JP6121203B2 - Coating device, pattern coating device, and pattern coating method - Google Patents

Description

  The present invention is used to efficiently coat a non-rectangular substrate such as a circular silicon wafer, and can apply a rectangular coating film by changing its coating width every moment, The present invention relates to a pattern coating apparatus and a pattern coating method.

  Semiconductors become products by forming various coating film layers on a circular silicon wafer. As a means for forming a coating film on such a circular substrate, a spinner is applied because the thickness of the coating film is uniform with high accuracy and the application range for viscosity is large. However, as is well known, in order to form a coating film with a uniform thickness using a spinner, an excess coating solution of 2 to 10 times the amount of the solution remaining on the wafer is finally supplied before the start of high-speed rotation. There is a problem that a lot of coating liquid is discarded. Various attempts have been made to improve this, but as a means that can be surely implemented, the wafer is mounted tightly in a circular recess (recess) on the stage without any gaps, and the discharge port has a width that is greater than the diameter of the wafer. There is a slit nozzle having a rectangular shape covering the entire wafer (for example, Patent Document 1). However, even with this method, although the amount of the coating liquid that becomes invalid is significantly reduced compared to the case of the spinner, the amount of coating liquid corresponding to the area coated more than the diameter of the wafer becomes completely invalid, so an expensive coating liquid The problem of environmental pollution due to an increase in the amount of waste liquid still remains. On the other hand, in the circular area that is equal to or less than the diameter of the wafer, it is sufficient if there is a means for applying a coating solution on the circular wafer in a required amount to form a uniform coating film. There is nothing in practical use.

  By the way, the semiconductor itself has a small rectangular shape as a product. As shown in FIG. 12, a large number of rectangular semiconductor units 204 are formed on the wafer 202 to form a collective product 200. Turn into. The collective arrangement of the semiconductor units 204 is determined so that the wafer 202 can be used to the maximum without waste, and the outer contour thereof is a shape whose width changes stepwise in the direction of the arrow, for example, an outer contour 206 indicated by a thick line. It becomes.

JP 2001-269610 A

  The object of the present invention is to embody a means for forming a coating film having a uniform thickness and a coating width that changes stepwise in the coating direction, so that the coating liquid can be applied to a non-rectangular substrate such as a circular wafer. An object of the present invention is to provide an applicator, a pattern applicator and a pattern application method capable of applying as much as necessary without waste.

The object of the present invention is achieved by the means described below.
Coated fabric instrument ing to the present invention, a coating liquid reservoir portion extending in the longitudinal direction, and the coating liquid supply port for supplying the coating liquid to the coating liquid reservoir portion, an opening portion for discharging the coating liquid from the coating liquid reservoir At least two or more applicator units having a coating liquid discharge port, and a path unit that connects the coating liquid storage unit and the coating liquid discharge port, are substantially the same as a cross section perpendicular to the longitudinal direction of the coating unit. The applicator is connected in the longitudinal direction via a partition plate having a shape, and the partition plate applies a tapered recess whose distance from the back surface decreases from the coating solution storage side to the coating solution discharge port side. It has a position corresponding to the liquid discharge port, the thickness is the smallest at the position corresponding to the coating liquid discharge port, and the thickness at the position corresponding to the coating liquid storage unit is larger .

A pattern coating apparatus according to the present invention comprises: an applicator according to claim 1 ; an application liquid supply means for supplying an application liquid individually to each of the applicator units constituting the applicator; A holding unit for holding, an applicator proximity means for bringing the coating liquid discharge port of the applicator close to the member to be coated, and a moving means for relatively moving at least one of the applicator and the member to be coated. It is characterized by.

  The coating method according to the present invention uses the above-described pattern coating apparatus to bring the coating liquid discharge port of the coating device close to the member to be coated up to a certain distance, and then separately from any coating liquid supply means to any coating device unit. A pattern coating method for supplying a coating liquid to form a coating film on a member to be coated, from a corresponding applicator unit so that a coating film whose coating width changes step by step in the coating direction can be formed. It is characterized in that the discharge start and discharge end of the coating liquid are respectively performed.

If the applicator according to the present invention is used, the discharge ports are partitioned by a partition plate, which is a very thin boundary sheet, and arranged in a line, so that the coating liquid can be easily applied immediately before the coating liquid is applied to the substrate. A coating film that is connected and connected in the coating width direction without a boundary can be formed on the substrate. As a result, it is possible to easily form a coating film having a uniform thickness and the coating width changing step by step in the coating direction. Also, after increasing the thickness at the position corresponding to the coating solution reservoir by having the partition plate at a position corresponding recesses tapered in the coating liquid discharge port, a position corresponding to the coating solution discharge port in than the smallest thickness, such as when a high feed capacity rate to time and the nozzle to the high viscosity of the coating solution, even if the internal pressure in the nozzle is increased, the coating just before applying the coating solution to a substrate It is possible to form a coating film in which the liquids are easily connected and the coating width changes stepwise in the coating direction with a uniform thickness without a horizontal step defect.

  The pattern coating apparatus and pattern coating method according to the present invention uses the above-described applicator and controls the start and end of the discharge of the coating liquid for each applicator unit. A coating film having a uniform thickness can be easily formed. As a result, even in the case of a non-rectangular substrate such as a circular wafer, a rectangular pattern can be applied within the entire area below the diameter of the circular wafer that requires the formation of a coating film. It can be made very small. Furthermore, since the coating area can be made smaller than when the entire circular wafer is applied, the amount of coating solution used is reduced, and not only can the coating solution be saved to reduce costs, but also an expensive and high-performance coating solution can be used. It becomes possible to use in terms of cost, and a high-performance and high-quality coating film can be formed at a low cost.

1 is a schematic side view of a pattern coating apparatus 1 according to the present invention. It is a schematic perspective view of the composite slit nozzle 100 which is an applicator which concerns on this invention. It is a schematic perspective view which decomposes | disassembles and shows the composite slit nozzle 100 to each component. 2 is a schematic perspective view showing the slit nozzle unit 120 constituting the composite slit nozzle 100 in a further exploded state. FIG. It is explanatory drawing of the pattern coating method which concerns on this invention. It is a schematic perspective view which shows the embodiment of another partition plate. It is front sectional drawing which shows the application | coating condition when another partition plate is used. It is a schematic perspective view which shows the embodiment of another partition plate. It is front sectional drawing which shows the application | coating condition at the time of using another partition plate. It is a schematic perspective view which shows the embodiment of another partition plate. It is front sectional drawing which shows the application | coating condition when another partition plate is used. It is a schematic plan view which shows semiconductor pattern arrangement | positioning on a wafer.

  The present invention will be described with reference to the drawings. FIG. 1 is a schematic side view of a pattern coating apparatus 1 according to the present invention, and FIG. 2 is a schematic perspective view of a composite slit nozzle 100 which is an applicator according to the present invention.

