JP6138669B2 - Photosensitive insulating resin composition and product using the same - Google Patents

Description

  The present invention relates to a photosensitive insulating resin composition and a product using the same.

  With the development of the electronic industry, demands for multi-functionality, high functionality and miniaturization of electronic components are rapidly increasing. In addition, as electronic parts become lighter, thinner, and smaller, printed circuit boards on which electronic parts are mounted are also required to have a high density of circuit patterns in which many electronic products must be integrated in a small area.

  As the circuit pattern of the printed circuit board is miniaturized and the interlayer distance between the circuits is narrowed, defects such as dielectric loss and short, or the adhesion between the circuit and the insulator is reduced, thereby reducing the reliability of the product. The problem has arisen.

  Therefore, a photosensitive insulating film capable of forming a fine opening pattern is used for a printed board, a semiconductor package board, a flexible printed board (FPCB), and the like.

  On the other hand, Patent Document 1 discloses an insulating composition containing a photosensitive resin that shows visibility and hiding power without using a pigment. This insulating composition has an interlayer adhesion strength and a thermal expansion coefficient. There was a limit to improving the characteristics.

Korean Published Patent No. 2012-0107373

  Accordingly, the present inventor has found that a product produced using a composition containing a metal binder and a thermosetting initiator in a photosensitive insulating resin composition has a low coefficient of thermal expansion, and a circuit pattern and a low roughness. Based on this finding, the present invention has been completed.

  Accordingly, an object of the present invention is to provide a photosensitive insulating resin composition having characteristics of a low thermal expansion coefficient and a high peel strength.

  Another object of the present invention is to provide an insulating film having a low coefficient of thermal expansion and a high peel strength, which is produced from the resin composition.

  Another object of the present invention is to provide a printed board including the insulating film.

  In order to achieve the above object, according to one aspect of the present invention, a photosensitive insulating resin composition (hereinafter referred to as “a”) comprising a photosensitive resin, a metal binder, a photocuring initiator, and a thermosetting initiator. The first invention ”).

  1st invention WHEREIN: The said insulating resin composition is 50 to 95 weight% photosensitive resin, 1 to 30 weight% metal binder, 1 to 10 weight% photocuring initiator, and 1 to 15 weight%. It comprises a thermosetting initiator.

  In the first invention, the photosensitive resin is an acrylate compound having two or more acrylic groups, or a mixture of an acrylate compound and a polyfunctional monomer.

  In the first invention, the acrylate compound having two or more acrylic groups is cresol novolac type epoxy acrylate, bisphenol type epoxy acrylate, bisphenol F type epoxy acrylate, bisphenyl type epoxy acrylate, urethane acrylate, phenol novolac type epoxy acrylate. And at least one selected from the group consisting of triphenolmethane type epoxy acrylate.

  In the first invention, the polyfunctional monomer having two or more acrylic groups is selected from the group consisting of dipentaerythritol hexaacrylate, glyceryl propyl triacrylate, propoxylated glyceryl triacrylate, and dihydrodicyclopenta-dienyl acrylate. One or more selected.

In the first invention, the metal binder is at least one selected from acetoacetoxyethyl methacrylate, ethylenediaminetetraacetic acid, amino acids, organic acid metal salts, metal salts, 1,3-diketone metal complex salts, and metal alkoxides.

  In the first invention, the metal binder is acetoacetoxyethyl methacrylate represented by the following chemical formula 1.

  In the first invention, the photocuring initiator is selected from the group consisting of benzophenone, acetophenone, acylphosphine oxide, α-aminoketone and α-hydroxyketone.

  In the first invention, the thermosetting initiator is 2,2′-azobis (N-butyl-2-methylpropionamide), 2,2′-azobis (N-cyclohexyl-2-methylpropionamide), 2, 2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), 1-[(1-cyano-1-methylethyl) azo] formamide, 2,2′-azobis [N- (2-prophenyl) -2-methylpropionamide], di-tert-butyl peroxide, and benzoyl peroxide.

  In the first invention, the thermosetting initiator is 2,2′-azobis (N-butyl-2-methylpropionamide) represented by the following chemical formula 2.

  In the first invention, the insulating resin composition further includes an epoxy resin, an inorganic filler, and a thermosetting agent.

  1st invention WHEREIN: The said epoxy resin has two or more epoxy groups, 1-30 weight part content with respect to 100 weight part of said insulating resin compositions, an aromatic epoxy resin, a glycidyl amine type epoxy resin, One or more selected from the group consisting of glycidyl acrylic epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin and polyester epoxy resin.

In the first invention, the inorganic filler is contained in an amount of 20 to 85 parts by weight based on 100 parts by weight of the insulating resin composition, and includes silica (SiO ₂ ), talc (Talc), barium sulfate (BaSO ₄ ), titanic acid. 1 from the group consisting of barium (BaTiO ₃ ), alumina (Al ₂ O ₃ ), clay, magnesium carbonate (MgCO ₃ ), calcium carbonate (CaCO ₃ ), aluminum hydroxide (Al (OH) ₃ ), and silicate More than species are selected.

  1st invention WHEREIN: The said thermosetting agent contains 0.01-1 weight part with respect to 100 weight part of said insulating resin compositions, and is an amine-type hardening | curing agent, an acid anhydride type hardening | curing agent, a polyamine hardening | curing agent, polysulfide hardening. One or more selected from the group consisting of an agent, a phenol novolac type curing agent, a bisphenol A type curing agent, and a dicyandiamide curing agent.

  According to another aspect of the present invention, there is provided an insulating film (hereinafter referred to as “second invention”) formed by applying and curing the photosensitive insulating resin composition according to the first invention on a substrate. To do.

  2nd invention WHEREIN: The surface roughness (Ra) of the said insulating film is 0.001-0.5 micrometer.

  According to another aspect of the present invention, there is provided a printed circuit board (hereinafter referred to as “third invention”) formed by laminating the insulating film of the second invention on a base material on which a circuit pattern is formed. .

  In a photosensitive insulating resin composition according to a typical embodiment of the present invention, a product manufactured using the composition containing a metal binder and a thermosetting initiator exhibits a low coefficient of thermal expansion and a high peel strength. be able to.

It is sectional drawing of the general printed circuit board which can apply the insulating film which concerns on one implementation example of this invention. It is a graph which shows the peel strength (peel strength) measured value of the insulating film which concerns on Example 2 and the comparative example 2 containing the inorganic filler of this invention.

  Before describing the present invention more specifically, the terms or words used in the specification and claims should not be limited to the ordinary and lexical meaning, and the invention is best practiced. Based on the principle that the terminology can be appropriately defined for the purpose of explanation, it should be interpreted with the meaning and concept consistent with the technical idea of the present invention. Therefore, the structure of the Example described in this specification is only a suitable example of this invention, and does not represent all the technical thoughts of this invention. Thus, it should be understood that there may be various equivalents and variations that can be substituted for at the time of filing this application.

  Hereinafter, preferred embodiments of the present invention will be described in detail so that those skilled in the art to which the present invention pertains can easily carry out the present invention. In describing the present invention, detailed descriptions of known techniques that may obscure the subject matter of the present invention are omitted.

(Photosensitive resin)
The photosensitive resin composition according to a typical embodiment of the present invention contains a photosensitive resin, and the amount used is not particularly limited, but is preferably 50 to 95% by weight. When the amount of the photosensitive resin used is less than 50% by weight, the physical properties of the resin composition may be deteriorated. When the amount of the photosensitive resin used exceeds 95% by weight, unreacted substances are present. It may occur or the amount of other compositions used may be reduced, causing problems in film formation. As the photosensitive resin used in the present invention, a mixture of an acrylate compound having two or more acrylic groups and a polyfunctional monomer can be selected.

  The acrylate compound having two or more acrylic groups includes cresol novolac type epoxy acrylate, bisphenol A type epoxy acrylate, bisphenol F type epoxy acrylate, bisphenyl type epoxy acrylate, urethane acrylate, phenol novolac type epoxy acrylate, and triphenol. One or more types can be selected from the group consisting of methane type epoxy acrylate.

