JP6105408B2 - Device storage package and mounting structure including the same - Google Patents

Description

  The present invention relates to an element storage package for storing elements and a mounting structure including the same.

  An element storage package for storing an element includes a substrate having a mounting area on which an element is mounted on an upper surface, and a frame disposed on the upper surface of the substrate so as to surround the mounting area. Furthermore, a circular through hole into which a fixing member such as a screw or a bolt is inserted is formed in the substrate (for example, see Patent Document 1).

  In such an element storage package, for example, when attaching to an external device or the like, the through hole of the substrate is overlaid on the fixing portion of the external device, the fixing member is inserted into the fixing portion through the through hole of the substrate, and the fixing member is tightened Thus, the substrate can be fixed to the external device. Thereby, the element storage package can be fixed to the external device.

Japanese Patent Laid-Open No. 10-200042

  Generally, in order to replace an element storage package used in a state where it is attached to an external device, the element storage package may be detached from the external device and another element storage package may be attached to the external device again.

  However, in the element storage package as described above, the fixing member is inserted into the circular through hole of the substrate. Therefore, when removing the element storage package from the external device, it is necessary to remove the fixing member from the through hole. there were. For this reason, in addition to the time required for extracting the fixing member, there is a possibility that the fixing member may be lost, and there is a problem that the efficiency of exchanging the element storage package is low.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an element storage package in which the efficiency of replacement work is improved.

An element storage package according to the present invention includes a substrate having a mounting region on which an element is mounted on an upper surface, and a frame body disposed on the upper surface of the substrate so as to surround the mounting region. A first mounting portion disposed at one end portion in the first direction of the substrate located outside the frame body, and a second end portion in the first direction of the substrate located outside the frame body. And a first notch portion through which a fixing member for fixing the substrate to the outside is inserted, and the second attachment portion externally connects the substrate. The first notch and the second notch are open in the first direction in plan view. The second notch is inserted through a fixing member to be fixed to the first notch. Further, in this element storage package, the frame body has a through hole, and an input / output terminal that is inserted through the through hole of the frame body and electrically connects the inside of the frame body and the outside of the frame body. Further, the first notch and the second notch do not overlap the input / output terminal.

  The element storage package according to the present invention can improve the efficiency of replacement work.

  According to the mounting structure according to the present invention, it is possible to improve the efficiency of the replacement work by including the element storage package.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of an element storage package according to an embodiment of the present invention and a mounting structure including the package, viewed from one direction with a lid removed. It is the perspective view which looked at the package for element storage of FIG. 1 which removed the cover body from another direction. FIG. 2 is a plan view of the element storage package of FIG. 1 with a lid removed. It is a top view which shows the element storage package which removed the fixing member from FIG. It is a top view which shows the package for element storage which concerns on other embodiment of this invention. It is a perspective view which shows the element storage package which concerns on other embodiment of this invention. It is the perspective view which looked at the element storage package of FIG. 6 from another direction. It is a top view which shows the package for element accommodation of FIG.

[Element storage package and mounting structure]
An element storage package according to an embodiment of the present invention and a mounting structure including the same will be described with reference to FIGS. The mounting structure 1 includes an element 2, an element storage package 3, and a plurality of fixing members 4.

  The element 2 is, for example, an active element such as a transistor, a laser diode, a photodiode, a diode, an integrated circuit or a thyristor, or a passive element such as a resistor, a capacitor, a solar cell, a piezoelectric element, a crystal resonator, a SAW filter, or a ceramic oscillator. It is.

  As an example, the element 2 of the present embodiment employs a so-called optical semiconductor element such as a laser diode or a photodiode. In the present embodiment, an optical semiconductor element is employed as the element 2 as an example, but the present invention is not limited to this.

  The element 2 is disposed in the mounting region 31b on the upper surface 31a of the substrate 31. Further, as shown in FIG. 1, the element 2 is arranged in a mounting region 31b on the upper surface 31a of the substrate 31 via the base member 2a. Further, as shown in FIG. 1, the element 2 is accommodated in an element accommodation package 3.

  The element storage package 3 has a function of protecting the element 2. As shown in FIG. 1, the element storage package 3 stores the element 2. In addition, although the element storage package 3 of this embodiment stores one element 2, it is not limited to this. The element storage package 3 may store, for example, a plurality of elements 2 in a combination of types depending on the application.

  The element storage package 3 includes a substrate 31, a frame body 32, input / output terminals 33, a seal ring 34, and a lid body 35.