  First, referring to FIG. 1, a pattern coating apparatus 1 according to the present invention is shown. The pattern coating apparatus 1 includes a base 2, and a mounting table 6 that holds a substrate A that is a member to be coated is disposed on the base 2. The upper surface 8 of the mounting table 6 is provided with suction holes and suction grooves so that the substrate A can be suction-held and fixed by vacuum suction, and is configured as a suction surface. Thus, the mounting table 6 has a function as a holding unit for the substrate A.

  On the base 2, a pair of guide rails 4 are further provided on both sides of the coating width direction, which is a direction perpendicular to the paper surface of the mounting table 6. A portal gantry 10 is mounted on the pair of guide rails 4 via a pair of bearings 14 so as to be guided in the X direction indicated by arrows. The portal gantry 10 includes a pair of traveling portions 16 fixed on a pair of bearings 14 on both sides in the coating width direction, and a stay 12 that connects the pair of traveling portions 16 and is configured in a portal shape. ing. The pair of traveling portions 16 of the portal gantry 10 are provided with a pair of up and down lifting units 70 that lift and lower both longitudinal ends of the composite slit nozzle 100 that is the applicator of the present invention. The composite slit nozzle 100 is attached to the pair of upper and lower lifting / lowering units 70 via a suspension holding base 80 so as to be positioned above the mounting table 6. The longitudinal direction of the composite slit nozzle 100 is a direction perpendicular to the paper surface and coincides with the coating width direction. Since the portal gantry 10 is driven by a linear motor (not shown), the composite slit nozzle 100 mounted on the portal gantry 10 can freely reciprocate in the X direction indicated by an arrow in FIG. Therefore, the portal gantry 10 has a function of moving means for moving the composite slit nozzle 100 relative to the substrate A.

  The composite slit nozzle 100 is composed of five slit nozzle units 120A to 120E as applicator units as shown in FIG. 2, and the configuration will be described in detail later. In FIG. 1, A to E are added to the reference numerals of the constituent members in order to show that there are five constituent members of the composite slit nozzle 100 as shown in the figure.

  Referring to FIG. 1 again in detail, the up-and-down lift unit 70 that raises and lowers the composite slit nozzle 100 guides the up-and-down stage 78 and the up-and-down stage 78 that raise and lower the suspension holding base 80 that suspends the composite slit nozzle 100. A guide 74 and a ball screw 76 for converting the rotational motion of the motor 72 into the linear motion of the lift 78 are configured. Corresponding to the pair of vertical lift units 70 disposed at both ends in the longitudinal direction of the composite slit nozzle 100, a pair of lift base 78, guide 74, motor 72, and ball screw 76 are also disposed. Since the pair of upper and lower lifting / lowering units 70 can be lifted and lowered independently on both sides in the coating width direction, the tilt angle of the composite slit nozzle 100 with respect to the horizontal in the longitudinal direction can be arbitrarily set. Accordingly, the discharge port surfaces 136A to 136E including the discharge ports 134A to 134E, which are the coating liquid discharge ports of the composite slit nozzle 100, and the surface CP of the substrate A can be made substantially parallel over the longitudinal direction of the composite slit nozzle 100. . Further, the up / down lifting unit 70 functions as an applicator proximity means that brings the discharge port surfaces 136A to 136E including the discharge ports 134A to 134E of the composite slit nozzle 100 close to the surface CP of the substrate A. Therefore, the vertical slit unit 100 is positioned in the Z direction, which is the vertical direction of the composite slit nozzle 100, so that the clearance between the discharge port surfaces 136A to 136E and the surface CP, that is, the clearance becomes the specified clearance amount CL. Can be adjusted.

  A wiping unit 20 is mounted on the base 2 at the left end of the base 2. The composite slit nozzle 100 engaged with the wiping head 22 can be moved by the portal gantry 10 up to the upper side of the wiping head 22 of the wiping unit 20. The wiping unit 20 discharges the coating liquid from the composite slit nozzle 100 and then removes the coating liquid remaining in the peripheral portions of the discharge ports 134A to 134E, and is in a state where the coating solution is filled up to the discharge ports 134A to 134E. That is, the composite slit nozzle 100 is initialized. By always performing this initialization before each application, the composite slit nozzle 100 can always start application in the same state, and even if application is performed on a large number of substrates, the same uniformity is applied to all the substrates. A coating film can be formed with good reproducibility. In the wiping unit 20, a wiping head 22 having a shape that engages with the periphery of the discharge ports 134 </ b> A to 134 </ b> E of the composite slit nozzle 100 is attached to the slider 26 via a bracket 24. The slider 26 is freely moved by the drive unit 28 in the longitudinal direction of the composite slit nozzle 100, that is, in the Y direction. The drive unit 28 and the tray 30 are fixed on a table 32. When wiping is performed, the portal gantry 10 is moved in the X direction to a position where the composite slit nozzle 100 engages with the wiping head 22, and then the composite slit nozzle 100 is lowered and engaged with the wiping head 22. Then, when the drive unit 28 is driven and the wiping head 22 is slid in the longitudinal direction of the composite slit nozzle 100, the coating liquid remaining in the peripheral portions of the discharge ports 134A to E of the composite slit nozzle 100 is removed. The composite slit nozzle 100 can be initialized. The removed coating liquid is collected in the tray 30. The tray 30 is connected to a discharge line (not shown) and can discharge and collect a liquid such as a coating solution accumulated inside. The tray 30 can also be used for collecting the coating liquid discharged from the composite slit nozzle 100 by air bleeding or the like. Specifically, the wiping head 22 is preferably a synthetic resin blade that is in line contact, but may be a blade of an elastic body such as rubber so that it can be evenly engaged with the composite slit nozzle 100. Further, when the coating liquid has a high viscosity, the wiping head 22 may hold the cloth soaked with the solvent with an elastic body.

  Next, when looking at the composite slit nozzle 100 in FIG. 1, the upstream side of the composite slit nozzle 100 is connected to supply hoses 60A to 60E connected to the coating liquid supply devices 40A to E functioning as the coating liquid supply means. ) Is always connected. The coating solution supply devices 40A to E and the supply hoses 60A to E are provided in each of the five slit nozzle units 120A to 120E constituting the composite slit nozzle 100. With this configuration, the coating liquid can be independently supplied from the coating liquid supply devices 40A to 40E to the slit nozzles 120A to 120E that are applicator units. As a result, the composite slit nozzle 100 can discharge and apply the coating liquid onto the substrate A. In FIG. 1, A to E are added to the reference numerals to indicate that there are five constituents of the coating liquid supply device 40 and the supply hose 60 as shown in the figure.