  The polyfunctional monomer having two or more acrylic groups includes dipentaerythritol hexaacrylate, glycerylpropyl triacrylate, propoxylated glyceryl triacrylate, and dihydrodicyclopentadiacrylate. One or more types can be selected from the group consisting of (dihydro dicycenta-dienyl acrylate).

(Metal binder)
The photosensitive insulating resin composition according to a typical embodiment of the present invention includes a metal binder in order to improve the adhesion between the insulating layer of the printed circuit board and the metal layer. The metal binder used in the present invention includes acetoacetoxyethyl methacrylate, ethylenediaminetetraacetic acid (EDTA), amino acids, organic acid metal salts, metal salts, 1,3-diketone metal complex salts, and metal alkoxides. It is preferable to use acetoacetoxyethyl methacrylate, which is selected from one or more, and represented by the following chemical formula 1.

  The metal binder is contained in the insulating resin composition and can be compounded and bonded to the metal, thereby strengthening the adhesive force between the insulating layer and the metal layer. Although the usage-amount of a metal binder is not specifically limited in the resin composition of this invention, It is 1-30 weight%, Especially 5-30 weight% is preferable. When the amount of the metal binder used is less than 1% by weight, the adhesive force between the insulating layer and the metal layer may be reduced, and when the amount of the metal binder used exceeds 30% by weight, insulation The adhesion between the metal layer and the metal layer can no longer be improved, and the amount of other compositions used can be reduced, causing problems in film formation.

(Photocuring initiator)
The photosensitive insulating resin composition according to a typical embodiment of the present invention includes a photocuring initiator in order to perform a curing reaction of the photosensitive resin. The photocuring initiator used in the present invention can be selected from the group consisting of benzophenone, acetophenone, acylphosphine oxide, α-aminoketone and α-hydroxyketone, and specific examples include bis (2, 4,6-trimethylbenzoyl) -phenylphosphine oxide (bis (2,4,6-trimethylbenzoyl) -phenylphosphineoxide), 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy -1- {4- [4- (2-hydroxy-2-methyl-propenyl) -benzyl] -phenyl} -2-methyl-propan-1-one (2-hydroxy-1- {4- [4- (2-hydro xy-2-methyl-propenyl) -benzyl] -phenyl} -2-methyl-propan-1-one), 4,4′-bis (diethylamino) benzophenone (4,4′-bis (diethylamino) benzophenone), 2 -Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1), 2,4,6-trimethylbenzoyl -Diphenylphosphine oxide (2,4,6-trimethylbenzoyl-diphenylphosphine oxide), 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopro 2-one-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one) and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone -1 (2-benzl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1) can be used.

  Although the usage-amount of the said photocuring initiator is not specifically limited, Preferably it is 1 to 10 weight%. When the amount of the photocuring initiator used is less than 1% by weight, the curing reaction of the photosensitive resin may not be performed smoothly, and unreacted substances may remain in the composition. If the amount used exceeds 10% by weight, the amount used of other compositions may be reduced, causing problems in film formation.

(Thermosetting initiator)
The photosensitive insulating resin composition according to a typical embodiment of the present invention includes a thermosetting initiator in order to cure an unreacted substance to improve mechanical properties of the insulating film and improve adhesive strength. The thermosetting initiator used in the present invention is an azo-based or peroxide-based initiator characterized by containing one or more functional groups, and is a 2,2′-azobis (N -Butyl-2-methylpropionamide) (2,2'-azobis (N-butyl-2-methylpropionamide), 2,2'-azobis (N-cyclohexyl-2-methylpropionamide) (2,2'-azobis) (N-cyclohexyl-2-methylpropionamide), 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile) (2,2′-azobis (N-methoxy-2,4-dimethylvalerontrile), 1- [(1-Cyano-1-methylethyl) azo] forma (1-[(1-cyano-1-methylethyl) azo] formamide), 2,2′-azobis [N- (2-propenyl) -2-methylpropionamide] (2,2′-azobis [N One or more selected from the group consisting of-(2-propenyl) -2-methylpropionamide], di-tert-butylperoxide, and benzoylperoxide, in particular, represented by the following chemical formula 2. 2,2′-azobis (N-butyl-2-methylpropionamide) is preferably used.

