JP2019006980A - Resin composition for insulation film, insulation film, and multilayer printed board - Google Patents

Abstract

To provide a resin composition for insulation film capable of reducing dielectric loss tangent and preventing crack or fracture from being generated when an insulation film is bent.SOLUTION: The resin composition for insulation film contains a first epoxy compound having an epoxy group, a second epoxy compound having 2 or more epoxy groups, a curing agent and a filler, with content of the first epoxy compound of 33 wt.% or less in total 100 mass% of the first epoxy compound and the second epoxy compound, and content of the filler is 50 wt.% or more in 100 wt.% of a component excluding a solvent in the resin composition for insulation film.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin composition for an insulating film comprising an epoxy compound, a curing agent, and a filler. The present invention also relates to an insulating film including an epoxy compound, a curing agent, and a filler. Moreover, this invention relates to the multilayer printed wiring board using the said resin composition for insulating films, and the said insulating film.

  Conventionally, various resin compositions have been used to obtain electronic components such as semiconductor devices, laminates, and printed wiring boards. For example, in a multilayer printed wiring board, a resin composition is used in order to form an insulating layer for insulating inner layers or to form an insulating layer located in a surface layer portion. On the surface of the insulating layer, a wiring generally made of metal is laminated. Moreover, in order to form the said insulating layer, the insulating film by which the said resin composition was made into a film may be used. The resin composition and the insulating film are used as insulating materials for multilayer printed wiring boards including a build-up film.

  As an example of the resin composition, the following Patent Document 1 discloses a curable epoxy composition containing an epoxy compound, an active ester compound, and a filler.

JP 2015-143302 A

  Insulating films used for multilayer printed wiring boards and the like are required to lower the dielectric loss tangent of the insulating layer. Many inorganic fillers may be blended for the purpose of lowering the dielectric loss tangent. However, when there are many compounding quantities of an inorganic filler, the handleability of an insulating film will fall, a crack may arise in an insulating film, or an insulating film may break.

  In the conventional insulating film, an epoxy compound having two or more epoxy groups is used as the thermosetting compound. When a conventional insulating film containing such an epoxy compound is bent, cracks or cracks may occur.

  In the conventional insulating film, it is difficult to reduce the dielectric loss tangent and prevent the bent insulating film from cracking or cracking. In particular, when the amount of the inorganic filler is small, even if it is possible to prevent the occurrence of cracks or cracks in the bent insulating film, if the amount of the inorganic filler is large, the bent insulation It is difficult to prevent the film from cracking or cracking.

  An object of the present invention is to provide a resin composition for an insulating film and an insulating film that can lower the dielectric loss tangent and prevent the occurrence of cracks or cracks when the insulating film is bent. Moreover, this invention is providing the multilayer printed wiring board using the said resin composition for insulating films, and an insulating film.

  According to a wide aspect of the present invention, the first epoxy compound having one epoxy group, a second epoxy compound having two or more epoxy groups, a curing agent, and a filler, In a total of 100% by weight of the epoxy compound and the second epoxy compound, the content of the first epoxy compound is 33% by weight or less, and in 100% by weight of the component excluding the solvent in the resin composition for insulating film A resin composition for an insulating film, in which the filler content is 50% by weight or more, is provided.

  According to a wide aspect of the present invention, the first epoxy compound having one epoxy group, a second epoxy compound having two or more epoxy groups, a curing agent, and a filler, The content of the first epoxy compound is 33% by weight or less in the total 100% by weight of the epoxy compound and the second epoxy compound, and the content of the filler in the 100% by weight of the insulating film is 50% by weight. % Of the insulating film is provided.

  In a specific aspect of the resin composition for an insulating film and the insulating film according to the present invention, the content of the first epoxy compound in a total of 100% by weight of the first epoxy compound and the second epoxy compound. Is 15% by weight or less.

  In a specific aspect of the resin composition for an insulating film and the insulating film according to the present invention, an epoxy compound having a polycyclic aromatic skeleton is used as at least one of the first epoxy compound or the second epoxy compound. Including.

  In a specific aspect of the resin composition for an insulating film and the insulating film according to the present invention, the first epoxy compound is an epoxy compound having an aromatic skeleton.

  On the specific situation with the resin composition for insulating films which concerns on this invention, and an insulating film, the said filler is an inorganic filler.

  In a specific aspect of the resin composition for an insulating film and the insulating film according to the present invention, the filler is silica.

  In a specific aspect of the resin composition for an insulating film and the insulating film according to the present invention, a thermoplastic resin is included.

  On the specific situation with the resin composition for insulating films which concerns on this invention, and an insulating film, the said hardening | curing agent contains a cyanate ester compound, a phenol compound, or an active ester compound.

  The resin composition for insulating films and the insulating film according to the present invention are suitably used for forming an insulating layer in a multilayer printed wiring board.

  According to a wide aspect of the present invention, a circuit board, a plurality of insulating layers disposed on a surface of the circuit board, and a plurality of metal layers disposed between the insulating layers, the plurality of insulating layers are provided. A multilayer printed wiring board in which at least one of the layers is a cured product of the above-described resin composition for an insulating film is provided.

  According to a wide aspect of the present invention, a circuit board, a plurality of insulating layers disposed on a surface of the circuit board, and a plurality of metal layers disposed between the insulating layers, the plurality of insulating layers are provided. A multilayer printed wiring board is provided in which at least one of the layers is a cured product of the above-described insulating film.

  The resin composition for insulating films according to the present invention includes a first epoxy compound having one epoxy group, a second epoxy compound having two or more epoxy groups, a curing agent, and a filler. In the resin composition for insulating films according to the present invention, the content of the first epoxy compound is 33% by weight or less in a total of 100% by weight of the first epoxy compound and the second epoxy compound, The content of the filler is 50% by weight or more in 100% by weight of the component excluding the solvent in the resin composition for insulating film. Since the resin composition for an insulating film according to the present invention has the above-described configuration, the dielectric loss tangent can be lowered and the occurrence of cracks or cracks when the insulating film is bent can be prevented.

  The insulating film according to the present invention includes a first epoxy compound having one epoxy group, a second epoxy compound having two or more epoxy groups, a curing agent, and a filler. In the insulating film according to the present invention, the content of the first epoxy compound is 33% by weight or less in the total of 100% by weight of the first epoxy compound and the second epoxy compound, and the weight of the insulating film is 100% by weight. %, The content of the filler is 50% by weight or more. Since the insulating film according to the present invention has the above-described configuration, the dielectric loss tangent can be lowered and the occurrence of cracks or cracks when the insulating film is bent can be prevented.