  Now, the coating liquid supply devices 40A to E are provided upstream of the supply hoses 60A to E with filters 46A to E, supply valves 42A to E, syringe pumps 50A to E, suction valves 44A to E, suction hoses 62A to E, Tanks 64A to 64E are provided. The same coating liquid 66 is stored in the tanks 64 </ b> A to 64 </ b> E, and it is connected to a pressure air source 68 (shared) so that a back pressure of an arbitrary magnitude can be applied to the coating liquid 66. The coating liquid 66 in the tanks 64A to 64E is supplied to the syringe pumps 50A to 50E through the suction hoses 62A to 62E. In syringe pumps 50A-E, syringes 52A-E and pistons 54A-E are attached to main bodies 56A-E. Here, the pistons 54A to 54E can reciprocate freely in the vertical direction by a driving source (not shown). The syringe pumps 50A to 50E fill the syringe 52A to E having a constant inner diameter with the coating liquid, push it out by the pistons 54A to E, and supply the substrate S to the composite slit nozzle 100 by the capacity for coating one sheet A. This is an intermittent drive constant capacity type pump, that is, an intermittent constant capacity type pump. When filling the application liquid 66 into the syringes 52A-E, the suction valves 44A-E are opened, the supply valves 42A-E are closed, and the pistons 54A-E are moved downward. When supplying the coating liquid filled in the syringes 52A to E toward the composite slit nozzle 100, the suction valves 44A to E are closed, the supply valves 42A to E are opened, and the pistons 54A to E are moved upward. By doing so, the application liquid inside the syringes 52A to 52E is pushed up and discharged by the pistons 54A to 54E.

  Among the valves, the supply valves 42A to 42E and the suction valves 44A to 44E may be of any type as long as they can switch the passage / blocking of the coating liquid, but preferably have a capacity by switching the passage / blocking of the coating liquid. Use a valve with less change. Specific examples of the valve include a ball valve, a cork valve, and a valve whose valve seat moves in a flow path.

  In the pattern coating apparatus 1, the linear motor, the motor 72, the coating liquid supply devices 40A to E, the wiping unit 20 and the like that are operated by a control signal are all electrically connected to the control device 90. Then, a control command signal is transmitted to each device according to an automatic operation program incorporated in the control device 90, and a predetermined pattern coating operation is executed. When changing the conditions, if a change parameter is appropriately input to the operation panel 92, it is transmitted to the control device 90, and the change of the driving operation can be realized.

  Next, the details of the composite slit nozzle 100 outlined above will be described with reference to FIGS. Here, FIG. 3 is a schematic perspective view showing the composite slit nozzle 100 disassembled into components, and FIG. 4 is a schematic perspective view showing the slit nozzle unit 120 constituting the composite slit nozzle 100 further disassembled.

  First, referring to FIG. 2, the composite slit nozzle 100 includes four partition sheets 106A to 106D, which are four boundary sheets, between the five slit nozzle units 120A to 120E, and is overlapped in the longitudinal direction. The reference plate 102 is in close contact with the upper side of the side plates 104A and 104B stacked on both sides. That is, the slit nozzle units 120A to 120E are connected in the longitudinal direction via the partition plates 106A to 106D. When viewed in the Y direction indicated by the arrow that is the longitudinal direction, the slit nozzle units 120A to 120E, the partition plates 106A to 106D, and the side plates 104A and 104B have the same shape. That is, the cross section perpendicular to the longitudinal direction of the slit nozzles 120A to 120E that are applicator units constituting the composite slit nozzle 100 has substantially the same shape as the partition plates 106A to 106D. The side plates 104A and 104B, the slit nozzle units 120A to 120E, and the partition plates 106A to 106D that are stacked in the longitudinal direction may be fastened and held with bolts or the like in the Y direction, which is the longitudinal direction, or only stacked closely in the longitudinal direction. Thus, the reference plate 102 may be fastened and held only in the Z direction.

  Next, referring to FIG. 3, the composite slit nozzle 100 is disassembled into slit nozzle units 120A to 120E, partition plates 106A to 106D, side plates 104A and 104B, and a reference plate 102 as constituent elements. The slit nozzle units 120A to 120E are configured by overlapping front lips 122A to E and rear lips 124A to E in the X direction indicated by arrows. The X direction is a coating direction and coincides with the X direction shown in FIG. Manifolds 126 </ b> A to 126 </ b> E extending in the Y direction, which is the longitudinal direction, are provided inside the front lips 122 </ b> A to 122 </ b> E. The manifolds 126A to 126E are liquid reservoirs for widening the coating liquid supplied to the slit nozzle units 120A to 120E in the Y direction, which is the coating width direction, and serve as a coating liquid storage unit. Under the manifolds 126A to 126E, slits 128A to 128E are formed in communication. The slits 128A to E extend in the Y direction and pass through. The lower ends of the slits 128A to E open at the discharge port surfaces 136A to E, which are the lowermost surfaces of the slit nozzle units 120A to 120E. Form. Since the discharge ports 134A to E function as coating liquid discharge ports that discharge the coating liquid from the manifolds 126A to E, the slits 128A to E serve as path portions that connect the manifolds 126A to E and the discharge ports 134A to E. . Further, slopes 138A to 138E that are obliquely upward are provided on both sides in the X direction of the discharge port surfaces 136A to 136E. Here, the discharge port surfaces 136A to 136E are in the same plane, and the discharge ports 134A to 134E are arranged in a line in the Y direction. Since the reference plate 102 serves as a reference, the discharge port surfaces 136A to 136E can be easily set in the same plane. The size of the gap between the slits 128A to 128E (measured in the X direction) is the gap amount G.

  Here, when the slit nozzle units 120A and 120B are further disassembled, FIG. 4 shows the size of the step between the mating surfaces 140A to E and the front slit surfaces 142A to E provided inside the front lips 122A to 122E (X direction). The step amount D, which is measured at the same time, coincides with the gap amount G. This is because the rear lip inner surfaces 144A to E which are the inner surfaces of the rear lips 124A to E facing the mating surfaces 140A to E and the front slit surfaces 142A to 142E are flat surfaces. FIG. 4 also shows that supply ports 132 </ b> A to 132 </ b> E penetrating from the outside are provided in the longitudinal center of the manifolds 126 </ b> A to 126 </ b> E. The supply ports 132A to 132E are individually connected to the coating solution supply apparatuses 40A to 40E via the supply hoses 60A to 60E, respectively. Accordingly, the supply ports 132A to 132E function as a coating solution supply port for supplying the coating solution from the coating solution apparatuses 40A to 40E to the manifolds 126A to 126E.

  Referring to FIG. 3 again, the coating liquid supplied from the coating liquid supply devices 40A to 40E to the slit nozzle units 120A to 120E via the supply ports 132A to E is expanded in the longitudinal direction by the manifolds 126A to E. The liquid flows through the slits 128A to 128E and is discharged onto the substrate A from the discharge ports 134A to 134E with widths WA to WE that are the lengths of the slit nozzle units 120A to 120E in the longitudinal direction. Accordingly, the widths WA to WE are application widths of the coating film formed by the slit nozzle units 120A to 120E. Moreover, the length of the partition plates 106A to 106D in the longitudinal direction is the thickness T of the plate, and in this embodiment, the partition plates 106A to 106D are the same.

