JP6105358B2 - 回路基板 - Google Patents
回路基板 Download PDFInfo
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- JP6105358B2 JP6105358B2 JP2013077251A JP2013077251A JP6105358B2 JP 6105358 B2 JP6105358 B2 JP 6105358B2 JP 2013077251 A JP2013077251 A JP 2013077251A JP 2013077251 A JP2013077251 A JP 2013077251A JP 6105358 B2 JP6105358 B2 JP 6105358B2
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- 230000005540 biological transmission Effects 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 48
- 239000004020 conductor Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 5
- 239000010949 copper Substances 0.000 description 3
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- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- 101100489713 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND1 gene Proteins 0.000 description 1
- 101100489717 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) GND2 gene Proteins 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/20—Structure, shape, material or disposition of high density interconnect preforms
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Transceivers (AREA)
Description
前記一方のフィルタチップは前記アンテナ端子と電気的に接続され、前記能動部品はアンプを含み、前記一方のフィルタチップは前記能動部品で増幅された信号をフィルタリングする又は前記能動部品は前記一方のフィルタチップでフィルタリングされた信号を増幅し、前記一方のフィルタチップと前記能動部品は、前記投影領域と前記能動部品が重なる領域の内側のみで接続されることを特徴とする回路基板である。
10a 送信フィルタチップ
10b 受信フィルタチップ
10c、10d 投影領域
16 PA
16a 能動部品
22 積層基板
30、32、34、36、38 絶縁層
40、42、44 導体層
40a 配線
50,50a ビア配線
52 コア
52a、52b 開口部
100、200、300、400 回路基板
Ant アンテナノード
Rx 受信ノード
Tx1、Tx2 送信ノード
Claims (7)
- 導体層と絶縁層とが積層されて形成された積層基板と、
前記積層基板に設けられたアンテナ端子と、
弾性波フィルタが形成され、前記積層基板に内蔵され、分波器を構成する送信フィルタが形成された送信フィルタチップと、
弾性波フィルタが形成され、前記積層基板に内蔵され、前記分波器を構成する受信フィルタが形成された受信フィルタチップと、
前記送信フィルタチップ及び前記受信フィルタチップのうちの一方のフィルタチップを前記積層基板の厚さ方向に投影して形成される投影領域の一部のみで重なるように前記積層基板の表面に設けられ、かつ前記一方のフィルタチップと接続された能動部品と、を具備し、
前記一方のフィルタチップは前記アンテナ端子と電気的に接続され、前記能動部品はアンプを含み、前記一方のフィルタチップは前記能動部品で増幅された信号をフィルタリングする又は前記能動部品は前記一方のフィルタチップでフィルタリングされた信号を増幅し、
前記一方のフィルタチップと前記能動部品は、前記投影領域と前記能動部品が重なる領域の内側のみで接続されることを特徴とする回路基板。 - 前記一方のフィルタチップと前記能動部品とは、別の部品を介さず直接接続されていることを特徴とする請求項1記載の回路基板。
- 前記一方のフィルタチップは前記送信フィルタチップであり、前記能動部品はパワーアンプであることを特徴とする請求項1または2記載の回路基板。
- 前記送信フィルタチップは送信ノードと共通ノードとの間に接続され、前記受信フィルタチップは受信ノードと前記共通ノードとの間に接続され、
前記一方のフィルタチップは前記送信フィルタチップであることを特徴とする請求項1から3のいずれか一項記載の回路基板。 - 前記一方のフィルタチップと前記能動部品とを接続する配線のうち、前記積層基板の面方向に延びる第1配線は、前記積層基板の厚さ方向に延びる第2配線より短いことを特徴とする請求項1から4のいずれか一項記載の回路基板。
- 前記積層基板は金属からなるコアを含み、
前記一方のフィルタチップは前記コアに形成された開口部に内蔵されていることを特徴とする請求項1から5のいずれか一項記載の回路基板。 - 前記一方のフィルタチップは、前記積層基板の厚さ方向に延びる接続配線及び面方向に延びる前記導体層を介して前記アンテナ端子に電気的に接続され、
前記アンテナ端子は、前記能動部品が設けられた前記積層基板の前記表面とは反対側の前記積層基板の表面に設けられていることを特徴とする請求項1から6のいずれか一項記載の回路基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013077251A JP6105358B2 (ja) | 2013-04-02 | 2013-04-02 | 回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013077251A JP6105358B2 (ja) | 2013-04-02 | 2013-04-02 | 回路基板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011282013A Division JP5241910B2 (ja) | 2011-12-22 | 2011-12-22 | 回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013141317A JP2013141317A (ja) | 2013-07-18 |
JP6105358B2 true JP6105358B2 (ja) | 2017-03-29 |
Family
ID=49038273
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013077251A Active JP6105358B2 (ja) | 2013-04-02 | 2013-04-02 | 回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6105358B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6638710B2 (ja) | 2016-10-14 | 2020-01-29 | 株式会社デンソー | 電池装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3109477B2 (ja) * | 1998-05-26 | 2000-11-13 | 日本電気株式会社 | マルチチップモジュール |
JP3484090B2 (ja) * | 1998-12-22 | 2004-01-06 | 株式会社日立製作所 | スイッチ型アンテナ共用器および移動無線端末 |
JP3750796B2 (ja) * | 2001-05-22 | 2006-03-01 | Tdk株式会社 | 移動体通信機器用モジュール |
JP2003347741A (ja) * | 2002-05-30 | 2003-12-05 | Taiyo Yuden Co Ltd | 複合多層基板およびそれを用いたモジュール |
JP2007273585A (ja) * | 2006-03-30 | 2007-10-18 | Sony Corp | マイクロデバイスモジュール及びその製造方法 |
JP4492708B2 (ja) * | 2008-01-31 | 2010-06-30 | Tdk株式会社 | 高周波モジュール |
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2013
- 2013-04-02 JP JP2013077251A patent/JP6105358B2/ja active Active
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JP2013141317A (ja) | 2013-07-18 |
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