JP6132838B2 - 照明制御 - Google Patents
照明制御 Download PDFInfo
- Publication number
- JP6132838B2 JP6132838B2 JP2014518591A JP2014518591A JP6132838B2 JP 6132838 B2 JP6132838 B2 JP 6132838B2 JP 2014518591 A JP2014518591 A JP 2014518591A JP 2014518591 A JP2014518591 A JP 2014518591A JP 6132838 B2 JP6132838 B2 JP 6132838B2
- Authority
- JP
- Japan
- Prior art keywords
- illumination
- optical
- conjugate plane
- objective lens
- pupil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005286 illumination Methods 0.000 claims description 215
- 230000003287 optical effect Effects 0.000 claims description 201
- 210000001747 pupil Anatomy 0.000 claims description 113
- 230000004075 alteration Effects 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 41
- 230000010287 polarization Effects 0.000 claims description 33
- 239000006185 dispersion Substances 0.000 claims description 28
- 230000005855 radiation Effects 0.000 claims description 9
- 230000004044 response Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 238000012937 correction Methods 0.000 claims description 6
- 230000003595 spectral effect Effects 0.000 claims description 5
- 238000001228 spectrum Methods 0.000 claims description 5
- 230000003068 static effect Effects 0.000 claims description 5
- 238000003491 array Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000007373 indentation Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 16
- 230000006870 function Effects 0.000 description 12
- 238000004458 analytical method Methods 0.000 description 8
- 230000001276 controlling effect Effects 0.000 description 7
- 230000001427 coherent effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 238000005457 optimization Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 241000276498 Pollachius virens Species 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000005314 correlation function Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000008713 feedback mechanism Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000004204 optical analysis method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000001454 recorded image Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/0016—Technical microscopes, e.g. for inspection or measuring in industrial production processes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/06—Means for illuminating specimens
- G02B21/08—Condensers
- G02B21/082—Condensers for incident illumination only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/36—Microscopes arranged for photographic purposes or projection purposes or digital imaging or video purposes including associated control and data processing arrangements
- G02B21/365—Control or image processing arrangements for digital or video microscopes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/18—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical projection, e.g. combination of mirror and condenser and objective
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Analytical Chemistry (AREA)
- Multimedia (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microscoopes, Condenser (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/170,025 | 2011-06-27 | ||
| US13/170,025 US8681413B2 (en) | 2011-06-27 | 2011-06-27 | Illumination control |
| PCT/US2012/041273 WO2013002988A2 (en) | 2011-06-27 | 2012-06-07 | Illumination control |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014521116A JP2014521116A (ja) | 2014-08-25 |
| JP2014521116A5 JP2014521116A5 (OSRAM) | 2015-07-09 |
| JP6132838B2 true JP6132838B2 (ja) | 2017-05-24 |
Family
ID=47361608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014518591A Active JP6132838B2 (ja) | 2011-06-27 | 2012-06-07 | 照明制御 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8681413B2 (OSRAM) |
| EP (1) | EP2724361B1 (OSRAM) |
| JP (1) | JP6132838B2 (OSRAM) |
| KR (1) | KR101982363B1 (OSRAM) |
| TW (1) | TWI564539B (OSRAM) |