FIG. 1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin composition for an insulating film or an insulating film according to an embodiment of the present invention.

  Hereinafter, the present invention will be described in detail.

  The resin composition for insulating films according to the present invention includes a first epoxy compound having one epoxy group, a second epoxy compound having two or more epoxy groups, a curing agent, and a filler. In the resin composition for insulating films according to the present invention, the content of the first epoxy compound is 33% by weight or less in a total of 100% by weight of the first epoxy compound and the second epoxy compound. In the resin composition for insulating films according to the present invention, the content of the filler is 50% by weight or more in 100% by weight of the components excluding the solvent in the resin composition for insulating films.

  The insulating film can be obtained by forming the resin composition for an insulating film according to the present invention into a film shape. The insulating film is an insulating film in which the resin composition for an insulating film is formed into a film. The resin composition for insulating films according to the present invention is used as an insulating film. Moreover, the resin composition for insulating films according to the present invention can be cured to form an insulating layer. The insulating film can be cured to form an insulating layer.

  The insulating film according to the present invention includes a first epoxy compound having one epoxy group, a second epoxy compound having two or more epoxy groups, a curing agent, and a filler. In the insulating film according to the present invention, the content of the first epoxy compound is 33% by weight or less in a total of 100% by weight of the first epoxy compound and the second epoxy compound. In the insulating film according to the present invention, the content of the filler is 50% by weight or more in 100% by weight of the insulating film.

  In the present invention, since the above-described configuration is provided, the dielectric loss tangent can be lowered and the occurrence of cracks or cracks when the insulating film is bent can be prevented.

  In the conventional resin composition for insulating films and insulating films, it is difficult to lower the dielectric loss tangent and prevent the bent insulating film from cracking or cracking. In particular, when the amount of the inorganic filler is small, even if it is possible to prevent the occurrence of cracks or cracks in the bent insulating film, if the amount of the inorganic filler is large, the bent insulation It is difficult to prevent the film from cracking or cracking. On the other hand, in this invention, even if there are many compounding quantities of an inorganic filler, a dielectric loss tangent can be made low and generation | occurrence | production of the crack or crack of the bent insulating film can be prevented.

  Furthermore, in the present invention, since the above-described configuration is provided, when the metal layer is disposed on the surface of the insulating layer formed by the cured product of the resin composition for insulating film or the cured product of the insulating film, The adhesive strength between the insulating layer (the cured product of the resin composition for insulating film or the cured product of the insulating film) and the metal layer can be increased.

  The resin composition for insulating films according to the present invention may be in the form of a film. The resin composition for insulating films according to the present invention may have fluidity. The resin composition for an insulating film according to the present invention may be in a paste form. The paste form includes liquid.

  Hereinafter, the detail of each component used for the resin composition for insulating films and insulating film which concerns on this invention, the use of the resin composition for insulating films and insulating film which concern on this invention, etc. are demonstrated.

[Epoxy compound]
The resin composition for an insulating film and the insulating film include a first epoxy compound having one epoxy group and a second epoxy compound having two or more epoxy groups. The first epoxy compound and the second epoxy compound are not particularly limited as long as they have the above number of epoxy groups. Conventionally known epoxy compounds can be used as the first epoxy compound and the second epoxy compound. Only 1 type may be used for a 1st epoxy compound and a 2nd epoxy compound, respectively, and 2 or more types may be used together.

  Examples of the first epoxy compound include epoxy compounds having an aromatic skeleton such as phenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, and naphthalene glycidyl ether, and allyl glycidyl ether, methyl glycidyl ether, ethyl glycidyl ether, and butyl glycidyl. Examples thereof include an epoxy compound having an alkyl chain such as ether.

  Examples of the second epoxy compound include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, and naphthalene. Type epoxy compound, fluorene type epoxy compound, phenol aralkyl type epoxy compound, naphthol aralkyl type epoxy compound, dicyclopentadiene type epoxy compound, anthracene type epoxy compound, epoxy compound having adamantane skeleton, epoxy compound having tricyclodecane skeleton, and Examples thereof include an epoxy compound having a triazine nucleus in the skeleton.

  From the viewpoint of further reducing the dielectric loss tangent and further improving the heat resistance, the resin composition for an insulating film and the insulating film are used as at least one of the first epoxy compound or the second epoxy compound. It is preferable to include an epoxy compound having an aromatic skeleton, and it is more preferable to include an epoxy compound having a plurality of aromatic skeletons. From the viewpoint of further reducing the dielectric loss tangent and further improving the heat resistance, the resin composition for an insulating film and the insulating film may contain an epoxy compound having an aromatic skeleton as the first epoxy compound. Preferably, it contains an epoxy compound having a plurality of aromatic skeletons. From the viewpoint of further lowering the dielectric loss tangent and further improving heat resistance, the epoxy compound having a plurality of aromatic skeletons is preferably an epoxy compound having a polycyclic aromatic skeleton, and an epoxy compound having a naphthalene skeleton. It is more preferable that In the present specification, the polycyclic aromatic skeleton does not include a skeleton in which an aromatic ring is not condensed.

  From the viewpoint of further reducing the dielectric loss tangent, the first epoxy compound is preferably an epoxy compound having an aromatic skeleton, and is preferably an epoxy compound having a naphthalene skeleton or a phenyl skeleton.

  The molecular weight of the first epoxy compound and the second epoxy compound is more preferably 1000 or less. In this case, even if the content of the filler in 100% by weight of the component excluding the solvent in the resin composition for an insulating film is 50% by weight or more, the resin composition for the insulating film has excellent embedding on the uneven surface. A thing is obtained. In this case, even if the content of the filler in 100% by weight of the insulating film is 50% by weight or more, an insulating film excellent in embeddability to the uneven surface can be obtained. For this reason, when the insulating film formed with the said resin composition for insulating films or the said insulating film is laminated on a board | substrate, a filler can be made to exist uniformly.

  The molecular weight of the first epoxy compound and the second epoxy compound and the molecular weight of the curing agent described below are specified when the epoxy compound or the curing agent is not a polymer and the structural formula of the epoxy compound or the curing agent. When possible, it means a molecular weight that can be calculated from the structural formula. Moreover, when the said epoxy compound or hardening | curing agent is a polymer, a weight average molecular weight is meant.

