 50b.

  Hereinafter, when there is no need to distinguish the lands 42a to 42j, the receiving holes 43a to 43j, the via holes 44a to 44j, and the electrode pads 41a to 41j, as shown in FIG. The land 42, the receiving hole 43, the via hole 44, and the electrode pad 41 are indicated.

  One set of the land 42, the receiving hole 43, the via hole 44, and the electrode pad 41 constitutes one connection portion. The connector connection board 40 is provided with a total of 10 connection portions of 2 rows × 5.

  That is, in the connector connection board 40, the first connection portion row G1 in which five first connection portions each including the lands 42a to 42e, the receiving holes 43a to 43e, the via holes 44a to 44e, and the electrode pads 41a to 41e are arranged, , Lands 42f to 42j, receiving holes 43f to 43j, via holes 44f to 44j and five second connection parts composed of electrode pads 41f to 41j are aligned and arranged in parallel with the first connection part row G1. This is a configuration having a partial row G2.

  Further, the connector terminals 35a to 35j can be electrically connected to each other by connecting the via holes 44a to 44j to each other by printed wiring or the like. For example, by connecting the via holes 44a and 44f with the printed wiring 47, the connector terminals 35a and 35f can be electrically connected.

  The via holes 44a to 44e and the via holes 44f to 44j of the first connection portion row G1 and the second connection portion row G2 are disposed between the first connection portion row G1 and the second connection portion row G2.

  If comprised in this way, in each of the 1st connection part row | line G1 and the 2nd connection part row | line G2, the via holes 44a-44j were provided in the outer side of the area | region which consists of the 1st connection part row | line | column G1 and the 2nd connection part row | line G2. Compared to the case, the wiring is made compact. This is advantageous in designing the wiring between the via holes 44a to 44j.

  Furthermore, conventionally, when connecting each of the plug terminals, as shown in FIG. 14, for example, it is necessary to connect between the connector terminals 105a and 105b by the cross wiring 110, which requires advanced processing technology. there were. On the other hand, according to the said structure, the connector terminals 35a-35j can be electrically connected more easily by printed wiring.

  Referring to FIG. 7, via hole 44 is provided in a positional relationship so as to projectly overlap electrode pad 41 when viewed from the connector terminal side. Referring to FIG. 8, in the receiving hole 43, the side wall 45 and the bottom portion 46 are plated with a conductive material such as copper, gold, or silver. The effect of adopting such a positional relationship structure and plating process will be described later.

  The thickness T1 of the connector connection board 40 is set to 1.0 mm. On the other hand, the depth T2 of the receiving hole 43 is set to 0.8 mm and the diameter D is set to 0.7 mm. ing. In addition, it is preferable that the depth T2 of the receiving hole 43 is 0.8 mm or more and is set so as not to penetrate the connector connection board 40.

  FIG. 9 is a process diagram showing a part of the manufacturing process of the connector connection substrate 40 shown in FIG. 8, and FIG. 10 is a process chart showing the continuation of the manufacturing process shown in FIG.

  Referring to these drawings, first, as shown in FIG. 9 (1), a copper-clad laminate in which copper foils 61 and 63 are bonded to one surface and the other surface of a base material 62 made of an insulating material, respectively. A plate 60 is prepared.

  Subsequently, as shown in (2) of the figure, a through hole 65 is formed to communicate one surface and the other surface of the copper-clad laminate 60, and a receiving hole 64 is formed in one surface of the copper-clad laminate 60. Set up. Thereby, the substrate 60a is obtained.

  Subsequently, as shown in (3) of the figure, via-holes 65a are formed by subjecting the through-holes 65 of the substrate 60a shown in (2) to interlayer connection. Examples of the conductive connection processing include methods such as a through-hole plating method and a conductive paste method. Further, the receiving hole 64 of the substrate 60a is plated to create a plated receiving hole 64a. Thereby, the substrate 60b is obtained.