| WO (1) | WO2013002988A2 (OSRAM) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9164397B2 (en) * | 2010-08-03 | 2015-10-20 | Kla-Tencor Corporation | Optics symmetrization for metrology |
| US9228943B2 (en) * | 2011-10-27 | 2016-01-05 | Kla-Tencor Corporation | Dynamically adjustable semiconductor metrology system |
| EP2823360B1 (de) * | 2012-03-09 | 2022-06-22 | Carl Zeiss SMT GmbH | Beleuchtungsoptik für die euv-projektionslithografie sowie optisches system mit einer derartigen beleuchtungsoptik |
| EP2865003A1 (en) * | 2012-06-26 | 2015-04-29 | Kla-Tencor Corporation | Scanning in angle-resolved reflectometry and algorithmically eliminating diffraction from optical metrology |
| US20150268418A1 (en) * | 2012-09-27 | 2015-09-24 | Applied Micro Circuits Corporation | Expanded beam interconnector |
| US9188839B2 (en) * | 2012-10-04 | 2015-11-17 | Cognex Corporation | Component attachment devices and related systems and methods for machine vision systems |
| NL2011477A (en) * | 2012-10-10 | 2014-04-14 | Asml Netherlands Bv | Mark position measuring apparatus and method, lithographic apparatus and device manufacturing method. |
| US20150157199A1 (en) * | 2012-12-06 | 2015-06-11 | Noam Sapiens | Method and apparatus for scatterometric measurement of human tissue |
| US10054423B2 (en) * | 2012-12-27 | 2018-08-21 | Nova Measuring Instruments Ltd. | Optical method and system for critical dimensions and thickness characterization |
| US9123649B1 (en) | 2013-01-21 | 2015-09-01 | Kla-Tencor Corporation | Fit-to-pitch overlay measurement targets |
| US9476837B2 (en) * | 2013-04-21 | 2016-10-25 | Nova Measuring Instruments Ltd. | Method and system for improving optical measurements on small targets |
| WO2014210381A1 (en) * | 2013-06-27 | 2014-12-31 | Kla-Tencor Corporation | Polarization measurements of metrology targets and corresponding target designs |
| KR102135999B1 (ko) * | 2014-03-20 | 2020-07-21 | 케이엘에이 코포레이션 | 조명 패터닝을 이용하는 압축 감지 |
| JP6578118B2 (ja) * | 2014-04-04 | 2019-09-18 | 株式会社ニューフレアテクノロジー | 撮像装置、検査装置および検査方法 |
| TWI557406B (zh) * | 2014-04-04 | 2016-11-11 | Nuflare Technology Inc | An imaging device, a defect inspection device, and a defect inspection method |
| NL2015160A (en) | 2014-07-28 | 2016-07-07 | Asml Netherlands Bv | Illumination system, inspection apparatus including such an illumination system, inspection method and manufacturing method. |
| US9793178B2 (en) * | 2014-08-28 | 2017-10-17 | University Of Rochester | Focused beam scatterometry apparatus and method |
| SG11201703585RA (en) | 2014-11-25 | 2017-06-29 | Kla Tencor Corp | Analyzing and utilizing landscapes |
| DE102015214302B4 (de) * | 2015-04-28 | 2021-02-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung zur Erzeugung zweidimensionaler Beleuchtungsmuster und Vorrichtung zur optischen Bestimmung von Geschwindigkeitsfeldern in Fluidströmungen |
| KR102128488B1 (ko) | 2015-12-09 | 2020-07-01 | 에이에스엠엘 홀딩 엔.브이. | 플렉시블 일루미네이터 |
| KR20180095605A (ko) | 2015-12-17 | 2018-08-27 | 에이에스엠엘 네델란즈 비.브이. | 스캐터로메트리에서의 편광 튜닝 |
| CN109073980B (zh) | 2015-12-17 | 2021-06-18 | Asml荷兰有限公司 | 量测设备的调节或基于已测量目标的特性而由量测设备进行的测量 |
| CN106933049B (zh) * | 2015-12-30 | 2020-06-16 | 上海微电子装备（集团）股份有限公司 | 一种用于半导体光刻的曝光系统与曝光方法 |
| US9846128B2 (en) * | 2016-01-19 | 2017-12-19 | Applied Materials Israel Ltd. | Inspection system and a method for evaluating an exit pupil of an inspection system |
| CN108700834B (zh) | 2016-03-07 | 2021-03-09 | Asml荷兰有限公司 | 照射系统和量测系统 |
| US10438339B1 (en) * | 2016-09-12 | 2019-10-08 | Apple Inc. | Optical verification system and methods of verifying micro device transfer |
| US10732516B2 (en) * | 2017-03-01 | 2020-08-04 | Kla Tencor Corporation | Process robust overlay metrology based on optical scatterometry |
| IL274148B2 (en) * | 2017-11-07 | 2024-01-01 | Asml Netherlands Bv | Metrology system and method for determining a characteristic of an area of interest |
| CN108279553B (zh) * | 2018-01-30 | 2019-06-21 | 中国科学院上海光学精密机械研究所 | 一种光刻机照明控制测试系统及方法 |