  The substrate 31 has a function of supporting the element 2. The substrate 31 has a mounting region 31b on the upper surface 31a. The substrate 31 may have a mounting region 31b for mounting the element 2 on the lower surface 31 in addition to the upper surface 31a. That is, the substrate 31 may be a single-sided mounting substrate 31 or a double-sided mounting substrate 31.

The substrate 31 is composed of a single metal plate or a laminate in which a plurality of metal plates are laminated. Examples of the material for the metal plate include metals such as copper, iron, tungsten, molybdenum, nickel, and cobalt, or alloys containing these metal materials. If a metal material is used as the material of the substrate 31, heat generated from the element 2 can be radiated through the substrate 31, so that the heat dissipation of the element housing package 3 is improved.

The substrate 31 has a first attachment portion 311 and a second attachment portion 312. The first attachment portion 311 and the second attachment portion 312 are portions for attaching the substrate 31 to an external device or the like. 1 to 4
As shown, the first attachment portion 311 and the second attachment portion 312 are located outside the frame body 32. The first attachment portion 311 is located at one end portion of the substrate 31 in the X direction. The second attachment portion 312 is located at the other end portion of the substrate 31 in the X direction. That is, in the X direction, the second mounting portion 312 is the first
The mounting portion 311 is located on the opposite side. Here, the X direction means one direction in which the coordinates in the Y direction and the coordinates in the Z direction are not particularly limited, and the same applies to the following.

The first attachment portion 311 is located at one end portion of the substrate 31 in the X direction. As shown in FIGS. 3 and 4, in the present embodiment, two first attachment portions 311 are arranged. Further, at one end portion of the substrate 31 in the X direction, one first attachment portion 311 is located at one end in the Y direction, and the other one first attachment portion 311 is located at the other end in the Y direction. . In addition, the number of the 1st attachment parts 311 is not restricted to two, For example, one may be sufficient and three or more may be sufficient.

The first attachment portion 311 has a first notch portion 311a. The first notch 311a is a part through which the fixing member 4 is inserted. The first notch portion 311 a passes through the first attachment portion 311 of the substrate 31. As shown in FIGS. 3 and 4, the first notch 311a is open in the X direction in plan view. As shown in FIGS. 3 and 4, in this embodiment, a part of the opening of the first notch 311a overlaps the input / output terminal 33 (base 331).

Further, the width of the opening of the first notch 311a is set to be larger than the diameter of the rod-shaped portion of the fixing member 4. The width of the opening of the first notch 311a is set smaller than the diameter of the head of the fixing member 4.

The second attachment portion 312 is located at the other end portion of the substrate 31 in the X direction. That is, the second attachment portion 312 is located on the opposite side of the first attachment portion 311 in the X direction. Further, as shown in FIGS. 3 and 4, in the present embodiment, two second attachment portions 312 are arranged. Further, at the other end portion of the substrate 31 in the X direction, one second mounting portion 312 is positioned at one end in the Y direction, and the other one second mounting portion 312 is positioned at the other end in the Y direction. Yes. Note that the number of the second attachment portions 312 is not limited to two, and may be one or three or more, for example.

The second attachment portion 312 has a second notch portion 312a. The second notch 312a is a part through which the fixing member 4 is inserted. The second notch portion 312 a passes through the second attachment portion 312 of the substrate 31. As shown in FIGS. 3 and 4, the second notch 312a is open in the X direction in plan view. That is, the first notch 311a and the second notch 312a are open in the same direction.

In addition, the width of the opening of the second notch 312a is set to be larger than the diameter of the rod-shaped portion of the fixing member 4. The width of the opening of the second notch 312a is set smaller than the diameter of the head of the fixing member 4.

As shown in FIG. 1, the frame 32 is disposed on the upper surface 31a of the substrate 31 so as to surround the element 2 (mounting region 31b). The frame body 32 is bonded to the upper surface 31a of the substrate 31 via a bonding member such as a brazing material. The frame 32 has a first side 321, a second side 322, a third side 323 and a fourth side 324. Note that the frame 32 of the present embodiment is rectangular in plan view,
It is not limited to this, For example, circular shape may be sufficient.

The first side portion 321 is a portion having a first through hole T1 through which a component for inputting and outputting an optical signal such as an optical fiber or a ferrule is inserted. The second side 322 is a second side through which the input / output terminal 33 is inserted.
This is a portion having a through hole T2 and adjacent to the first side portion 321. The third side portion 323 has a third through hole T3 through which the input / output terminal 33 is inserted, and is a portion facing the second side portion 322. The fourth side portion 324 faces the first side portion 321.

  Examples of the material of the frame 32 include metals such as copper, iron, tungsten, molybdenum, nickel, and cobalt, alloys containing these metals, ceramics, glass, and resins. In the frame body 32 of the present embodiment, a metal or an alloy is employed. As a result, the heat for driving the element 2 is easily dissipated by the frame 32.