  Subsequently, as shown in (4) of FIG. 10, a dry film is laminated on both surfaces of the substrate 60b shown in (3) of FIG.

  Thus, on one surface of the substrate 60b laminated with the dry film, the photosensitive portion 66a is finally formed on the region that becomes the via hole 44, and the photosensitive portion 66b and land 42 are formed on the region that becomes the connection portion between the via hole 44 and the land 42. A photosensitive portion 66c is formed on the region. Note that the portions denoted by reference numerals 67a and 67b are unexposed portions.

  Further, on the other surface of the substrate 60b laminated with the dry film, a photosensitive portion 68a is formed on a region that finally becomes a via hole 44, and a photosensitive portion 68b is formed on a region that becomes an electrode pad. The portions indicated by reference numerals 69a and 69b are unexposed portions.

  In this way, the substrate 60c is obtained.

  Subsequently, as shown in FIG. 10 (5), unnecessary portions other than the pattern were removed from the substrate 60c shown in FIG. 10 (4), and etching was performed to remove the copper foil other than the pattern. A substrate 60d is obtained.

  Subsequently, as shown in FIG. 10 (6), the resist pattern remaining after the etching step is peeled off from the substrate 60d shown in FIG. 10 (5) to obtain a substrate 60e.

  As shown in (5) and (6), by removing unnecessary portions from one surface of the copper-clad laminate 60, lands 42 connected to the via holes 44 are formed around the receiving holes 43, and copper-clad By removing unnecessary portions from the other surface of the laminated plate 60, the electrode pads 41 connected to the via holes 44 can be formed. Thereafter, if appropriate surface treatment is performed, the connector connection substrate 40 shown in FIG. 8 can be obtained.

  FIG. 11 is a process diagram showing a part of the manufacturing process of the connector terminal member shown in FIG. 3, and FIG. 12 is a process chart showing the continuation of the manufacturing process shown in FIG.

  Referring to these drawings, first, as shown in FIG. 11, a solder paste 71 is printed at the position of the electrode pad 41 of the connector connection substrate 40, and the connector of the connector terminal member 34 is further formed on the printed solder paste 71. The exposed part 36 of the terminal 35 is installed facing each other. In this state, soldering is performed by a reflow method.

  Then, since the via hole 44 is provided in a positional relationship so as to projectly overlap the electrode pad 41 when viewed from the connector terminal side, the connector terminal 35 is reflow soldered to the electrode pad 41 as shown in FIG. As a result, a part 71a of the melted solder paste 71 flows into the via hole 44 and the hole is easily filled, so that the waterproof property is improved.

  Furthermore, the diameter of the via hole 44 can be made smaller than the diameter of the receiving hole 43 into which the lead wire 18 is inserted. By reducing the diameter of the via hole 44, the via hole 44 is easily filled with the part 71 a of the solder paste 71, so that waterproofness is improved.

  FIG. 13 is a process diagram showing a process of soldering a cable lead wire to a receiving hole of the connector connection board.

  Referring to the drawing, as shown in (1), the lead wire 18 is advanced to the position P at a level below the first surface 48 with respect to the receiving hole 43 of the connector connection substrate 40, and soldering is performed. Do. Then, as shown in (2), the solder 75 surrounds the periphery of the tip of the lead wire 18 and comes into contact with the surface of the land 42 and the side wall 45 of the receiving hole 43.

  As described above, according to the connector connection board 40, a structure in which the lead wire 18 is inserted into the receiving hole and soldered can be obtained. Therefore, even if the lead wire 18 is an axial component, the soldering operation is facilitated. Moreover, the connection part of the lead wire 18 can be made compact by such a structure. Further, since heat when soldering the lead wire in the land 42 is not directly transferred to the electrode pad 41, the solder melts in the connector terminal 35 reflow-soldered to the electrode pad 41, and the connector terminal 35 becomes the electrode pad 41. It can suppress peeling from.

  In addition, since the side wall 45 is plated, the solder surrounds the periphery of the tip of the lead wire 18 and comes into contact with the surface of the land 42 and the side wall 45 of the receiving hole 43. As described above, since the lead wire 18 and the land 42 can be electrically connected via the solder also on the side wall 45 of the receiving hole 43, the reliability of the conductive state of the lead wire 18 is increased.

  As described above, the cable 1 with a connector plug includes the connector connection board structure 30 having a sealing structure 33 and a waterproof structure in which the via hole 44 is filled with solder during reflow. Moreover, in the cable 1 with a connector plug, the housing 11 has a waterproof property, and the rubber packing 15 has a structure that prevents liquid from entering between the housing 11 and the connector terminal member 34. With the configuration as described above, the cable 1 with a connector plug having improved waterproofness can be obtained.

  In the above-described embodiment, the connector connection board and the connector terminal member having a specific shape and size have been described. However, the present invention is not limited to this and can be arbitrarily set. Further, for example, the structure of the connector connection board structure 30 as described above may be applied to the receptacle 2 side. In the connector connection board 40, the alignment holes 50a and 50b can be omitted.

  In the above embodiment, the waterproof packing 15 is provided with the protrusions 15a to 15d. However, such protrusions 15a to 15d may be omitted. Further, a protrusion may be further provided at a contact portion between the lower surface of the connector connection substrate 40 and the top surface of the waterproof packing 15. Thereby, waterproofness improves further.

  Furthermore, in the above-described embodiment, the sealing layer 33 is provided between the connector terminal member 34 and the connector connection substrate 40. However, the sealing layer 33 can be omitted.

  Furthermore, in the above-described embodiment, the via holes 44a to 44e and the via holes 44f to 44j of the first connection portion row G1 and the second connection portion row G2 are the same as the first connection portion row G1 and the second connection portion row G2, respectively. Although it was the structure arrange | positioned between, it is not restricted to this. A via hole 44 can be provided at an arbitrary position with respect to the land 42 and the electrode pad 41.

  Furthermore, in the above-described embodiment, the via hole 44 is provided in a positional relationship so as to projectly overlap the electrode pad 41 when viewed from the connector terminal side, but is not limited thereto. If there is room in the board space and there is no problem from the viewpoint of waterproofness, the via holes 44 may be provided so as to be spaced apart from each other so as not to project over the electrode pads 41 when viewed from the connector terminal side.

  Furthermore, in the above-described embodiment, the side wall 45 and the bottom 46 are plated in the receiving hole 43. However, the present invention is not limited to this, and at least the side wall 45 only needs to be plated.

  Furthermore, although said embodiment demonstrated manufacturing the connector connection board | substrate 40 from the copper clad laminated board 60, it is not restricted to this. The connector connection board 40 can be manufactured from a laminated board in which a conductive material is attached to both surfaces of a base material.

  Furthermore, in the above embodiment, the manufacturing process of the connector connection board 40 has been described with reference to FIGS. 9 and 10, but the present invention is not limited to this. For example, either the through hole 65 forming process or the receiving hole 64 drilling process shown in (2) of FIG. 9 may be performed first, or both processes may be performed simultaneously. May be. Further, either the via hole 65a forming process or the receiving hole 64 plating process shown in (3) of FIG. 9 may be performed first, or both processes may be performed simultaneously. May be. Further, as shown in FIGS. 10 (5) and (6), either the land 42 forming process or the electrode pad 41 forming process may be performed first, or both processes may be performed. Processing may be performed simultaneously.

DESCRIPTION OF SYMBOLS 1 ... Connector plug 2 ... Receptacle 11 ... Housing 14 ... Cable insertion hole 15 ... Waterproof packing 16 ... Connector accommodating part 18 ... Lead wire 30 ... Connector connection board structure 31 ... Plug terminal 33 ... Sealing layer 34 ... Connector terminal member 35 ... Connector terminal 36 ... Exposed portion 40 ... Connector connection board 41 ... Electrode pad 42 ... Land 43 ... Receiving hole 44 ... Via hole 45 ... Side wall 47 ... First surface 48 ... Second surface The same reference numerals in the drawings are the same or equivalent Indicates the part.