  Next, a pattern coating method for forming a pattern coating film on a circular substrate A using the pattern coating apparatus 1 of the present invention will be described in detail with reference to FIGS. FIG. 5 is an explanatory diagram of the pattern coating method according to the present invention. 5 has a table configuration, and in the row (a), the coating liquid 66 is supplied from the supply hoses 60A to E to the slit nozzle units 120A to 120E constituting the composite slit nozzle 100, and the circular shape is circular. The front view which shows the condition which apply | coats to the board | substrate A is shown. If thick arrows are added to the supply hoses 60A to 60E, it means that the coating liquid 66 has been supplied. Further, if the space between the slit nozzle units 120A to 120E and the substrate A is blacked out, it means that the coating liquid 66 is discharged from the slit nozzle units 120A to 120E. In the row (b), a plan view of the substrate A to which the pattern is applied is shown. The outline of the pattern application is indicated by a thin line in advance, and the black outline indicates that it has been applied. X0 to X7 indicate position coordinates in the X direction in FIG. In the X column, position coordinates X0 to X7 in the X direction described in the column (b) are described, and the discharge ports 134A to E of the slit nozzle units 120A to 120E are at the X direction coordinate positions. It means coming. At that time, (a) and (b), which are lined up side by side, show the operation status and results at that time.

  First, referring to FIG. 1, as a preparatory work before coating, when the origin of each operation unit of the pattern coating apparatus 1 is returned, the portal gantry 10 has the discharge ports 134A to 134E of the composite slit nozzle 100 at the left of FIG. It moves so that it may come to the origin position (X = X0) above the wiping head 22 in the section. Here, the coating liquid 66 is already filled up to the tanks 64A to E to the composite slit nozzle 100, and the operation of discharging the residual air in the path to the composite slit nozzle 100 after the tanks 64A to E has already been completed. . At this time, the coating liquid supply devices 40A to E are in a state where the syringes 52A to E are filled with the coating liquid 66, the suction valves 44A to E are closed, the supply valves 42A to E are opened, and the pistons 54A to E are at the lowest end. The coating liquid 66 can be supplied to the composite slit nozzle 100 at any time.

  Next, lift pins (not shown) are raised on the upper surface 8 that is the suction surface of the mounting table 6, and a circular substrate A is placed on the lift pins from a loader (not shown). Next, the lift pins are lowered to place the substrate A on the upper surface 8 of the placing table 6 and simultaneously hold it by suction. The height H from the upper surface 8 of the surface CP of the substrate A is measured by a height sensor (not shown). Using the measured height H of the substrate A, the coating position separated from the surface CP of the substrate A by the clearance amount CL given in advance is calculated from the height Hn = H + CL from the upper surface 8. Then, the movement coordinate value of the vertical elevating / lowering unit 70 is determined so that the discharge port surfaces 136A to 136E of the composite slit nozzle 100 can move from the upper surface 8 to the application position having the height Hn.

In parallel with this, the coating liquid supply devices 40A to 40E are operated to discharge a small amount of the coating liquid 66 from the composite slit nozzle 100, and then the drive unit 28 is driven to move the wiping head 22 in the longitudinal direction of the composite slit nozzle 100. Move to the sliding start position at the end and stop. Then, the composite slit nozzle 100 is lowered, and after the discharge ports 134A to E and the periphery thereof are engaged with the wiping head 22, the wiping head 22 is slid in the longitudinal direction of the composite slit nozzle 100 to The periphery of the discharge ports 134A to E is wiped over in the longitudinal direction, and the composite slit nozzle 100 is initialized. When the initialization is completed, the composite slit nozzle 100 is raised. After completion of raising the composite slit nozzle 100, the wiping head 22 is returned to the initial position in the longitudinal direction.
This completes the preparation for coating. At this time, the gantry 10 equipped with the composite slit nozzle 100 is stopped, and the composite slit nozzle 100 is at the wiping position of X = X0 in the X direction and at the highest origin position in the Z direction. The syringe pumps 50A to 50E are stopped, the suction valves 44A to 44E are closed, and the supply valves 42A to 42E are opened (situation where X = X0 in FIG. 5).
Next, after confirming that the substrate A is attracted and held on the upper surface 8 of the mounting table 6 and is stationary, the gate type gantry 10 is started to be driven toward the right side in the X direction at the coating speed V, and combined. The slit nozzle 100 is started to move to the position X = X1, which is the first application start position of the substrate A, and the height of the substrate A sucked and held on the mounting table 6 is measured to determine a predetermined application position (upper surface). 8), the discharge port surfaces 136A to 136E of the composite slit nozzle 100 are lowered in the Z direction.

  Next, when the discharge ports 134A to E of the composite slit nozzle 100 reach the position of X = X1, which is the first application start position of the substrate A, the discharge ports 134A to E have a constant clearance CL in the substrate A in the Z direction. Since the portal gantry 10 continues to move at the coating speed V because it is close to the interval, the syringe pump 50C of the coating liquid supply device 40C connected to the slit nozzle unit 120C is started to be driven at a predetermined supply. The coating liquid 66 is supplied to the slit nozzle unit 120C at the capacity speed QC. Thereby, the discharge of the coating liquid 66 with the width WC is started from the discharge port 134C, and the formation of the coating film with the coating width WC is started at the center of the substrate A. The supply capacity speed QC is calculated by multiplying the coating speed V, the coating width WC, and the wet coating thickness (situation where X = X1 in FIG. 5).

  When the gantry 10 and the composite slit nozzle 100 held by the gantry 10 continue to move at the coating speed V and the discharge ports 134A to E reach the position X = X2, which is the second coating start position of the substrate A, the slit nozzle unit. The driving of the coating liquid supply devices 40B, D connected to 120B, 120D, and the syringe pumps 50B, D of D are started, and the coating liquid 66 is supplied to the slit nozzle units 120B, D at predetermined supply capacity speeds QB, QD. . As a result, the coating liquid 66 starts to be ejected with the width WB from the ejection port 134B and with the width WD from the ejection port 134D, and the width WB and the width WD are applied to both sides in the coating width direction of the coating film having the width WC at the center of the substrate A. The coating film begins to form. The coating films with the width WB and the width WD are connected to the coating film with the width WC in the coating width direction immediately after the formation, and the formation of an integrated coating film with the width WB + WC + WD is started. The supply capacity speed QB is calculated by multiplying the coating speed V, the width WB, and the wet coating thickness, and the supply capacity speed QD is calculated by multiplying the coating speed V, the width WD, and the wet coating thickness (X in FIG. 5). = Situation of X2).