On the first side 321 outside the frame 32, a holding member 32a for holding components such as an optical fiber and a ferrule is joined via a brazing material or the like. An optical fiber, a ferrule, and the like held by the holding member 32a are inserted into the first through hole T1 of the first side portion 321 and are optically connected to the element 2 positioned inside the frame body 32.

The input / output terminal 33 has a function of transmitting an electrical signal between the element 2 and an external circuit board (not shown). As shown in FIGS. 1 to 4, the element storage package 3 of the present embodiment includes two input / output terminals. One input / output terminal 33 is inserted into the second through hole T2 of the second side portion 322, and the other one input / output terminal 33 is the third through hole T3 of the third side portion 323 of the frame 32. Is inserted. The input / output terminal 33 includes a base 331, a wiring layer 332, and a lead terminal 333.

  The base 331 has a function of supporting the wiring layer 332 and the lead terminal 333. Examples of the material of the substrate 331 include ceramics such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, or a silicon nitride sintered body.

The wiring layer 332 has a function of transmitting the electrical signal converted by the element 2 from the optical signal to the lead terminal 333. As shown in FIG. 1, a plurality of wiring layers 332 are arranged on the base 331. The plurality of wiring layers 332 extend from the outside to the inside of the frame 32. A portion of the wiring layer 332 located inside the frame 32 is electrically connected to the element 2 by a bonding wire or the like. On the other hand, the portion of the wiring layer 332 located outside the frame 32 is electrically connected to the lead terminal 333 by solder or brazing material. Examples of the material of the wiring layer 332 include metal materials such as copper, silver, gold, aluminum, nickel, molybdenum, tungsten, manganese, and chromium, or alloys containing these metal materials.

The lead terminal 333 has a function of transmitting an electrical signal transmitted from the element 2 via the wiring layer 332 to the outside. The lead terminal 333 is connected to the wiring layer 332. Also, the lead terminal 333 is
For example, it consists of metal materials, such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials.

  The seal ring 34 has a function of joining the frame body 32 and the lid body 35. As shown in FIG. 1, the seal ring 34 is disposed on the end surfaces of the first side portion 321 to the fourth side portion 324 of the frame body 32 and surrounds the element 2 in plan view. Examples of the material of the seal ring 34 include metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum, and tungsten, or alloys that combine a plurality of these metal materials.

The lid 35 has a function of protecting the element 2. Further, as shown in FIG. 1, the lid 35 seals the opening of the element storage package 3. The lid 35 can be formed of a metal material similar to that of the seal ring 34, for example.

The fixing member 4 has a function of fixing the substrate 31 to an external device or the like. The fixing member 4 has a head portion and a rod-like portion. Moreover, the diameter of the rod-shaped part is smaller than the diameter of the head. In addition, the thread part is formed in the rod-shaped part of the fixing member 4 of this embodiment. The fixing member 4 is inserted through the first notch portion 311 a of the first attachment portion 311 and the second notch portion 312 a of the second attachment portion 312. That is, in FIG. 1 to FIG. 3, the four fixing members 4 are inserted through the two first cutout portions 311a and the two second cutout portions 312a, respectively. Examples of the fixing member 4 include bolts and screws.

  In the element storage package 3, for example, when being attached to an external device or the like, the first notch portion 31 and the second notch portion 32 of the substrate 31 are overlapped with the fixing portion of the external device, and the fixing member 4 is tightened while tightening 4 is inserted through the first notch 311a and the second notch 312a, and the fixing member 4 is inserted into the fixing part. Thus, the element housing package 3 is fixed to the external device by sandwiching the substrate 31 between the head of the fixing member 4 and the external device.

In the element storage package 3, the first notch portion 311 a of the first attachment portion 311 disposed at one end portion in the X direction and the second notch portion of the second attachment portion 312 disposed at the other end portion in the X direction. 312a opens toward the same X direction. Thus, for example, when the element storage package 3 attached to an external device or the like is replaced, the fixing member 4 is loosened and the element storage package 3 is pulled in a direction opposite to the X direction (−X direction). The fixing member 4 can be taken out from the opening of the first notch 311a to the outside of the first mounting portion 311, and the fixing member 4 can be extended from the opening of the second notch 312a to the outside of the second mounting portion 312. Can be put out. That is, the element housing package 3 can be removed from an external device or the like simply by loosening the fastening condition of the fixing member 4 and pulling the element housing package 3 in the direction opposite to the X direction (−X direction).

  In addition, another element storage package 3 is prepared, and the fixing member 4 is inserted into the first mounting portion 311 from the first cutout portion 311a in a state in which the tightening is loosened. Another element housing package 3 can be attached to an external device or the like by inserting the second notch 312a into the first attachment 312 and tightening the fixing member 4. Therefore, the element housing package 3 can be quickly replaced without removing the fixing member 4, and the possibility of losing the fixing member 4 can be reduced. Therefore, the efficiency of the replacement operation of the element housing package 3 is improved. be able to.

In the element storage package 3, the first mounting portion 311 and the second mounting portion 312 are disposed adjacent to the input / output terminal 33. That is, the input / output terminal 33 is disposed between the first mounting portion 311 and the second mounting portion 312. As a result, the position of the input / output terminal 33 can be stabilized, so that the input / output terminal 33 and the external circuit board can be stably connected, and the connection reliability of the input / output terminal 33 and the external circuit board is improved. Can do.

In the element storage package 3, the first attachment portion 311 and the second attachment portion 312 are disposed adjacent to the corner portion of the frame 32. Thereby, the element storage package 3 can be stably fixed to an external device or the like.

In addition, as shown in FIG. 3, a marker M such as a wall portion M may be formed in the external device adjacent to the fixing portion (fixing member 4). Thus, for example, when the device storage package 3 is attached to an external device or the like, the device storage package 3 may be slid toward the wall M (marker M), while the device storage package 3 is attached to the external device. When removing from the device, the element storage package 3 may be slid so as to be away from the wall portion M (marker M). Therefore, if the marker M such as the wall M is formed, the element housing package 3 can be easily fixed to the external device in a desired arrangement. The marker M is not limited to the wall M as long as it serves as a mark.

  In the mounting structure 1, the element 2 is mounted on the mounting region 31 b of the substrate 31 of the element storage package 3. That is, the element 2 is accommodated in the element accommodation package 3. Accordingly, the mounting structure 1 can be quickly replaced without removing the fixing member 4, and the possibility of losing the fixing member 4 can be reduced. Therefore, the efficiency of the replacement work of the mounting structure 1 can be improved. Can do.

  The present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the scope of the present invention.

As shown in FIGS. 3 and 4, in the element housing package 3 of the above embodiment, a part of the first notch 311 a of the first mounting portion 311 overlaps the input / output terminal 33 (base 331). However, the present invention is not limited to this.

  That is, as shown in FIG. 5, both the first notch 311 a and the second notch 311 b may not overlap the input / output terminal 33. This makes it easier to visually recognize the opening of the first notch 311a and the opening of the second notch 312a when removing the element storage package 3, so that the fixing member 4 can be seen from the opening of the first notch 311a. It becomes easy to take out to the outer side of the 1st attaching part 311, and it becomes easy to take out the fixing member 4 to the outer side of the 2nd attaching part 312 from opening of the 2nd notch part 312a.

Moreover, FIGS. 6-8 is a figure which shows the element storage package 3 of other embodiment. In the element storage package 3, the second mounting portion 312 is the first in the Y direction orthogonal to the X direction.
Compared to the attachment portion 311, it is located closer to the center of the inner region of the frame 32 on the upper surface of the substrate 31. In other words, in the present embodiment, the first attachment portion 311 is adjacent to the long side of the frame body 32, whereas the second attachment portion 312 is adjacent to the short side of the frame body 32. That is, the second mounting portion 312 is not positioned in front of the first mounting portion 311 in the X direction, and the position of the first mounting portion 311 in the Y direction is different from the position of the second mounting portion 312. Thus, when the element storage package 3 is detached and attached, the fixing member 4 is simply slid in the X direction and the −X direction to remove the fixing member 4 from the first notch 311a. The fixing member 4 can be taken in and out of the first mounting portion 312 from the second notch portion 312a. Therefore, even if the element storage package 3 is slid in the X direction or the −X direction, the replacement of the element storage package 3 is not disturbed by the fixing member 4 that has not been removed. The work efficiency can be further improved.

Moreover, in the said embodiment, the 1st attaching part 311 is located in the one end part in the X direction of the board | substrate 31,
Although the 2nd attachment part 312 is located in the other end part in the X direction of the board | substrate 31, it is not restricted to this.

  That is, the first attachment portion 311 may be located at one end portion in the Y direction of the substrate 31, and the second attachment portion 312 may be located at the other end portion in the Y direction of the substrate 31. In this case, the first cutout portion 311a of the first attachment portion 311 and the second cutout portion 312a of the second attachment portion 312 may be opened toward the Y direction.

Moreover, in the said embodiment, although the board | substrate 31 and the frame 32 are formed as a different body, it is not limited to this, You may form the board | substrate 31 and the frame 32 integrally. For example, by forming a recess on the surface of the ceramic laminate, a portion surrounding the recess (mounting region 31b) is a frame 32, and a lower portion connected to the frame 32 is a substrate 31. The frame 32 can be formed integrally.

[Method for Manufacturing Device Storage Package and Mounting Structure]
Hereinafter, a method for manufacturing the element housing package 3 and the mounting structure 1 shown in FIG. 1 will be described. In addition, this invention is not limited to the following embodiment.

First, the substrate 31 and the frame body 32 are produced. Each of the substrate 31 and the frame body 32 is manufactured by forming an ingot obtained by casting a molten metal material into a mold and solidifying it into a predetermined shape by using a metal processing method. The substrate 31 has a first notch portion 311a.
A second attachment portion 312 having an attachment portion 311 and a second notch portion 312a is formed. The frame 32
The first through hole T1 to the third through hole T3 are formed.

Next, the input / output terminal 33 having the base 331, the wiring layer 332, and the lead terminal 333 is manufactured. First, for example, a mixture obtained by adding an organic binder, a plasticizer, a solvent, or the like to ceramic powder such as aluminum oxide, boron nitride, aluminum nitride, silicon nitride, silicon carbide, or beryllium oxide is processed into a predetermined shape. Next, a refractory metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer or a solvent is added to and mixed with the powder to prepare a metal paste. Then, a metal paste is printed in a predetermined pattern on the surface of the mixture processed into a predetermined shape. Then, by baking this, the metal paste is used as the wiring layer 332, and the mixture processed into a predetermined shape is used as the base 331. Then, the input / output terminal 33 is manufactured by bonding the lead terminal 333 onto the wiring layer 332 via a silver solder.

Next, the frame body 32 is disposed on the upper surface 31a of the substrate 31, the holding member 32a is disposed so as to overlap the first through hole T1 of the first side portion 321 of the frame body 32, and the input / output terminals 33 are secondly arranged. Insert into the through hole T2 and the third through hole T3.

Next, the element 2 is disposed on the mounting region 31b of the upper surface 31a of the substrate 31 via the base member 2a, and the element 2 is electrically connected to the wiring layer 332 via a bonding wire or the like. Finally, the mounting structure 1 can be manufactured by sealing the element storage package 3 with the lid 35.

DESCRIPTION OF SYMBOLS 1 Mounting structure 2 Element 2a Base member 3 Package for element storage
31 Board
31a Top view
31b Mounting area
311 First mounting part
311a 1st notch
312 Second mounting part
312a Second notch
32 frame
321 first side
322 Second side
323 3rd side
324 Fourth side portion T1 First through hole T2 Second through hole T3 Third through hole
32a Holding member
33 I / O terminals
331 substrate
332 Wiring layer
333 Lead terminal
34 Seal ring
35 Lid 4 Fixing member M Marker

Claims (3)

A substrate having a mounting region on which an element is mounted on the upper surface, and a frame body disposed on the upper surface of the substrate so as to surround the mounting region;
The substrate is located on the outside of the frame body, the first mounting portion disposed at one end in the first direction of the substrate, and the other on the outside of the frame body in the first direction of the substrate. A second mounting portion disposed at the end,
The first attachment portion has a first cutout portion through which a fixing member for fixing the substrate to the outside is inserted, and the second attachment portion is a second cutout through which a fixing member for fixing the substrate to the outside is inserted. Has a notch,
The first notch and the second notch are open in the first direction in plan view, and the frame has a through hole,
An input / output terminal that is inserted through the through-hole of the frame and electrically connects the inside of the frame and the outside of the frame;
The first cutout portion and the second cutout portion are element storage packages that do not overlap the input / output terminals . A substrate having a mounting region on which an element is mounted on the upper surface, and a frame body disposed on the upper surface of the substrate so as to surround the mounting region;
The substrate is located on the outside of the frame body, the first mounting portion disposed at one end in the first direction of the substrate, and the other on the outside of the frame body in the first direction of the substrate. A second mounting portion disposed at the end,
The first attachment portion has a first cutout portion through which a fixing member for fixing the substrate to the outside is inserted, and the second attachment portion is a second cutout through which a fixing member for fixing the substrate to the outside is inserted. Has a notch,
The first notch and the second notch are open in the first direction when seen in a plan view, and the second attachment portion is arranged in the second direction perpendicular to the first direction. the frame of the area inside the central portion element storing package that are located on the side of the said upper surface of said substrate compared to first mounting portion. The device storage package according to claim 1 or 2 ,
A mounting structure comprising: an element mounted on the mounting region of the substrate of the element storage package.

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