Claims (7)

A connector connection board for connecting a connector terminal and a cable lead wire,
A land provided on the first surface of the substrate on the lead wire side;
The land is provided so as to reach the middle of the substrate, and a receiving hole for receiving a lead wire,
The first surface is electrically connected to the land, communicates between the first surface and the second surface of the board on the connector terminal side, and electrically connects the first surface and the second surface. A via hole connected to the
Provided on the second surface and electrically connected to the via hole, and comprising an electrode pad for connecting to a connector terminal;
A first connection portion row in which a plurality of first connection portions each including the land, the receiving hole, the via hole, and the electrode pad are aligned;
A plurality of second connection parts composed of the lands, the receiving holes, the via holes, and the electrode pads, and a second connection part row arranged in parallel with the first connection part row;
The connector connection substrate, wherein the via hole of each of the first connection portion row and the second connection portion row is disposed between the first connection portion row and the second connection portion row.   The connector connection board according to claim 1, wherein the via hole is provided in a positional relationship so as to projectly overlap the electrode pad when viewed from the connector terminal side.   The connector connection board according to claim 1, wherein at least a side wall of the receiving hole is plated with a conductive material. The connector connection board according to any one of claims 1 to 3,
A connector terminal member encapsulated in a synthetic resin with a part of the connector terminal exposed, and a part of the exposed part of the connector terminal is reflow soldered to the electrode pad;
A connector connection board structure provided with a sealing layer formed by sealing a sealing material having a waterproof property in a gap between the connector terminal member and the connector connection board. A connector connection board structure including a connector connection board for connecting a connector terminal and a cable lead wire,
The connector connection board is
A land provided on the first surface of the substrate on the lead wire side;
The land is provided so as to reach the middle of the substrate, and a receiving hole for receiving a lead wire,
The first surface is electrically connected to the land, communicates between the first surface and the second surface of the board on the connector terminal side, and electrically connects the first surface and the second surface. A via hole connected to the
Provided on the second surface and electrically connected to the via hole, and comprising an electrode pad for connecting to a connector terminal;
Furthermore, the connector terminal is encapsulated in a synthetic resin with a part of the connector terminal exposed, and a part of the exposed part of the connector terminal is reflow soldered to the electrode pad; and
A connector connection board structure provided with a sealing layer formed by sealing a sealing material having a waterproof property in a gap between the connector terminal member and the connector connection board. A cable with a connector plug,
A waterproof housing;
The connector connection board structure according to claim 4 or 5,
A connector housing portion provided in the housing for housing the connector connection board structure;
Waterproof packing attached to a gap between the housing and the connector terminal member;
A cable insertion hole provided in the housing;
A cable that is inserted into the cable insertion hole and each of the lead wires is soldered to a land of the connector connection board structure; and
A cable with a connector plug, comprising a plug terminal formed by an exposed tip portion of the connector terminal. A method of manufacturing a connector connection board structure,
Forming a through-hole that communicates one side and the other side of the laminate with the conductive material affixed to both sides of the substrate, and forming a receiving hole in one side of the laminate; and
A process of forming a via hole by conducting a conductive connection process between layers for the through hole; and
By removing unnecessary portions from one side of the laminate, a land connected to the via hole is formed around the receiving hole, and by removing unnecessary portions from the other side of the laminate, the via hole Forming an electrode pad to connect with,
Preparing a connector terminal member having a connector terminal encapsulated in synthetic resin in a partially exposed state, and reflow soldering a part of the exposed portion of the connector terminal of the connector terminal member to the electrode pad; ,
A sealing material having a waterproof property in a gap between the connector terminal member and a part of the exposed portion of the connector terminal of the connector terminal member and the base material on which the reflow soldered electrode pad is formed. The manufacturing method of a connector connection board structure including the process of sealing and forming a sealing layer.

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