  When the composite slit nozzle 100 continues to move in the X direction at the coating speed V and the discharge ports 134A to E reach the position of X = X3, which is the third coating start position of the substrate A, the slit nozzle units 120A and 120E The driving of the syringe pumps 50A and 50E of the coating liquid supply devices 40A and E connected thereto is started, and the coating liquid 66 is supplied to the slit nozzle units 120A and 120E at predetermined supply capacity speeds QA and QE. As a result, the coating liquid 66 starts to be ejected with the width WA from the ejection port 134A and with the width WE from the ejection port 134E, and the width WA on both sides in the coating width direction of the coating film of width WB + WC + WD previously formed at the center of the substrate A. And a coating film having a width WE starts to be formed. The coating films having the width WA and the width WE are connected to the coating film having the width WB + WC + WD immediately after the formation in the coating width direction, and the formation of an integrated coating film having the width WA + WB + WC + WD + WE is started. The supply capacity speed QA is calculated by multiplying the coating speed V, the width WA, and the wet coating thickness, and the supply capacity speed QE is calculated by multiplying the coating speed V, the width WE, and the wet coating thickness (X in FIG. 5). = Situation of X3).

  The composite slit nozzle 100 continues to move in the X direction at the coating speed V. When the discharge ports 134A to E reach the position of X = X4, which is the first coating end position of the substrate A, the coating liquid supply device 40A, The supply of the coating liquid from E to the slit nozzle unit 120A, E is stopped. Specifically, the syringe pumps 50A and 50E start to stop, the supply valves 42A and E are closed, and the suction valves 44A and E are opened. As a result, the discharge of the coating liquid 66 from the discharge ports 134A and E is completed, and the formation of the coating film having the width WA and the coating film having the width WE on both sides in the coating width direction is completed. In addition, an integrated coating film of width WB + WC + WD remains (situation where X = X4 in FIG. 5).

  Further, the X-direction movement of the composite slit nozzle 100 at the coating speed V continues, and when the discharge ports 134A to E reach the position of X = X5, which is the second coating end position of the substrate A, the coating liquid supply devices 40B and 40D Supply of the coating liquid to the slit nozzle units 120B and 120D is stopped. Specifically, the syringe pumps 50B and D start to stop, the supply valves 42B and D are closed, and the suction valves 42B and D are opened. Thereby, the discharge of the coating liquid 66 from the discharge ports 134B and D is completed, and the formation of the coating film having the width WB and the coating film having the width WD on both sides in the coating width direction is completed. In addition, only the coating film having the width WC remains (situation where X = X5 in FIG. 5).

  The X-direction movement of the composite slit nozzle 100 at the coating speed V continues further. When the discharge ports 134A to E reach the position of X = X6, which is the third coating end position of the substrate A, the coating liquid supply device 40C moves to the slit nozzle. The supply of the coating liquid to the unit 120C is stopped. Specifically, the syringe pump 50C starts to stop, the supply valve 42C is closed, and the suction valve 42C is opened. Thus, the discharge of the coating liquid 66 from the discharge port 134C is completed, and the formation of the coating film having the width WC that is the central portion in the coating width direction is completed (situation X = X6 in FIG. 5).

  The X-direction movement at the coating speed V of the composite slit nozzle 100 continues, and when the discharge ports 134A to E of the composite slit nozzle 100 reach the end position X = X7, the driving of the portal gantry 10 is stopped. And the composite slit nozzle 100 hold | maintained at this also stops. At this time, the composite slit nozzle 100 is raised to the origin position in the Z direction (situation X = X7 in FIG. 5).

  Subsequently, the syringe pumps 50 </ b> A to 50 </ b> E are driven to the opposite side, and a necessary amount of coating liquid is sucked from the tanks 64 </ b> A to 64 </ b> E and filled. At the same time, the adsorption of the substrate A by the mounting table 6 is released, lift pins (not shown) are raised to lift the substrate A, and the substrate A is carried out to the next step by an unloader (not shown). Then, after the next substrate A is placed on the upper part of the lift pin from a loader (not shown), the lift pin is lowered to place the next substrate A on the upper surface 8 of the placing table 6 and simultaneously sucked and held. Then, the height H from the upper surface 8 of the surface CP of the next substrate A is measured by a height sensor (not shown) to determine the application position.

  Subsequently, when filling of the coating liquid of the syringe pumps 50A to 50E is completed, the suction valves 44A to 44E are closed, and then the supply valves 42A to 42E are opened. Then, the portal gantry 10 starts to be driven in the reverse direction and moves until the discharge ports 134A to E of the composite slit nozzle 100 come to the origin position (X = X0) above the wiping head 92. When the movement is completed, the coating liquid supply devices 40A to 40E are operated to discharge a small amount of the coating liquid 66 from the composite slit nozzle 100, and then the composite slit nozzle 100 is initialized in the same procedure as the preparation work.

  Thereafter, the same procedure is repeated to apply the pattern to the next substrate A.

  By the above pattern coating method, it is possible to easily apply a pattern shape in which the coating width changes step by step in the coating direction. In addition, since the coating films having the same thickness are connected without gaps, the coating film thickness does not change at the connection portion, and the coating films are the same. As a result, no streak or step indicating a boundary or seam is generated.

  With respect to the start of coating by the above pattern coating method, the supply valves 42A to E are closed and the internal pressures in the supply hoses 60A to 60E are increased until the start immediately while the syringe pumps 50A to E are driven, and the supply valve 42A at the coating start position. Application may be started with ~ E opened. As a result, the coating film thickness instantaneously becomes the target value at the coating start position.

  Further, at the end of the application, a suck back may be performed in which the application liquid is pulled back from the composite slit nozzle 100 toward the application liquid supply devices 40A to 40E. As a result, the application liquid from the discharge ports 134A to 134E is stopped instantaneously, the defective film thickness region at the application end portion can be shortened, and the product portion can be enlarged. As specific means for sucking back, it is preferable to drive the syringe pumps 50A to 50E in the reverse direction, and to use a suck back valve that can suck back a predetermined amount of coating liquid when the supply valves 42A to 42E are closed. . Furthermore, the coating liquid in the manifolds 126A to E of the slit nozzle units 120A to 120E may be pulled back by direct suction by a pump or vacuum pressure, that is, suck back may be performed.

  Although the above pattern coating method has shown the case where there are five slit nozzle units 120, the number is not limited, and the same procedure may be repeated regardless of whether the number increases or decreases. However, since at least two slit nozzle units 120, which are applicator units, are necessary to change the coating width step by step in the coating direction, at least two slit nozzle units 120 should be provided. Is preferred.

  In the above pattern coating method, the same clearance amount CL is maintained between the substrate and the substrate without changing the Z-direction position of the composite slit nozzle 100 from the start of coating to the end of coating. Sometimes, the composite slit nozzle 100 may be raised to finish coating.

