JP6120239B2 - 導電性ボール - Google Patents
導電性ボール Download PDFInfo
- Publication number
- JP6120239B2 JP6120239B2 JP2016536968A JP2016536968A JP6120239B2 JP 6120239 B2 JP6120239 B2 JP 6120239B2 JP 2016536968 A JP2016536968 A JP 2016536968A JP 2016536968 A JP2016536968 A JP 2016536968A JP 6120239 B2 JP6120239 B2 JP 6120239B2
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- sphere
- heat
- conductive
- shell
- conductive ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Connecting Device With Holders (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図1に示す構成の導電性ボール10を作製した。なお、球体11はシリコーンゴム(耐熱性:400℃)で、耐熱膨張性樹脂殻12はポリイミド(耐熱性:350℃)で形成し、導電性金属殻13は、銅/ニッケル/金の順でメッキを施すことで形成した。なお、球体11の直径Dは0.29mm、耐熱膨張性樹脂殻12の厚さt2は15μm(球体11の直径Dの5%)、導電性金属殻13の厚さt1は5μm(球体11の直径Dの2%)であった。また、球体11は、平板状の電極を2g〜5gの加重で載せた場合にその直径Dが10%減少するような弾性率を有していた。
耐熱膨張性樹脂殻を形成しないこと以外は実施例と同様にして、導電性ボールを作製した。なお、シリコーンゴムで形成された球体に直接メッキをすることができないため。導電性金属殻は銅/ニッケル/金の順にスパッタで成膜することで形成した。
実施例及び比較例で得られた導電性ボールを5分間加熱し、室温まで戻した後の皮膜の状態をマイクロスコープで観察した。加熱温度は、50℃、100℃、150℃、200℃、及び250℃とした。結果を表1に示す。なお、実施例と比較例で導電性ボールの見え方が異なるのは、最外層となる導電性金属殻の形成方法が異なるためである。
11 球体
12 耐熱膨張性樹脂殻
13 導電性金属殻
Claims (7)
- 電極同士を接合するコネクタとして使用する導電性ボールであって、弾性体で形成された球体(11)と、前記球体(11)の表面を被覆した、ポリイミド又はポリイミドを含む材料で形成された耐熱膨張性樹脂殻(12)と、前記耐熱膨張性樹脂殻(12)の外表面を被覆した導電性金属殻(13)とを備え、前記球体(11)の直径(D)が0.04mm以上2mm以下であることを特徴とする導電性ボール。
- 前記球体(11)が、ゴムで形成されている請求項1記載の導電性ボール。
- 前記ゴムが、200℃以上の耐熱性(JIS K7120に従った熱重量分析(TGA)にて重量減少率が1%に達する温度)を有する請求項2記載の導電性ボール。
- 前記耐熱膨張性樹脂殻(12)が、−40℃以上400℃以下における引っ張り強度が1MPa以上700MPa以下であって耐熱性(JIS K7120に従った熱重量分析(TGA)にて重量減少率が1%に達する温度)が200℃以上の物性を持つ樹脂で形成されている請求項1ないし3いずれか1項に記載の導電性ボール。
- 前記耐熱膨張性樹脂殻(12)の厚さ(t2)が、前記球体(11)の直径(D)の1%以上20%以下である請求項1ないし4いずれか1項に記載の導電性ボール。
- 前記導電性金属殻(13)が、銅、金、銀若しくはパラジウム又はそれらを含む合金で形成されている請求項1ないし5いずれか1項に記載の導電性ボール。
- 前記導電性金属殻(13)の厚さ(t1)が、前記球体(11)の直径(D)の0.1%以上10%以下である請求項1ないし6いずれか1項に記載の導電性ボール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015067919 | 2015-03-30 | ||
JP2015067919 | 2015-03-30 | ||
PCT/JP2016/054119 WO2016158030A1 (ja) | 2015-03-30 | 2016-02-12 | 導電性ボール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6120239B2 true JP6120239B2 (ja) | 2017-04-26 |
JPWO2016158030A1 JPWO2016158030A1 (ja) | 2017-04-27 |
Family
ID=57005686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016536968A Active JP6120239B2 (ja) | 2015-03-30 | 2016-02-12 | 導電性ボール |
Country Status (4)
Country | Link |
---|---|
US (2) | US20170047145A1 (ja) |
EP (1) | EP3118857B1 (ja) |