  Although the usage-amount of the said thermosetting initiator is not specifically limited, 1 to 15 weight% is preferable. When the usage-amount of the said thermosetting initiator is less than 1 weight%, there exists a possibility that it may be inadequate to harden the unreacted substance in the said resin composition, and the usage-amount of the said thermosetting initiator is 15 If it exceeds wt%, the amount of other composition used may be reduced, which may cause problems in film formation, and unreacted substances in the composition no longer remain. There is a possibility that the effect cannot be obtained. Although the delamination strength is improved by adding a metal binder to the insulating resin composition, the amount of other composition used is reduced by the amount of the metal binder added, and the thermal expansion coefficient is reduced. There is a tendency for characteristics to deteriorate. In order to complement this, the delamination strength and the coefficient of thermal expansion can be improved by adding a thermosetting initiator to the insulating resin composition.

(Epoxy resin)
The photosensitive insulating resin composition according to the exemplary embodiment of the present invention may further include an epoxy resin in order to increase the bonding strength of the resin composition. Although the said epoxy resin contains two or more epoxy groups and is not specifically limited, 1-30 weight part can be used with respect to 100 weight part of said resin compositions. When the amount of the epoxy resin used is less than 1 part by weight, the bonding force between the resin compositions may be weakened. When the amount of the epoxy resin used exceeds 30 parts by weight, it is not cured. An unreacted epoxy resin may be present in the composition, resulting in a decrease in physical properties.

  Specific examples of the epoxy resin include 1 from the group consisting of an aromatic epoxy resin, a glycidylamine type epoxy resin, a glycidyl acrylic type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a polyester type epoxy resin. More than one species can be selected.

(Inorganic filler)
The photosensitive insulating resin composition according to a typical embodiment of the present invention may further include an inorganic filler in order to reduce the thermal expansion coefficient of the resin composition. Although the inorganic filler is not particularly limited, it is contained in an amount of 20 to 85 parts by weight based on 100 parts by weight of the resin composition, and includes silica (SiO ₂ ), talc (Talc), and barium sulfate (BaSO ₄ ). , Barium titanate (BaTiO ₃ ), alumina (Al ₂ O ₃ ), clay, magnesium carbonate (MgCO ₃ ), calcium carbonate (CaCO ₃ ), aluminum hydroxide (Al (OH) ₃ ), and silicate (Silicate) One or more types can be selected from the group.

  If the amount of the inorganic filler used is less than 20 parts by weight, the coefficient of thermal expansion may increase. If the amount of the inorganic filler used exceeds 85 parts by weight, is it difficult to form a film? There is also a possibility that photolithography processability such as exposure or development may be hindered. The inorganic filler may be added alone to the resin composition, but may be added in combination with a silane coupling agent or a dispersant in order to improve the dispersibility and the bonding strength between the resins. preferable.

(Thermosetting agent)
The photosensitive insulating resin composition according to a typical embodiment of the present invention may further include a thermosetting agent. Although the said thermosetting agent is not specifically limited, 0.01-1 weight part is contained with respect to 100 weight part of said resin compositions, and an amine-type hardening | curing agent, an acid anhydride type hardening | curing agent, a polyamine hardening | curing agent is contained. One or more selected from the group consisting of a polysulfide curing agent, a phenol novolak type curing agent, a bisphenol A type curing agent, and a dicyandiamide curing agent.

  The thermosetting agent causes an epoxy resin curing reaction, and an active ester compound, a benzoxazine compound, a maleimide compound, a thermosetting cation polymerization catalyst, and a photocurable cation polymerization capable of causing a photosensitive resin to cure. One or more initiators and cyanate ester resins can be used.

  The insulating film of a printed circuit board can be manufactured using the photosensitive insulating resin composition according to a typical embodiment of the present invention. The manufactured insulating film has a surface roughness (Ra) in the range of 0.001 to 0.5 μm. When the surface roughness (Ra) of the insulating film is less than 0.001 μm, there is no possibility of peeling off because no adhesive force with the metal layer is generated, and the surface roughness (Ra) of the insulating film. When the thickness exceeds 0.5 μm, the thickness of the insulating film itself is so thin that it exceeds the thickness of the film, which may cause a problem in forming the film.

  In general, when an insulating film having a low roughness is used, the adhesive strength with a metal layer is lowered. Therefore, the roughness of the insulating film is increased on the substrate to maintain the adhesive strength. However, the insulating film manufactured using the photosensitive insulating resin composition of the present invention contains a metal binder, and this can maintain the adhesive force with the metal layer even at low roughness.

  FIG. 1 is a cross-sectional view of a general printed circuit board to which an insulating film manufactured using the resin composition of the present invention can be applied.

  That is, the printed circuit board 100 is largely composed of an insulating layer 131 and a circuit layer 132. Referring to FIG. 1, circuit layers 132 are formed on both surfaces of an insulator 110, and an insulating layer 131 is further formed on the circuit layer 132 using a buildup film, and further circuit layers are formed on the insulating layer 131. 132 is formed to form a continuous buildup layer 130.

  Such a printed circuit board 100 may include a capacitor 140, a resistance element 150, or other electronic components 120 as necessary, and includes a solder resist layer 160 on the outermost surface to protect the circuit board. . Such a printed circuit board 100 may include an external connection unit 170 or a pad layer 180 depending on an electronic product to be mounted. The printed circuit board 100 manufactured according to a typical embodiment of the present invention is excellent in thermal expansion coefficient characteristics and extremely excellent in peel strength between the insulating layer and the metal layer.

  Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. However, these examples and comparative examples do not limit the scope of the present invention.

(Manufacture of insulation film)
[Example 1]
160 g of cresol novolac epoxy acrylate, 42 g of bisphenol A novolak epoxy resin, 19 g of glyceryl propyl triacrylate (GPTA), 11 g of acetoacetoxyethyl methacrylate and 3 g of 1-hydroxy-cyclohexyl-phenyl-ketone (Irgacure 184D) were mixed. A resin varnish was produced by dissolving 12 g of 2-ethyl-4-methylimidazole as a thermosetting agent and 5 g of 2,2′-azobis (N-butyl-methylpropionamide) as a thermosetting initiator. . Thereafter, the resin varnish was applied onto a polyethylene terephthalate (PET) film having a thickness of about 38 μm using a bar coater and semi-cured (B-stage) to produce an insulating film having a thickness of about 30 μm.

[Example 2]
Average particle dispersed in 42 g of bisphenol A novolac epoxy resin, 160 g of cresol novolac epoxy acrylate, 19 g of glyceryl propyl triacrylate (GPTA), 11 g of acetoacetoxyethyl methacrylate, 3 g of 1-hydroxy-cyclohexyl-phenyl-ketone (Irgacure 184D) and methyl ethyl ketone solvent 485 g of spherical silica (SiO ₂ ) having a diameter of 0.3 μm was mixed and dispersed using a bead mill. A resin varnish was prepared by dissolving 12 g of 2-ethyl-4-methylimidazole as a thermosetting agent and 10 g of 2,2′-azobis (N-butyl-2-methylpropionamide) as a thermosetting initiator. Manufactured. Thereafter, the resin varnish was applied and semi-cured (B-stage) on a polyethylene terephthalate (PET) film having a thickness of about 38 μm using a bar coater to produce an insulating film having a thickness of 30 μm.

[Comparative Example 1]
80 g of bisphenol A type epoxy resin, 160 g of cresol novolac epoxy acrylate, 360 g of acid-modified epoxy acrylate, 30 g of phosphorus flame retardant epoxy resin and 5 g of 1-hydroxy-cyclohexyl-phenyl-ketone (Irgacure 184D) were mixed. A resin varnish was produced by dissolving 15 g of 2-ethyl-4-methylimidazole as a thermosetting agent. Thereafter, the resin varnish was applied and semi-cured on a polyethylene terephthalate (PET) film having a thickness of about 38 μm using a bar coater to produce an insulating film having a thickness of about 30 μm.

[Comparative Example 2]
Dispersed in 80 g of bisphenol A type epoxy resin, 240 g of cresol novolak epoxy acrylate, 400 g of acid-modified epoxy acrylate, 40 g of phosphorus flame retardant epoxy resin, 3 g of 1-hydroxy-cyclohexyl-phenyl-ketone (Irgacure 184D), and methyl ethyl ketone solvent 923 g of spherical silica (SiO ₂ ) having an average particle size of 0.3 μm was mixed and dispersed using a bead mill. The resin varnish was manufactured by dissolving 12 g of 2-ethyl-4-methylimidazole as a thermosetting agent. Thereafter, the resin varnish was applied onto a polyethylene terephthalate (PET) film having a thickness of about 38 μm using a bar coater and semi-cured (B-stage) to produce an insulating film having a thickness of about 30 μm.

(Manufacture of printed circuit boards)
[Example 3]
After drying the inner layer circuit board having copper foil laminated on both sides at a temperature of about 120 ° C. for 30 minutes, the insulating film produced in Example 2 was about 90 ° C. and 2 MPa using a Morton CVA 725 vacuum laminator. A printed circuit board was manufactured by vacuum laminating on both surfaces under the conditions of about 20 seconds.

  The physical property evaluation of the insulating films manufactured in Examples 1 and 2 and Comparative Examples 1 and 2 is shown in Table 1 below.

  The thermal expansion coefficient was measured in two sections of a temperature range of 50 to 130 ° C. and 180 to 250 ° C. using a thermomechanical analyzer (Thermo Mechanical Analysis, TMA). The measurement results were subjected to thermomechanical analysis by the tensile load method. After attaching the test piece of the insulating film to the said apparatus, it measured on the measurement conditions of the temperature increase rate of 5 degree-C / min. The average linear thermal expansion coefficient (ppm) in the sections of thermal expansion coefficient α1 (50 to 130 ° C.) and α2 (180 to 250 ° C.) in the measurement was calculated. The peel strength was measured and evaluated by measuring the peel strength between the copper clad layer and the insulating layer using a tensile strength measuring machine (Universal Testing Machine, UTM).

  As can be seen from Table 1, Example 1 and Comparative Example 1 were measured using an insulating film containing no inorganic filler, and Example 2 and Comparative Example 2 were measured using an insulating film containing an inorganic filler. It was measured. It can be seen that the thermal expansion coefficient and peel strength of Example 1 are superior to those of Comparative Example 1, and the thermal expansion coefficient and peel strength of Example 2 are also superior to those of Comparative Example 2. It was confirmed that the insulating films produced in Examples 1 and 2 improved the thermal expansion coefficient and peel strength characteristics by including a thermosetting initiator and a metal binder.

  Moreover, as shown in FIG. 2, the peel strength measured value of the insulating film which concerns on Example 2 and the comparative example 2 containing an inorganic filler was shown with the graph.

  From this graph, it can be confirmed with the naked eye that the insulating film manufactured in Example 2 has an improved peel strength compared to the insulating film manufactured in Comparative Example 2. Therefore, it turns out that the insulating film which concerns on this invention is a level suitable as a substrate material.

  The present invention has been described in detail on the basis of specific embodiments. However, the present invention is intended to specifically describe the present invention, and the present invention is not limited thereto. It will be apparent to those skilled in the art that modifications and improvements within the technical idea of the present invention are possible.

  All simple variations and modifications of the present invention belong to the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

  The present invention is applicable to a photosensitive insulating resin composition and a product using the same.

DESCRIPTION OF SYMBOLS 100 Printed circuit board 110 Insulator 120 Electronic component 130 Build-up layer 131 Insulating layer 132 Circuit layer 140 Capacitor 150 Resistance element 160 Solder resist layer 170 External connection means 180 Pad layer

Claims (15)

Photosensitive resin,
A metal binder comprising acetoacetoxyethyl methacrylate represented by the following chemical formula 1 ,
A photosensitive insulating resin composition comprising a photocuring initiator and a thermosetting initiator.