| EP3528047A1 (en) * | 2018-02-14 | 2019-08-21 | ASML Netherlands B.V. | Method and apparatus for measuring a parameter of interest using image plane detection techniques |
| US10761031B1 (en) * | 2018-03-20 | 2020-09-01 | Kla-Tencor Corporation | Arbitrary wavefront compensator for deep ultraviolet (DUV) optical imaging system |
| WO2020141085A1 (en) | 2018-12-31 | 2020-07-09 | Asml Netherlands B.V. | Method for overlay metrology and apparatus thereof |
| US11359916B2 (en) * | 2019-09-09 | 2022-06-14 | Kla Corporation | Darkfield imaging of grating target structures for overlay measurement |
| CN113048895B (zh) * | 2021-03-04 | 2022-08-16 | 上海精测半导体技术有限公司 | 探测反射光变化的装置、方法及膜厚测量装置 |
| JP7589188B2 (ja) * | 2022-02-28 | 2024-11-25 | キヤノン株式会社 | 計測装置、計測方法、リソグラフィ装置及び物品の製造方法 |
| CN119547018A (zh) * | 2022-09-26 | 2025-02-28 | Asml荷兰有限公司 | 可调谐光学系统 |
| KR102519813B1 (ko) * | 2022-10-17 | 2023-04-11 | (주)오로스테크놀로지 | 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램 |
| KR102546552B1 (ko) | 2022-11-14 | 2023-06-22 | (주)오로스테크놀로지 | 오버레이 계측 장치의 동작을 제어하는 데이터를 저장하기 위한 데이터 구조를 기록한 컴퓨터 판독 가능 저장 매체 및 이를 위한 오버레이 계측 장치 |
| KR102898111B1 (ko) * | 2023-03-15 | 2025-12-09 | (주) 오로스테크놀로지 | 오버레이 측정 장치의 최적화 방법 및 이를 수행하는 오버레이 측정 장치 |
| CN119986931A (zh) * | 2023-11-10 | 2025-05-13 | 致茂电子(苏州)有限公司 | 科勒照明系统的最佳化扩散片位置调校方法 |
| WO2025243284A1 (en) * | 2024-05-20 | 2025-11-27 | Tondo Smart Ltd. | Systems and methods for improving illumination efficiency in an area of interest |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6023338A (en) | 1996-07-12 | 2000-02-08 | Bareket; Noah | Overlay alignment measurement of wafers |
| DE19835072A1 (de) * | 1998-08-04 | 2000-02-10 | Zeiss Carl Jena Gmbh | Anordnung zur Beleuchtung und/oder Detektion in einem Mikroskop |
| US6462818B1 (en) | 2000-06-22 | 2002-10-08 | Kla-Tencor Corporation | Overlay alignment mark design |
| US6486954B1 (en) | 2000-09-01 | 2002-11-26 | Kla-Tencor Technologies Corporation | Overlay alignment measurement mark |
| US7009704B1 (en) | 2000-10-26 | 2006-03-07 | Kla-Tencor Technologies Corporation | Overlay error detection |
| US7155018B1 (en) | 2002-04-16 | 2006-12-26 | Microsoft Corporation | System and method facilitating acoustic echo cancellation convergence detection |
| CN101487982A (zh) * | 2002-08-24 | 2009-07-22 | 无掩模平版印刷公司 | 连续地直接写的光刻技术 |
| US6844927B2 (en) * | 2002-11-27 | 2005-01-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for removing optical abberations during an optical inspection |
| US6870554B2 (en) | 2003-01-07 | 2005-03-22 | Anvik Corporation | Maskless lithography with multiplexed spatial light modulators |
| EP1719018A1 (en) * | 2004-02-25 | 2006-11-08 | Micronic Laser Systems Ab | Methods for exposing patterns and emulating masks in optical maskless lithography |
| JP2006023221A (ja) * | 2004-07-09 | 2006-01-26 | Tokyo Seimitsu Co Ltd | 外観検査装置及び投影方法 |
| US7791727B2 (en) | 2004-08-16 | 2010-09-07 | Asml Netherlands B.V. | Method and apparatus for angular-resolved spectroscopic lithography characterization |
| US7525642B2 (en) | 2006-02-23 | 2009-04-28 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20080239428A1 (en) * | 2007-04-02 | 2008-10-02 | Inphase Technologies, Inc. | Non-ft plane angular filters |
| WO2008131928A1 (en) | 2007-04-25 | 2008-11-06 | Carl Zeiss Smt Ag | Illumination system for illuminating a mask in a microlithographic exposure apparatus |
| US7463342B2 (en) | 2007-05-02 | 2008-12-09 | Angstrom, Inc. | Optical tracking device using micromirror array lenses |
| DE102007047446A1 (de) * | 2007-10-04 | 2009-04-09 | Carl Zeiss Smt Ag | Optisches Element mit wenigstens einem elektrisch leitenden Bereich und Beleuchtungssystem mit einem solchen Element |
| DE102008054582A1 (de) | 2007-12-21 | 2009-07-09 | Carl Zeiss Smt Ag | Mikrolithographische Projektionsbelichtungsanlage |
| JP5487118B2 (ja) | 2008-02-15 | 2014-05-07 | カール・ツァイス・エスエムティー・ゲーエムベーハー | マイクロリソグラフィのための投影露光装置に使用するファセットミラー |
| WO2009133849A1 (ja) * | 2008-04-28 | 2009-11-05 | 株式会社ニコン | 検査装置 |