  From the viewpoint of lowering the dielectric loss tangent and preventing the occurrence of cracks or cracks in the bent insulating film, the first epoxy compound in a total of 100% by weight of the first epoxy compound and the second epoxy compound. The content of is not more than 33% by weight. From the viewpoint of effectively lowering the dielectric loss tangent and further preventing the occurrence of cracks or cracks in the bent insulating film, in a total of 100% by weight of the first epoxy compound and the second epoxy compound, The content of the first epoxy compound is preferably 15% by weight or less, more preferably 5% by weight or less, and still more preferably 1% by weight or less.

  The content of the first epoxy compound is preferably 0.001% by weight or more, more preferably 0.01% by weight or more, in a total of 100% by weight of the first epoxy compound and the second epoxy compound. More preferably, it is 0.05% by weight or more, particularly preferably 0.5% by weight or more, and most preferably 1% by weight or more. In this case, generation of cracks or cracks in the bent insulating film can be further prevented.

[Curing agent]
The hardening agent contained in the said resin composition for insulating films and the said insulating film is not specifically limited. A conventionally known curing agent can be used as the curing agent. As for the said hardening | curing agent, only 1 type may be used and 2 or more types may be used together.

  As the curing agent, cyanate ester compound (cyanate ester curing agent), phenol compound (phenol curing agent), amine compound (amine curing agent), thiol compound (thiol curing agent), imidazole compound, phosphine compound, acid anhydride, Examples include active ester compounds and dicyandiamide. The curing agent preferably has a functional group capable of reacting with the epoxy group of the first epoxy compound, and preferably has a functional group capable of reacting with the epoxy group of the second epoxy compound.

  Examples of the cyanate ester compound include novolac-type cyanate ester resins, bisphenol-type cyanate ester resins, and prepolymers in which these are partially trimerized. As said novolak-type cyanate ester resin, a phenol novolak-type cyanate ester resin, an alkylphenol-type cyanate ester resin, etc. are mentioned. Examples of the bisphenol type cyanate ester resin include bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, and tetramethylbisphenol F type cyanate ester resin.

  Commercially available products of the above-mentioned cyanate ester compounds include phenol novolac type cyanate ester resins (Lonza Japan "PT-30" and "PT-60"), and prepolymers (Lonza Japan) in which bisphenol type cyanate ester resins are trimerized. "BA-230S", "BA-3000S", "BTP-1000S", and "BTP-6020S") manufactured by the company.

  Examples of the phenol compound include novolak type phenol, biphenol type phenol, naphthalene type phenol, dicyclopentadiene type phenol, aralkyl type phenol, dicyclopentadiene type phenol and the like.

  Examples of commercially available phenolic compounds include novolak type phenol (“TD-2091” manufactured by DIC), biphenyl novolac type phenol (“MEH-7851” manufactured by Meiwa Kasei Co., Ltd.), and aralkyl type phenol compound (“MEH manufactured by Meiwa Kasei Co., Ltd.). -7800 "), and phenols having an aminotriazine skeleton (" LA1356 "and" LA3018-50P "manufactured by DIC).

  From the viewpoint of further reducing the dielectric loss tangent, the curing agent preferably contains a cyanate ester compound, a phenol compound or an active ester compound, and more preferably contains an active ester compound. The active ester compound means a compound containing at least one ester bond in the structure and having an aromatic ring bonded to both sides of the ester bond. Preferable examples of the active ester compound include a compound represented by the following formula (1).

  In said formula (1), X1 and X2 represent group containing an aromatic ring respectively. Preferable examples of the group containing an aromatic ring include a benzene ring which may have a substituent and a naphthalene ring which may have a substituent. A hydrocarbon group is mentioned as said substituent. The carbon number of the hydrocarbon group is preferably 12 or less, more preferably 6 or less, and still more preferably 4 or less.

  As a combination of X1 and X2, a combination of a benzene ring which may have a substituent and a benzene ring which may have a substituent, a benzene ring which may have a substituent and a substitution The combination with the naphthalene ring which may have a group is mentioned. Furthermore, examples of the combination of X1 and X2 include a combination of a naphthalene ring which may have a substituent and a naphthalene ring which may have a substituent.

  The active ester compound is not particularly limited. As a commercial item of the said active ester compound, "HPC-8000-65T", "EXB9416-70BK", "EXB8100-65T" by DIC, etc. are mentioned.

  The molecular weight of the curing agent is preferably 1000 or less. In this case, even if the content of the filler in 100% by weight of the component excluding the solvent in the resin composition for an insulating film is 50% by weight or more, the resin composition for the insulating film has excellent embedding on the uneven surface. A thing is obtained. In this case, even if the content of the filler in 100% by weight of the insulating film is 50% by weight or more, an insulating film excellent in embeddability to the uneven surface can be obtained. For this reason, when the insulating film or insulating film formed with the resin composition for insulating films is laminated on a board | substrate, a filler can be made to exist uniformly.

  The total content of the first epoxy compound, the second epoxy compound, and the curing agent is preferably 75% by weight in 100% by weight of the component excluding the filler and solvent in the resin composition for an insulating film. % Or more, more preferably 80% by weight or more, preferably 99% by weight or less, more preferably 97% by weight or less. In 100% by weight of the component excluding the filler in the insulating film, the total content of the first epoxy compound, the second epoxy compound and the curing agent is preferably 75% by weight or more, more preferably It is 80% by weight or more, preferably 99% by weight or less, more preferably 97% by weight or less. When the total content of the epoxy compound and the curing agent is not less than the above lower limit and not more than the above upper limit, a better cured product can be obtained and the melt viscosity can be adjusted, so that the dispersibility of the filler Will be better. Furthermore, it is possible to prevent the insulating film from spreading into unintended areas during the curing process. Furthermore, the dimensional change by the heat | fever of hardened | cured material can be suppressed further. Further, if the total content of the first epoxy compound, the second epoxy compound, and the curing agent is equal to or more than the lower limit, the melt viscosity does not become too low, and insulation is performed in an unintended region during the curing process. There exists a tendency for the resin composition for films or an insulating film to become difficult to spread too much. In addition, when the total content of the first epoxy compound, the second epoxy compound, and the curing agent is equal to or less than the upper limit, it is easy to embed holes or irregularities in the circuit board, and further, a filler. Tends to be non-uniformly present.

  The content of the curing agent is appropriately selected so that the first epoxy compound and the second epoxy compound are cured well. The content of the curing agent is preferably 20 in 100% by weight of the component excluding the filler and solvent in the resin composition for insulating film, or in 100% by weight of the component in the insulating film excluding the filler. % By weight or more, more preferably 30% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less. When the content of the curing agent is not less than the above lower limit and not more than the above upper limit, a better cured product is obtained, and the dielectric loss tangent is effectively reduced.

  100% by weight of the component excluding the filler and solvent in the insulating film resin composition means that when the insulating film resin composition contains a solvent, the filler and solvent in the insulating film resin composition It means 100% by weight of the excluded component. 100% by weight of the component excluding the filler and solvent in the insulating film resin composition means that, when the insulating film resin composition does not contain a solvent, the filler in the insulating film resin composition is excluded. Means 100% by weight of ingredients.

[Filler]
The said resin composition for insulating films and the said insulating film contain a filler. By using the filler, the dimensional change due to heat of the cured product is further reduced. Furthermore, the surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased.

  Examples of the filler include inorganic fillers and organic fillers. From the viewpoint of further reducing the dimensional change due to heat of the cured product, the filler is preferably an inorganic filler.

  Examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

  The surface roughness of the cured product is reduced, the adhesive strength between the cured product and the metal layer is further increased, finer wiring is formed on the surface of the cured product, and better insulation reliability is achieved by the cured product. From the viewpoint of imparting the above, the inorganic filler is preferably silica or alumina, more preferably silica, and still more preferably fused silica. By using silica, the coefficient of thermal expansion of the cured product is further reduced, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased. The shape of silica is preferably spherical.

  Regardless of the curing environment, the inorganic filler is spherical silica from the viewpoint of promoting the curing of the resin, effectively increasing the glass transition temperature of the cured product, and effectively reducing the thermal linear expansion coefficient of the cured product. It is preferable.

  The average particle diameter of the filler is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 150 nm or more, particularly preferably 0.3 μm or more, most preferably 0.6 μm or more, preferably 20 μm or less, more preferably It is 10 μm or less, more preferably 5 μm or less. When the average particle size of the filler is not less than the above lower limit and not more than the above upper limit, the adhesive strength between the cured product and the metal layer is further increased.

  A median diameter (d50) value of 50% is employed as the average particle diameter of the filler. The average particle size can be measured using a laser diffraction / scattering particle size distribution measuring apparatus.

  Each of the fillers is preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the cured product and the metal layer is effectively increased. When each of the fillers is spherical, the aspect ratio of each filler is preferably 2 or less, more preferably 1.5 or less.

  The filler is preferably surface-treated, more preferably a surface-treated product with a coupling agent, and still more preferably a surface-treated product with a silane coupling agent. Thereby, the surface roughness of the surface of the roughened cured product is further reduced, the adhesive strength between the cured product and the metal layer is further increased, and finer wiring is formed on the surface of the cured product, and more Better inter-wiring insulation reliability and interlayer insulation reliability can be imparted to the cured product.

  Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents. Examples of the silane coupling agent include methacryl silane, acrylic silane, amino silane, imidazole silane, vinyl silane, and epoxy silane.

  In 100% by weight of the component excluding the solvent of the resin composition for insulating film, or in 100% by weight of the insulating film, the content of the filler (in the case where the filler is an inorganic filler, the content of the inorganic filler) ) Is 50% by weight or more. In 100% by weight of the component excluding the solvent of the resin composition for insulating film, or in 100% by weight of the insulating film, the content of the filler (in the case where the filler is an inorganic filler, the content of the inorganic filler) ) Is preferably 60% by weight or more, more preferably 70% by weight or more. In 100% by weight of the component excluding the solvent of the resin composition for insulating film, or in 100% by weight of the insulating film, the content of the filler (in the case where the filler is an inorganic filler, the content of the inorganic filler) ) Is preferably 99% by weight or less, more preferably 85% by weight or less, still more preferably 80% by weight or less, and particularly preferably 75% by weight or less. When the total content of the filler is not less than the above lower limit and not more than the above upper limit, the surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased, and Finer wiring is formed on the surface of the cured product. Furthermore, with this amount of filler, it is possible to improve the smear removability at the same time as reducing the thermal expansion coefficient of the cured product. When the content of the filler is not less than the above lower limit, the dielectric loss tangent is effectively lowered.

  The component 100% by weight excluding the solvent in the resin composition for insulating film means 100% by weight of the component excluding the solvent in the resin composition for insulating film when the resin composition for insulating film contains a solvent. . The component 100% by weight excluding the solvent in the insulating film resin composition means 100% by weight of the insulating film resin composition when the insulating film resin composition does not contain a solvent.

[Thermoplastic resin]
From the viewpoint of effectively improving the handleability of the insulating film resin composition and the insulating film, the insulating film resin composition and the insulating film preferably include a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl acetal resin and phenoxy resin. As for the said thermoplastic resin, only 1 type may be used and 2 or more types may be used together.

  Regardless of the curing environment, the thermoplastic resin is preferably a phenoxy resin from the viewpoint of effectively reducing the dielectric loss tangent and effectively improving the adhesion of the metal wiring. By using the phenoxy resin, deterioration of the embedding property of the resin composition for insulating film or the insulating film with respect to the holes or irregularities of the circuit board and non-uniformity of the filler can be suppressed. In addition, the use of phenoxy resin makes it possible to adjust the melt viscosity, so that the dispersibility of the filler is improved, and the resin composition for insulating film or the insulating film is difficult to wet and spread in unintended areas during the curing process. . The phenoxy resin is not particularly limited. A conventionally known phenoxy resin can be used as the phenoxy resin. As for the said phenoxy resin, only 1 type may be used and 2 or more types may be used together.

  Examples of the phenoxy resin include phenoxy resins having a skeleton such as a bisphenol A skeleton, a bisphenol F skeleton, a bisphenol S skeleton, a biphenyl skeleton, a novolac skeleton, a naphthalene skeleton, and an imide skeleton.

  Examples of commercially available phenoxy resins include “YP50”, “YP55” and “YP70” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and “1256B40”, “4250”, “4256H40” manufactured by Mitsubishi Chemical Corporation, “ 4275 "," YX6954BH30 "," YX8100BH30 ", and the like.

  From the viewpoint of obtaining a resin composition for an insulating film or an insulating film that is more excellent in storage stability, the weight average molecular weight of the thermoplastic resin is preferably 5000 or more, more preferably 10,000 or more, preferably 100,000 or less, more preferably. Is 50000 or less.