JP (1) | JP6120239B2 (ja) |
WO (1) | WO2016158030A1 (ja) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6487307A (en) * | 1987-09-30 | 1989-03-31 | Nitto Denko Corp | Polyimide powder and manufacture thereof |
US6193618B1 (en) * | 1993-04-28 | 2001-02-27 | Spalding Sports Worldwide, Inc. | Low spin golf ball comprising a mantle with a cellular or liquid core |
US6142887A (en) * | 1996-09-16 | 2000-11-07 | Spalding Sports Worldwide, Inc. | Golf ball comprising a metal, ceramic, or composite mantle or inner layer |
US6494795B2 (en) * | 2001-03-23 | 2002-12-17 | Acushnet Company | Golf ball and a method for controlling the spin rate of same |
JP3217046B2 (ja) | 1998-12-03 | 2001-10-09 | 九州日本電気株式会社 | Bga型icパッケージ |
JP2001011503A (ja) * | 1999-06-25 | 2001-01-16 | Catalysts & Chem Ind Co Ltd | 新規な導電性微粒子、および該微粒子の用途 |
JP4176683B2 (ja) | 2001-02-23 | 2008-11-05 | 独立行政法人科学技術振興機構 | マイクロカプセルの製造方法およびその装置 |
JP4662699B2 (ja) * | 2003-07-03 | 2011-03-30 | 大阪府 | 金属皮膜を有するポリマー微粒子及びその製造方法 |
JP2005136246A (ja) * | 2003-10-31 | 2005-05-26 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP5522335B2 (ja) * | 2007-07-06 | 2014-06-18 | 荒川化学工業株式会社 | ポリアミック酸微粒子またはポリイミド微粒子、ポリアミック酸微粒子の製造方法およびポリイミド微粒子の製造方法 |
US9044648B2 (en) * | 2009-03-13 | 2015-06-02 | Acushnet Company | Golf balls having multi-layered covers based on aromatic and aliphatic polyurethanes |
JP2013131321A (ja) * | 2011-12-20 | 2013-07-04 | Sekisui Chem Co Ltd | 導電性粒子、異方性導電材料及び接続構造体 |
KR20150072381A (ko) * | 2012-10-15 | 2015-06-29 | 세키스이가가쿠 고교가부시키가이샤 | 유기 무기 하이브리드 입자, 도전성 입자, 도전 재료 및 접속 구조체 |
US20140319681A1 (en) * | 2013-04-24 | 2014-10-30 | Samsung Electronics Co., Ltd. | Semiconductor package including solder ball |
-
2016
- 2016-02-12 US US15/306,059 patent/US20170047145A1/en not_active Abandoned
- 2016-02-12 JP JP2016536968A patent/JP6120239B2/ja active Active
- 2016-02-12 WO PCT/JP2016/054119 patent/WO2016158030A1/ja active Application Filing
- 2016-02-12 EP EP16771914.5A patent/EP3118857B1/en active Active
-
2018
- 2018-04-23 US US15/960,234 patent/US20180240568A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP3118857B1 (en) | 2019-04-03 |
WO2016158030A1 (ja) | 2016-10-06 |
EP3118857A1 (en) | 2017-01-18 |
US20170047145A1 (en) | 2017-02-16 |
EP3118857A4 (en) | 2018-01-24 |
JPWO2016158030A1 (ja) | 2017-04-27 |
US20180240568A1 (en) | 2018-08-23 |
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