| SG173857A1 (en) | 2009-03-04 | 2011-09-29 | Asml Netherlands Bv | Illumination system, lithographic apparatus and method of forming an illumination mode |
| JP2010278353A (ja) * | 2009-05-29 | 2010-12-09 | Nikon Corp | 露光装置 |
| WO2011012624A1 (en) | 2009-07-31 | 2011-02-03 | Asml Netherlands B.V. | Metrology method and apparatus, lithographic system, and lithographic processing cell |
| JP2011064892A (ja) * | 2009-09-16 | 2011-03-31 | Olympus Corp | 空間光変調装置、及び、それを備えたレーザ照明装置、レーザ顕微鏡 |
| EP2521934A2 (en) * | 2010-01-06 | 2012-11-14 | Ecole Polytechnique Fédérale de Lausanne (EPFL) | Dark field optical coherence microscopy |
| JP5721042B2 (ja) * | 2010-10-20 | 2015-05-20 | 株式会社ニコン | 顕微鏡システム |
| NL2007765A (en) * | 2010-11-12 | 2012-05-15 | Asml Netherlands Bv | Metrology method and inspection apparatus, lithographic system and device manufacturing method. |
-
2011
- 2011-06-27 US US13/170,025 patent/US8681413B2/en active Active
-
2012
- 2012-06-07 EP EP12803940.1A patent/EP2724361B1/en active Active
- 2012-06-07 KR KR1020147002337A patent/KR101982363B1/ko active Active
- 2012-06-07 WO PCT/US2012/041273 patent/WO2013002988A2/en not_active Ceased
- 2012-06-07 JP JP2014518591A patent/JP6132838B2/ja active Active
- 2012-06-11 TW TW101120937A patent/TWI564539B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201303258A (zh) | 2013-01-16 |
| EP2724361A4 (en) | 2015-03-18 |
| EP2724361A2 (en) | 2014-04-30 |
| WO2013002988A2 (en) | 2013-01-03 |
| TWI564539B (zh) | 2017-01-01 |
| KR101982363B1 (ko) | 2019-05-27 |
| US8681413B2 (en) | 2014-03-25 |
| EP2724361B1 (en) | 2023-12-27 |
| US20120327503A1 (en) | 2012-12-27 |
| KR20140053141A (ko) | 2014-05-07 |
| JP2014521116A (ja) | 2014-08-25 |
| WO2013002988A3 (en) | 2013-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6132838B2 (ja) | 照明制御 | |
| JP5444334B2 (ja) | 干渉欠陥検知及び分類 | |
| US6614535B1 (en) | Exposure apparatus with interferometer | |
| NL2021848A (en) | Holographic metrology apparatus. | |
| CN108292038B (zh) | 物镜系统 | |
| KR100588117B1 (ko) | 리소그래피장치 및 디바이스제조방법 | |
| TWI665512B (zh) | 光學系統及使用此系統校正光罩缺陷的方法 | |
| TW200931208A (en) | Alignment method and apparatus, lithographic apparatus, metrology apparatus and device manufacturing method | |
| JP5616983B2 (ja) | マスク検査装置の照明系及び投影対物系 | |
| JP2013504063A (ja) | 計測システムおよび計測方法 | |
| JP7489403B2 (ja) | デフレクトメトリ測定システム | |
| WO2013139483A2 (en) | Measuring system for measuring an imaging quality of an euv lens | |
| JP6773894B2 (ja) | 補正を導き出すための方法及び装置、構造の特性を決定するための方法及び装置、デバイス製造方法 | |
| US9709494B2 (en) | Measuring arrangement for measuring optical properties of a reflective optical element, in particular for microlithography | |
| KR101863752B1 (ko) | 광학적 웨이퍼 검사 장치의 해상력 강화 방법 및 이를 이용한 tsom 영상 획득 방법 | |
| CN107924146B (zh) | 光刻设备对准传感器和方法 | |
| TWI662375B (zh) | 可撓式照明器 | |
| TWI769545B (zh) | 用於測量光的物體之反射率的測量方法以及用於執行該方法的計量系統 | |
| JP2022000692A (ja) | マイクロリソグラフィマスクを特徴付けるための装置および方法 | |
| JP5009915B2 (ja) | 投影露光装置の結像面中の強度分布を決定する方法 | |
| US11029259B2 (en) | Detection device for detecting a structure on an area portion of a lithography mask, and apparatus comprising a detection device of this type | |
| JP6952136B2 (ja) | リソグラフィの方法及び装置 | |
| JP3351051B2 (ja) | 水平検出装置及びそれを用いた露光装置 | |
| JP2011077438A (ja) | 光学特性計測方法及び装置、並びに露光方法及び装置 | |
| KR20090107982A (ko) | 노광 장치 및 디바이스 제조 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150520 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150520 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160518 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160524 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20160822 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20161019 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161121 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170321 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170418 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6132838 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |