JP6135275B2 - 保護膜形成用スパッタリングターゲット - Google Patents

保護膜形成用スパッタリングターゲット Download PDF

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Publication number
JP6135275B2
JP6135275B2 JP2013089721A JP2013089721A JP6135275B2 JP 6135275 B2 JP6135275 B2 JP 6135275B2 JP 2013089721 A JP2013089721 A JP 2013089721A JP 2013089721 A JP2013089721 A JP 2013089721A JP 6135275 B2 JP6135275 B2 JP 6135275B2
Authority
JP
Japan
Prior art keywords
mass
protective film
sputtering target
film
wiring film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013089721A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014214318A (ja
Inventor
曉 森
曉 森
野中　荘平
荘平 野中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2013089721A priority Critical patent/JP6135275B2/ja
Priority to US14/247,591 priority patent/US10538059B2/en
Priority to TW103113232A priority patent/TWI627295B/zh
Priority to CN201410151582.3A priority patent/CN104109837B/zh
Priority to KR1020140045869A priority patent/KR102220851B1/ko
Publication of JP2014214318A publication Critical patent/JP2014214318A/ja
Application granted granted Critical
Publication of JP6135275B2 publication Critical patent/JP6135275B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C18/00—Alloys based on zinc
    • C22C18/02—Alloys based on zinc with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2013089721A 2013-04-22 2013-04-22 保護膜形成用スパッタリングターゲット Expired - Fee Related JP6135275B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013089721A JP6135275B2 (ja) 2013-04-22 2013-04-22 保護膜形成用スパッタリングターゲット
US14/247,591 US10538059B2 (en) 2013-04-22 2014-04-08 Sputtering target for forming protective film, and laminated wiring film
TW103113232A TWI627295B (zh) 2013-04-22 2014-04-10 保護膜形成用濺射靶及層疊配線膜
CN201410151582.3A CN104109837B (zh) 2013-04-22 2014-04-15 保护膜形成用溅射靶及层叠配线膜
KR1020140045869A KR102220851B1 (ko) 2013-04-22 2014-04-17 보호막 형성용 스퍼터링 타깃 및 적층 배선막

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013089721A JP6135275B2 (ja) 2013-04-22 2013-04-22 保護膜形成用スパッタリングターゲット

Publications (2)

Publication Number Publication Date
JP2014214318A JP2014214318A (ja) 2014-11-17
JP6135275B2 true JP6135275B2 (ja) 2017-05-31

Family

ID=51706821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013089721A Expired - Fee Related JP6135275B2 (ja) 2013-04-22 2013-04-22 保護膜形成用スパッタリングターゲット

Country Status (5)

Country Link
US (1) US10538059B2 (zh)
JP (1) JP6135275B2 (zh)
KR (1) KR102220851B1 (zh)
CN (1) CN104109837B (zh)
TW (1) TWI627295B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5979034B2 (ja) 2013-02-14 2016-08-24 三菱マテリアル株式会社 保護膜形成用スパッタリングターゲット
CN104685977B (zh) * 2013-05-13 2016-09-28 株式会社爱发科 装载装置及其制造方法
JP5757318B2 (ja) * 2013-11-06 2015-07-29 三菱マテリアル株式会社 保護膜形成用スパッタリングターゲットおよび積層配線膜
JP6384267B2 (ja) * 2014-10-24 2018-09-05 大同特殊鋼株式会社 積層体
JP6250614B2 (ja) * 2015-02-19 2017-12-20 株式会社神戸製鋼所 Ｃｕ積層膜、およびＣｕ合金スパッタリングターゲット
KR20170083611A (ko) * 2015-09-25 2017-07-18 울박, 인크 스퍼터링 타겟, 타겟 제조 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4110132A (en) * 1976-09-29 1978-08-29 Olin Corporation Improved copper base alloys
JPS5976453A (ja) * 1982-10-19 1984-05-01 Mitsubishi Metal Corp 半導体装置のリ−ド材用Ｃｕ合金クラツド材
AU6279296A (en) * 1996-06-12 1998-01-07 International Business Machines Corporation Lead-free, high tin ternary solder alloy of tin, silver, and indium
US6123783A (en) * 1997-02-06 2000-09-26 Heraeus, Inc. Magnetic data-storage targets and methods for preparation
JPH111735A (ja) * 1997-04-14 1999-01-06 Mitsubishi Shindoh Co Ltd プレス打抜き加工性に優れた耐食性高強度Ｃｕ合金
US6123738A (en) 1998-08-19 2000-09-26 The Dow Chemical Company Process for the production of low color 2,3-epoxypropyltrialkylammonium halide
TWI223673B (en) * 2002-07-25 2004-11-11 Hitachi Metals Ltd Target and manufacturing method thereof
US20060233692A1 (en) * 2004-04-26 2006-10-19 Mainstream Engineering Corp. Nanotube/metal substrate composites and methods for producing such composites
TWI254747B (en) * 2005-03-01 2006-05-11 Ritdisplay Corp Alloy target for conductive film or its protection layer and manufacturing method thereof
JP5532767B2 (ja) * 2009-09-04 2014-06-25 大同特殊鋼株式会社 Ｃｕ電極保護膜用ＮｉＣｕ合金ターゲット材
JP5895370B2 (ja) 2010-08-30 2016-03-30 大同特殊鋼株式会社 パネル用Ｃｕ電極保護膜用ＮｉＣｕ合金ターゲット材及び積層膜

Also Published As

Publication number Publication date
KR20140126252A (ko) 2014-10-30
TWI627295B (zh) 2018-06-21
JP2014214318A (ja) 2014-11-17
CN104109837A (zh) 2014-10-22
US10538059B2 (en) 2020-01-21
US20140315043A1 (en) 2014-10-23
KR102220851B1 (ko) 2021-02-25
TW201510247A (zh) 2015-03-16
CN104109837B (zh) 2018-01-16

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