  The said weight average molecular weight of the said thermoplastic resin shows the weight average molecular weight in polystyrene conversion measured by gel permeation chromatography (GPC).

  Content of the said thermoplastic resin and the said phenoxy resin is not specifically limited. The content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) in 100% by weight of the component excluding the filler and solvent in the resin composition for an insulating film is preferably It is 2% by weight or more, more preferably 4% by weight or more, preferably 15% by weight or less, more preferably 10% by weight or less. In 100% by weight of the component excluding the filler in the insulating film, the content of the thermoplastic resin (the content of the phenoxy resin when the thermoplastic resin is a phenoxy resin) is preferably 2% by weight or more. Preferably it is 4 weight% or more, Preferably it is 15 weight% or less, More preferably, it is 10 weight% or less. When the content of the thermoplastic resin is not less than the above lower limit and not more than the above upper limit, the embedding property of the resin composition for an insulating film or the holes or irregularities of the circuit board of the insulating film becomes good. When the content of the thermoplastic resin is not less than the above lower limit, the formation of the insulating film is further facilitated, and an even better insulating layer is obtained. When the content of the thermoplastic resin is not more than the above upper limit, the thermal expansion coefficient of the cured product is further reduced. The surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the cured product and the metal layer is further increased.

[Curing accelerator]
It is preferable that the said resin composition for insulating films and the said insulating film contain a hardening accelerator. By using the curing accelerator, the curing rate is further increased. By rapidly curing the resin composition for an insulating film or the insulating film, the crosslinked structure in the cured product becomes uniform, the number of unreacted functional groups decreases, and the crosslinking density increases as a result. The said hardening accelerator is not specifically limited, A conventionally well-known hardening accelerator can be used. As for the said hardening accelerator, only 1 type may be used and 2 or more types may be used together.

  Examples of the curing accelerator include imidazole compounds, phosphorus compounds, amine compounds, and organometallic compounds.

  Examples of the imidazole compound include 2-undecylimidazole, 2-heptadecylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2 ′ -Methyl Midazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6 [2′-Ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine Isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethylimidazole Can be mentioned.

  Examples of the phosphorus compound include triphenylphosphine.

  Examples of the amine compound include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine and 4,4-dimethylaminopyridine.

  Examples of the organometallic compound include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), and trisacetylacetonate cobalt (III).

  The content of the curing accelerator is not particularly limited. In 100% by weight of the component excluding the filler and solvent in the resin composition for insulating film, the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.9% by weight or more, preferably It is 3.0 weight% or less, More preferably, it is 1.8 weight% or less. In 100% by weight of the component excluding the filler in the insulating film, the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.9% by weight or more, preferably 3.0% by weight or less. More preferably, it is 1.8% by weight or less. When the content of the curing accelerator is not less than the above lower limit and not more than the above upper limit, the resin composition for insulating film or the insulating film is efficiently cured. If content of the said hardening accelerator is a more preferable range, the storage stability of the resin composition for insulating films or an insulating film will become still higher, and a much better hardened | cured material will be obtained.

[solvent]
The resin composition for an insulating film and the insulating film do not contain or contain a solvent. By using the solvent, the viscosity of the resin composition for insulating film can be controlled within a suitable range, and the coating property of the resin composition for insulating film or the insulating film can be enhanced. Moreover, the said solvent may be used in order to obtain the slurry containing the said filler. As for the said solvent, only 1 type may be used and 2 or more types may be used together.

  Examples of the solvent include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, Examples thereof include N, N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone, and naphtha as a mixture.

  Most of the solvent is preferably removed when the insulating film resin composition is formed into a film. Therefore, the boiling point of the solvent is preferably 200 ° C. or lower, more preferably 180 ° C. or lower. Content of the said solvent in the said resin composition for insulating films is not specifically limited. The content of the solvent can be appropriately changed in consideration of the coating property of the resin composition for an insulating film.

[Other ingredients]
For the purpose of improving impact resistance, heat resistance, resin compatibility, workability, etc., the resin composition for insulating film and the insulating film include a leveling agent, a flame retardant, a coupling agent, a colorant, and an antioxidant. You may add other thermosetting resins other than an agent, an ultraviolet degradation inhibitor, an antifoamer, a thickener, a thixotropic agent, and an epoxy compound.

  Examples of the coupling agent include silane coupling agents, titanium coupling agents, and aluminum coupling agents. Examples of the silane coupling agent include vinyl silane, amino silane, imidazole silane, and epoxy silane.

  Examples of the other thermosetting resins include polyphenylene ether resins, divinyl benzyl ether resins, polyarylate resins, diallyl phthalate resins, polyimide resins, benzoxazine resins, benzoxazole resins, bismaleimide resins, and acrylate resins.

(Insulating film and laminated film)
The insulating film can be obtained by forming the resin composition for an insulating film according to the present invention into a film shape. The insulating film is preferably a B stage film.

  From the viewpoint of more uniformly controlling the degree of cure of the insulating film, the thickness of the insulating film is preferably 5 μm or more, and preferably 200 μm or less.

  Examples of a method for forming an insulating film resin composition into a film to obtain an insulating film include the following methods. (1) An extrusion molding method in which a resin composition for an insulating film is melt-kneaded using an extruder, extruded, and then molded into a film by a T-die or a circular die. (2) A casting molding method in which a resin composition for an insulating film containing a solvent is cast to form a film. (3) Other conventionally known film forming methods. The extrusion molding method or the casting molding method is preferable because it can cope with the reduction in thickness. The film includes a sheet.

  An insulating film which is a B stage film is obtained by forming the resin composition for an insulating film into a film and drying it by heating at 50 to 150 ° C. for 1 to 10 minutes, for example, to such an extent that curing by heat does not proceed excessively. Can do.

  The film-like resin composition for an insulating film that can be obtained by the drying process as described above is referred to as a B-stage film. The B-stage film is in a semi-cured state. The semi-cured product is not completely cured and curing can proceed further.

  The insulating film may not be a prepreg. When the insulating film is not a prepreg, migration does not occur along the glass cloth or the like. In addition, when laminating or pre-curing the insulating film, unevenness due to glass cloth does not occur on the surface. The said insulating film can be used with the form of a laminated film provided with metal foil or a base material, and the insulating film laminated | stacked on the surface of this metal foil or base material. The metal foil is preferably a copper foil.