  The composite slit nozzle 100 is initialized by wiping with the wiping head 22, but may be performed by preliminarily applying to a roll or a plate.

  Now, in order to change the coating width step by step in the coating direction and connect seamlessly with the same coating film thickness, the thickness T of the partition plates 106A to 106D is preferably 5 to 90 μm. However, when the pressure in the manifolds 126A to E is high, such as when the viscosity of the coating liquid is high or the supply capacity speed from the syringe pumps 50A to 50E is high, for example, when the pressure is 50 kPa or more, Problems arise. That is, when the supply of the coating liquid from the syringe pumps 50A to 50E is started and the coating liquid is discharged from the slit nozzle units 120A to 120E to start the respective coatings, the partition plates 106A to 106D having a thickness of 5 to 90 μm are used. If there is, the partition plates 106A to 106D facing the slit nozzle units 120A to 120E that start coating are deformed by the internal pressure, whereby the discharge amount from the slit nozzle units 120A to 120E changes for a moment, resulting in uneven thickness. The thickness unevenness at the start of application is the total length of the application width of the slit nozzle units 120A to E adjacent to the slit nozzle units 120A to E adjacent to the application, and the slit nozzle units 120A to 120E. It occurs in a short range in the coating direction. Such thickness unevenness can be visually recognized as a line parallel to the longitudinal direction of the slit nozzle units 120A to 120E, that is, the coating width direction, which is a so-called horizontal defect.

  The thickness T of the partition plates 106A to 106E can be used to seamlessly connect with the same coating film thickness while changing the coating width step by step in the coating direction while preventing the horizontal step defect generated as described above. The portion facing the manifolds 126A to E is enlarged to increase the rigidity, and the portion facing the slits 128A to E in the vicinity of the discharge ports 134A to E can be made small so that the adjacent coating liquid can be easily connected. . A specific embodiment is a partition plate 150 shown in FIG. FIG. 6 is a schematic perspective view showing a partition plate 150 which is another embodiment of the partition plate.

  First, in FIG. 6, the outer shape of the partition plate 150 viewed in the Y direction indicated by the arrow is the same as that of the partition plates 106A to 106D. Although the back surface 154 is a flat surface, a rectangular recess 160 having the same length in the X direction as the gap amount G of the slits 128A to 128E is provided on the front surface 152 at a position corresponding to the slits 128A to 128E. Yes. The length of the indentation 160 in the vertical direction, that is, the Z direction is the length L, and the lowest is the lowermost end 158. The thickness of the partition plate 150 including the portions facing the manifolds 126A to E other than the recess 160, that is, the distance between the front surface 152 and the rear surface 154 is the thickness T. In addition, the slope 156 as one element constituting the depression 160 is a tapered surface that becomes smaller as the distance from the back surface 154 becomes lower in the Z direction indicated by the arrow, and the slit nozzle units 120A to 120E in the Z direction. At the lowermost end 158 at the same position as the discharge port surfaces 136A to 136E, the distance between the inclined surface 156 and the back surface 154 is the minimum thickness T1, which is smaller than the thickness T. In other words, the partition plate 150 has the smallest thickness (thickness T1) at the position corresponding to the ejection port surfaces 136A to E including the ejection ports 134A to 134E, and naturally the thickness is less than the thickness (heat T1). The thickness (thickness T) at the position corresponding to the manifolds 126A to 126E is larger.

  Application by incorporating the partition plate 150 into the composite slit nozzle 100 will be described with reference to FIG. FIG. 7 is a front cross-sectional view showing an application state when the partition plate 150 is used. In FIG. 7, the composite slit nozzle 100 in which the cut plate 150 is replaced with the partition plate 106 </ b> B is applied in the vicinity of the substrate A by discharging the coating liquid and removing the rear lips 124 </ b> A to E in a virtual state. The coating situation seen in the X direction is shown. For convenience, only the part where the front lip 122B, the partition plate 150, the front lip 122C, the partition plate 106C, and the front lip 122D are connected is taken out, and the coating liquid is shown as being painted. In FIG. 7, the length of partitioning the coating liquid in the front lip 122B and the coating liquid in the front lip 122C in the Y direction is the thickness T at the position where the manifolds 126B and C are located, but the slit 128B, C decreases from the middle of a certain position to the lower discharge ports 134B and C, and becomes a minimum thickness T1 at the positions of the discharge ports 134B and C. If the coating liquid supplied from the supply ports 132B and C has a small thickness T1 and is appropriately set, the discharge ports 134B and C and the substrate A become a boundary after being discharged from the discharge ports 134B and C. They can merge in space and are easily connected in the Y direction, which is the coating width direction. On the other hand, the length of partitioning the coating liquid in the front lip 122C and the coating liquid in the front lip 122D in the Y direction is equal to the thickness T of the partition plate 106C, and even at the positions of the discharge ports 134C and D. Equal to thickness T When the thickness T is large, the coating liquid supplied from the supply ports 132C and D is slightly discharged from the discharge ports 134C and D and then the widths WC and WD, which are the lengths in the Y direction, of the discharge ports 134C and D. Although spreading, the discharge ports 134C and D and the substrate A cannot be joined at the boundary and are not connected in the Y direction, so that a space S without a coating liquid remains between them.

  As described above, in the partition plate 150, the length of partitioning in the Y direction is the thickness T at the positions corresponding to the manifolds 126B and C. If the internal pressure increases due to the use of a high-viscosity coating solution, the pressure receiving area increases due to the shape of the manifolds 126B, C, D, and the partition plate 150 is large at the positions of the manifolds 126B, C, D. Since pressure acts, high strength is required to prevent deformation. Even in such a case, with the configuration of the partition plate 150, the coating liquid can be used regardless of whether the thickness T at the position corresponding to the manifolds 126B, C, and D is increased so as not to be deformed even by a large pressure. The thickness T1, which is the length of partitioning in the Y direction at the positions of the discharge ports 134B and C related to the connectivity, can be made small enough to easily connect the coating liquid in the coating width direction. That is, if the partition plate 150 is used, the thickness T is increased to prevent the partition plate 150 from being deformed, thereby preventing the occurrence of lateral defects at the start of coating, while reducing the thickness T1. It is possible to connect seamlessly with the same coating film thickness by changing the coating width step by step in the direction. The thickness T at this time is preferably 0.1 mm or more, more preferably 0.5 mm or more, and the thickness T1 is preferably 1 to 90 μm, more preferably 5 to 50 μm. The angle of the inclined surface 156 with respect to the horizontal plane (discharge port surfaces 136A to 136E including the discharge ports 134A to E) is preferably 30 to 85 degrees, more preferably 45 to 75 degrees. The length L, which is the length of the indentation 160 in the Z direction, is preferably determined so that the above angle can be realized.

