KR102029479B1 - Photosensitive insulating resin composition and products having the same - Google Patents

Abstract

The present invention provides a photosensitive insulating resin composition and a product using the same. More specifically, the present invention relates to a printed circuit board including an insulating film and an insulating film which include a metal binder and a thermosetting initiator in the resin composition to improve the properties of the coefficient of thermal expansion and peel strength.

Description

Photosensitive insulating resin composition and product using the same {PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND PRODUCTS HAVING THE SAME}

The present invention relates to a photosensitive insulating resin composition and a product using the same.

With the development of the electronics industry, the demand for multifunctional, high functionalization and miniaturization of electronic components is rapidly increasing. In addition, as the electronic components are thin and short, the printed circuit board on which the electronic components are mounted is also required to have a high density of circuit patterns that require the integration of many electronic products in a small area. As circuit patterns of printed circuit boards become finer and the interlayer spacing becomes smaller, problems such as dielectric loss or short, or adhesion between the circuit and the insulator are degraded, resulting in deterioration of product reliability. Therefore, a photosensitive insulating film capable of forming a fine opening pattern is used for a printed circuit board, a semiconductor package substrate, or a flexible printed circuit board (FPCB).

On the other hand, Patent Document 1 discloses an insulating composition containing a photosensitive resin showing visibility and hiding power without using a pigment, but there is a limit in improving the properties of the interlayer adhesion strength and the coefficient of thermal expansion.

Patent Document 1: Korean Patent Publication No. 2012-0107373

Accordingly, the present invention confirmed that in the photosensitive insulating resin composition, a product manufactured using a composition including a metal binder and a thermosetting initiator has a low coefficient of thermal expansion, and has a high adhesion with a circuit pattern even at low roughness. Completed on this basis.

Accordingly, one aspect of the present invention is to provide a photosensitive insulating resin composition having characteristics of low coefficient of thermal expansion and high peel strength.

Another aspect of the present invention is to provide an insulating film made of the resin composition, having a low thermal expansion coefficient and high peel strength characteristics.

Another aspect of the present invention to provide a printed circuit board having the insulating film.

In order to achieve one aspect of the present invention, a photosensitive insulating resin composition (hereinafter referred to as "first invention") according to an exemplary embodiment of the present invention may be a photosensitive resin; Metal binders; Photocuring initiators; And thermosetting initiators.

In the first invention, the insulating resin composition comprises 50 to 95% by weight of the photosensitive resin, 1 to 30% by weight of the metal binder, 1 to 10% by weight of the photocuring initiator and 1 to 15% by weight of the thermosetting initiator do.

In the first invention, the photosensitive resin is an acrylate compound having two or more acrylic groups, or a mixture of an acrylate compound and a polyfunctional monomer.

In the first invention, the acrylate compound having two or more acrylic groups are cresol novolac type epoxy acrylate, bisphenol A type epoxy acrylate, bisphenol F type epoxy acrylate, bisphenyl type epoxy acrylate, urethane type acrylate, At least one selected from the group consisting of phenol novolac type epoxy acrylate and triphenolmethane type epoxy acrylate.

In the first invention, the multifunctional monomer having two or more acrylic groups is dipentaerythritol hexaacrylate, glyceryl propyl triacrylate, propoxylated glyceryl triacrylate and dihydro dicyclopenta-dienyl At least one is selected from the group consisting of acrylates.

In the first invention, the metal binder is at least one selected from acetoacetoxyethyl methacrylate, ethylenediaminetetraacetic acid, amino acid, organic acid metal salt, metal salt, 1,3-diketone metal complex salt and metal alkoxide.

In the first invention, the metal binder is acetoacetoxyethyl methacrylate represented by the following formula (1).

[Formula 1]

In the first invention, the photocuring initiator is selected from the group consisting of benzophenone, acetophenone, acylphosphine oxide, α-aminoketone and α-hydroxyketone.