  The insulating resin composition includes 50 to 95% by weight of a photosensitive resin, 1 to 30% by weight of a metal binder, 1 to 10% by weight of a photocuring initiator, and 1 to 15% by weight of a thermosetting initiator. The photosensitive insulating resin composition according to claim 1.   The photosensitive insulating resin composition according to claim 1, wherein the photosensitive resin is an acrylate compound having two or more acrylic groups, or a mixture of an acrylate compound and a polyfunctional monomer.   The acrylate compound having two or more acrylic groups includes cresol novolac type epoxy acrylate, bisphenol A type epoxy acrylate, bisphenol F type epoxy acrylate, bisphenyl type epoxy acrylate, urethane acrylate, phenol novolac type epoxy acrylate, and triphenol. The photosensitive insulating resin composition according to claim 3, wherein at least one selected from the group consisting of methane type epoxy acrylates.   The polyfunctional monomer having two or more acrylic groups is selected from the group consisting of dipentaerythritol hexaacrylate, glyceryl propyl triacrylate, propoxylated glyceryl triacrylate, and dihydrodicyclopenta-dienyl acrylate. The photosensitive insulating resin composition according to claim 3.   2. The photosensitive insulating resin composition according to claim 1, wherein the photocuring initiator is selected from the group consisting of benzophenone, acetophenone, acylphosphine oxide, α-aminoketone, and α-hydroxyketone.   The thermosetting initiator is 2,2′-azobis (N-butyl-2-methylpropionamide), 2,2′-azobis (N-cyclohexyl-2-methylpropionamide), 2,2′-azobis ( 4-methoxy-2,4-dimethylvaleronitrile), 1-[(1-cyano-1-methylethyl) azo] formamide, 2,2′-azobis [N- (2-propenyl) -2-methylpropion The photosensitive insulating resin composition according to claim 1, which is selected from the group consisting of amide], di-tert-butyl peroxide, and benzoyl peroxide. The photosensitive insulating resin composition according to claim 7 , wherein the thermosetting initiator is 2,2′-azobis (N-butyl-2-methylpropionamide) represented by the following chemical formula 2.

  The photosensitive insulating resin composition according to claim 1, wherein the insulating resin composition further comprises an epoxy resin, an inorganic filler, and a thermosetting agent. The epoxy resin has two or more epoxy groups, and is contained in an amount of 1 to 30 parts by weight with respect to 100 parts by weight of the insulating resin composition. An aromatic epoxy resin, a glycidylamine epoxy resin, a glycidylacrylic epoxy resin The photosensitive insulating resin composition according to claim 9, which is selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin and polyester type epoxy resin. The inorganic filler is contained in an amount of 20 to 85 parts by weight based on 100 parts by weight of the insulating resin composition, and includes silica (SiO ₂ ), talc (Talc), barium sulfate (BaSO ₄ ), and barium titanate (BaTiO ₃ ). At least one selected from the group consisting of alumina (Al ₂ O ₃ ), clay, magnesium carbonate (MgCO ₃ ), calcium carbonate (CaCO ₃ ), aluminum hydroxide (Al (OH) ₃ ), and silicate The photosensitive insulating resin composition according to claim 9 . The thermosetting agent is contained in an amount of 0.01 to 1 part by weight with respect to 100 parts by weight of the insulating resin composition. The amine curing agent, the acid anhydride curing agent, the polyamine curing agent, the polysulfide curing agent, and the phenol novolac type. The photosensitive insulating resin composition according to claim 9, which is selected from the group consisting of a curing agent, a bisphenol A curing agent, and a dicyandiamide curing agent.   The insulating film in which the photosensitive insulating resin composition of Claim 1 was formed on the base material. The insulating film according to claim 13 , wherein a surface roughness (Ra) of the insulating film is 0.001 to 0.5 μm. A printed circuit board formed by laminating the insulating film according to claim 13 on a substrate on which a circuit pattern is formed.

Images