  Note that the recess 160 may be provided on the back surface 154 so as to be symmetrical with the partition plate 150. As a result, the inclined surface 156 is also provided symmetrically, and becomes a double-tapered shape in which the interval in the Y direction between the two inclined surfaces decreases toward the lower side (the discharge ports 134B, C, D side).

  The recess 160 is preferably provided at a position corresponding to the slits 128A to 128E, and the length in the X direction is preferably equal to or less than the gap amount G between the slits 128A to 128E. If the gap amount is larger than the gap amount G, a nozzle having a large slit gap amount is locally applied, and the portion is locally thickly applied, resulting in a disadvantage that a linear joining line occurs.

  In FIG. 8, another partition plate is seen. FIG. 8 is a schematic perspective view showing a partition plate 170 which is another embodiment of the partition plate. The partition plate 170 is configured to sandwich the central partition plate 172 having a thickness T3 in the Y direction between the two partition plates 180A and B having a thickness T2. The outer shape of the central partition plate 172 and the side partition plates 180A and B viewed in the Y direction is the same as that of the partition plates 106A to 106D. Both side partition plates 180A, B are provided with rectangular slits 182A, B having a Z-direction length Z1 and an X-direction length equal to the gap amount G between the slits 128A-E at positions corresponding to the slits 128A-E. Yes. As with the partition plate 150, the partition plate 170 has a thickness (2 × T2 + T3) at a position corresponding to the manifolds 126A to 126E that is large enough not to be deformed even by a large pressure, and a discharge port 134A related to the connectivity of the coating liquid. The thickness T3 that is the length partitioned in the Y direction at the position corresponding to ~ E can be made the smallest independently so that the application liquid can be easily connected.

  FIG. 9 is a front sectional view showing a coating state when the partition plate 170 is used instead of the partition plate 150 of FIG. As shown in FIG. 9, even when the partition plate 170 is used, the length of partitioning the coating solution in the front lip 122B and the coating solution in the front lip 122C in the Y direction as in the case of the partition plate 150. Becomes the minimum thickness T3 over the range of the Z-direction length Z1 in the Z direction from the discharge ports 134B and 134C. Therefore, the coating liquid discharged from the discharge ports 134B and C can be merged in a space where the discharge ports 134B and C and the substrate A are bounded, and easily connected in the Y direction. Also, the thickness 2 × T2 + T3 at the position corresponding to the manifolds 126B and C can be increased so as not to be deformed even by a large pressure, regardless of the thickness T3. Even when the height is increased, it is possible to seamlessly connect and apply the same coating thickness by changing the coating width step by step in the coating direction while preventing the occurrence of horizontal defects at the start of coating. . Regarding the Z-direction length Z1, the lower limit is preferably 0.5 mm or more, and the upper limit is preferably the Z-direction length of the slits 128A to 128E. If the Z-direction length Z1 is within this range, the coating liquid discharged from the discharge ports 134B and C can be merged in the space between the discharge ports 134B and C and the substrate A, and can easily be moved in the Y direction. There are no inconveniences such as connection and generation of connection lines. Further, the thickness T3 is preferably the same as the thickness T1 of the partition plate 150.

  Next, FIG. 10 is a schematic perspective view showing a partition plate 190 which is still another embodiment of the partition plate, and FIG. 11 shows an application state when the partition plate 190 is used instead of the partition plate 150 of FIG. It is front sectional drawing shown. In FIG. 10, the outer shape of the partition plate 190 viewed in the Y direction is the same as that of the partition plates 106A to 106D. The thickness, which is the length of the partition plate 190 in the Y direction, is a uniform thickness T in the entire region. The partition plate 190 is provided with a rectangular slit 192 having a Z-direction length Z2 and an X-direction length equal to the gap amount G between the slits 128A-E at positions corresponding to the slits 128A-E. Of course, in the partition plate 190, the thickness at the position corresponding to the manifolds 126A to 126E becomes the entire thickness T, which is increased so as not to be deformed even by a large pressure. Next, referring to FIG. 11, in the partition plate 190, there is no portion that divides the discharge port 134 </ b> B, C having the slit 192 in the Z direction on the upper side in the Z direction length Z <b> 2. The coating liquid in the slit 128B and the coating liquid in the slit 128C of the front lip 122C communicate and merge, and are ejected from the ejection ports 134B and C and applied onto the substrate A in a joined state. The coating film connected in the Y direction (coating width direction) is formed. The coating film can be formed because the slit 192 has a function of fluidly communicating with the slits 128B and C in the vicinity of the discharge ports 134B and C. When such a partition plate 190 is used, the coating liquid can be merged inside the slit nozzle units 120A to 120E. Therefore, rather than the partition plates 150 and 170 that merge the coating liquid outside the slit nozzle units 120A to 120E. Furthermore, it becomes possible to easily connect coating films having the same coating thickness in the Y direction. The Z-direction length Z2 is preferably 0.1 to 10 mm, more preferably 0.1 to 5 mm. If it is smaller than this range, the length of the joining of the coating solutions is too small and does not sufficiently join, resulting in connection streaks. A coating film separated into shapes cannot be formed.

The slit 192 is preferably provided at a position corresponding to the slits 128A to 128E, and the length in the X direction is preferably equal to or less than the gap amount G between the slits 128A to 128E. When the gap amount is larger than the gap amount G, a nozzle having a large slit gap amount is locally applied, and the portion is locally thickly applied, resulting in a disadvantage that a linear joining line is generated.
Furthermore, using the partition plate 190, while preventing the occurrence of lateral defects at the start of coating, the coating width is changed step by step in the coating direction to seamlessly connect with the same coating film thickness. The thickness T is preferably 0.2 mm or more, more preferably 0.5 mm or more so as not to be deformed even by a large pressure.

  In the above embodiment example, the syringe pump is used as the intermittent constant capacity pump. However, the intermittent pump is not limited to this as long as the constant volume of the coating liquid is supplied and suctioned. Nominal CT pump), diaphragm pump, and the like can be suitably used.

  Furthermore, the pattern coating apparatus and the pattern coating method of the present invention can also be applied to form a plurality of coating films having different coating widths in a substrate or to form one coating film having a different coating width for each substrate. It can be said that the applicator of the present invention has a coating width switching function. Furthermore, the pattern coating apparatus and the pattern coating method of the present invention may be applied to a continuous body such as a film or a sheet instead of a sheet-like substrate.

  The coating solution to which the present invention described above can be applied has a viscosity of 1 to 100000 mPaS and is preferably a Newtonian from the viewpoint of coating properties, but can also be applied to coating solutions having thixotropy. Specific examples of coating liquids that can be applied include semiconductor adhesive layer coating liquids, planarization coating liquids, protective film coating liquids, resist liquids, colored layer coating liquids, fluorescent light emitting layer coating liquids, and TFTs. Positive resist, etc. As a member to be coated which is a substrate, a metal plate such as aluminum, a ceramic plate, a film, or the like may be used in addition to a silicon wafer or glass. The shape of the member to be coated may be a non-rectangular shape such as a circle or a rectangular shape. Further, as application conditions to be used, the coating speed is 1 mm / s to 400 mm / s, more preferably 5 mm / s to 200 mm / s, the slit gap of the composite slit nozzle is 50 to 1000 μm, more preferably 80 to 200 μm, and the coating thickness. The thickness is 0.2 to 100 μm, more preferably 1 to 20 μm in a wet state.