  Examples of the substrate of the laminated film include polyester resin films such as polyethylene terephthalate film and polybutylene terephthalate film, olefin resin films such as polyethylene film and polypropylene film, and polyimide resin film. The surface of the base material may be subjected to a release treatment as necessary.

  The thickness of the insulating film is preferably 5 μm or more, and preferably 200 μm or less. When using the said insulating film as an insulating layer of a circuit, it is preferable that the thickness of the insulating layer formed with the said insulating film is more than the thickness of the conductor layer (metal layer) which forms a circuit. The thickness of the insulating layer is preferably 5 μm or more, and preferably 200 μm or less.

(Semiconductor devices, printed wiring boards, copper-clad laminates and multilayer printed wiring boards)
The resin composition for an insulating film and the insulating film are suitably used for forming a mold resin for embedding a semiconductor chip in a semiconductor device.

  The said resin composition for insulating films and the said insulating film are used suitably in order to form an insulating layer in a multilayer printed wiring board.

  The printed wiring board can be obtained, for example, by heat-pressing the resin composition for an insulating film or the insulating film.

  A metal foil can be laminated on one side or both sides of the insulating film. The method for laminating the insulating film and the metal foil is not particularly limited, and a known method can be used. For example, the insulating film can be laminated on the metal foil while using a device such as a parallel plate press or a roll laminator while applying pressure while heating or without heating.

  The said insulating film is used suitably in order to obtain a copper clad laminated board. An example of the copper-clad laminate is a copper-clad laminate comprising a copper foil and an insulating film laminated on one surface of the copper foil.

  The thickness of the copper foil of the copper-clad laminate is not particularly limited. The thickness of the copper foil is preferably in the range of 1 to 50 μm. Moreover, in order to raise the adhesive strength of the hardened | cured material of the said insulating film, and copper foil, it is preferable that the said copper foil has a fine unevenness | corrugation on the surface. The method for forming the unevenness is not particularly limited. Examples of the method for forming the unevenness include a formation method by treatment using a known chemical solution.

  The said resin composition for insulating films and the said insulating film are used suitably in order to obtain a multilayer substrate.

  As an example of the multilayer substrate, a multilayer substrate including a circuit substrate and an insulating layer stacked on the circuit substrate can be given. The insulating layer of the multilayer substrate is formed of the insulating film resin composition or the insulating film. Moreover, the insulating layer of the multilayer substrate may be formed of the insulating film of the laminated film using a laminated film. The insulating layer is preferably laminated on the surface of the circuit board on which the circuit is provided. Part of the insulating layer is preferably embedded between the circuits.

  In the multilayer substrate, it is preferable that the surface of the insulating layer opposite to the surface on which the circuit substrate is laminated is roughened.

  As the roughening treatment method, a conventionally known roughening treatment method can be used, and it is not particularly limited. The surface of the insulating layer may be subjected to a swelling treatment before the roughening treatment.

  Moreover, it is preferable that the said multilayer substrate is further equipped with the copper plating layer laminated | stacked on the surface by which the roughening process of the said insulating layer was carried out.

  As another example of the multilayer board, the circuit board, the insulating layer laminated on the surface of the circuit board, and the surface of the insulating layer opposite to the surface on which the circuit board is laminated are laminated. And a multilayer substrate provided with copper foil. The said insulating layer and the said copper foil harden the said resin composition for insulating films, or the said insulating film using the copper clad laminated board provided with the resin film laminated | stacked on one surface of copper foil and this copper foil. It is preferable that it is formed. Furthermore, it is preferable that the copper foil is etched and is a copper circuit.

  Another example of the multilayer substrate is a multilayer substrate including a circuit board and a plurality of insulating layers stacked on the surface of the circuit board. At least one layer among the plurality of insulating layers arranged on the circuit board is formed using the insulating resin composition or the insulating film. It is preferable that the multilayer substrate further includes a circuit laminated on at least one surface of the insulating layer formed using the resin film.

  Among multilayer substrates, multilayer printed wiring boards are required to have a low dielectric loss tangent and to have high insulation reliability due to an insulating layer. In the resin composition for an insulating film and the insulating film according to the present invention, the insulation reliability can be effectively increased by reducing the dielectric loss tangent and preventing the occurrence of cracks or cracks in the bent insulating film. Therefore, the resin composition for insulating films and the insulating film according to the present invention are suitably used for forming an insulating layer in a multilayer printed wiring board.

  The multilayer printed wiring board includes, for example, a circuit board, a plurality of insulating layers arranged on the surface of the circuit board, and a metal layer arranged between the plurality of insulating layers. At least one of the insulating layers is a cured product of the resin composition for an insulating film or a cured product of the insulating film.

  FIG. 1 is a cross-sectional view schematically showing a multilayer printed wiring board using a resin composition for an insulating film or an insulating film according to an embodiment of the present invention.

  In the multilayer printed wiring board 11 shown in FIG. 1, a plurality of insulating layers 13 to 16 are laminated on the upper surface 12 a of the circuit board 12. Insulating layers 13-16 are hardened material layers. A metal layer 17 is formed in a partial region of the upper surface 12 a of the circuit board 12. Among the plurality of insulating layers 13 to 16, the metal layer 17 is formed in a partial region of the upper surface of the insulating layers 13 to 15 other than the insulating layer 16 located on the outer surface opposite to the circuit board 12 side. Has been. The metal layer 17 is a circuit. Metal layers 17 are respectively disposed between the circuit board 12 and the insulating layer 13 and between the stacked insulating layers 13 to 16. The lower metal layer 17 and the upper metal layer 17 are connected to each other by at least one of via hole connection and through hole connection (not shown).

  In the multilayer printed wiring board 11, the insulating layers 13-16 are formed with the said resin composition for insulating films, or the said insulating film. In this embodiment, since the surfaces of the insulating layers 13 to 16 are roughened, fine holes (not shown) are formed on the surfaces of the insulating layers 13 to 16. Further, the metal layer 17 reaches the inside of the fine hole. Moreover, in the multilayer printed wiring board 11, the width direction dimension (L) of the metal layer 17 and the width direction dimension (S) of the part in which the metal layer 17 is not formed can be made small. In the multilayer printed wiring board 11, good insulation reliability is imparted between an upper metal layer and a lower metal layer that are not connected by via-hole connection and through-hole connection (not shown).

(Roughening treatment and swelling treatment)
The insulating film is preferably used to obtain a cured product that is roughened or desmeared. The cured product includes a precured product that can be further cured.