In the first invention, the thermosetting initiator is 2,2'-azobis (N-butyl-2-methylpropionamide), 2,2'-azobis (N-cyclohexyl-2-methylpropionamide), 2,2'-azobis (4-methoxy-2,4-dimethyl valeronitrile), 1-[(1-cyano-1-methylethyl) azo] formamide, 2,2'-azobis [ N- (2-propenyl) -2-methylpropionamide], di-tert-butyl peroxide and benzoyl peroxide.

In the first invention, the thermosetting initiator is 2,2'-azobis (N-butyl-2-methylpropionamide) represented by the following formula (2).

[Formula 2]

In the first invention, the insulating resin composition further comprises an epoxy resin, an inorganic filler and a thermosetting agent.

In the first invention, the epoxy resin has two or more epoxy groups, it is contained in 1 to 30 parts by weight based on 100 parts by weight of the insulating resin composition, aromatic epoxy resin, glycidylamine type epoxy resin, glycidyl acryl At least one selected from the group consisting of a type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin and a polyester type epoxy resin.

In the first invention, the inorganic filler is contained in 20 to 85 parts by weight based on 100 parts by weight of the insulating resin composition, silica (SiO ₂ ), talc (Talc), barium sulfate (BaSO ₄ ), barium titanate (BaTiO) ₃ ), alumina (Al ₂ O ₃ ), clay, magnesium carbonate (MgCO ₃ ), calcium carbonate (CaCO ₃ ), aluminum hydroxide (Al (OH) ₃ ) and silicate (Silicate).

 In the first invention, the thermosetting agent is contained in an amount of 0.01 to 1 parts by weight based on 100 parts by weight of the insulating resin composition, an amine curing agent, an acid anhydride curing agent, polyamine curing agent, polysulfide curing agent, phenol novolac curing agent, bisphenol At least one selected from the group consisting of a type A curing agent and a dicyandiamide curing agent.

An insulating film (hereinafter referred to as "second invention") for achieving another aspect of the present invention is formed by applying and curing the photosensitive insulating resin composition according to the first invention on a substrate.

In the second invention, the surface roughness Ra of the insulating film is 0.001 to 0.5 µm.

A printed circuit board (hereinafter referred to as "third invention") for achieving another aspect of the present invention is formed by laminating the insulating film of the second invention on a substrate on which a circuit pattern is formed.

In the photosensitive insulating resin composition according to an exemplary embodiment of the present invention, a product manufactured using the composition including a metal binder and a thermosetting initiator may exhibit low coefficient of thermal expansion and high peel strength.

1 is a cross-sectional view of a general printed circuit board to which an insulating film according to an embodiment of the present invention is applicable.
Figure 2 is a graph showing the peel strength (peel strength) measurement value of the insulating film according to Example 2 and Comparative Example 2 including an inorganic filler in the present invention.

Before describing the invention in more detail, the terms or words used in the specification and claims are not to be limited to their usual or dictionary meanings, and the concept of terms is appropriately described to best explain the invention. It should be interpreted as meanings and concepts in accordance with the technical spirit of the present invention based on the principle that it can be defined. Therefore, the configuration of the embodiments described herein is only one preferred example of the present invention, and does not represent all of the technical idea of the present invention, various equivalents and modifications that can replace them at the time of the present application It should be understood that there may be

Hereinafter, preferred embodiments of the present invention will be described in detail so that those skilled in the art may easily implement the present invention. In addition, in the description of the present invention, detailed descriptions of related well-known technologies that may unnecessarily obscure the subject matter of the present invention will be omitted.

Photosensitive resin

The photosensitive insulating resin composition according to the exemplary embodiment of the present invention includes a photosensitive resin, and the amount of use thereof is not particularly limited, but may be 50 to 95% by weight. If the amount of the photosensitive resin is less than 50% by weight, the physical properties of the resin composition may be lowered. If the amount of the photosensitive resin is greater than 95% by weight, unreacted substances may be generated or the amount of other compositions may be reduced, thereby causing problems in film molding. . The photosensitive resin used in the present invention may be selected from a mixture of an acrylate compound having two or more acrylic groups and a polyfunctional monomer.