  The present invention will be specifically described below with reference to examples.

  The pattern application shown in FIG. 5 was performed using the pattern application apparatus 1 shown in FIG. 1 as the application apparatus. The coating solution was an adhesive solution having a viscosity of 300 mPas and a solid content concentration of 30%. The coating solution was applied onto the substrate A at a coating speed of 50 mm / s with a wet coating thickness of 30 μm and a clearance CL of 90 μm. As the substrate A, a silicon wafer having a diameter of 8 inches (203.2 mm) and a thickness of 0.7 mm was used.

  The composite slit nozzle 100 is shown in FIG. 3, and the partition plates 106 </ b> A to 106 </ b> D are replaced with the partition plate 150. The gaps G between the slits 128A to 128E of the slit nozzle units 120A to 120E to be configured were all 0.2 μm. Moreover, although it is width WA-WE which is the length of the longitudinal direction of slit nozzle unit 120A-E, it was WA = WB = WD = WE = 19mm and WC = 95mm. Regarding the partition plate 150, the thickness T was 0.3 mm, the length of the indentation 160 was 0.2 mm, the length L in the Z direction was 1 mm, and the thickness T1 was 10 μm.

  Further, X-direction position coordinates X0 to X7 which are conditions for determining the coating length are X0 = 0, X1 = 200 mm, X2 = 212 mm, X3 = 236 mm, X4 = 332 mm, X5 = 356 mm, X6 = 368 mm, X7. = 500 mm (end point position). For the supply valves 42A to 42E of the pattern coating apparatus 1, a suction back valve that sucks the coating liquid from the composite slit nozzle 100 when the valve is closed was used to adjust the suction amount, that is, the suck back amount to 10 μl. . The supply volume rates QA to QE during application of the syringe pumps A to E are the same, but the syringe pumps 50A, B, D, and E are the same, QA = QB = QD = QE = 28.5 μl / s, and the syringe pump 50C is The QC was 142.5 μl / s.

  The applied silicon wafer was immediately dried on a hot plate at 120 ° C. for 10 minutes. As a result, a pattern coating film having a thickness of 9 μm was obtained. Although the coating films were connected in the width direction using different slit nozzle units A to E, the seam could not be confirmed visually. As a result of measuring the film thickness distribution in the width direction including the connected portion, the level difference was 0.5 μm or less of the measurement limit, and the seam indicating the connected portion could not be confirmed even in the measurement.

DESCRIPTION OF SYMBOLS 1 Pattern coating device 2 Base 4 Guide rail 6 Mounting base 8 Upper surface 10 Gate type gantry 12 Stay 14 Bearing 16 Traveling part 20 Wiping unit 22 Wiping head 24 Bracket 26 Slider 28 Drive unit 30 Tray 32 Base 40A-E Coating liquid supply apparatus 42A to E Supply valve 44A to E Suction valve 46A to E Filter 50A to E Syringe pump 52A to E Syringe 54A to E Piston 56A to E Main body 60A to E Supply hose 62A to E Suction hose 64A to E Tank 66 Coating liquid 68 Pressure air Source 70 Vertical lift unit 72 Motor 74 Guide 76 Ball screw 78 Lift base 80 Suspension holding base 90 Controller 92 Operation panel 100 Composite slit nozzle (applicator)
102 Reference plate 104A, B Side plate 106A-D Partition plate 120A-E Slit nozzle unit 122A-E Front lip 124A-E Rear lip 126A-E Manifold 128A-E Slit 132A-E Supply port 134A-E Discharge port 136A-E Discharge port Surfaces 138A to E Slopes 140A to E Mating surfaces 142A to E Front slit surfaces 144A to E Rear lip inner surface 150 Partition plate 152 Surface 154 Back surface 156 Slope 158 Lowermost end 160 Recess 170 Partition plate 172 Central partition plate 180A, B Both side partition plates 182A , B Slit 190 Partition plate 192 Slit 200 Assembly product 202 Wafer 204 Semiconductor unit 206 Outline A Substrate (Coating member)
CL clearance amount (clearance (clearance) size (unit of length))
CP surface (of substrate A)
D Step amount G Gap amount H Height (from upper surface 8 of surface CP)
Hn Height L Length QA, QB, QC, QD, QE Supply capacity speed S Space T Thickness (for partition plates 106A-D)
T1, T2, T3 Thickness V Coating speed WA, WB, WC, WD, WE Width (for slit nozzle units 120A-E)
W1, W2, W3 Width Z1, Z2 Z direction length

  INDUSTRIAL APPLICATION This invention can be utilized for manufacture of the member which forms an application | coating film | membrane efficiently in a non-rectangular board | substrate mainly, such as a circular silicon wafer used for semiconductor manufacture, without waste.

Claims (3)

A coating liquid reservoir extending in the longitudinal direction, a coating liquid supply port for supplying the coating liquid to the coating liquid reservoir, a coating liquid outlet serving as an opening for discharging the coating liquid from the coating liquid reservoir, and a coating liquid storage At least two or more applicator units having a path portion that communicates the portion and the coating liquid discharge port with a partition plate having substantially the same shape as the cross section perpendicular to the longitudinal direction of the applicator unit, in the longitudinal direction The partition plate has a tapered recess at a position corresponding to the coating liquid discharge port, and the distance from the back surface decreases as it goes from the coating liquid storage unit side to the coating liquid discharge port side. The applicator is characterized in that the thickness is the smallest at the position corresponding to the coating liquid discharge port, and the thickness at the position corresponding to the coating liquid reservoir is larger. An applicator according to claim 1, an application liquid supply means for supplying the application liquid individually to each of the applicator units constituting the applicator, a holding unit for holding a member to be applied, and an applicator A coating width in the coating direction, comprising: an applicator proximity means for bringing the coating liquid discharge port close to the member to be coated; and a moving means for relatively moving at least one of the applicator and the member to be coated. A pattern coating apparatus capable of forming a coating film that changes step by step on a member to be coated. Using the pattern coating apparatus according to claim 2 , the coating liquid discharge port of the coating device is brought close to the member to be coated at a predetermined interval, and then the coating liquid is individually supplied from the coating liquid supply means to any coating device unit. Then, a pattern coating method for forming a coating film on a member to be coated, and discharging a coating liquid from a corresponding applicator unit so that a coating film whose coating width changes stepwise in the coating direction can be formed. A pattern coating method characterized by starting and ending discharge.