  In order to form fine irregularities on the surface of the cured product obtained by pre-curing the insulating film, the cured product is preferably roughened. Prior to the roughening treatment, the cured product is preferably subjected to a swelling treatment. The cured product is preferably subjected to a swelling treatment after preliminary curing and before the roughening treatment, and is further cured after the roughening treatment. However, the cured product is not necessarily subjected to the swelling treatment.

  As a method for the swelling treatment, for example, a method of treating a cured product with an aqueous solution or an organic solvent dispersion of a compound containing ethylene glycol or the like as a main component is used. The swelling liquid used for the swelling treatment generally contains an alkali as a pH adjuster or the like. The swelling liquid preferably contains sodium hydroxide. Specifically, for example, the swelling treatment is performed by treating the cured product with a 40 wt% ethylene glycol aqueous solution at a treatment temperature of 30 to 85 ° C. for 1 to 30 minutes. The swelling treatment temperature is preferably in the range of 50 to 85 ° C. When the temperature of the swelling treatment is too low, it takes a long time for the swelling treatment, and the adhesive strength between the cured product and the metal layer tends to be low.

  For the roughening treatment, for example, a chemical oxidizing agent such as a manganese compound, a chromium compound, or a persulfuric acid compound is used. These chemical oxidizers are used as an aqueous solution or an organic solvent dispersion after water or an organic solvent is added. The roughening liquid used for the roughening treatment generally contains an alkali as a pH adjuster or the like. The roughening solution preferably contains sodium hydroxide.

  Examples of the manganese compound include potassium permanganate and sodium permanganate. Examples of the chromium compound include potassium dichromate and anhydrous potassium chromate. Examples of the persulfate compound include sodium persulfate, potassium persulfate, and ammonium persulfate.

  The arithmetic average roughness Ra of the surface of the cured product is preferably 10 nm or more, preferably less than 300 nm, more preferably less than 200 nm, and still more preferably less than 100 nm. In this case, the adhesive strength between the cured product and the metal layer is increased, and further finer wiring is formed on the surface of the insulating layer. Furthermore, conductor loss can be suppressed and signal loss can be suppressed low.

(Desmear treatment)
A through-hole may be formed in the hardened | cured material obtained by precuring the said insulating film. In the multilayer substrate or the like, a via or a through hole is formed as a through hole. For example, the via can be formed by irradiation with a laser such as a CO ₂ laser. The diameter of the via is not particularly limited, but is about 60 to 80 μm. Due to the formation of the through hole, a smear, which is a resin residue derived from the resin component contained in the cured product, is often formed at the bottom of the via.

  In order to remove the smear, the surface of the cured product is preferably desmeared. The desmear process may also serve as a roughening process.

  In the desmear treatment, for example, a chemical oxidant such as a manganese compound, a chromium compound, or a persulfate compound is used in the same manner as the roughening treatment. These chemical oxidizers are used as an aqueous solution or an organic solvent dispersion after water or an organic solvent is added. The desmear treatment liquid used for the desmear treatment generally contains an alkali. The desmear treatment liquid preferably contains sodium hydroxide.

  The use of the insulating film sufficiently reduces the surface roughness of the desmeared cured product.

  Hereinafter, the present invention will be specifically described by giving examples and comparative examples. The present invention is not limited to the following examples.

(First epoxy compound)
Naphthalene-type epoxy compound 1 (“1- (glycidyloxy) naphthalene”, epoxy equivalent 210, manufactured by J & K SCIENTIFIC)
Phenyl epoxy compound (“ED-529” manufactured by ADEKA, epoxy equivalent 180)
Alkyl chain type epoxy compound (“ED-502” manufactured by ADEKA, epoxy equivalent 320)

(Second epoxy compound)
Biphenyl type epoxy compound (Nippon Kayaku Co., Ltd. “NC3000”, epoxy equivalent 271)
Dicyclopentadiene type epoxy compound (“XD1000” manufactured by Nippon Kayaku Co., epoxy equivalent 254)
Naphthalene type epoxy compound 2 (manufactured by DIC "HP-6000", epoxy equivalent 250)

(Curing agent)
Active ester curing agent-containing liquid (DIC Corporation "EXB9416-70BK", equivalent 330, solid content 70 wt%, methyl isobutyl ketone content 30 wt%)
Aminotriazine skeleton phenol novolac curing agent-containing liquid (“LA1356” manufactured by DIC, equivalent 151, solid content 60 wt%, methyl ethyl ketone content 40 wt%)
Cyanate ester type curing agent-containing liquid ("BA-3000S" manufactured by Lonza Japan Co., Ltd., equivalent 234, solid content 75% by weight, toluene content 25% by weight)

(Filler)
Silica-containing slurry (“C4 silica” manufactured by Admatechs, silica average particle size 1.0 μm, content of silica 75% by weight, cyclohexanone content 25% by weight)

(Curing accelerator)
Imidazole compound (“2P4MZ” manufactured by Shikoku Chemicals)

(Thermoplastic resin)
Phenoxy resin-containing liquid (Mitsubishi Chemical Corporation “YX6954BH30”, containing biphenyl skeleton, solid content 30 wt%, cyclohexanone content 35 wt%, methyl ethyl ketone content 35 wt%)

(Examples 1-7 and Comparative Examples 1-4)
The components shown in Table 1 below are blended in the blending amounts shown in Table 1 below (unit: parts by weight of solid content), and stirred at room temperature until a uniform solution is obtained. Resin composition for insulating film (resin composition varnish) )

  After applying the resin composition for insulating film (resin composition varnish) obtained on the release-treated surface of the release-treated PET film (“XG284” manufactured by Toray Industries Inc., thickness 25 μm) using an applicator And dried in a gear oven at 100 ° C. for 3 minutes to volatilize the solvent. In this way, an insulating film (laminated film of PET film and insulating film) having a thickness of 40 μm was obtained on the PET film.

(Evaluation)
(1) Dielectric loss tangent The obtained insulating film was cured on a PET film at 180 ° C. for 30 minutes, and further cured at 190 ° C. for 120 minutes to obtain a cured body. The obtained cured body was cut into a size of 2 mm in width and 80 mm in length, and 10 sheets were overlapped to obtain a laminate having a thickness of 400 μm. The obtained laminate was measured at room temperature (23 ° C.) by the cavity resonance method using “Cavity resonance perturbation method dielectric constant measuring device CP521” manufactured by Kanto Electronics Application Development Co., Ltd. and “Network Analyzer E8362B” manufactured by Agilent Technologies. The dielectric loss tangent was measured at 5.8 GHz.

[Criteria for dielectric loss tangent]
◯: Dielectric loss tangent is 0.0045 or less ○: Dielectric tangent exceeds 0.0045, 0.005 or less ×: Dielectric tangent exceeds 0.005

(2) Bending test The obtained laminated film was cut out into a rectangle of 10 cm in length and 5 cm in width. The center of the laminated film in the length direction was bent 90 degrees so that the insulating film side was inward, and then returned to a flat shape. Thereafter, the presence or absence of cracks and cracks in the insulating film was confirmed.

[Criteria for bending test]
○○: No cracks and cracks ○: Slightly cracked ×: Cracked or severely cracked

(3) Cutter test The obtained laminated film was cut out into a rectangle of 10 cm in length and 5 cm in width. Four cuts of 8 cm in the vertical direction were made in the insulating film with a cutter. The cut portion was visually observed to check for chipping.

[Criteria for cutter test]
○○: No chipping ○: Slightly chipping ×: Quite chipping

(4) Glass transition temperature Tg
The obtained insulating film was stored at a temperature of 23 ° C. and a humidity of 30% for 1 month or more, and then press molded with a press molding machine to obtain a measurement object. About this measuring object, it measured using "ARES-G2" by TAINSTRUMENTS. As a jig, a parallel plate having a diameter of 8 mm was used, and the measurement was performed under the condition of decreasing the temperature from 100 ° C. to −10 ° C. at a temperature decreasing rate of 3 ° C./min, and under the conditions of frequency 1 Hz and strain 1%. In the obtained measurement results, the peak temperature of the loss tangent was defined as the glass transition temperature Tg (° C.).

[Criteria for determination of glass transition temperature Tg]
○○: Tg is 180 ° C. or higher ○: Tg is 160 ° C. or higher and lower than 180 ° C. X: Tg is lower than 160 ° C.

(5) Average coefficient of linear expansion (CTE)
The obtained insulating film was cured on a PET film at 180 ° C. for 30 minutes, and further cured at 190 ° C. for 120 minutes to obtain a cured product. The cured body was cut into a size of 3 mm × 25 mm. Using a thermomechanical analyzer (“EXSTAR TMA / SS6100” manufactured by SII Nano Technology), the cured product cut at 25 ° C. to 150 ° C. under conditions of a tensile load of 33 mN and a heating rate of 5 ° C./min. The average linear expansion coefficient (ppm / ° C.) was calculated.

[Criteria for average linear expansion coefficient]
○○: Average linear expansion coefficient is 25 ppm / ° C. or less ○: Average linear expansion coefficient exceeds 25 ppm / ° C., 30 ppm / ° C. or less ×: Average linear expansion coefficient exceeds 30 ppm / ° C.

  The composition and results are shown in Table 1 below. In addition, the compounding quantity of each component in Table 1 was shown by the compounding quantity of solid content.

DESCRIPTION OF SYMBOLS 11 ... Multilayer printed wiring board 12 ... Circuit board 12a ... Upper surface 13-16 ... Insulating layer 17 ... Metal layer

Claims (20)

A first epoxy compound having one epoxy group, a second epoxy compound having two or more epoxy groups, a curing agent, and a filler,
In a total of 100% by weight of the first epoxy compound and the second epoxy compound, the content of the first epoxy compound is 33% by weight or less,
The resin composition for insulating films whose content of the said filler is 50 weight% or more in 100 weight% of components except the solvent in the resin composition for insulating films.   The resin composition for an insulating film according to claim 1, wherein the content of the first epoxy compound is 15% by weight or less in a total of 100% by weight of the first epoxy compound and the second epoxy compound. .   The resin composition for insulating films according to claim 1 or 2, comprising an epoxy compound having a polycyclic aromatic skeleton as at least one of the first epoxy compound or the second epoxy compound.   The resin composition for insulating films according to any one of claims 1 to 3, wherein the first epoxy compound is an epoxy compound having an aromatic skeleton.   The resin composition for insulating films according to any one of claims 1 to 4, wherein the filler is an inorganic filler.   The resin composition for insulating films according to claim 1, wherein the filler is silica.   The resin composition for insulating films according to claim 1, comprising a thermoplastic resin.   The resin composition for insulating films of any one of Claims 1-7 in which the said hardening | curing agent contains a cyanate ester compound, a phenol compound, or an active ester compound.   The resin composition for insulating films of any one of Claims 1-8 used in order to form an insulating layer in a multilayer printed wiring board. A circuit board;
A plurality of insulating layers disposed on a surface of the circuit board;
A metal layer disposed between the plurality of insulating layers,
The multilayer printed wiring board whose at least 1 layer of the said some insulating layers is a hardened | cured material of the resin composition for insulating films of any one of Claims 1-9. A first epoxy compound having one epoxy group, a second epoxy compound having two or more epoxy groups, a curing agent, and a filler,
In a total of 100% by weight of the first epoxy compound and the second epoxy compound, the content of the first epoxy compound is 33% by weight or less,
The insulating film whose content of the said filler is 50 weight% or more in 100 weight% of insulating films.   The insulating film according to claim 11, wherein the content of the first epoxy compound is 15% by weight or less in a total of 100% by weight of the first epoxy compound and the second epoxy compound.   The insulating film according to claim 11 or 12, comprising an epoxy compound having a polycyclic aromatic skeleton as at least one of the first epoxy compound or the second epoxy compound.   The insulating film according to any one of claims 11 to 13, wherein the first epoxy compound is an epoxy compound having an aromatic skeleton.   The insulating film according to claim 11, wherein the filler is an inorganic filler.   The insulating film according to claim 11, wherein the filler is silica.   The insulating film of any one of Claims 11-16 containing a thermoplastic resin.   The insulating film according to any one of claims 11 to 17, wherein the curing agent includes a cyanate ester compound, a phenol compound, or an active ester compound.   The insulating film of any one of Claims 11-18 used in order to form an insulating layer in a multilayer printed wiring board. A circuit board;
A plurality of insulating layers disposed on a surface of the circuit board;
A metal layer disposed between the plurality of insulating layers,
The multilayer printed wiring board whose at least 1 layer of the said some insulating layers is a hardened | cured material of the insulating film of any one of Claims 11-19.

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