The acrylate compound having two or more acrylic groups is a cresol novolak type epoxy acrylate, bisphenol A type epoxy acrylate, bisphenol F type epoxy acrylate, bisphenyl type epoxy acrylate, urethane type acrylate, phenol novolac type epoxy acrylic And at least one from the group consisting of latex and triphenolmethane type epoxy acrylates.

The multifunctional monomers having two or more acrylic groups include dipentaerythritol hexaacrylate, glyceryl propyl triacrylate, propoxylated glyceryl triacrylate and dihydro dicyclopenta. It may be selected from the group consisting of dihydro dicyclopenta-dienyl acrylate.

Metal binder

The photosensitive insulating resin composition according to the exemplary embodiment of the present invention includes a metal binder in order to improve adhesion between the insulating layer and the metal layer of the printed circuit board. The metal binder used in the present invention is one from acetoacetoxyethyl methacrylate, ethylenediaminetetraacetic acid (EDTA), amino acid, organic acid metal salt, metal salt, 1,3-diketone metal complex salt and metal alkoxide It may be appropriate to use acetoacetoxyethyl methacrylate, which is selected above, and in particular represented by the following formula (1).

[Formula 1]

The metal binder may be included in the insulating resin composition to coordination bond with the metal, thereby enhancing adhesion between the insulating layer and the metal layer. In the resin composition of the present invention, the amount of the metal binder to be used is not particularly limited, but it may be appropriate to use a content of 1 to 30% by weight, especially 5 to 30% by weight. When the amount of the metal binder is less than 1% by weight, a problem may occur in that the adhesion between the insulating layer and the metal layer is lowered. When the amount of the metal binder exceeds 30% by weight, the improvement in adhesion between the insulating layer and the metal layer no longer appears, and the amount of the other composition is increased. This may cause problems in film forming.

Photocuring initiator

The photosensitive insulating resin composition according to the exemplary embodiment of the present invention includes a photocuring initiator to proceed with the curing reaction of the photosensitive resin. The photocuring initiator used in the present invention may be selected from one or more selected from the group consisting of benzophenone, acetophenone, acylphosphine oxide, α-aminoketone and α-hydroxyketone, specific examples of bis (2,4 , 6-trimethylbenzoyl) -phenylphosphineoxide (bis (2,4,6-trimethylbenzoyl) -phenylphosphineoxide), 1-hydroxycyclohexyl-phenyl-ketone (1-hydroxy-cyclohexyl-phenyl-ketone), 2 -Hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propenyl) -benzyl] -phenyl} -2-methyl-propan-1-one (2-hydroxy-1- {4 -[4- (2-hydroxy-2-methyl-prophenyl) -benzyl] -phenyl} -2-methyl-propan-1-one, 4,4'bis (diethylamino) benzophenone (4,4'- bis (diethylamino) benzophenone), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone- 1), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (2,4,6-trimethylbenzoyl-diphenylphosphine oxide), 2-methyl-1- [4- (Methylthio) phenyl} -2-morpholinopropan-1-one (2-methyl-1- [4- (methylthio) phenyl] -2-morpholinonpropan-1-one) and 2-benzyl-2-dimethylamino -1- (4-morpholinophenyl) -butanone-1 (2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1) may be used.

The amount of the photocuring initiator to be used is not particularly limited, but may be 1 to 10% by weight. When the amount of the photocuring initiator is less than 1% by weight, the curing reaction of the photosensitive resin may not be performed smoothly, and an unreacted substance may remain in the composition. When the amount of the photocuring initiator is more than 10% by weight, the amount of the other composition is reduced to form a film. Problems may also arise.

Thermosetting initiator

The photosensitive insulating resin composition according to the exemplary embodiment of the present invention includes a thermosetting initiator to cure the unreacted material to improve mechanical properties of the insulating film and to improve adhesion. The thermosetting initiator used in the present invention is an azo or peroxide initiator comprising at least one functional group, and is 2,2'-azobis (N-butyl-2- Methylpropionamide) (2,2'-azobis (N-butyl-2-methylpropionamide), 2,2'-azobis (N-cyclohexyl-2-methylpropionamide) (2,2'-azobis (N- cyclohexyl-2-methylpropionamide), 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile) (2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile), 1- [(1-cyano-1-methylethyl) azo] formamide (1-[(1-cyano-1-methylethyl) azo] formamide), 2,2'-azobis [N- (2-propenyl) -2-methylpropionamide] (2,2'-azobis [N- (2-prophenyl) -2-methylpropionamide], di-tert-butylperoxide and benzoylperoxide At least one selected from the group consisting of 2,2'-azobis (N-butyl-2-methyl) As it may be appropriate to use a Nafion amide).

[Formula 2]

The amount of the thermal curing initiator used is not particularly limited, but may be 1 to 15% by weight may be appropriate. When the amount of the thermosetting initiator is less than 1% by weight, it may not be sufficient to cure the unreacted material in the resin composition. When the amount of the thermosetting initiator is more than 15% by weight, the amount of the other composition may be reduced, causing problems in film forming. Since the unreacted material in the composition no longer remains, the effect by the curing reaction may not be obtained. In addition, the interlaminar peel strength is improved by adding the metal binder to the insulating resin composition, but the amount of the other composition decreases as the amount of the metal binder is added, so that the property of the coefficient of thermal expansion tends to decrease. In order to compensate for this, by adding a thermosetting initiator to the insulating resin composition, the properties of the interlaminar peel strength and the coefficient of thermal expansion can be improved.

Epoxy resin

The photosensitive insulating resin composition according to the exemplary embodiment of the present invention may further include an epoxy resin to increase the bonding strength of the resin composition. The epoxy resin includes two or more epoxy groups, and is not particularly limited, but may be 1 to 30 parts by weight based on 100 parts by weight of the resin composition. If the amount of the epoxy resin is less than 1 part by weight, the bonding strength between the resin compositions may be weakened. If the amount of the epoxy resin is greater than 30 parts by weight, the uncured unreacted epoxy resin may be present in the composition, resulting in deterioration of physical properties.

Specific examples of the epoxy resins include one or more from the group consisting of aromatic epoxy resins, glycidyl amine epoxy resins, glycidyl acrylic epoxy resins, bisphenol A epoxy resins, bisphenol F epoxy resins and polyester epoxy resins. Can be selected.

Inorganic filler

The photosensitive insulating resin composition according to the exemplary embodiment of the present invention may further include an inorganic filler to lower the thermal expansion coefficient of the resin composition. The inorganic filler is not particularly limited, but is contained in 20 to 85 parts by weight based on 100 parts by weight of the resin composition, silica (SiO ₂ ), talc (Talc), barium sulfate (BaSO ₄ ), barium titanate (BaTiO ₃ ), Alumina (Al ₂ O ₃ ), clay, magnesium carbonate (MgCO ₃ ), calcium carbonate (CaCO ₃ ), aluminum hydroxide (Al (OH) ₃ ) and silicate (Silicate). .

If the amount of the inorganic filler is less than 20 parts by weight, the coefficient of thermal expansion may increase, and if it exceeds 85 parts by weight, film forming may be difficult or photolithography processability such as exposure or development may be impaired. In addition, the inorganic filler may be added to the resin composition alone, but it is preferable to add the inorganic filler in combination with a silane coupling agent or a dispersant in order to improve the dispersibility side and the bonding strength between the resin.

Thermosetting agent

The photosensitive insulating resin composition according to the exemplary embodiment of the present invention may further include a thermosetting agent. The thermosetting agent is not particularly limited, but is contained in an amount of 0.01 to 1 parts by weight based on 100 parts by weight of the resin composition, and includes an amine curing agent, an acid anhydride curing agent, a polyamine curing agent, a polysulfide curing agent, a phenol novolac curing agent, and a bisphenol A At least one selected from the group consisting of a type curing agent and a dicyandiamide curing agent.

The thermosetting agent causes a curing reaction of the epoxy resin, and from an active ester compound, a benzoxazine compound, a maleimide compound, a thermosetting cationic polymerization catalyst, a photocurable cationic polymerization initiator and a cyanate ester resin which can also cure the photosensitive resin. One or more may be used.

An insulating film of a printed circuit board may be manufactured using the photosensitive insulating resin composition according to the exemplary embodiment of the present invention. Surface roughness (Ra) of the prepared insulating film is in the range of 0.001 to 0.5㎛. If the surface roughness (Ra) of the insulating film is less than 0.001㎛ does not generate an adhesive force with the metal layer can easily fall, if the thickness exceeds 0.5㎛ because the thickness of the insulating film itself is thin to exceed the film thickness Problems may also occur. In general, when the insulating film having a low roughness is used, the adhesive strength with the metal layer is reduced, so that the substrate maintains the adhesive strength by increasing the roughness of the insulating film. However, the insulating film prepared by using the photosensitive insulating resin composition of the present invention contains a metal binder, through which the adhesive force with the metal layer can be maintained even at low roughness.

1 is a cross-sectional view of a general printed circuit board to which an insulating film manufactured using the resin composition of the present invention is applicable. That is, the printed circuit board 100 is largely divided into an insulating layer 131 and a circuit layer 132. Referring to FIG. 1, the circuit layer 132 is formed on both surfaces of the insulator 110. The insulating layer 131 is formed again on the 132 using the buildup film, and the circuit layer 132 is formed again on the continuous buildup layer 130. The printed circuit board may include a capacitor 140, a resistor 150 or other electronic components 120, if necessary, the outermost is provided with a layer of solder resist 160 to protect the circuit board have. The printed circuit board may include an external connection means 170, and sometimes a pad 180 layer, depending on the electronic product to be mounted. The printed circuit board manufactured according to the exemplary embodiment of the present invention not only has excellent coefficient of thermal expansion, but also has excellent peel strength between the insulating layer and the metal layer.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the scope of the present invention is not limited to the following Examples.

Insulation Film Manufacturing

Example 1

160 g cresol novolac epoxy acrylate, 42 g bisphenol A novolac epoxy resin, 19 g glyceryl propyl triacrylate (GPTA), 11 g acetoacetoxyethyl methacrylate and 1-hydroxy-cyclohexyl-phenyl-ketone (Irgacure 184D ) 3 g were mixed. A resin varnish was prepared by dissolving 12 g of 2-ethyl-4-methylimidazole as a thermosetting agent and 5 g of 2,2'-azobis (N-butyl-2-methylpropionamide) as a thermosetting initiator. Next, the resin varnish was coated and semi-cured on a polyethylene terephthalate (PET) film having a thickness of about 38 μm using a barcoat to prepare an insulating film having a thickness of about 30 μm. .

Example 2

42 g of bisphenol A novolac epoxy resin, 160 g of cresol novolac epoxy acrylate, 19 g of glyceryl propyl triacrylate (GPTA), 11 g of acetoacetoxyethyl methacrylate, 1-hydroxy-cyclohexyl-phenyl-ketone (Irgacure 184D 3 g) and 485 g of spherical silica (SiO ₂ ) having an average particle size of 0.3 μm dispersed in a solvent of methyl ethyl ketone were mixed and dispersed using a bead mill. A resin varnish was prepared by dissolving 12 g of 2-ethyl-4-methylimidazole as a thermosetting agent and 10 g of 2,2'-azobis (N-butyl-2-methylpropionamide) as a thermosetting initiator. Next, the resin varnish was coated and semi-cured on a polyethylene terephthalate (PET) film having a thickness of about 38 μm using a barcoat to prepare an insulating film having a thickness of about 30 μm. .

Comparative Example 1

80 g of bisphenol A epoxy resin, 160 g of cresol novolac epoxy resin, 360 g of acid-modified epoxy acrylate, 30 g of phosphorus flame retardant epoxy resin, and 5 g of 1-hydroxy-cyclohexyl-phenyl-ketone (Irgacure 184D) were mixed. A resin varnish was prepared by dissolving 15 g of 2-ethyl-4-methylimidazole as a thermosetting agent therein. Next, the resin varnish was coated and semi-cured on a polyethylene terephthalate (PET) film having a thickness of about 38 μm using a barcoat to prepare an insulating film having a thickness of about 30 μm. .

Comparative Example 2

Dispersed in 80 g of bisphenol A epoxy resin, 240 g of cresol novolac epoxy resin, 400 g of acid-modified epoxy acrylate, 40 g of phosphorus flame retardant epoxy resin, 3 g of 1-hydroxycyclohexyl-phenyl-ketone (Irgacure 184D) and methyl ethyl ketone solvent 923 g of spherical silica (SiO ₂ ) having an average particle size of 0.3 μm were mixed and dispersed using a bead mill. A resin varnish was prepared by dissolving 12 g of 2-ethyl-4-methylimidazole as a thermosetting agent therein. Next, the resin varnish was coated and semi-cured on a polyethylene terephthalate (PET) film having a thickness of about 38 μm using a barcoat to prepare an insulating film having a thickness of about 30 μm. .

Printed Circuit Board Manufacturing

Example 3

After drying the inner layer circuit board on which copper foil is laminated on both sides for 30 minutes at a temperature of about 120 ° C., the insulating film prepared in Example 2 was subjected to a condition of about 90 ° C. and 2 MPa using Morton CVA 725 vacuum laminate. By vacuum lamination on both sides for about 20 seconds to prepare a printed circuit board.

Properties of the insulating film produced through Examples 1 and 2 and Comparative Examples 1 and 2 are shown in Table 1 below. The thermal expansion coefficient was measured in two sections of 50-130 ° C. and 180-250 ° C. using a thermomechanical analysis device (TMA), and thermomechanical analysis was performed by a tensile weighting method. After mounting the specimen of the insulating film to the apparatus, it was measured under the measurement conditions of the temperature increase rate 5 ℃ / min. The average linear thermal expansion coefficient (ppm) of the thermal expansion coefficients α1 (50 to 130 ° C) and α2 (180 to 250 ° C) sections in the measurement was calculated. The measurement and evaluation of peeling strength measured the peeling strength between the copper foil layer and the insulating layer using a tensile strength meter (Universal Testing Machine, UTM).

division Coefficient of thermal expansion (ppm / ℃)
(α1, 50 ~ 130 ℃) Coefficient of thermal expansion (ppm / ℃)
(α2, 180 ~ 250 ℃) Peel strength
(kgf / cm) Example 1 60.1 115.4 1.0 Example 2 28.9 56.5 0.46 Comparative Example 1 80.2 160.2 0.6 Comparative Example 2 39.1 82.5 0.27

As can be seen in Table 1, Example 1 and Comparative Example 1 was measured through an insulating film containing no inorganic filler, Example 2 and Comparative Example 2 was measured through an insulating film containing an inorganic filler. It can be seen that the thermal expansion coefficient and peel strength of Example 1 are superior to Comparative Example 1, and the thermal expansion coefficient and peel strength of Example 2 are also superior to Comparative Example 2. The insulating films produced through Examples 1 and 2 were found to include improved thermal expansion coefficient and peel strength properties by including a thermal curing initiator and a metal binder. In addition, as shown in Figure 2, the peel strength measurement values of the insulating film according to Example 2 and Comparative Example 2 including the inorganic filler is shown in a graph, the insulating film prepared through Example 2 also compared on the graph It can be seen visually that the peel strength is improved compared to the insulating film prepared in Example 2. Therefore, it can be seen that the insulating film according to the present invention is a level suitable as a substrate material.

Although the present invention has been described in detail through specific examples, it is intended to describe the present invention in detail, and the present invention is not limited thereto, and should be understood by those skilled in the art within the technical spirit of the present invention. It is obvious that it can be modified or improved.

All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

100: printed circuit board 110: insulator
120: electronic component 130: build-up layer
131: insulating layer 132: circuit layer
140: capacitor 150: resistance element
160: solder resist 170: external connection means
180: pad

Claims (17)

Photosensitive resin;
Metal binders;
Photocuring initiators; And
Thermosetting initiators; Including;
The metal binder is acetoacetoxyethyl methacrylate represented by the following formula (1).
[Formula 1]

The method according to claim 1,
The insulating resin composition comprises 50 to 95% by weight of the photosensitive resin, 1 to 30% by weight of the metal binder, 1 to 10% by weight of the photocuring initiator and 1 to 15% by weight of the thermosetting initiator.
The method according to claim 1,
The photosensitive resin is a photosensitive insulating resin composition which is an acrylate compound having two or more acrylic groups, or a mixture of an acrylate compound and a polyfunctional monomer.
The method according to claim 3,
The acrylate compound having two or more acrylic groups is a cresol novolak type epoxy acrylate, bisphenol A type epoxy acrylate, bisphenol F type epoxy acrylate, bisphenyl type epoxy acrylate, urethane type acrylate, phenol novolac type epoxy acrylic At least one photosensitive insulating resin composition selected from the group consisting of acrylates and triphenolmethane type epoxy acrylates.
The method according to claim 3,
The multifunctional monomer having two or more acrylic groups is selected from the group consisting of dipentaerythritol hexaacrylate, glyceryl propyl triacrylate, propoxylated glyceryl triacrylate and dihydro dicyclopenta-dienyl acrylate. At least one selected photosensitive insulating resin composition.
delete delete The method according to claim 1,
The photocuring initiator is at least one selected from the group consisting of benzophenone, acetophenone, acylphosphine oxide, α-amino ketone and α- hydroxy ketone.
The method according to claim 1,
The thermosetting initiators are 2,2'-azobis (N-butyl-2-methylpropionamide), 2,2'-azobis (N-cyclohexyl-2-methylpropionamide), 2,2'-azo Bis (4-methoxy-2,4-dimethyl valeronitrile), 1-[(1-cyano-1-methylethyl) azo] formamide, 2,2'-azobis [N- (2-pro Phenyl) -2-methylpropionamide], di-tert-butyl peroxide and benzoyl peroxide.
The method according to claim 9,
The thermosetting initiator is a 2,2'-azobis (N-butyl-2-methylpropionamide) represented by the following formula (2).
[Formula 2]

The method according to claim 1,
The insulating resin composition further comprises an epoxy resin, an inorganic filler and a thermosetting agent.
The method according to claim 11,
The epoxy resin has two or more epoxy groups, contained in an amount of 1 to 30 parts by weight based on 100 parts by weight of the insulating resin composition, an aromatic epoxy resin, glycidylamine type epoxy resin, glycidylacrylic type epoxy resin, bisphenol A At least one photosensitive insulating resin composition selected from the group consisting of an epoxy resin, a bisphenol F epoxy resin, and a polyester epoxy resin.
The method according to claim 11,
The inorganic filler is contained in 20 to 85 parts by weight based on 100 parts by weight of the insulating resin composition, silica (SiO ₂ ), talc (Talc), barium sulfate (BaSO ₄ ), barium titanate (BaTiO ₃ ), alumina (Al ₂ O ₃ ), clay, magnesium carbonate (MgCO ₃ ), calcium carbonate (CaCO ₃ ), aluminum hydroxide (Al (OH) ₃ ) and silicate (Silicate).
The method according to claim 11,
The thermosetting agent is included in an amount of 0.01 to 1 parts by weight based on 100 parts by weight of the insulating resin composition, and includes an amine curing agent, an acid anhydride curing agent, a polyamine curing agent, a polysulfide curing agent, a phenol novolak type curing agent, a bisphenol A type curing agent, and dicyandi At least one photosensitive insulating resin composition selected from the group consisting of amide curing agents.
The insulating film in which the photosensitive insulating resin composition of Claim 1 was formed on the base material.
The method according to claim 15,
Surface roughness (Ra) of the insulating film is an insulating film, characterized in that 0.001 to 0.5㎛.
A printed circuit board, wherein the insulating film according to claim 15 is laminated on a substrate on which a circuit pattern is formed.

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